WO1997013392A2 - Button contact for surface mounting an ic device to a circuit board - Google Patents

Button contact for surface mounting an ic device to a circuit board Download PDF

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Publication number
WO1997013392A2
WO1997013392A2 PCT/US1996/015191 US9615191W WO9713392A2 WO 1997013392 A2 WO1997013392 A2 WO 1997013392A2 US 9615191 W US9615191 W US 9615191W WO 9713392 A2 WO9713392 A2 WO 9713392A2
Authority
WO
WIPO (PCT)
Prior art keywords
contact
button
suppoπ
plane
points
Prior art date
Application number
PCT/US1996/015191
Other languages
French (fr)
Inventor
Inc. Oz Technologies
Nasser Barabi
Iraj Barabi
Original Assignee
Oz Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oz Technologies Inc filed Critical Oz Technologies Inc
Publication of WO1997013392A2 publication Critical patent/WO1997013392A2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Definitions

  • the present mvention generally relates to surface mounted integrated circuit (IC) devices, and more particularly to achieving a solderless connections between a leadless IC device and a printed circuit (PC) board.
  • IC surface mounted integrated circuit
  • PC printed circuit
  • the invention finds parucular application in connection with the burn-in and test of leadless IC devices such as used with ball grid array (BGA) surface mount techmques.
  • BGA ball grid array
  • test sockets for leadless IC devices most commonly employ stamped or formed metal contact pins for achieving electncal interconnection between the I/O contacts of the IC device being tested and the PC test board circuits.
  • Such socket designs have a relatively high profile and relatively high capacitance and inductance making them undesirable for high speed applications. They also require soldering of the socket pins to the PC board and do not operate efficiently with IC devices havmg non-compliant I/O contacts
  • Sockets having elastomeric contactors which do not require soldering have also been devised.
  • These sockets utilize flexible wire filaments which extend in a perpendicular relation to the contact points. Such wire filaments are generally not reliable and will not hold up with repetitive use. In addition, they are not likely to withstand the thermal shock encountered while testing an IC device.
  • the present mvention overcomes the disadvantages of conventional sockets for leadless IC devices by providmg a solderless elect ⁇ cal interconnection between a PC board and the IC device which is suitable for high frequency circuits, which will operate at extreme temperatures, and which withstands repeated insertions and extractions of the IC device from the IC socket While the invention is pa ⁇ icularly suited to use with sockets for test and burn-m procedures, it can be used in any application requiring the surface mounting of a leadless IC device to a PC board.
  • each button contact includes a body having opposed contact faces.
  • the body of the bu ⁇ on contact which can be suitably fabricated in approximately 5 mil. metal sheet material such as beryllium copper, lies in a plane and provides a conductive path of a substantial cross-section between its two contact faces.
  • At least one contact point protrudes from at least one of the opposed contact faces of the body, and preferably two oppositely directed contact points will be provided, one for each of the body's opposed contact faces.
  • the contact points which suitable can be gold points bonded to the faces of the body, act to extend the conductive path between the contact faces in a direction generally pe ⁇ endicular to the plane of the body. These contact points are inwardly displaceable to accommodate any lack of coplanarity in the contact surfaces of uie surface mounted components. To permit repeated use and to provide an efficient contact, the contact points of the button contacts are also preferably resiliently displaceable so as to provide a spring-loaded contact.
