WO1998037767A1 - Wafer product and process of manufacture - Google Patents

Wafer product and process of manufacture Download PDF

Info

Publication number
WO1998037767A1
WO1998037767A1 PCT/EP1998/000820 EP9800820W WO9837767A1 WO 1998037767 A1 WO1998037767 A1 WO 1998037767A1 EP 9800820 W EP9800820 W EP 9800820W WO 9837767 A1 WO9837767 A1 WO 9837767A1
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
grid
wafer
squares
wafer product
Prior art date
Application number
PCT/EP1998/000820
Other languages
French (fr)
Inventor
Joanna Catherine Reeves
Vito Antonio Tricarico, Jr.
Original Assignee
Unilever Plc
Unilever N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unilever Plc, Unilever N.V. filed Critical Unilever Plc
Priority to EP98910660A priority Critical patent/EP0967881B1/en
Priority to SK1156-99A priority patent/SK115699A3/en
Priority to PCT/EP1998/000820 priority patent/WO1998037767A1/en
Priority to CA002282657A priority patent/CA2282657C/en
Priority to AU64970/98A priority patent/AU723771B2/en
Priority to PL98335280A priority patent/PL335280A1/en
Priority to BR9807762-7A priority patent/BR9807762A/en
Priority to PT98910660T priority patent/PT967881E/en
Priority to AT98910660T priority patent/ATE249745T1/en
Priority to IL13105598A priority patent/IL131055A/en
Priority to DE69818234T priority patent/DE69818234T2/en
Priority to JP53724498A priority patent/JP2001512981A/en
Publication of WO1998037767A1 publication Critical patent/WO1998037767A1/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D15/00—Preserving finished, partly finished or par-baked bakery products; Improving
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D13/00—Finished or partly finished bakery products
    • A21D13/40—Products characterised by the type, form or use
    • A21D13/45—Wafers
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D8/00—Methods for preparing or baking dough
    • A21D8/06—Baking processes

