WO1998022860A3 - Computer aided inspection machine - Google Patents

Computer aided inspection machine Download PDF

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Publication number
WO1998022860A3
WO1998022860A3 PCT/US1997/020431 US9720431W WO9822860A3 WO 1998022860 A3 WO1998022860 A3 WO 1998022860A3 US 9720431 W US9720431 W US 9720431W WO 9822860 A3 WO9822860 A3 WO 9822860A3
Authority
WO
WIPO (PCT)
Prior art keywords
points
analyzed
dimensions
disclosed
structured light
Prior art date
Application number
PCT/US1997/020431
Other languages
French (fr)
Other versions
WO1998022860A2 (en
Inventor
B Shawn Buckley
Jihong Chen
Dao Shan Yang
Hui Cheng Zhou
Original Assignee
B Shawn Buckley
Jihong Chen
Dao Shan Yang
Hui Cheng Zhou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by B Shawn Buckley, Jihong Chen, Dao Shan Yang, Hui Cheng Zhou filed Critical B Shawn Buckley
Priority to AU51746/98A priority Critical patent/AU5174698A/en
Publication of WO1998022860A2 publication Critical patent/WO1998022860A2/en
Publication of WO1998022860A3 publication Critical patent/WO1998022860A3/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/024Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning

Abstract

An automatic inspection method and apparatus using structured light (3) and machine vision cameras (2) to inspect an object (4) in conjunction with the geometric model of the object (4) is disclosed. Camera images of the object (4) are analyzed by computer to produce the location of points on the object's surface in three dimensions. During a setup phase before object inspection, the points are analyzed with respect to the geometric model computer file of the object (4). Many points are eliminated to reduce data-taking and analysis time to a minimum and to prevent extraneous reflections from producing errors. When similar objects are subsequently inspected, points from each surface of interest are spatially averaged to give high accuracy measurements of object (4) dimensions. The inspection device uses several multiplexed sensors, each composed of a camera (2) and a structured light source (3), to measure all sides of the object (4) on a single pass. Calibration and compensation methods are also disclosed.
PCT/US1997/020431 1996-11-08 1997-11-07 Computer aided inspection machine WO1998022860A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU51746/98A AU5174698A (en) 1996-11-08 1997-11-07 Computer aided inspection machine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3077196P 1996-11-08 1996-11-08
US60/030,771 1996-11-08

Publications (2)

Publication Number Publication Date
WO1998022860A2 WO1998022860A2 (en) 1998-05-28
WO1998022860A3 true WO1998022860A3 (en) 2000-08-24

Family

ID=21855929

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/020431 WO1998022860A2 (en) 1996-11-08 1997-11-07 Computer aided inspection machine

Country Status (3)

Country Link
US (1) US6064759A (en)
AU (1) AU5174698A (en)
WO (1) WO1998022860A2 (en)

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