WO1996038860A1 - Base plate for an integrated electric circuit component - Google Patents

Base plate for an integrated electric circuit component Download PDF

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Publication number
WO1996038860A1
WO1996038860A1 PCT/DE1996/000977 DE9600977W WO9638860A1 WO 1996038860 A1 WO1996038860 A1 WO 1996038860A1 DE 9600977 W DE9600977 W DE 9600977W WO 9638860 A1 WO9638860 A1 WO 9638860A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
press
contact pins
internal
base plate
Prior art date
Application number
PCT/DE1996/000977
Other languages
German (de)
French (fr)
Inventor
Alfred Murr
Adolf SCHÖN
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to AU58912/96A priority Critical patent/AU5891296A/en
Publication of WO1996038860A1 publication Critical patent/WO1996038860A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • H05K2201/10833—Flat leads having a curved or folded cross-section

Definitions

  • the invention relates to an integrated electrical circuit component and a base plate for such a circuit component with an electronic chip, the base plate being designed as an internal printed circuit board on which contact pins for external electrical contacts are fastened, and connections of the Chips with interconnects of the circuit board are connectable.
  • the contact pins are e.g. formed as plug pins which can be inserted into socket contacts of a plug-in base, the contact pins being arranged along the outer edge of the circuit module. Since the distances between the contact pins cannot be reduced at will, the number of external connections remains limited.
  • solder balls distributed over their entire surface which can be contacted by heating with an external printed circuit board.
  • this arrangement which is usually referred to as a "ball grid array”
  • solder balls there is the problem of bringing the solder balls to a constant soldering temperature from the outside inwards. Since the inner solder balls only reach the required soldering temperature after a sufficient heating period, there is a risk of thermal damage to the module.
  • the invention is based on the object of designing a base plate for an integrated circuit module in such a way that the circuit module can be produced with little effort and can be contacted safely.
  • This object is achieved by the invention according to claim 1.
  • Such press-in connections are characterized according to IEC standard 352-5 as solderless connections, in which rectilinear press-in zones of contact pins with their longitudinal edges are excessively pressed into plated-through plated holes in a printed circuit board, the longitudinal edges pressing into the plating in a contacting manner.
  • the contact pins according to the present invention can be kept so narrow that they are e.g. of 1.25 mm can be arranged. With a module with a circuit board of 32 x 32 mm, pole numbers of more than 500 contact pins can then be achieved, which cannot be achieved with plug contacts. Through precise dimensioning of the hole cross sections and the contact pin cross sections, the press-in force can be metered to a value which is only slightly above the plug-in force of a plug pin. The free distance between the pads enables several conductor tracks to be passed between them.
  • the press-in connection represents a tried and tested type of contact which has a high degree of contact reliability. Compared to soldering, it has the advantage that the thermal load is completely avoided and that the
  • Circuit module with its contact pins can be removed from the external circuit board in a simple manner by pushing them out or pulling them out.
  • the internal connection technology corresponds to the external one.
  • the contact pins with their internal press-in zones can be pressed individually or in groups into the pads of the internal circuit board without the need for a further soldering process. Also here there is sufficient space for the passage of conductor tracks between the soldering eyes.
  • the developments according to claims 4 and 5 ensure that the holding force of the contact pins in the internal printed circuit board is higher than in the external one. As a result, the circuit module can be pulled out of the external printed circuit board without the contact pins being pulled out of the internal printed circuit board.
  • the internal holding force can also be increased by a tighter fit or by a larger press-in length, which enables a flexible design of the internal press-in zone.
