WO1998044330A3 - Optical inspection module and method for detecting particles and defects on substrates in integrated process tools - Google Patents
Optical inspection module and method for detecting particles and defects on substrates in integrated process tools Download PDFInfo
- Publication number
- WO1998044330A3 WO1998044330A3 PCT/US1998/006222 US9806222W WO9844330A3 WO 1998044330 A3 WO1998044330 A3 WO 1998044330A3 US 9806222 W US9806222 W US 9806222W WO 9844330 A3 WO9844330 A3 WO 9844330A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- defects
- optical inspection
- inspection module
- substrates
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019997008951A KR100540314B1 (en) | 1997-03-31 | 1998-03-30 | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
AU69429/98A AU6942998A (en) | 1997-03-31 | 1998-03-30 | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
EP98915184.0A EP1016126B1 (en) | 1997-03-31 | 1998-03-30 | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
JP54189498A JP4527205B2 (en) | 1997-03-31 | 1998-03-30 | Optical inspection module and method for detecting particles and defects on a substrate in an integrated process tool |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4220297P | 1997-03-31 | 1997-03-31 | |
US60/042,202 | 1997-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998044330A2 WO1998044330A2 (en) | 1998-10-08 |
WO1998044330A3 true WO1998044330A3 (en) | 1998-12-23 |
Family
ID=21920611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/006222 WO1998044330A2 (en) | 1997-03-31 | 1998-03-30 | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
Country Status (6)
Country | Link |
---|---|
US (1) | US5909276A (en) |
EP (1) | EP1016126B1 (en) |
JP (1) | JP4527205B2 (en) |
KR (1) | KR100540314B1 (en) |
AU (1) | AU6942998A (en) |
WO (1) | WO1998044330A2 (en) |
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1998
- 1998-03-30 AU AU69429/98A patent/AU6942998A/en not_active Abandoned
- 1998-03-30 EP EP98915184.0A patent/EP1016126B1/en not_active Expired - Lifetime
- 1998-03-30 US US09/050,267 patent/US5909276A/en not_active Expired - Lifetime
- 1998-03-30 JP JP54189498A patent/JP4527205B2/en not_active Expired - Fee Related
- 1998-03-30 KR KR1019997008951A patent/KR100540314B1/en not_active IP Right Cessation
- 1998-03-30 WO PCT/US1998/006222 patent/WO1998044330A2/en active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4569695A (en) * | 1983-04-21 | 1986-02-11 | Nec Corporation | Method of cleaning a photo-mask |
US4692223A (en) * | 1985-05-15 | 1987-09-08 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for polishing silicon wafers |
US5317380A (en) * | 1991-02-19 | 1994-05-31 | Inspex, Inc. | Particle detection method and apparatus |
US5417537A (en) * | 1993-05-07 | 1995-05-23 | Miller; Kenneth C. | Wafer transport device |
US5479252A (en) * | 1993-06-17 | 1995-12-26 | Ultrapointe Corporation | Laser imaging system for inspection and analysis of sub-micron particles |
Also Published As
Publication number | Publication date |
---|---|
US5909276A (en) | 1999-06-01 |
WO1998044330A2 (en) | 1998-10-08 |
JP4527205B2 (en) | 2010-08-18 |
AU6942998A (en) | 1998-10-22 |
KR20010005875A (en) | 2001-01-15 |
KR100540314B1 (en) | 2006-01-10 |
EP1016126A4 (en) | 2009-04-01 |
JP2001519021A (en) | 2001-10-16 |
EP1016126B1 (en) | 2018-12-26 |
EP1016126A2 (en) | 2000-07-05 |
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