  • the body of the button contact is comprised of a perimeter portion and deflectable contact support portions extending of the perimeter portion for carrying me contact points.
  • the deflectable contact suppo ⁇ po ⁇ ions of ⁇ e body are in the form of resiliently deflectable contact suppo ⁇ arms which extend inwardly of the perimeter po ⁇ ion, with the contact points being positioned at the distal end of the suppo ⁇ arms.
  • a contact button array that matches the I/O contacts of a surface mounted IC device is provided by securing a plurality of button contacts in accordance with the invention to one side of a thin insulator backing material, preferably a polymide material such as KaptonTM tape, and etching out po ⁇ ions of the backing material at the point of securement of me plurality of button contacts to expose their face-down contact points.
  • a thin insulator backing material preferably a polymide material such as KaptonTM tape
  • a primary object of the present invention is to provide an efficient, solderless contact between a leadless IC device and a PC board. Another object of the invention is to provide a contact which has a low profile, and low capacitance and inductance characteristics. It is a further object of the invention to provide a contact which can withstand the thermal stress of bum-in and test applications. Yet objects of the invention will be apparent from the following specification and claims.
  • FIG. 1 is an exploded perspective view of a test socket for an IC device utilizing a button contact array in accordance with the present invention.
  • FIG. 2 is an enlarged fragmentary view of a po ⁇ ion of the button contact array shown in FIG. 1.
  • FIG. 3 is a top plan view of the button contact array shown in FIG. 2.
  • FIG. 3 A is an enlarged top plan view of an individual bu ⁇ on contact as shown in FIG. 3.
  • FIG. 4 is a cross-sectional view in side elevation of the bu ⁇ on contact array of FIG. 3 taken along section lines 4-4.
  • FIG. 1 illustrates the means by which a leadless IC device 11 can be surface mounted to a PC board 13 by means of a contact bu ⁇ on array 15 in accordance with the invention.
  • the button contact array elements are the sole means by which the I/O contacts (not shown) of the IC device are electrically interconnected to dieir corresponding circuit contacts 17 on die PC board.
  • the bu ⁇ on contact a ⁇ ay which is further described below, is a generally thin, flexible, and rectangularly shaped element that can be sandwiched between the IC device and the PC board.
  • the array is seen to have a plurality of individual contacts 19 generally shaped like bu ⁇ ons and arranged in a rectangular matrix which causes the bu ⁇ on contacts to overlie the individual circuit contacts of the circuit contact a ⁇ ay 17 of the PC board.
  • Locator pins 21 and locator holes 23 are provided, respectively, on the PC board and the bu ⁇ on contact array to permit precise location of the array.
  • the IC chip 11 is in m mounted over the bu ⁇ on contact array by means of carrier assembly 25 which includes a carrier frame 27, cover plate 29, and hold-down latches 31. It is noted that the locator pins 21 on the PC board are also used to align the carrier frame. This is done by providing me bottom of the carrier frame with locator pin holes (not shown). To ensure mat a good electrical interconnection is achieved through the button contact array, the IC chip 1 1 must be mounted firmly to the PC board. In the FIG. 1 embodiment, this is accomplished by first screwing the carrier frame 27 into the threaded holes 33 in the PC board through screw openings 35 of the carrier frame. Flat head screws (not shown) are most suitably used for mis purpose.