  • the development according to claim 7 enables the press-in pressure to be transmitted to the contact pins via the printed circuit board.
  • the invention according to claim 8 results in an immediately mountable integrated electronic circuit module that can be reliably connected to an external circuit board in a simple manner.
  • the recess according to claim 10 has the same effect as the franking on the press tool. This can then be designed, for example, as a flat plate, which can lie flat on the cover cap without exact centering.
  • the invention is explained in more detail below with reference to an embodiment shown in the drawing.
  • FIG. 1 shows an enlarged cross section through an integrated circuit module and an external circuit board
  • FIG. 2 shows a partial section through the circuit module along the line II-II in FIG. 1,
  • FIG. 3 shows a plan view of an internal circuit board of the circuit module with an inner electronic chip
  • FIG. 4 shows a section through the parts according to FIG. 1 with a press-in tool and a press-out tool.
  • an integrated circuit module has an electronic chip 1, which is connected to an internal circuit board 2. This has through contacts 3, into which contact pins 4 are pressed with an internal press-in zone. This results in a reliable electrical connection between the plated-through holes 3 and the contact pins 4. These protrude from the internal printed circuit board and the circuit module with an external press-in zone 6, with which they connect to further plated-through holes 3 of an external printed circuit board 7 an insertable assembly are pressed and contacted.
  • the contact pins 4 are distributed over the entire area of the internal circuit board 2 with the exception of the area occupied by the chip 1. It is in principle possible to attach contact pins 4 in this area as well. By omitting the contact pins in this area it is avoided that press-in forces can act directly on the sensitive electronic chip 1.
  • the contact pins 4 have a widened collar 8 between the internal press-in zone 5 and the external press-in zone 6, which serves to transmit press-in forces. Pressing into the internal printed circuit board 2 takes place, for example, with the aid of a tool which lies against the collar 8 from the outside and presses the press-in pins 4 with their internal press-in zone 5 individually or in groups into the internal printed circuit board 2.
  • the internal press-in zone 5 has a quadratic and solid cross section.
  • the external press-in zone 6 has a U-shaped or V-shaped cross-section with transversely resilient legs which form a flexible press-in zone.
  • the circuit module has a cover cap 9, which surrounds the chip with play and, in the rest of the area, bears against the entire printed circuit board 2.
  • a cover cap 9 which surrounds the chip with play and, in the rest of the area, bears against the entire printed circuit board 2.
  • Press-in pins 4 rest on the internal printed circuit board 2, so that the press-in forces are transmitted from the latter to the contact pins 4.
  • plated-through holes with or without a solder pad are shown, for example, in external or internal layers. It can be seen that two conductor tracks 10 can be passed between two plated-through holes 3 widened by soldering eyes. Four conductor tracks 10 can be passed between two non-widened through contacts 3, for example in internal layers of the printed circuit board 7.
  • a press-in tool 11 lies flat against the cover cap of the circuit module and presses it in the direction of the arrow indicated. Only in the area of the chip 1 does the press-in tool 11 have a clearance 12, by means of which press-in forces are prevented from being transmitted to the chip 1. It is also possible to provide the cover cap 9 with a corresponding recess 13 through which the franking 12 can be dispensed with.
  • the press-in pins 4 are already pressed into the external circuit board 7 in their full length.
  • a removal tool 14 which is provided with spikes 15 which can be placed on the free ends of the contact pins 4 and which can push them out of the external printed circuit board 7 in the direction indicated by the arrow.
  • spikes 15 which can be placed on the free ends of the contact pins 4 and which can push them out of the external printed circuit board 7 in the direction indicated by the arrow.