Definitions

  • the invention relates to a circular wafer product and a process for its manufacture.
  • Circular wafer products are well known in the art. However to date in order to achieve the required circular shape the wafer batter is introduced into a hot mould. Such use of a mould results in a crude, soggy wafer because the mould provides no outlet for the moisture during cooking.
  • Wafer products manufactured by the introduction of a wafer batter between heated flat plates are crisp, but because of preferential flow of the batter, it has not been possible to date to provide an approximately circular product.
  • the present invention therefore addresses the problem of how to provide an approximately circular wafer which also has the desired crispness.
  • the invention provides a crisp, approximately circular wafer product whereby the two surfaces of the wafer each have a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45° to the other, the second surface having a single grid pattern, the pattern being at 45° to the lower grid on the first surface.
  • each grid is formed by a pattern of squares .
  • the upper surface has preferably two superimposed grid patterns, the first (upper) grid being at a 45° orientation to the second (lower) grid.
  • the squares forming the pattern of the first grid on the first surface are larger compared to the squares forming the second grid of the first surface.
  • the squares forming the grid pattern on the second surface are smaller compared with the squares forming first grid pattern on the first surface.
  • the squares forming the grid pattern on the second surface are smaller compared with the squares forming either of the two superimposed grid patterns on the first surface.
  • the grid of the second surface preferably has the same orientation as the first grid of the first surface.
  • the wafers of the invention will generally be used as a component in a food product. Typically the wafer will be shaped and then filled with a food component, for example ice cream. Suggested products which may be produced are filled cones and Taco products.
  • the first surface of the wafer will form the outer surface of the filled product and the second surface will form the inner surface of the filled product.
  • the wafers are prepared by placing a wafer batter formulation between two heated plates having the required pattern engraved on the plates.
  • the plates will typically be at a temperature of from 185 to 215°C.
  • the wafer is oiled whist still hot (for example at a temperature of greater than or equal to 100°C) .
  • the wafer may either be formed into the required shape whilst still hot, or alternatively the wafer can be re-heated in order to be shaped.
  • the re-heating can be by any suitable means, however the preferred means of re-heating is by infra-red radiation as disclosed in our co-pending European application number 96306392.0
  • the wafer product of the invention For preparation of the wafer product of the invention the a wide number of wafer formulations can be used. It is believed to be well within the ability of the skilled person to determine which wafer compositions can suitably be used. Generally the wafers will be starch based e.g. made of wheat, rice, corn or other suitable flour. Other ingredients such as sugar, flavouring, emulsifier, milk ingredients, fat etc can be added. Preferably the wafer formulation comprises molasses .
  • wafers are prepared having a thickness of less than 3 mm, for example from 0.5 to 2.5 mm.
  • Figure 1 shows a first surface wafer pattern according to the invention.
  • Figure 2 shows a second surface wafer pattern according to the invention.
  • Figure 3 shows an end view of a wafer having a first surface pattern as shown in Figure 1 and a second surface pattern as shown in Figure 2.
  • Figure 4 shows a cross section through 4-4 of Figure 1 where the wafer has a first surface pattern as shown in Figure 1 and a second surface pattern as shown in Figure 2.
  • Figure 5 shows an alternative first surface pattern according to the invention.
  • Comparative Figure A shows a comparative surface pattern which does not provide a circular wafer product.
  • Comparative Figure B shows a second comparative surface pattern which does not provide a circular wafer product.
  • a wafer batter having the following formulation was prepared;
  • the batter was introduced between heated flat plates having a temperature of approximately 200°C and heated for 70 sees to provide a wafer.
  • the flat plates had been engraved with a pattern such that one surface of the wafer was provided with the pattern shown in Figure 1 and the other surface was provided with the pattern shown in Figure 2, the pattern in Figure 2 being at 45° to the smaller square grid of the pattern shown in Figure 1.
  • An approximately circular, crisp wafer was provided, as shown by Figures 1 and 2.
  • Example 1 was repeated except the heated flat plates used were engraved such that the wafer was provided with a first surface having a pattern as shown in Figure 5 and a second surface having a pattern as shown in Figure 2 , the pattern in Figure 2 being at 45° to the smaller square grid of the pattern shown in Figure 5.
  • Example 1 was repeated except that the heated flat plate was engraved such that the wafer was provided with a single surface having a pattern as shown in Figure A.
  • a wafer having the shape as shown in Figure A was produced. This shape is not sufficiently circular.
  • Example 1 was repeated except that the heated flat plate was engraved such that the wafer was provided with a single surface having a pattern as shown in Figure B. A wafer having the shape as shown in Figure B was produced. This shape is not sufficiently circular.

Abstract

A crisp, approximately circular wafer product is provided whereby the two surfaces of the wafer each has a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45° to the other, the second surface having a single grid pattern, the pattern being at 45° to the lower grid on the first surface.