  • the IC device 11 can be received by and firmly held in the carrier frame by inse ⁇ ing die IC device into me frame's central opening 37 and placing die assembly's cover plate 29 over carrier frame 27 such that me cover plate's bottom plug 39 (shown in phantom lines) extends into opening 37 to press against me top of die IC device. Latches 31 are then closed to firmly hold the assembly together.
  • FIGS. 2-4 show the individual button contacts and button contact array of the invention in greater detail.
  • the button contacts 19 include a substantially flat body 41 which lies in a plane and which has two opposed, oppositely directed contact faces 43, 45.
  • the body of the button contact is made up of a perimeter po ⁇ ion 47 and two resiliently deflectable contact suppo ⁇ po ⁇ ions in the form of two parallel and resiliently deflectable contact suppo ⁇ arms 49 which extend inwardly toward each other from opposite sides of the perimeter po ⁇ ion.
  • Oppositely directly contact points 51, 52 are provided at the distal end of support arms 49, 50 such that one contact point protrudes from the opposed faces of the contact button.
  • the contact points are suitably gold bumps bonded onto the ends of the suppo ⁇ arms.
  • protruding contact points can be provided by bending the tips of the suppo ⁇ arms in a direction perpendicular to me plane of the contact button or through other fabrication processes, including a panicle interconnect process wherein abrasive diamond chips are embedded on the support arms.
  • the contact points will be conductive, and will act to extend the conductive path between me contact faces of me body in a direction which is generally pe ⁇ endicular diereto.
  • me contact points 51, 52 of the button contacts are inwardly displaceable when the contacts are sandwiched between me I/O contacts of an IC device and circuit contacts of a printed circuit board.
  • the resiliency of me contact suppo ⁇ arms will also spring-load the contact points to produce a contact force against the contact surfaces adjacent the button faces.
  • me contact bu ⁇ ons of me invention can adapt to coplanariry ⁇ egularities in the surface mount environment, while maintaining good electrical contact with contact surfaces. Bu ⁇ on contacts made of hardened beryllium copper will provide suitable resiliency to give the contacts me spring-like prope ⁇ ies desired. Fu ⁇ her referring to FIGS.
  • an array of bu ⁇ on contact is provided by adhering a plurality of bu ⁇ on contacts 19 in accordance wim the invention to a thin insulator backing 55, which is suitably a strip of KaptonTM tape approximately 3 mil. in thickness.
  • the insulator backing 55 has a defmed first side 56 which provides an adhesive surface and to which the button contacts are adhered in a predetermmed array, and a second side 57 which forms the back of me button contact a ⁇ ay.
  • openings 59 are suitably etched into the insulator backing to expose these contact points. Such an etching process would be well known to persons skilled in me an.
  • the present invention provides an electrical interface between a leadless IC device and a circuit board by means of button contacts having a low profile and a substantial conductor pa .
  • Button contacts and button contact arrays provided in accordance with e invention will have relatively low capacitance and inductance, will be suitable for high frequency applications, and will be durable enough to withstand d ermal shock and repetitive inse ⁇ ions and extractions of IC devices into and from an IC socket, such as occurs in test and burn-in applications. While die present invention has been described in considerable detail in the foregoing specification and claims, it shall be understood that it is not intended mat the invention be limited to such detail, except as necessitated by the following claims.