Abstract

A circuit component has an internal printed circuit board (2) into which contact pins (4) are pressed in a contact-making manner. The contact pins (4) further have an outer zone (6) that is pressed into through-plated holes (3) in an external printed circuit board (7). The circuit component may thus be provided with a grid of closely spaced contact pins over its whole base surface and a reliable contact may be established between the contact pins and the external printed circuit board (7).

Description

Beschreibungdescription
Grundplatte für einen integrierten elektrischen Schaltungs¬ bausteinBase plate for an integrated electrical circuit module
Die Erfindung bezieht sich auf einen integrierten elektri¬ schen Schaltungsbaustein und eine Grundplatte für einen sol¬ chen Schaltungsbaustein mit einem elektronischen Chip, wobei die Grundplatte als interne Leiterplatte ausgebildet ist, an der Kontaktstifte für externe elektrische Kontaktierungen be¬ festigt sind, und wobei Anschlüsse des Chips mit Leiterbahnen der Leiterplatte verbindbar sind.The invention relates to an integrated electrical circuit component and a base plate for such a circuit component with an electronic chip, the base plate being designed as an internal printed circuit board on which contact pins for external electrical contacts are fastened, and connections of the Chips with interconnects of the circuit board are connectable.
Es ist bekannt, eine derartige Grundplatte mit dem Chip und einer Abdeckkappe zu versehen.Die Kontaktstifte sind z.B. als Steckerstifte ausgebildet, die in Buchsenkontakte eines Stecksockels einsteckbar sind, wobei die Kontaktstifte ent¬ lang dem äußeren Rand des Schaltungsbausteins angeordnet sind. Da die Abstände zwischen den Kontaktstiften nicht be- liebig verringert werden können, bleibt hier die Anzahl der externen Anschlüsse begrenzt.It is known to provide such a base plate with the chip and a cover cap. The contact pins are e.g. formed as plug pins which can be inserted into socket contacts of a plug-in base, the contact pins being arranged along the outer edge of the circuit module. Since the distances between the contact pins cannot be reduced at will, the number of external connections remains limited.
Ferner ist es bekannt, zur Erhöhung der Polzahl auf der Lei¬ terplatte über deren gesamte Fläche verteilte Lotkügelchen anzubringen, die durch Erwärmung mit einer externen Leiter¬ platte kontaktiert werden können. Bei dieser üblicherweise als "ball grid array" bezeichneten Anordnung besteht das Problem, die Lotkügelchen von außen nach innen auf eine gleichbleibende Löttemperatur zu bringen. Da die inneren Lotkügelchen erst nach einer hinreichenden Beheizungsdauer die erforderliche Löttemperatur erreichen, besteht die Gefahr einer thermischen Beschädigung des Bausteins.Furthermore, to increase the number of poles on the printed circuit board, it is known to attach solder balls distributed over their entire surface, which can be contacted by heating with an external printed circuit board. In this arrangement, which is usually referred to as a "ball grid array", there is the problem of bringing the solder balls to a constant soldering temperature from the outside inwards. Since the inner solder balls only reach the required soldering temperature after a sufficient heating period, there is a risk of thermal damage to the module.
Der Erfindung liegt die Aufgabe zugrunde, eine Grundplatte für einen integrierten Schaltungsbaustein so auszubilden, daß der Schaltungsbaustein mit geringem Aufwand herstellbar und sicher kontaktierbar ist. Diese Aufgabe wird durch die Erfindung gemäß Anspruch 1 ge¬ löst. Derartige Einpressverbindungen sind nach der IEC-Norm 352-5 als lötfreie Verbindungen charakterisiert, bei denen geradlinig verlaufende Einpresszonen von Kontaktstiften mit ihren Längskanten mit Übermaß in durchkontaktierte plattierte Bohrungen einer Leiterplatte eingepreßt werden, wobei sich die Längskanten in die Plattierung kontaktgebend eindrücken.The invention is based on the object of designing a base plate for an integrated circuit module in such a way that the circuit module can be produced with little effort and can be contacted safely. This object is achieved by the invention according to claim 1. Such press-in connections are characterized according to IEC standard 352-5 as solderless connections, in which rectilinear press-in zones of contact pins with their longitudinal edges are excessively pressed into plated-through plated holes in a printed circuit board, the longitudinal edges pressing into the plating in a contacting manner.