Description

Wafer Product and Process of Manufacture
Technical Field of the Invention
The invention relates to a circular wafer product and a process for its manufacture.
Background to the Invention
Circular wafer products are well known in the art. However to date in order to achieve the required circular shape the wafer batter is introduced into a hot mould. Such use of a mould results in a crude, soggy wafer because the mould provides no outlet for the moisture during cooking.
Wafer products manufactured by the introduction of a wafer batter between heated flat plates are crisp, but because of preferential flow of the batter, it has not been possible to date to provide an approximately circular product.
The present invention therefore addresses the problem of how to provide an approximately circular wafer which also has the desired crispness.
Surprisingly this problem can be solved if a specific pattern is formed by ridges on both sides of the wafer. Description of the Invention
Accordingly the invention provides a crisp, approximately circular wafer product whereby the two surfaces of the wafer each have a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45° to the other, the second surface having a single grid pattern, the pattern being at 45° to the lower grid on the first surface.
Preferably each grid is formed by a pattern of squares .
The upper surface has preferably two superimposed grid patterns, the first (upper) grid being at a 45° orientation to the second (lower) grid.
Preferably the squares forming the pattern of the first grid on the first surface are larger compared to the squares forming the second grid of the first surface.
Preferably the squares forming the grid pattern on the second surface are smaller compared with the squares forming first grid pattern on the first surface. Most preferably the squares forming the grid pattern on the second surface are smaller compared with the squares forming either of the two superimposed grid patterns on the first surface.
The grid of the second surface preferably has the same orientation as the first grid of the first surface. The wafers of the invention will generally be used as a component in a food product. Typically the wafer will be shaped and then filled with a food component, for example ice cream. Suggested products which may be produced are filled cones and Taco products.
Preferably when a filled product is prepared, the first surface of the wafer will form the outer surface of the filled product and the second surface will form the inner surface of the filled product.
The wafers are prepared by placing a wafer batter formulation between two heated plates having the required pattern engraved on the plates. The plates will typically be at a temperature of from 185 to 215°C.
Preferably the wafer is oiled whist still hot (for example at a temperature of greater than or equal to 100°C) .
If a shaped rather than a flat wafer is required, the wafer may either be formed into the required shape whilst still hot, or alternatively the wafer can be re-heated in order to be shaped. The re-heating can be by any suitable means, however the preferred means of re-heating is by infra-red radiation as disclosed in our co-pending European application number 96306392.0
For preparation of the wafer product of the invention the a wide number of wafer formulations can be used. It is believed to be well within the ability of the skilled person to determine which wafer compositions can suitably be used. Generally the wafers will be starch based e.g. made of wheat, rice, corn or other suitable flour. Other ingredients such as sugar, flavouring, emulsifier, milk ingredients, fat etc can be added. Preferably the wafer formulation comprises molasses .
Preferably wafers are prepared having a thickness of less than 3 mm, for example from 0.5 to 2.5 mm.
Drawings
The invention will now be further illustrated by the following drawings ;
Figure 1 shows a first surface wafer pattern according to the invention.
Figure 2 shows a second surface wafer pattern according to the invention.
Figure 3 shows an end view of a wafer having a first surface pattern as shown in Figure 1 and a second surface pattern as shown in Figure 2.
Figure 4 shows a cross section through 4-4 of Figure 1 where the wafer has a first surface pattern as shown in Figure 1 and a second surface pattern as shown in Figure 2. Figure 5 shows an alternative first surface pattern according to the invention.
Comparative Figure A shows a comparative surface pattern which does not provide a circular wafer product.
Comparative Figure B shows a second comparative surface pattern which does not provide a circular wafer product.
Examples
The invention will now be further illustrated by the following examples.
Example 1
A wafer batter having the following formulation was prepared;
Ingredient wt%
Flour 38 . 82
Sucrose 18 . . 63 Molasses 3 . . 88
Invert Sugar 1 . . 79 Oil & Lecithin 1 , . 00 Salt 0 . . 93 Water to 100
The batter was introduced between heated flat plates having a temperature of approximately 200°C and heated for 70 sees to provide a wafer. The flat plates had been engraved with a pattern such that one surface of the wafer was provided with the pattern shown in Figure 1 and the other surface was provided with the pattern shown in Figure 2, the pattern in Figure 2 being at 45° to the smaller square grid of the pattern shown in Figure 1. An approximately circular, crisp wafer was provided, as shown by Figures 1 and 2.
Example 2
Example 1 was repeated except the heated flat plates used were engraved such that the wafer was provided with a first surface having a pattern as shown in Figure 5 and a second surface having a pattern as shown in Figure 2 , the pattern in Figure 2 being at 45° to the smaller square grid of the pattern shown in Figure 5.
An approximately circular, crisp wafer was provided.
Comparative Example A
Example 1 was repeated except that the heated flat plate was engraved such that the wafer was provided with a single surface having a pattern as shown in Figure A.
A wafer having the shape as shown in Figure A was produced. This shape is not sufficiently circular.
Comparative Example B
Example 1 was repeated except that the heated flat plate was engraved such that the wafer was provided with a single surface having a pattern as shown in Figure B. A wafer having the shape as shown in Figure B was produced. This shape is not sufficiently circular.