Abstract

A button contact (19) and array of button contacts (15) are provided for surface mounting a leadless IC device to a circuit board (13). The button contacts of the button contact array have a substantially flat body (41) lying in a plane and oppositedly directed contact points (51, 52) protruding from resiliently deflectable contact support arms of said body (49). The button contacts of the invention, which provide a low profile contact between surface mounted components, are suitable for high frequency applications, and particularly high frequency test and burn-in applications, and are relatively durable.

Description

TITLE OF THE INVENTION
Button Contact For Surface Mounting An IC Device to a Circuit Board
TECHNICAL FIELD The present mvention generally relates to surface mounted integrated circuit (IC) devices, and more particularly to achieving a solderless connections between a leadless IC device and a printed circuit (PC) board. The invention finds parucular application in connection with the burn-in and test of leadless IC devices such as used with ball grid array (BGA) surface mount techmques.
BACKGROUND ART
The increased capabilities of IC chips have led to mcreased mput/output (I/O) densities and alternative techmques for surface mountmg IC chips to pπnted circuit (PC) boards mvolving leadless IC chips. For example, BGA mountmg techmques have been developed to replace pm gπd array (PGA) mounting approaches m order to achieve more densely packed contacts and smaller contact dimensions (m the order of 25 mils.). To facilitate the testing and burn-m such IC devices, special test sockets have been devised to hold these devices and to temporarily connect them to a PC test board Test sockets for leadless IC devices most commonly employ stamped or formed metal contact pins for achieving electncal interconnection between the I/O contacts of the IC device being tested and the PC test board circuits. Such socket designs have a relatively high profile and relatively high capacitance and inductance making them undesirable for high speed applications. They also require soldering of the socket pins to the PC board and do not operate efficiently with IC devices havmg non-compliant I/O contacts Sockets having elastomeric contactors which do not require soldering have also been devised. These sockets utilize flexible wire filaments which extend in a perpendicular relation to the contact points. Such wire filaments are generally not reliable and will not hold up with repetitive use. In addition, they are not likely to withstand the thermal shock encountered while testing an IC device.
The present mvention overcomes the disadvantages of conventional sockets for leadless IC devices by providmg a solderless electπcal interconnection between a PC board and the IC device which is suitable for high frequency circuits, which will operate at extreme temperatures, and which withstands repeated insertions and extractions of the IC device from the IC socket While the invention is paπicularly suited to use with sockets for test and burn-m procedures, it can be used in any application requiring the surface mounting of a leadless IC device to a PC board.
DISCLOSURE OF THE INVENTION
Briefly, the present invention provides for button contacts which can be produced in a miniaturized form for surface mounting a leadless IC device to a printed circuit board without the need for soldered connections. Each button contact includes a body having opposed contact faces. The body of the buπon contact, which can be suitably fabricated in approximately 5 mil. metal sheet material such as beryllium copper, lies in a plane and provides a conductive path of a substantial cross-section between its two contact faces. At least one contact point protrudes from at least one of the opposed contact faces of the body, and preferably two oppositely directed contact points will be provided, one for each of the body's opposed contact faces. The contact points, which suitable can be gold points bonded to the faces of the body, act to extend the conductive path between the contact faces in a direction generally peφendicular to the plane of the body. These contact points are inwardly displaceable to accommodate any lack of coplanarity in the contact surfaces of uie surface mounted components. To permit repeated use and to provide an efficient contact, the contact points of the button contacts are also preferably resiliently displaceable so as to provide a spring-loaded contact.
In the preferred embodiment of the invention, the body of the button contact is comprised of a perimeter portion and deflectable contact support portions extending of the perimeter portion for carrying me contact points. Suitably the deflectable contact suppoπ poπions of ϋ e body are in the form of resiliently deflectable contact suppoπ arms which extend inwardly of the perimeter poπion, with the contact points being positioned at the distal end of the suppoπ arms. A contact button array that matches the I/O contacts of a surface mounted IC device is provided by securing a plurality of button contacts in accordance with the invention to one side of a thin insulator backing material, preferably a polymide material such as Kapton™ tape, and etching out poπions of the backing material at the point of securement of me plurality of button contacts to expose their face-down contact points.
Therefore, a primary object of the present invention is to provide an efficient, solderless contact between a leadless IC device and a PC board. Another object of the invention is to provide a contact which has a low profile, and low capacitance and inductance characteristics. It is a further object of the invention to provide a contact which can withstand the thermal stress of bum-in and test applications. Yet objects of the invention will be apparent from the following specification and claims.
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an exploded perspective view of a test socket for an IC device utilizing a button contact array in accordance with the present invention.
FIG. 2 is an enlarged fragmentary view of a poπion of the button contact array shown in FIG. 1.