Die Kontaktstifte nach der vorliegenden Erfindung können so schmal gehalten sein, daß sie in einem engen Rasterabstand z.B. von 1,25 mm angeordnet werden können. Bei einem Baustein mit einer Leiterplatte von 32 x 32 mm lassen sich dann Pol¬ zahlen von mehr als 500 Kontaktstiften verwirklichen, was mit Steckkontakten nicht erreichbar ist. Durch genaue Dimensio¬ nierung der Lochquerschnitte und der Kontaktstiftquerschnitte läßt sich die Einpreßkraft auf einen Wert dosieren, der nur wenig über der Steckkraft eines Steckerstifts liegt. Der freie Abstand zwischen den Lötaugen ermöglicht es zwischen ihnen mehrere Leiterbahnen hindurchzuführen.The contact pins according to the present invention can be kept so narrow that they are e.g. of 1.25 mm can be arranged. With a module with a circuit board of 32 x 32 mm, pole numbers of more than 500 contact pins can then be achieved, which cannot be achieved with plug contacts. Through precise dimensioning of the hole cross sections and the contact pin cross sections, the press-in force can be metered to a value which is only slightly above the plug-in force of a plug pin. The free distance between the pads enables several conductor tracks to be passed between them.
Die Einpreßverbindung stellt eine erprobte und zuverlässige Kontaktierungsart dar, die eine hohe Kontaktsicherheit auf¬ weist. Gegenüber dem Löten hat sie den Vorteil, daß die ther- mische Belastung vollständig vermieden wird und daß derThe press-in connection represents a tried and tested type of contact which has a high degree of contact reliability. Compared to soldering, it has the advantage that the thermal load is completely avoided and that the
Schaltungsbaustein mit seinen Kontaktstiften durch Heraus¬ drücken oder Herausziehen in einfacher Weise von der externen Leiterplatte entfernt werden kann.Circuit module with its contact pins can be removed from the external circuit board in a simple manner by pushing them out or pulling them out.
Vorteilhafte Weiterbildungen der Erfindung sind in den An¬ sprüchen 2 bis 9 gekennzeichnet.Advantageous developments of the invention are characterized in claims 2 to 9.
Durch die Weiterbildung nach Anspruch 2 entspricht die in¬ terne Verbindungstechnik der externen. Die Kontaktstifte kön- nen mit ihren internen Einpreßzonen einzeln oder gruppenweise in die Lötaugen der internen Leiterplatte eingepreßt werden, ohne daß es dazu eines weiteren Lötvorganges bedarf. Auch hier bleibt hinreichend Platz für den Durchtritt von Leiter¬ bahnen zwischen den Lötaugen.Due to the further development according to claim 2, the internal connection technology corresponds to the external one. The contact pins with their internal press-in zones can be pressed individually or in groups into the pads of the internal circuit board without the need for a further soldering process. Also here there is sufficient space for the passage of conductor tracks between the soldering eyes.
Durch die Weiterbildungen nach den Ansprüchen 4 und 5 wird erreicht, daß die Haltekraft der Kontaktstifte in der inter¬ nen Leiterplatte höher ist als in der externen. Dadurch kann der Schaltungsbaustein aus der externen Leiterplatte heraus¬ gezogen werden ohne daß dabei die Kontaktstifte aus der in¬ ternen Leiterplatte herausgezogen werden. Die interne Halte- kraft kann auch durch einen engeren Sitz oder durch eine grö¬ ßere Einpreßlänge erhöht werden, die eine flexible Ausbildung der internen Einpreßzone ermöglicht.The developments according to claims 4 and 5 ensure that the holding force of the contact pins in the internal printed circuit board is higher than in the external one. As a result, the circuit module can be pulled out of the external printed circuit board without the contact pins being pulled out of the internal printed circuit board. The internal holding force can also be increased by a tighter fit or by a larger press-in length, which enables a flexible design of the internal press-in zone.
Durch die Weiterbildung nach Anspruch 6 ist es möglich, den von den Kontaktstiften ausgehenden Einpreßdruck vom internen Chip fernzuhalten. Dementsprechend ist es zweckmäßig, ein Einpreßwerkzeug mit einer entsprechenden Freimachung im Be¬ reich des Chips vorzusehen.The development according to claim 6 makes it possible to keep the injection pressure emanating from the contact pins away from the internal chip. Accordingly, it is expedient to provide a press-in tool with a corresponding clearance in the area of the chip.
Die Weiterbildung nach Anspruch 7 ermöglicht, daß der Ein¬ preßdruck über die Leiterplatte auf die Kontaktstifte über¬ tragen werden kann.The development according to claim 7 enables the press-in pressure to be transmitted to the contact pins via the printed circuit board.
Die Erfindung nach Anspruch 8 ergibt einen unmittelbar montagefähigen integrierte elektronischen Schaltungsbaustein, der in einfacher Weise zuverlässig mit einer externen Leiterplatte verbunden werden kann.The invention according to claim 8 results in an immediately mountable integrated electronic circuit module that can be reliably connected to an external circuit board in a simple manner.
