WO1998054632A3 - Semiconductor wafer processing with defect eradication - Google Patents

Semiconductor wafer processing with defect eradication Download PDF

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Publication number
WO1998054632A3
WO1998054632A3 PCT/US1998/010658 US9810658W WO9854632A3 WO 1998054632 A3 WO1998054632 A3 WO 1998054632A3 US 9810658 W US9810658 W US 9810658W WO 9854632 A3 WO9854632 A3 WO 9854632A3
Authority
WO
WIPO (PCT)
Prior art keywords
station
wafers
defect
switched
defects
Prior art date
Application number
PCT/US1998/010658
Other languages
French (fr)
Other versions
WO1998054632A2 (en
Inventor
Paul P Castrucci
Kenneth Baldwin
Original Assignee
Paul P Castrucci
Kenneth Baldwin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Paul P Castrucci, Kenneth Baldwin filed Critical Paul P Castrucci
Priority to AU75977/98A priority Critical patent/AU7597798A/en
Publication of WO1998054632A2 publication Critical patent/WO1998054632A2/en
Publication of WO1998054632A3 publication Critical patent/WO1998054632A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

An improved semiconductor wafer processing device (10) includes a series of processing stations combined in one form, to achieve a defect level in the range of 0.01 defects/cm2. Wafers are supplied to an input station (28) for recording results at each station. Individual wafers are switched to a computerized defect-mapping station (14) where defects are identified. Defected wafers are then switched to a computerized laser cleaning station (11) which sweeps the wafers surface clean, except for stubborn defects. Wafers are switched to a final mapping station (20 or 22), followed by an output station (30). Wafers with stubborn defects are switched to a 2nd defect-mappng station (16) where stubborn defects are located by coordinates, then the wafers are switched to a Defect Review Tool with a Scanning Electron Microscope (SEM-DRT) (24). A laser point-cleaning station (13) sweeps each stubborn defect. Wafers are switched to a 3rd defect-mapping station (18) for recording, then to a 2nd laser cleaning station (12) for a final cleaning, followed by a final mapping station (20 or 22) for mapping of any remaining stubborn defects then on to an output station (30).
PCT/US1998/010658 1997-05-29 1998-05-26 Semiconductor wafer processing with defect eradication WO1998054632A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU75977/98A AU7597798A (en) 1997-05-29 1998-05-26 Semiconductor wafer processing apparatus and method with defect eradication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4790797P 1997-05-29 1997-05-29
US60/047,907 1997-05-29

Publications (2)

Publication Number Publication Date
WO1998054632A2 WO1998054632A2 (en) 1998-12-03
WO1998054632A3 true WO1998054632A3 (en) 1999-03-11

Family

ID=21951684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/010658 WO1998054632A2 (en) 1997-05-29 1998-05-26 Semiconductor wafer processing with defect eradication

Country Status (2)

Country Link
AU (1) AU7597798A (en)
WO (1) WO1998054632A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL127720A0 (en) * 1998-12-24 1999-10-28 Oramir Semiconductor Ltd Local particle cleaning
JP3365551B2 (en) 1999-05-20 2003-01-14 日本電気株式会社 Lot supply system and lot supply method
GB2351160A (en) * 1999-05-20 2000-12-20 Nec Corp Lot supply system for a production line
US6407373B1 (en) * 1999-06-15 2002-06-18 Applied Materials, Inc. Apparatus and method for reviewing defects on an object
TW543080B (en) 1999-10-26 2003-07-21 Fab Solutions Inc Semiconductor device
EP1273031B1 (en) 2000-04-13 2005-08-10 NanoPhotonics AG Modular substrate measurement system
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
TWI294632B (en) 2000-06-27 2008-03-11 Ebara Corp Inspecting device using an electron ebam and method for making semiconductor devices with such inspection device
US6842659B2 (en) 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
US7236847B2 (en) 2002-01-16 2007-06-26 Kla-Tencor Technologies Corp. Systems and methods for closed loop defect reduction
CN103962347B (en) * 2013-01-24 2016-05-11 北京京东方光电科技有限公司 A kind of cleaning systems and method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531857A (en) * 1988-07-08 1996-07-02 Cauldron Limited Partnership Removal of surface contaminants by irradiation from a high energy source
US5598341A (en) * 1995-03-10 1997-01-28 Advanced Micro Devices, Inc. Real-time in-line defect disposition and yield forecasting system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531857A (en) * 1988-07-08 1996-07-02 Cauldron Limited Partnership Removal of surface contaminants by irradiation from a high energy source
US5598341A (en) * 1995-03-10 1997-01-28 Advanced Micro Devices, Inc. Real-time in-line defect disposition and yield forecasting system

Also Published As

Publication number Publication date
WO1998054632A2 (en) 1998-12-03
AU7597798A (en) 1998-12-30

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