WO1998032314A3 - Solder joints for surface mount chips - Google Patents

Solder joints for surface mount chips Download PDF

Info

Publication number
WO1998032314A3
WO1998032314A3 PCT/IB1997/001602 IB9701602W WO9832314A3 WO 1998032314 A3 WO1998032314 A3 WO 1998032314A3 IB 9701602 W IB9701602 W IB 9701602W WO 9832314 A3 WO9832314 A3 WO 9832314A3
Authority
WO
WIPO (PCT)
Prior art keywords
solder
mounting pads
surface mount
pads
solder joint
Prior art date
Application number
PCT/IB1997/001602
Other languages
French (fr)
Other versions
WO1998032314A2 (en
Inventor
Richard Keith Ii Mcmillan
Vivek Amir Jairazbhoy
Yi-Hsin Pao
Original Assignee
Ford Global Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Global Tech Inc filed Critical Ford Global Tech Inc
Priority to DE69709172T priority Critical patent/DE69709172T2/en
Priority to JP53403498A priority patent/JP2001508949A/en
Priority to CA002278019A priority patent/CA2278019A1/en
Priority to EP97947200A priority patent/EP0953277B1/en
Priority to BR9714289-1A priority patent/BR9714289A/en
Publication of WO1998032314A2 publication Critical patent/WO1998032314A2/en
Publication of WO1998032314A3 publication Critical patent/WO1998032314A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/306—Lifting the component during or after mounting; Increasing the gap between component and PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

There is disclosed herein a surface mount printed circuit board having a substrate (10), at least one surface mount device (14), at least two mounting pads (12) per device (14), solder joints (24) connecting the terminations (22) of the device (14) to their respective mounting pads (12), at least one rectangular lifter pad (30) on the substrate (10) amid the mounting pads (12), and a solder mass (32) on each lifter pad (30) in contact with the bottom surface (18) of the device (14). The solder joint (24) has preferably convex outer fillets (28), the device (14) is maintained at a predetermined height (ho) above the mounting pads (12), the inner fillet angle (α) is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased (li and lo). An alternative embodiment also includes plugged vias (34) under the lifter pads (30) and/or mounting pads (12), with gas pockets (40) trapped between the solder masses (32)/solder joints (24) and the plugged vias (34). This trapped gas pocket (40) provides additional buoyant force upon the SMD (14) during reflow.
PCT/IB1997/001602 1997-01-16 1997-12-29 Solder joints for surface mount chips WO1998032314A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE69709172T DE69709172T2 (en) 1997-01-16 1997-12-29 OPTIMIZED SOLDERING CONNECTIONS FOR SURFACE MOUNTED CHIPS
JP53403498A JP2001508949A (en) 1997-01-16 1997-12-29 Optimal brazing for surface mounting chips
CA002278019A CA2278019A1 (en) 1997-01-16 1997-12-29 Solder joints for surface mount chips
EP97947200A EP0953277B1 (en) 1997-01-16 1997-12-29 Optimized solder joints for surface mount chips
BR9714289-1A BR9714289A (en) 1997-01-16 1997-12-29 Weld joints optimized for surface-mounted chips

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/786,389 US5936846A (en) 1997-01-16 1997-01-16 Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips
US08/786,389 1997-01-16

Publications (2)

Publication Number Publication Date
WO1998032314A2 WO1998032314A2 (en) 1998-07-23
WO1998032314A3 true WO1998032314A3 (en) 1999-06-03

Family

ID=25138437

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1997/001602 WO1998032314A2 (en) 1997-01-16 1997-12-29 Solder joints for surface mount chips

Country Status (10)

Country Link
US (1) US5936846A (en)
EP (1) EP0953277B1 (en)
JP (1) JP2001508949A (en)
CN (1) CN1245007A (en)
BR (1) BR9714289A (en)
CA (1) CA2278019A1 (en)
DE (1) DE69709172T2 (en)
ES (1) ES2167797T3 (en)
PT (1) PT953277E (en)
WO (1) WO1998032314A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1014767A1 (en) * 1998-12-23 2000-06-28 Lucent Technologies Inc. Thermal stress relief for surface mount components using via filling
KR100843737B1 (en) * 2002-05-10 2008-07-04 페어차일드코리아반도체 주식회사 Semiconductor package having improved reliability of solder joint
US7049051B2 (en) * 2003-01-23 2006-05-23 Akustica, Inc. Process for forming and acoustically connecting structures on a substrate
TWI243462B (en) * 2004-05-14 2005-11-11 Advanced Semiconductor Eng Semiconductor package including passive component
JP4557676B2 (en) * 2004-10-27 2010-10-06 京セラ株式会社 Mounting structure of semiconductor device
DE102005017527A1 (en) * 2005-04-15 2006-11-02 Osram Opto Semiconductors Gmbh Surface-mountable optoelectronic component
DE102006054085A1 (en) * 2006-11-16 2008-05-29 Epcos Ag Component arrangement
US7893545B2 (en) * 2007-07-18 2011-02-22 Infineon Technologies Ag Semiconductor device
US7830022B2 (en) * 2007-10-22 2010-11-09 Infineon Technologies Ag Semiconductor package
US8399995B2 (en) * 2009-01-16 2013-03-19 Infineon Technologies Ag Semiconductor device including single circuit element for soldering
DE102009060060A1 (en) * 2009-12-22 2011-06-30 Rohde & Schwarz GmbH & Co. KG, 81671 Retaining element for captive assembly of a screw
JP5552882B2 (en) * 2010-04-26 2014-07-16 株式会社デンソー Mounting structure of surface mount semiconductor package
JP5389748B2 (en) * 2010-06-18 2014-01-15 日本メクトロン株式会社 Electronic component surface mounting method and printed circuit board manufactured using the method
US8604356B1 (en) * 2010-11-12 2013-12-10 Amkor Technology, Inc. Electronic assembly having increased standoff height
CN102522347B (en) * 2011-12-23 2015-04-29 清华大学 Method for manufacturing solder bump
JP2014110370A (en) * 2012-12-04 2014-06-12 Seiko Epson Corp Base substrate, mounting structure, module, electronic equipment, and mobile object
JP5646021B2 (en) * 2012-12-18 2014-12-24 積水化学工業株式会社 Semiconductor package
US9622356B2 (en) * 2013-03-14 2017-04-11 Lockheed Martin Corporation Electronic package mounting
US9237655B1 (en) 2013-03-15 2016-01-12 Lockheed Martin Corporation Material deposition on circuit card assemblies
AT515071B1 (en) * 2013-09-03 2019-03-15 Zkw Group Gmbh Method for positionally stable soldering
JP6481446B2 (en) * 2014-06-13 2019-03-13 株式会社村田製作所 Multilayer capacitor mounting structure
US9634053B2 (en) 2014-12-09 2017-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor chip sidewall interconnection
CN113694796B (en) * 2021-10-14 2022-02-08 深圳市澳华集团股份有限公司 Dissolving device for producing intestinal immunopotentiator and use method thereof
US11839031B2 (en) * 2022-04-06 2023-12-05 Western Digital Technologies, Inc. Micro solder joint and stencil aperture design