Durch die Abdeckkappe nach Anspruch 9 wird der Einpreßdruck von dieser unmittelbar auf die Kontaktstifte übertragen.By the cover cap according to claim 9, the press-in pressure is transmitted from this directly to the contact pins.
Die Ausnehmung nach Anspruch 10 hat die gleiche Wirkung wie die Freimachung am Einpreßwerkzeug. Dieses kann dann z.B. als flache Platte ausgebildet sein, die ohne genaue Zentrierung flach auf der Abdeckkappe aufliegen kann. Im folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert.The recess according to claim 10 has the same effect as the franking on the press tool. This can then be designed, for example, as a flat plate, which can lie flat on the cover cap without exact centering. The invention is explained in more detail below with reference to an embodiment shown in the drawing.
Es zeigen:Show it:
Figur l einen vergrößerten Querschnitt durch einen inte¬ grierten Schaltungsbaustein und eine externe Lei¬ terplatte, Figur 2 einen Teilschnitt durch den Schaltungsbaustein ent- lang der Linie II-II in Figur 1,1 shows an enlarged cross section through an integrated circuit module and an external circuit board, FIG. 2 shows a partial section through the circuit module along the line II-II in FIG. 1,
Figur 3 eine Draufsicht auf eine interne Leiterplatte des Schaltungsbausteins mit einem inneren elektroni¬ schen Chip, Figur 4 einen Schnitt durch die Teile nach Figur 1 mit ei- nem Einpreßwerkzeug und einem Ausdrückwerkzeug.3 shows a plan view of an internal circuit board of the circuit module with an inner electronic chip, FIG. 4 shows a section through the parts according to FIG. 1 with a press-in tool and a press-out tool.
Nach den Figuren 1, 2 und 3 weist ein integrierter Schal¬ tungsbaustein einen elektronischen Chip 1 auf, der mit einer internen Leiterplatte 2 verbunden ist. Diese weist Durchkon- taktierungen 3 auf, in die Kontaktstifte 4 mit einer internen Einpreßzone eingepreßt sind. Daraus resultiert eine zuverläs¬ sige elektrische Verbindung zwischen den Durchkontaktierungen 3 und den Kontaktstiften 4. Diese ragen aus der internen Lei¬ terplatte und dem Schaltungsbaustein mit einer externen Ein- preßzone 6 heraus, mit der sie in weitere Durchkontaktierun¬ gen 3 einer externen Leiterplatte 7 einer einschiebbaren Bau¬ gruppe eingepreßt und kontaktiert sind.According to FIGS. 1, 2 and 3, an integrated circuit module has an electronic chip 1, which is connected to an internal circuit board 2. This has through contacts 3, into which contact pins 4 are pressed with an internal press-in zone. This results in a reliable electrical connection between the plated-through holes 3 and the contact pins 4. These protrude from the internal printed circuit board and the circuit module with an external press-in zone 6, with which they connect to further plated-through holes 3 of an external printed circuit board 7 an insertable assembly are pressed and contacted.
Aus Figur 3 ist erkennbar, daß sich die Kontaktstifte 4 über die gesamte Fläche der internen Leiterplatte 2 mit Ausnahme der durch den Chip 1 belegten Fläche verteilen. Es ist zwar grundsätzlich möglich, auch in diesem Bereich Kontaktstifte 4 anzubringen. Durch das Weglassen der Kontaktstifte in diesem Bereich wird vermieden, daß Einpreßkräfte unmittelbar auf den empfindlichen elektronischen Chip 1 einwirken können. Die Kontaktstifte 4 weisen zwischen der internen Einpreßzone 5 und der externen Einpreßzone 6 einen verbreiterten Kragen 8 auf, der der Übertragung von Einpreßkräften dient. Das Ein¬ pressen in die interne Leiterplatte 2 erfolgt z.B. mit Hilfe eines Werkzeuges, das von außen her an dem Kragen 8 anliegt und die Einpreßstifte 4 mit ihrer internen Einpreßzone 5 ein¬ zeln oder gruppenweise in die interne Leiterplatte 2 ein¬ drückt. Die interne Einpreßzone 5 ist im Querschnitt quadra¬ tisch und massiv ausgebildet. Die externe Einpreßzone 6 weist einen u- oder v-förmigen Querschnitt mit in sich transversal federnd nachgiebigen Schenkeln auf, die eine flexible Ein¬ preßzone bilden.It can be seen from FIG. 3 that the contact pins 4 are distributed over the entire area of the internal circuit board 2 with the exception of the area occupied by the chip 1. It is in principle possible to attach contact pins 4 in this area as well. By omitting the contact pins in this area it is avoided that press-in forces can act directly on the sensitive electronic chip 1. The contact pins 4 have a widened collar 8 between the internal press-in zone 5 and the external press-in zone 6, which serves to transmit press-in forces. Pressing into the internal printed circuit board 2 takes place, for example, with the aid of a tool which lies against the collar 8 from the outside and presses the press-in pins 4 with their internal press-in zone 5 individually or in groups into the internal printed circuit board 2. The internal press-in zone 5 has a quadratic and solid cross section. The external press-in zone 6 has a U-shaped or V-shaped cross-section with transversely resilient legs which form a flexible press-in zone.
