WO1998030356A1 - Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto - Google Patents
Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto Download PDFInfo
- Publication number
- WO1998030356A1 WO1998030356A1 PCT/US1998/000317 US9800317W WO9830356A1 WO 1998030356 A1 WO1998030356 A1 WO 1998030356A1 US 9800317 W US9800317 W US 9800317W WO 9830356 A1 WO9830356 A1 WO 9830356A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pad
- precursor
- pattern
- accordance
- photomask
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
Definitions
- the design of the surface pattern can be readily changed in accordance with the methods of the present invention, this invention is particularly well suited to low volume production of customized patterns relative to conventional molding techniques.
- Pad design can be optimized for specific integrated circuit designs.
- the present invention provides advantages over the prior art in modifying and customizing polishing pad designs, particularly on a prototyping or other similar-type low volume production.
- the precursor is applied to the photodish by curtain coating, doctor blading, spin coating, screen printing, ink jet printing or any similar-type conventional or non-conventional coating technique.
- the photo-curing is accomplished from above the precursor, and photo-curing radiation from below is unnecessary. Consequently, in such an embodiment, any support substrate would be appropriate and need not be a photo-curing transparent substrate, i.e., a photodish.
- FIGURE 2 is a cross-sectional view of a pad surface configuration manufactured in accordance with the present invention.
- a similar-type ultraviolet light source was then applied from above the surface of the precursor material, thereby causing photocuring of the top (non-patterned) side of the precursor material. Exposure time for the upper and lower ultraviolet light source was about 20-30 seconds from the top and aboui 15 seconds from the bottom. The precursor material was then
- two different reactive base polymers 30 and 40 having different properties are used to coat a substrate 50 to create a surface layer having a gradient of properties.
- Substrate 50 and reactive coating 40 have equivalent low hardness while coating 30 has a higher hardness.
- coatings of each material in turn are formed and reacted as described above. This produces a fully reacted intermediate layer on top of which is applied the next layer in the desired sequence.
- the coating materials are combined to give a simple hard top coat over two softer underlayers.
- multiple layers are alternated to give a step approximation to a hardness gradient in the surface.
- Figures 5 a-d illustrate a technique for preparing a textured pad having flow channels in the surface.
- a reactive polymer base 60 is spread onto a substrate 70 to form a contiguous uniform surface layer.
- a mask 80 with opaque and transmissive area is placed onto or proximate to the outer surface of the layer.
- the reactive polymer 60 polymerizes only where light is transmitted (64), leaving the remainder 62 of the layer in an unreacted form.
- the article is washed in an appropriate solvent to remove the unpolymerized portion of the surface layer to produce a series of flow channels in the final surface.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98903401A EP0984846B1 (en) | 1997-01-13 | 1998-01-12 | Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern |
KR10-1999-7006289A KR100487455B1 (en) | 1997-01-13 | 1998-01-12 | Polymeric Polishing Pad Having Photolithographically Induced Surface Pattern(s) and Methods Relating Thereto |
JP53109098A JP4163756B2 (en) | 1997-01-13 | 1998-01-12 | Polymer polishing pad having a surface pattern formed by photolithography and method related thereto |
DE69827789T DE69827789T2 (en) | 1997-01-13 | 1998-01-12 | METHOD FOR PRODUCING A PHOTOLITHOGRAPHICALLY PATTERNED PLASTIC POLISHING PILLOW |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3449297P | 1997-01-13 | 1997-01-13 | |
US60/034,492 | 1997-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998030356A1 true WO1998030356A1 (en) | 1998-07-16 |
Family
ID=21876756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/000317 WO1998030356A1 (en) | 1997-01-13 | 1998-01-12 | Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto |
Country Status (6)
Country | Link |
---|---|
US (2) | US6036579A (en) |
EP (1) | EP0984846B1 (en) |
JP (1) | JP4163756B2 (en) |
KR (1) | KR100487455B1 (en) |
DE (1) | DE69827789T2 (en) |
WO (1) | WO1998030356A1 (en) |
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US6234875B1 (en) | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
WO2001064396A1 (en) * | 2000-02-28 | 2001-09-07 | Rodel Holdings, Inc. | Polishing pad surface texture formed by solid phase droplets |
WO2001083167A1 (en) * | 2000-05-03 | 2001-11-08 | Rodel Holdings, Inc. | Polishing pad with a seam which is reinforced with caulking material |
WO2001091972A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
EP1161322A1 (en) * | 1999-01-21 | 2001-12-12 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
WO2001094074A1 (en) * | 2000-06-05 | 2001-12-13 | Speedfam-Ipec Corporation | Polishing pad window for a chemical-mechanical polishing tool |
JP2002141315A (en) * | 2000-11-02 | 2002-05-17 | Hitachi Chem Co Ltd | Cmp pad for cerium oxide polishing agent and polishing method of substrate |
US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
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US7192340B2 (en) | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
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US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10384330B2 (en) | 2014-10-17 | 2019-08-20 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
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US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
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US6290589B1 (en) * | 1998-12-09 | 2001-09-18 | Applied Materials, Inc. | Polishing pad with a partial adhesive coating |
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Cited By (41)
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EP1161322A1 (en) * | 1999-01-21 | 2001-12-12 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
EP1161322A4 (en) * | 1999-01-21 | 2003-09-24 | Rodel Inc | Improved polishing pads and methods relating thereto |
US6234875B1 (en) | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
WO2001064396A1 (en) * | 2000-02-28 | 2001-09-07 | Rodel Holdings, Inc. | Polishing pad surface texture formed by solid phase droplets |
WO2001083167A1 (en) * | 2000-05-03 | 2001-11-08 | Rodel Holdings, Inc. | Polishing pad with a seam which is reinforced with caulking material |
WO2001091972A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
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US6685537B1 (en) | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
JP2003535484A (en) * | 2000-06-05 | 2003-11-25 | スピードファム−アイピーイーシー コーポレイション | Polishing pad window used in chemical mechanical polishing (CMP) tool |
GB2379627A (en) * | 2000-06-05 | 2003-03-19 | Speedfam Ipec Corp | Polishing pad window for a chemical-mechanical polishing tool |
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Also Published As
Publication number | Publication date |
---|---|
DE69827789T2 (en) | 2005-11-10 |
EP0984846A1 (en) | 2000-03-15 |
US6210254B1 (en) | 2001-04-03 |
JP4163756B2 (en) | 2008-10-08 |
EP0984846B1 (en) | 2004-11-24 |
KR20000070068A (en) | 2000-11-25 |
US6036579A (en) | 2000-03-14 |
EP0984846A4 (en) | 2000-03-15 |
KR100487455B1 (en) | 2005-05-09 |
DE69827789D1 (en) | 2004-12-30 |
JP2001507997A (en) | 2001-06-19 |
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