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3536431A1 (en) * 1985-10-12 1987-04-16 Standard Elektrik Lorenz Ag Soldering of surface mounted devices (SMDs)
US5051339A (en) * 1988-03-29 1991-09-24 Dieter Friedrich Method and apparatus for applying solder to printed wiring boards by immersion
DE4137045A1 (en) * 1991-11-11 1993-05-13 Siemens Ag METHOD FOR PRODUCING SOLDER AREAS ON A CIRCUIT BOARD AND SOLDER PASTE FILM FOR CARRYING OUT THE METHOD
WO1993023981A1 (en) * 1992-05-12 1993-11-25 Mask Technology, Inc. Method, apparatus and product for surface mount solder joints
DE4402545A1 (en) * 1993-02-05 1994-08-11 Ncr Int Inc Method for the formation of discrete solder points on corresponding contact connection surfaces on a printed circuit board
WO1996020580A1 (en) * 1994-12-23 1996-07-04 Ford Motor Company Optimally shaped solder joints

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3684602D1 (en) * 1986-10-08 1992-04-30 Ibm METHOD FOR PRODUCING SOLDER CONTACTS FOR A CERAMIC MODULE WITHOUT PLUGS.
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
US4760948A (en) * 1986-12-23 1988-08-02 Rca Corporation Leadless chip carrier assembly and method
JPH01251789A (en) * 1988-03-31 1989-10-06 Toshiba Corp Printed board
JP2761113B2 (en) * 1991-02-25 1998-06-04 松下電工株式会社 Printed wiring board
US5315070A (en) * 1991-12-02 1994-05-24 Siemens Aktiengesellschaft Printed wiring board to which solder has been applied
CA2089435C (en) * 1992-02-14 1997-12-09 Kenzi Kobayashi Semiconductor device
KR100280762B1 (en) * 1992-11-03 2001-03-02 비센트 비.인그라시아 Thermally Reinforced Semiconductor Devices Having Exposed Backsides and Methods of Manufacturing the Same
JP3152834B2 (en) * 1993-06-24 2001-04-03 株式会社東芝 Electronic circuit device
US5400950A (en) * 1994-02-22 1995-03-28 Delco Electronics Corporation Method for controlling solder bump height for flip chip integrated circuit devices
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3536431A1 (en) * 1985-10-12 1987-04-16 Standard Elektrik Lorenz Ag Soldering of surface mounted devices (SMDs)
US5051339A (en) * 1988-03-29 1991-09-24 Dieter Friedrich Method and apparatus for applying solder to printed wiring boards by immersion
DE4137045A1 (en) * 1991-11-11 1993-05-13 Siemens Ag METHOD FOR PRODUCING SOLDER AREAS ON A CIRCUIT BOARD AND SOLDER PASTE FILM FOR CARRYING OUT THE METHOD
WO1993023981A1 (en) * 1992-05-12 1993-11-25 Mask Technology, Inc. Method, apparatus and product for surface mount solder joints
DE4402545A1 (en) * 1993-02-05 1994-08-11 Ncr Int Inc Method for the formation of discrete solder points on corresponding contact connection surfaces on a printed circuit board
WO1996020580A1 (en) * 1994-12-23 1996-07-04 Ford Motor Company Optimally shaped solder joints

Also Published As

Publication number Publication date
DE69709172D1 (en) 2002-01-24
EP0953277A2 (en) 1999-11-03
US5936846A (en) 1999-08-10
CN1245007A (en) 2000-02-16
BR9714289A (en) 2000-04-25
PT953277E (en) 2002-06-28
ES2167797T3 (en) 2002-05-16
JP2001508949A (en) 2001-07-03
DE69709172T2 (en) 2002-05-02
WO1998032314A2 (en) 1998-07-23
EP0953277B1 (en) 2001-12-12
CA2278019A1 (en) 1998-07-23

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