Dadurch sind die externen Einpreßkräfte niedriger als die in- ternen, so daß beim Herausziehen des integrierten Schaltungs¬ bausteins aus der externen Leiterplatte 7 die Einpreßstifte nicht aus der internen Leiterplatte 2 herausgezogen werden können.As a result, the external press-in forces are lower than the internal, so that when the integrated circuit module is pulled out of the external circuit board 7, the press-in pins cannot be pulled out of the internal circuit board 2.
Der Schaltungsbaustein weist eine Abdeckkappe 9 auf, die den Chip mit Spiel umschließt und im übrigen Bereich an der in¬ ternen Leiterplatte 2 vollflächig anliegt. Beim Einpressen der externen Einpreßzonen 6 in die externe Leiterplatte 7 werden die Einpreßkräfte über die Abdeckkappe auf die interne Leiterplatte 2 übertragen. Die verbreiterten Kragen 8 derThe circuit module has a cover cap 9, which surrounds the chip with play and, in the rest of the area, bears against the entire printed circuit board 2. When the external press-in zones 6 are pressed into the external circuit board 7, the press-in forces are transmitted to the internal circuit board 2 via the cover cap. The widened collar 8 of the
Einpreßstifte 4 liegen an der internen Leiterplatte 2 an, so daß die Einpreßkräfte von dieser auf die Kontaktstifte 4 übertragen werden.Press-in pins 4 rest on the internal printed circuit board 2, so that the press-in forces are transmitted from the latter to the contact pins 4.
In Figur 2 sind Durchkontaktierungen mit bzw. ohne Lötauge z.B. in externen bzw. internen Lagen dargestellt. Es ist erkennbar, daß zwischen zwei durch Lötaugen verbreiterten Durchkontaktierungen 3 zwei Leiterbahnen 10 hindurchgeführt werden können. Zwischen zwei nicht verbreiterten Durchkontak- tierungen 3 z.B. in internen Lagen der Leiterplatte 7 können vier Leiterbahnen 10 hindurchgeführt werden. Nach Figur 4 liegt ein Einpreßwerkzeug 11 flach an der Ab¬ deckkappe des Schaltungsbausteins an und drückt auf diesen in der angegebenen Pfeilrichtung. Lediglich im Bereich des Chips 1 weist das Einpreßwerkzeug 11 eine Freimachung 12 auf, durch die verhindert wird, daß Einpreßkräfte auf den Chip 1 über¬ tragen werden. Es ist auch möglich, die Abdeckkappe 9 mit ei¬ ner entsprechenden Ausnehmung 13 zu versehen, durch die auf die Freimachung 12 verzichtet werden kann.In FIG. 2, plated-through holes with or without a solder pad are shown, for example, in external or internal layers. It can be seen that two conductor tracks 10 can be passed between two plated-through holes 3 widened by soldering eyes. Four conductor tracks 10 can be passed between two non-widened through contacts 3, for example in internal layers of the printed circuit board 7. According to FIG. 4, a press-in tool 11 lies flat against the cover cap of the circuit module and presses it in the direction of the arrow indicated. Only in the area of the chip 1 does the press-in tool 11 have a clearance 12, by means of which press-in forces are prevented from being transmitted to the chip 1. It is also possible to provide the cover cap 9 with a corresponding recess 13 through which the franking 12 can be dispensed with.
Die Einpreßstifte 4 sind bereits in voller Länge in die ex¬ terne Leiterplatte 7 eingepreßt. Zum Abziehen des integrier¬ ten Schaltungsbausteins von der Leiterplatte 7 kann man z.B. ein Ausdrückwerkzeug 14 verwenden, das mit Stacheln 15 verse¬ hen ist, die auf die freien Enden der Kontaktstifte 4 auf- setzbar sind und diese aus der externen Leiterplatte 7 in der angegebenen Pfeilrichtung herausdrücken können. Es ist aber auch möglich, zwischen der internen Leiterplatte 2 und der externen Leiterplatte 7 einen so großen Abstand zu lassen, daß der integrierte Schaltungsbaustein mit Hilfe eines nicht dargestellten Abziehwerkzeuges von der externen Leiterplatte 7 abgezogen werden kann. The press-in pins 4 are already pressed into the external circuit board 7 in their full length. To remove the integrated circuit module from the printed circuit board 7, one can e.g. use a removal tool 14 which is provided with spikes 15 which can be placed on the free ends of the contact pins 4 and which can push them out of the external printed circuit board 7 in the direction indicated by the arrow. However, it is also possible to leave such a large distance between the internal circuit board 2 and the external circuit board 7 that the integrated circuit module can be removed from the external circuit board 7 with the aid of a removal tool, not shown.

