WO1998049698A3 - Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor - Google Patents
Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor Download PDFInfo
- Publication number
- WO1998049698A3 WO1998049698A3 PCT/IB1998/000371 IB9800371W WO9849698A3 WO 1998049698 A3 WO1998049698 A3 WO 1998049698A3 IB 9800371 W IB9800371 W IB 9800371W WO 9849698 A3 WO9849698 A3 WO 9849698A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- multilayer capacitor
- supporting plate
- enveloped
- insulating material
- electrically insulating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/12—Protection against corrosion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Abstract
The invention relates to a method of manufacturing enveloped multilayer capacitors, in which a) a flat supporting plate of an electrically insulating material is provided with through-holes, b) dielectric layers and electrode layers are provided in the holes and on both surfaces of the flat supporting plate, c) after a sufficient number of layers has been provided for the intended purpose, the supporting plate is covered on both sides with a cover plate of an electrically insulating material which is hermetically secured to the supporting plate of an electrically insulating material, d) the assembly is subdivided into blocks which each comprise a multilayer capacitor enveloped by an electrically insulating material, with partition lines extending through the electrode layers situated on both surfaces of the supporting plate, e) and, subsequently, end contacts are provided on two opposing ends of the blocks.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10529347A JP2000512810A (en) | 1997-04-25 | 1998-03-16 | Method of manufacturing encapsulated multilayer capacitor and encapsulated multilayer capacitor |
EP98905586A EP0951724A2 (en) | 1997-04-25 | 1998-03-16 | Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97201239 | 1997-04-25 | ||
EP97201239.7 | 1997-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998049698A2 WO1998049698A2 (en) | 1998-11-05 |
WO1998049698A3 true WO1998049698A3 (en) | 1999-02-04 |
Family
ID=8228256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB1998/000371 WO1998049698A2 (en) | 1997-04-25 | 1998-03-16 | Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor |
Country Status (5)
Country | Link |
---|---|
US (2) | US6094336A (en) |
EP (1) | EP0951724A2 (en) |
JP (1) | JP2000512810A (en) |
TW (1) | TW373200B (en) |
WO (1) | WO1998049698A2 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3585796B2 (en) * | 1999-12-17 | 2004-11-04 | 新光電気工業株式会社 | Multilayer wiring board manufacturing method and semiconductor device |
JP5678905B2 (en) * | 2011-03-14 | 2015-03-04 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
EP3920200A1 (en) | 2014-05-05 | 2021-12-08 | 3D Glass Solutions, Inc. | 2d and 3d inductors antenna and transformers fabricating photoactive substrates |
US10070533B2 (en) | 2015-09-30 | 2018-09-04 | 3D Glass Solutions, Inc. | Photo-definable glass with integrated electronics and ground plane |
JP7071609B2 (en) * | 2016-02-25 | 2022-05-19 | スリーディー グラス ソリューションズ,インク | Capacitor array for manufacturing 3D capacitors and photoactive substrates |
WO2017177171A1 (en) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
US11101532B2 (en) | 2017-04-28 | 2021-08-24 | 3D Glass Solutions, Inc. | RF circulator |
CA3067812C (en) | 2017-07-07 | 2023-03-14 | 3D Glass Solutions, Inc. | 2d and 3d rf lumped element devices for rf system in a package photoactive glass substrates |
CA3084818C (en) | 2017-12-15 | 2023-01-17 | 3D Glass Solutions, Inc. | Coupled transmission line resonate rf filter |
KR102600200B1 (en) | 2018-01-04 | 2023-11-10 | 3디 글래스 솔루션즈 인코포레이티드 | Impedance matching conductive structure for high-efficiency RF circuits |
EP3643148A4 (en) | 2018-04-10 | 2021-03-31 | 3D Glass Solutions, Inc. | Rf integrated power condition capacitor |
WO2019231947A1 (en) | 2018-05-29 | 2019-12-05 | 3D Glass Solutions, Inc. | Low insertion loss rf transmission line |
CA3112608C (en) | 2018-09-17 | 2021-12-28 | 3D Glass Solutions, Inc. | High efficiency compact slotted antenna with a ground plane |
CA3107810A1 (en) | 2018-12-28 | 2020-07-02 | 3D Glass Solutions, Inc. | Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates |
AU2019416327B2 (en) | 2018-12-28 | 2021-12-09 | 3D Glass Solutions, Inc. | Annular capacitor RF, microwave and MM wave systems |
WO2020206323A1 (en) | 2019-04-05 | 2020-10-08 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
US11373908B2 (en) | 2019-04-18 | 2022-06-28 | 3D Glass Solutions, Inc. | High efficiency die dicing and release |
WO2021211855A1 (en) | 2020-04-17 | 2021-10-21 | 3D Glass Solutions, Inc. | Broadband inductor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455496A2 (en) * | 1990-05-03 | 1991-11-06 | Oxley Developments Company Limited | Multilayer discoidal capacitors |
US5406446A (en) * | 1993-04-29 | 1995-04-11 | Fujitsu Limited | Thin film capacitor |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3725454A1 (en) * | 1987-07-31 | 1989-02-09 | Siemens Ag | ELECTRICAL MULTI-LAYER COMPONENT WITH A SINTERED, MONOLITHIC CERAMIC BODY AND METHOD FOR PRODUCING THE ELECTRICAL MULTI-LAYER COMPONENT |
US5053916A (en) * | 1989-03-13 | 1991-10-01 | U.S. Philips Corporation | Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor |
US5195019A (en) * | 1992-02-10 | 1993-03-16 | Hertz Jerome J | Bonding fired multilayer capacitors into a stack |
JPH07169649A (en) * | 1993-12-16 | 1995-07-04 | Tdk Corp | Multilayer through-type capacitor array |
-
1998
- 1998-03-16 EP EP98905586A patent/EP0951724A2/en not_active Withdrawn
- 1998-03-16 JP JP10529347A patent/JP2000512810A/en active Pending
- 1998-03-16 WO PCT/IB1998/000371 patent/WO1998049698A2/en not_active Application Discontinuation
- 1998-04-20 US US09/062,937 patent/US6094336A/en not_active Expired - Fee Related
- 1998-04-21 TW TW087106109A patent/TW373200B/en active
-
2000
- 2000-02-03 US US09/498,258 patent/US6321429B1/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455496A2 (en) * | 1990-05-03 | 1991-11-06 | Oxley Developments Company Limited | Multilayer discoidal capacitors |
US5406446A (en) * | 1993-04-29 | 1995-04-11 | Fujitsu Limited | Thin film capacitor |
Also Published As
Publication number | Publication date |
---|---|
JP2000512810A (en) | 2000-09-26 |
WO1998049698A2 (en) | 1998-11-05 |
TW373200B (en) | 1999-11-01 |
EP0951724A2 (en) | 1999-10-27 |
US6094336A (en) | 2000-07-25 |
US6321429B1 (en) | 2001-11-27 |
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