Claims

Claims
1. A crisp, approximately circular wafer product whereby the two surfaces of the wafer each have a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45┬░ to the other, the second surface having a single grid pattern, the pattern being at 45┬░ to the lower grid on the first surface.
2. A wafer product according to claim 1 wherein each grid is formed by a pattern of squares.
3. A wafer according to claim 2 wherein a first grid of the first surface is of squares larger compared to the squares forming a second grid of said first surface.
4. A wafer product according to claim 2 wherein the squares forming the grid pattern on the second surface are smaller compared with the squares forming the first grid pattern on the first surface.
5. A wafer product according to claim 2 wherein the squares forming the grid pattern on the second surface are smaller compared with the squares forming either of the first and second grid patterns on the first surface.
6. A wafer a ccording to claim 2 wherein the grid of the second surface preferably has the same orientation as the first grid of the first surface.
PCT/EP1998/000820 1997-02-27 1998-02-13 Wafer product and process of manufacture WO1998037767A1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
EP98910660A EP0967881B1 (en) 1997-02-27 1998-02-13 Wafer product
SK1156-99A SK115699A3 (en) 1997-02-27 1998-02-13 A crisp, approximately circular wafer product
PCT/EP1998/000820 WO1998037767A1 (en) 1997-02-27 1998-02-13 Wafer product and process of manufacture
CA002282657A CA2282657C (en) 1997-02-27 1998-02-13 Wafer product and process of manufacture
AU64970/98A AU723771B2 (en) 1997-02-27 1998-02-13 Wafer product and process of manufacture
PL98335280A PL335280A1 (en) 1997-02-27 1998-02-13 Wafer-based product and method of making same
BR9807762-7A BR9807762A (en) 1997-02-27 1998-02-13 Roughly toasted circular wafer product.
PT98910660T PT967881E (en) 1997-02-27 1998-02-13 BOLACHA PRODUCT
AT98910660T ATE249745T1 (en) 1997-02-27 1998-02-13 WAFFLE PRODUCT
IL13105598A IL131055A (en) 1997-02-27 1998-02-13 Wafer product and process of manufacture
DE69818234T DE69818234T2 (en) 1997-02-27 1998-02-13 WAFFLE PRODUCT
JP53724498A JP2001512981A (en) 1997-02-27 1998-02-13 Wafer product and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97200556.5 1997-02-27
PCT/EP1998/000820 WO1998037767A1 (en) 1997-02-27 1998-02-13 Wafer product and process of manufacture

Publications (1)

Publication Number Publication Date
WO1998037767A1 true WO1998037767A1 (en) 1998-09-03

Family

ID=8166872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/000820 WO1998037767A1 (en) 1997-02-27 1998-02-13 Wafer product and process of manufacture

Country Status (1)

Country Link
WO (1) WO1998037767A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT512716A1 (en) * 2012-03-30 2013-10-15 Haas Food Equipment Gmbh Process for the continuous production of rolling waffles with a mourning texture

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696734A (en) * 1971-07-08 1972-10-10 Mc Graw Edison Co Commercial waffle baker
EP0107289A2 (en) * 1982-09-01 1984-05-02 Schwan's Sales Enterprises, Inc. Fried pizza crusts
US5131320A (en) * 1990-08-26 1992-07-21 Little Factories, Inc. Image-forming griddle
DE4239143A1 (en) * 1992-07-10 1994-01-13 Sadaharu Ito Prodn. of edible containers esp. for soft ice-cream - by baking, softening dough by moistening and seal-packing for use, heating, drying and moulding to required shape, and hardening by cooling

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696734A (en) * 1971-07-08 1972-10-10 Mc Graw Edison Co Commercial waffle baker
EP0107289A2 (en) * 1982-09-01 1984-05-02 Schwan's Sales Enterprises, Inc. Fried pizza crusts
US5131320A (en) * 1990-08-26 1992-07-21 Little Factories, Inc. Image-forming griddle
DE4239143A1 (en) * 1992-07-10 1994-01-13 Sadaharu Ito Prodn. of edible containers esp. for soft ice-cream - by baking, softening dough by moistening and seal-packing for use, heating, drying and moulding to required shape, and hardening by cooling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT512716A1 (en) * 2012-03-30 2013-10-15 Haas Food Equipment Gmbh Process for the continuous production of rolling waffles with a mourning texture

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