WO1998049698A3 - Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor - Google Patents

Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor Download PDF

Info

Publication number
WO1998049698A3
WO1998049698A3 PCT/IB1998/000371 IB9800371W WO9849698A3 WO 1998049698 A3 WO1998049698 A3 WO 1998049698A3 IB 9800371 W IB9800371 W IB 9800371W WO 9849698 A3 WO9849698 A3 WO 9849698A3
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer capacitor
supporting plate
enveloped
insulating material
electrically insulating
Prior art date
Application number
PCT/IB1998/000371
Other languages
French (fr)
Other versions
WO1998049698A2 (en
Inventor
Johannus Wilhelmus Weekamp
Original Assignee
Koninkl Philips Electronics Nv
Philips Svenska Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Philips Svenska Ab filed Critical Koninkl Philips Electronics Nv
Priority to JP10529347A priority Critical patent/JP2000512810A/en
Priority to EP98905586A priority patent/EP0951724A2/en
Publication of WO1998049698A2 publication Critical patent/WO1998049698A2/en
Publication of WO1998049698A3 publication Critical patent/WO1998049698A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Abstract

The invention relates to a method of manufacturing enveloped multilayer capacitors, in which a) a flat supporting plate of an electrically insulating material is provided with through-holes, b) dielectric layers and electrode layers are provided in the holes and on both surfaces of the flat supporting plate, c) after a sufficient number of layers has been provided for the intended purpose, the supporting plate is covered on both sides with a cover plate of an electrically insulating material which is hermetically secured to the supporting plate of an electrically insulating material, d) the assembly is subdivided into blocks which each comprise a multilayer capacitor enveloped by an electrically insulating material, with partition lines extending through the electrode layers situated on both surfaces of the supporting plate, e) and, subsequently, end contacts are provided on two opposing ends of the blocks.
PCT/IB1998/000371 1997-04-25 1998-03-16 Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor WO1998049698A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10529347A JP2000512810A (en) 1997-04-25 1998-03-16 Method of manufacturing encapsulated multilayer capacitor and encapsulated multilayer capacitor
EP98905586A EP0951724A2 (en) 1997-04-25 1998-03-16 Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97201239.7 1997-04-25
EP97201239 1997-04-25

Publications (2)

Publication Number Publication Date
WO1998049698A2 WO1998049698A2 (en) 1998-11-05
WO1998049698A3 true WO1998049698A3 (en) 1999-02-04

Family

ID=8228256

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1998/000371 WO1998049698A2 (en) 1997-04-25 1998-03-16 Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor

Country Status (5)

Country Link
US (2) US6094336A (en)
EP (1) EP0951724A2 (en)
JP (1) JP2000512810A (en)
TW (1) TW373200B (en)
WO (1) WO1998049698A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3585796B2 (en) * 1999-12-17 2004-11-04 新光電気工業株式会社 Multilayer wiring board manufacturing method and semiconductor device
JP5678905B2 (en) * 2011-03-14 2015-03-04 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component
JP6574207B2 (en) 2014-05-05 2019-09-11 スリーディー グラス ソリューションズ，インク３Ｄ Ｇｌａｓｓ Ｓｏｌｕｔｉｏｎｓ，Ｉｎｃ 2D and 3D inductors, antennas, and transformers for manufacturing photoactive substrates
US10070533B2 (en) 2015-09-30 2018-09-04 3D Glass Solutions, Inc. Photo-definable glass with integrated electronics and ground plane
JP7071609B2 (en) * 2016-02-25 2022-05-19 スリーディー グラス ソリューションズ，インク Capacitor array for manufacturing 3D capacitors and photoactive substrates
US11161773B2 (en) 2016-04-08 2021-11-02 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
WO2018200804A1 (en) 2017-04-28 2018-11-01 3D Glass Solutions, Inc. Rf circulator
WO2019010045A1 (en) 2017-07-07 2019-01-10 3D Glass Solutions, Inc. 2d and 3d rf lumped element devices for rf system in a package photoactive glass substrates
US10854946B2 (en) 2017-12-15 2020-12-01 3D Glass Solutions, Inc. Coupled transmission line resonate RF filter
JP7226832B2 (en) 2018-01-04 2023-02-21 スリーディー グラス ソリューションズ，インク Impedance-matching conductive structures for high-efficiency RF circuits
WO2019199470A1 (en) 2018-04-10 2019-10-17 3D Glass Solutions, Inc. Rf integrated power condition capacitor
US10903545B2 (en) 2018-05-29 2021-01-26 3D Glass Solutions, Inc. Method of making a mechanically stabilized radio frequency transmission line device
EP3853944B1 (en) 2018-09-17 2023-08-02 3D Glass Solutions, Inc. High efficiency compact slotted antenna with a ground plane
JP7257707B2 (en) 2018-12-28 2023-04-14 スリーディー グラス ソリューションズ，インク Annular capacitor RF, microwave and MM wave systems
KR102642603B1 (en) 2018-12-28 2024-03-05 3디 글래스 솔루션즈 인코포레이티드 Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates
AU2020253553A1 (en) 2019-04-05 2021-10-28 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
EP3948954B1 (en) 2019-04-18 2023-06-14 3D Glass Solutions, Inc. High efficiency die dicing and release
JP2023516817A (en) 2020-04-17 2023-04-20 スリーディー グラス ソリューションズ，インク broadband induction