Claims

Patentansprüche claims
1. Grundplatte für einen integrierten elektrischen Schaltungsbaustein mit einem elektronischen Chip (1) ,wobei die Grundplatte als interne Leiterplatte (2) ausgebildet ist, an der Kontaktstifte (4) für externe elektrische Kontaktie¬ rungen befestigt sind, und wobei Anschlüsse des Chips (1) mit Leiterbahnen (10) der Leiterplatte (2) verbindbar sind, dadurch gekennzeichnet, daß die Kontaktstifte (4) als Einpreßstifte ausgebildet sind, die mit einer externen Einpreßzone (6) in Durchkontaktierun¬ gen (3) einer externen Leiterplatte (7) einpreßbar sind, und daß die Kontaktstifte (4) gleichmäßig über die gesamte freie Fläche der internen Leiterplatte (2) verteilt sind.1. Base plate for an integrated electrical circuit module with an electronic chip (1), the base plate being designed as an internal printed circuit board (2), on which contact pins (4) for external electrical contacts are fastened, and connections of the chip (1 ) can be connected to conductor tracks (10) of the printed circuit board (2), characterized in that the contact pins (4) are designed as press-in pins which can be pressed into through-contacts (3) of an external printed circuit board (7) with an external press-in zone (6) are, and that the contact pins (4) are evenly distributed over the entire free area of the internal circuit board (2).
2. Grundplatte nach Anspruch 1, dadurch gekennzeichnet , daß die Kontaktstifte (4) eine interne Einpreßzone (5) auf¬ weisen, mit der sie in Durchkontaktierungen (3) der internen Leiterplatte (2) eingepreßt sind.2. Base plate according to claim 1, characterized in that the contact pins (4) have an internal press-in zone (5) with which they are pressed into plated-through holes (3) of the internal circuit board (2).
3. Grundplatte nach Anspruch 2, dadurch gekennzeichnet, daß die Kontaktstifte (4) einzeln oder gruppenweise in die interne Leiterplatte (2) einpreßbar sind.3. Base plate according to claim 2, characterized in that the contact pins (4) individually or in groups in the internal circuit board (2) can be pressed.
4. Grundplatte nach Anspruch 2 oder 3, dadurch gekennzeichnet , daß die interne Einpreßzone (5) im Querschnitt vollflächig massiv ausgebildet ist.4. Base plate according to claim 2 or 3, characterized in that the internal press-in zone (5) is solid over the entire cross section.
5. Grundplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichne , daß die externe Einpreßzone (6) longitudinale Ausnehmungen aufweist, die in der flexiblen Einpreßzone transversal nach¬ giebige Schenkel ergeben. 5. Base plate according to one of the preceding claims, characterized in that the external press-in zone (6) has longitudinal recesses which give in the flexible press-in zone transversely resilient legs.
6. Grundplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die vom elektronischen Chip (1) belegte Fläche der inter¬ nen Leiterplatte (2) von Kontaktstiften (4) frei bleibt.6. Base plate according to one of the preceding claims, characterized in that the area occupied by the electronic chip (1) of the internal circuit board (2) of contact pins (4) remains free.
7. Grundplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Kontaktstifte (4) zwischen der internen Einpreßzone (5) und der externen Einpreßzone (6) einen verbreiterten Kra- gen (8) aufweisen.7. Base plate according to one of the preceding claims, characterized in that the contact pins (4) have an enlarged collar (8) between the internal press-in zone (5) and the external press-in zone (6).
8. Integrierter elektrischer Schaltungsbaustein mit einem elektronischen Chip (1) und einer internen Leiterplatte (2) , an der Kontaktstifte (4) für externe elektrische Kontaktie- rungen befestigt sind, insbesondere nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Kontaktstifte (4) als Einpreßstifte ausgebildet sind, die mit einer externen Einpreßzone (6) in Durchkontaktierun- gen (3) einer externen Leiterplatte (7) einpreßbar sind, und daß die Kontaktstifte (4) gleichmäßig über die gesamte freie Fläche der internen Leiterplatte (2) verteilt sind.8. Integrated electrical circuit module with an electronic chip (1) and an internal circuit board (2) on the contact pins (4) for external electrical contacts, in particular according to one of the preceding claims, characterized in that the contact pins (4th ) are designed as press-in pins which can be pressed into through-contacts (3) of an external circuit board (7) with an external press-in zone (6), and that the contact pins (4) are evenly distributed over the entire free area of the internal circuit board (2) are.
9. Schaltungsbaustein nach Anspruch 8 dadurch gekennzeichnet, daß die inneren Enden der Kontaktstifte (4) unmittelbar an einer Abdeckkappe (9) des Schaltungsbausteins anliegen.9. Circuit module according to claim 8, characterized in that the inner ends of the contact pins (4) bear directly against a cover cap (9) of the circuit module.
10. Schaltungsbaustein nach Anspruch 8 oder 9, dadurch gekennzeich et, daß die Abdeckkappe (9) auf ihrer Außenseite im Bereich der vom Chip (1) belegten Fläche eine Ausnehmung (13) aufweist. 10. Circuit module according to claim 8 or 9, characterized in that the cover cap (9) has a recess (13) on its outside in the area of the area occupied by the chip (1).
PCT/DE1996/000977 1995-06-01 1996-06-03 Base plate for an integrated electric circuit component WO1996038860A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU58912/96A AU5891296A (en) 1995-06-01 1996-06-03 Base plate for an integrated electric circuit component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19520183.3 1995-06-01
DE19520183 1995-06-01