FIG. 3 is a top plan view of the button contact array shown in FIG. 2. FIG. 3 A is an enlarged top plan view of an individual buπon contact as shown in FIG. 3.
FIG. 4 is a cross-sectional view in side elevation of the buπon contact array of FIG. 3 taken along section lines 4-4.
BEST MODE FOR CARRYING OUT THE INVENTION Turning now to the drawings, FIG. 1 illustrates the means by which a leadless IC device 11 can be surface mounted to a PC board 13 by means of a contact buπon array 15 in accordance with the invention. In the FIG. 1 assembly, the button contact array elements are the sole means by which the I/O contacts (not shown) of the IC device are electrically interconnected to dieir corresponding circuit contacts 17 on die PC board. The buπon contact aπay, which is further described below, is a generally thin, flexible, and rectangularly shaped element that can be sandwiched between the IC device and the PC board. The array is seen to have a plurality of individual contacts 19 generally shaped like buπons and arranged in a rectangular matrix which causes the buπon contacts to overlie the individual circuit contacts of the circuit contact aπay 17 of the PC board. Locator pins 21 and locator holes 23 are provided, respectively, on the PC board and the buπon contact array to permit precise location of the array.
The IC chip 11 is in m mounted over the buπon contact array by means of carrier assembly 25 which includes a carrier frame 27, cover plate 29, and hold-down latches 31. It is noted that the locator pins 21 on the PC board are also used to align the carrier frame. This is done by providing me bottom of the carrier frame with locator pin holes (not shown). To ensure mat a good electrical interconnection is achieved through the button contact array, the IC chip 1 1 must be mounted firmly to the PC board. In the FIG. 1 embodiment, this is accomplished by first screwing the carrier frame 27 into the threaded holes 33 in the PC board through screw openings 35 of the carrier frame. Flat head screws (not shown) are most suitably used for mis purpose. With carrier frame 27 securely mounted to PC board 13 over button contact array 15, the IC device 11 can be received by and firmly held in the carrier frame by inseπing die IC device into me frame's central opening 37 and placing die assembly's cover plate 29 over carrier frame 27 such that me cover plate's bottom plug 39 (shown in phantom lines) extends into opening 37 to press against me top of die IC device. Latches 31 are then closed to firmly hold the assembly together.
FIGS. 2-4 show the individual button contacts and button contact array of the invention in greater detail. Referring to diese figures, it is seen that the button contacts 19 include a substantially flat body 41 which lies in a plane and which has two opposed, oppositely directed contact faces 43, 45. The body of the button contact is made up of a perimeter poπion 47 and two resiliently deflectable contact suppoπ poπions in the form of two parallel and resiliently deflectable contact suppoπ arms 49 which extend inwardly toward each other from opposite sides of the perimeter poπion. Oppositely directly contact points 51, 52 are provided at the distal end of support arms 49, 50 such that one contact point protrudes from the opposed faces of the contact button. The contact points are suitably gold bumps bonded onto the ends of the suppoπ arms. Alternatively, protruding contact points can be provided by bending the tips of the suppoπ arms in a direction perpendicular to me plane of the contact button or through other fabrication processes, including a panicle interconnect process wherein abrasive diamond chips are embedded on the support arms. In any event, the contact points will be conductive, and will act to extend the conductive path between me contact faces of me body in a direction which is generally peφendicular diereto.
It is noted d at because the suppoπ arms 49, 50 can be resiliently deflected, me contact points 51, 52 of the button contacts are inwardly displaceable when the contacts are sandwiched between me I/O contacts of an IC device and circuit contacts of a printed circuit board. The resiliency of me contact suppoπ arms will also spring-load the contact points to produce a contact force against the contact surfaces adjacent the button faces. Thus, me contact buπons of me invention can adapt to coplanariry πτegularities in the surface mount environment, while maintaining good electrical contact with contact surfaces. Buπon contacts made of hardened beryllium copper will provide suitable resiliency to give the contacts me spring-like propeπies desired. Fuπher referring to FIGS. 2-4, an array of buπon contact is provided by adhering a plurality of buπon contacts 19 in accordance wim the invention to a thin insulator backing 55, which is suitably a strip of Kapton™ tape approximately 3 mil. in thickness. The insulator backing 55 has a defmed first side 56 which provides an adhesive surface and to which the button contacts are adhered in a predetermmed array, and a second side 57 which forms the back of me button contact aπay. To permit contact point 52 of button contacts 19 to project through the insulator backing 55, openings 59 are suitably etched into the insulator backing to expose these contact points. Such an etching process would be well known to persons skilled in me an.
Therefore, it can be seen that the present invention provides an electrical interface between a leadless IC device and a circuit board by means of button contacts having a low profile and a substantial conductor pa . Button contacts and button contact arrays provided in accordance with e invention will have relatively low capacitance and inductance, will be suitable for high frequency applications, and will be durable enough to withstand d ermal shock and repetitive inseπions and extractions of IC devices into and from an IC socket, such as occurs in test and burn-in applications. While die present invention has been described in considerable detail in the foregoing specification and claims, it shall be understood that it is not intended mat the invention be limited to such detail, except as necessitated by the following claims.