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0455496A2 (en) * 1990-05-03 1991-11-06 Oxley Developments Company Limited Multilayer discoidal capacitors
US5406446A (en) * 1993-04-29 1995-04-11 Fujitsu Limited Thin film capacitor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3725454A1 (en) * 1987-07-31 1989-02-09 Siemens Ag ELECTRICAL MULTI-LAYER COMPONENT WITH A SINTERED, MONOLITHIC CERAMIC BODY AND METHOD FOR PRODUCING THE ELECTRICAL MULTI-LAYER COMPONENT
US5053916A (en) * 1989-03-13 1991-10-01 U.S. Philips Corporation Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor
US5195019A (en) * 1992-02-10 1993-03-16 Hertz Jerome J Bonding fired multilayer capacitors into a stack
JPH07169649A (en) * 1993-12-16 1995-07-04 Tdk Corp Multilayer through-type capacitor array

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0455496A2 (en) * 1990-05-03 1991-11-06 Oxley Developments Company Limited Multilayer discoidal capacitors
US5406446A (en) * 1993-04-29 1995-04-11 Fujitsu Limited Thin film capacitor

Also Published As

Publication number Publication date
JP2000512810A (en) 2000-09-26
US6321429B1 (en) 2001-11-27
EP0951724A2 (en) 1999-10-27
WO1998049698A2 (en) 1998-11-05
TW373200B (en) 1999-11-01
US6094336A (en) 2000-07-25

Similar Documents

Publication Publication Date Title
WO1998049698A3 (en) Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor
US4266091A (en) Layer-built laminated bus embedding condensers
US6470545B1 (en) Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
EP0172784A3 (en) Surface-area pressure transducer and line-selection circuit for use therewith
EP0823781A3 (en) Piezoelectric resonator, manufacturing method thereof, and electronic component using the piezoelectric resonator
EP0351851A3 (en) Method and apparatus for making a flexible interconnect
EP0662248A4 (en) Energy storage device and methods of manufacture
AU2357900A (en) Improved conductive polymer device and method for manufacturing same
EP0200327A3 (en) Improved double layer capacitors
DE50106829D1 (en) ELECTRIC MULTILAYER ELEMENT AND DESOLDERING WITH THE COMPONENT
US4616290A (en) Electric double layer capacitor
JPH0412609B2 (en)
CA1187953A (en) High capacitance bus bar including multilayer ceramic capacitors
DE69317049D1 (en) Flat insulation displacement contact for electrical connectors
SE8904254D0 (en) ADJUSTABLE MULTILAYERED CAPACITOR
DE69735858D1 (en) ACTIVE CARBON ELECTRODES FOR ELECTRIC DOUBLE-LAYER CAPACITORS
GB2152753A (en) Decoupling capacitor for integrated circuits and relationship with a printed circuit board
IE840748L (en) Distribution strip
MY114343A (en) End terminals for modular electrical assemblies with pressure relief
CA2281448A1 (en) High frequency low loss electrode
EP1589574A3 (en) Methods of forming capacitators, methods of forming capacitator-over-bit line memory circuitry, and related integrated circuitry constructions
EP0094873A3 (en) Improved conductive foils for solid dielectric capacitor
KR100206376B1 (en) Feed through type capacitor
GB2213322A (en) Terminating a flat wound capacitor used in a discharge circuit
JPH029547Y2 (en)

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

WWE Wipo information: entry into national phase

Ref document number: 1998905586

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 1998905586

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1998905586

Country of ref document: EP