Publications (1)

Publication Number Publication Date
WO1996038860A1 true WO1996038860A1 (en) 1996-12-05

Family

ID=7763463

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/000977 WO1996038860A1 (en) 1995-06-01 1996-06-03 Base plate for an integrated electric circuit component

Country Status (4)

Country Link
AR (1) AR002161A1 (en)
AU (1) AU5891296A (en)
WO (1) WO1996038860A1 (en)
ZA (1) ZA964464B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117211A2 (en) * 1983-02-18 1984-08-29 Fairchild Semiconductor Corporation Method for fabricating a package for an integrated circuit
JPS62266858A (en) * 1986-05-15 1987-11-19 Ibiden Co Ltd Semiconductor mounting substrate
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package
US4943846A (en) * 1989-11-09 1990-07-24 Amp Incorporated Pin grid array having seperate posts and socket contacts
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
EP0539075A1 (en) * 1991-10-21 1993-04-28 Nec Corporation Semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117211A2 (en) * 1983-02-18 1984-08-29 Fairchild Semiconductor Corporation Method for fabricating a package for an integrated circuit
JPS62266858A (en) * 1986-05-15 1987-11-19 Ibiden Co Ltd Semiconductor mounting substrate
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package
US4943846A (en) * 1989-11-09 1990-07-24 Amp Incorporated Pin grid array having seperate posts and socket contacts
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
EP0539075A1 (en) * 1991-10-21 1993-04-28 Nec Corporation Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 150 (E - 606) 10 May 1988 (1988-05-10) *

Also Published As

Publication number Publication date
ZA964464B (en) 1996-12-11
AU5891296A (en) 1996-12-18
AR002161A1 (en) 1998-01-07

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