Claims

CLAIMS: 1. A button contact for surface mounting an IC device to a circuit board, said button contact comprising a body lying in a plane and having opposed contact faces, said body providing a conductive path between the contact faces thereof, and at least one contact point protruding from at least one of the opposed contact faces of said body, said contact point acting to extend the conductive pam between the contact faces of said body in a direction generally peφendicular to the plane of said body and being displaceable toward the plane of said body.
2. The button contact of claim 1 wherein said contact point is resiliently displaceable.
3. The button contact of claim 1 wherein said body is comprised of a perimeter poπion and at least one deflectable contact suppoπ poπion extending internally of said perimeter poπion, and wherein said contact point protrudes from said deflectable suppoπ poπion.
4. The button contact of claim 1 wherein at least one contact point protrudes from each of the contact faces of said body to provide at least two oppositely directed and displaceable contact points.
5. A buπon contact for surface mounting an IC device to a circuit board, said buπon contact comprising a substantially flat body lying in a plane and having opposed contact faces, said body including at least one resiliently deflectable contact suppoπ arm, and a contact point protruding from said contact suppoπ arm, said contact suppoπ arm being resiliently deflectable to permit said contact point to be displaced toward to the plane of said body, and said body providing a conductive pam between me opposed contact faces of said body and said contact point acting to extend said conductive pam in a direction peφendicular to me plane of said body.
6. The button contact of claim 5 wherein said body has first and second resiliently deflectable contact suppoπ arms, and wherein at least two oppositely directed, displaceable contact points are provided, one of said contact points protruding from said first contact suppoπ arm and the other of said contact points protruding from the other of said contact suppoπ arms.
7. The button contact of claim 5 wherein said body has a perimeter poπion and first and second resiliently deflectable contact suppoπ arms extending inwardly of said perimeter poπion, wherein oppositely directed, displaceable contact points are provided, and wherein one of said contact points protrudes from said first contact suppoπ arm and the other of said contact points protrudes from me other of said contact suppoπ arms.
8. A button contact for surface mounting an IC device to a circuit board, said button contact comprising a substantially flat electrically conductive body lying in a plane and having opposed contact faces, said body including a perimeter poπion and first and second resiliently deflectable contact support arms extending inwardly of said perimeter poπion, and a contact point protruding from each of said first and second contact suppoπ arms, me contact point on said first contact suppoπ arm being oppositely directed from the contact point on me said second contact suppoπ arm, said contact suppoπ arms being resiliently deflectable to permit said contact points to be displaced toward the plane of said body.
9. The button contact of claim 8 wherein said first and second contact suppoπ arms have free distal ends, and wherein said contact points protrude from the distal ends of said suppoπ arms.
10. The button contact of claim 8 wherein said body is a sheet metal pan.
11. The button contact of claim 8 wherein said body is fabricated of beryllium copper.
12. The button contact of claim 8 wherein the perimeter poπion of said body is a circular ring.
13. The button contact of claim 8 wherein said contact points are in the form of gold contact points bonded to said contact suppoπ arms.
14. A buπon contact array for surface mounting an IC device to a circuit board, said button contact assembly comprising a diin flexible insulator backing lying in a plane and having a first side and a second side, a plurality of button contacts secured to me first side of said base to provide an array of electrically conductive contacts, each of said button contacts comprising a substantially flat body lying substantially in die plane of said film insulator backing and having opposed contact faces, said body providing a conductive pa between the contact faces thereof, and oppositely directed contact points, one of said contact points protruding from each of the opposed contact faces of said body, said contact points acting to extend d e conductive pam between d e contact faces of said body in a direction perpendicular to the plane of said body and being displaceable in relation to the plane of said body, said thin insulator backing having etched out poπions at the point of securement of each of said plurality of button contacts to expose die contact points diereof on die second side of said insulator backing.
15. The button contact array of claim 14 wherein said contact points are resiliently displaceable.
16. The button contact array of claim 14 wherein me body of said button contacts are fabricated entirely of a conductive material.
17. The button contact array of claim 16 wherein said conductive material is beryllium copper.
PCT/US1996/015191 1995-09-20 1996-09-20 Button contact for surface mounting an ic device to a circuit board WO1997013392A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8/531,367950920 1995-09-20
US08/531,367 US5629837A (en) 1995-09-20 1995-09-20 Button contact for surface mounting an IC device to a circuit board

Publications (1)

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WO1997013392A2 true WO1997013392A2 (en) 1997-04-10

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TW (1) TW305097B (en)
WO (1) WO1997013392A2 (en)

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