WO1996028846A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- WO1996028846A1 WO1996028846A1 PCT/GB1996/000567 GB9600567W WO9628846A1 WO 1996028846 A1 WO1996028846 A1 WO 1996028846A1 GB 9600567 W GB9600567 W GB 9600567W WO 9628846 A1 WO9628846 A1 WO 9628846A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fins
- metal
- heat sink
- walls
- wax
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Definitions
- This invention relates to heat sinks particularly for use with devices, typically electrical or electronic devices for dissipating heat generated by such devices.
- heat sinks are well known some of which comprise a metal structure having an extended surface area which is exposed to a current of air or liquid as the heat dissipating medium.
- the air current may be by natural convection or may be fan generated.
- the liquid may be pumped.
- Another known form of heat sink which may also be force cooled, has the metal structure in the form of a framework forming a plurality of cells each housing a body of wax. The wax absorbs heat delivered to one of the metal walls of the framework firstly by temperature increase and then by phase change, from solid to liquid, which is equivalent to a temperature rise of about 150°C.
- a heat sink comprising a unitary metal framework made of highly thermally-conductive metal, having a pair of metal walls extending substantially parallel to each other and held in spaced mutual relationship by a plurality of metal fins, the fins being substantially parallel to each other and extending transversely to the metal walls, the arrangement being such that the framework defines a plurality of cells between adjacent fins, the cells being substantially filled with a fill material of low thermal conductivity and high latent heat of fusion, characterised by selecting the following features in combination: i) the metal is aluminium; ii) the fins have a thickness in the range 0.10 to
- the fill material is a wax.
- the effective thermal resistance of the heat sink is very low, significantly lower than hitherto which results in the temperature of the metal wall input face being maintained at a comparatively low temperature, typically not more than 5°C greater than the temperature at which the wax fill material melts, until the entirety of the wax fill material has melted.
- the heat sink is comparatively small in size and weight.
- the wax fill material may be any one of a number of different waxes having different melt temperatures and latent heat of fusion.
- Particular waxes may be selected for any particular application of the heat sink, for example from the data listed in the "Handbook of Chemistry and Physics" published from time to time by CRC Press, Inc. (for example, the 65th edition published in 1984/5) .
- the waxes may be long-chain hydrocarbons or silicone based materials. They are selected because they are inexpensive and non-toxic, usually with a melting temperature below 150°C. Also, they have comparatively low thermal conductivity.
- the drawing shows a heat sink 10 comprising a unitary metal framework made of aluminium which is a highly thermally-conductive metal.
- the framework is formed of a pair of substantially parallel walls 1 which are comparatively thick and which are interconnected and held in spaced mutual relationship by a plurality of spaced fins 2 which are comparatively thin.
- the fins 2 are substantially parallel to each other and extend transversely, preferably orthogonally, to the walls 1.
- the spaces between adjacent fins 2 and bonded by the walls 1 define cells 4 which are substantially filled with wax material of low thermal conductivity and high latent heat of fusion.
- the fins 2 are about 0.15 mm thick and have a pitch or spacing 3 which is less than 1.5 mm and for example 0.'65mm.
- the walls 1 are typically 0.4mm in thickness and are spaced apart typically by about 5 to 10mm although this is not critical.
- the wax may for example be Naphthalene 1,7- dichloro which has a melting point of about 63°C and a latent heat of fusion of about 250 KJ/kg.
- one of the metal walls 1 forms the heat input face of the heat sink 10 and is placed in intimate contact with a device which is to be cooled. Because the aluminium is highly thermally conductive heat is rapidly transferred by conduction to each of the fins 2.
- the fins 2 are both thin and closely spaced so that there is a very large increase in surface area of fins and wax.
- the thickness of each wax filled cell 4 is comparatively small so that the thermal path length to the centre of each cell 4 is comparatively small and accordingly the thermal resistance of the sink 10 is comparatively low notwithstanding the low thermal conductivity of the wax.
Abstract
A heat sink (10) is formed by an aluminium framework composed of thick walls (1) interconnected by thin fins (2). The fins (2) are about 0.10 to 0.20 mm in thickness and are spaced apart by about 0.5 mm to 1.5 mm so as to form cells (4). The cells (4) are filled with a wax.
Description
HEAT S INK
This invention relates to heat sinks particularly for use with devices, typically electrical or electronic devices for dissipating heat generated by such devices.
Various forms of heat sinks are well known some of which comprise a metal structure having an extended surface area which is exposed to a current of air or liquid as the heat dissipating medium. The air current may be by natural convection or may be fan generated. The liquid may be pumped. Another known form of heat sink, which may also be force cooled, has the metal structure in the form of a framework forming a plurality of cells each housing a body of wax. The wax absorbs heat delivered to one of the metal walls of the framework firstly by temperature increase and then by phase change, from solid to liquid, which is equivalent to a temperature rise of about 150°C.
It is an object of the present invention to provide a new and improved form of heat sink.
According to the present invention there is provided a heat sink comprising a unitary metal framework made of highly thermally-conductive metal, having a pair of metal walls extending substantially parallel to each other and held in spaced mutual relationship by a plurality of metal fins, the fins being substantially parallel to each other and extending transversely to the metal walls, the arrangement being such that the framework defines a plurality of cells between adjacent fins, the cells being substantially filled with a fill material of low thermal conductivity and high latent heat of fusion, characterised by selecting the following features in combination: i) the metal is aluminium; ii) the fins have a thickness in the range 0.10 to
0.20 mm; iii) the spacing between the fins is in the range 0.5 to 1.5 mm; iv) the fill material is a wax.
By virtue of the present invention the effective thermal resistance of the heat sink is very low, significantly lower than hitherto which results in the temperature of the metal wall input face being maintained at a comparatively low temperature, typically not more than 5°C greater than the temperature at which the wax fill material melts, until the entirety of the wax fill material has melted. Thus there is highly efficient removal of heat from the heat source and forced cooling of the heat sink is not required. Additionally, the heat sink is comparatively small in size and weight.
It will be understood that the wax fill material may be any one of a number of different waxes having different melt temperatures and latent heat of fusion. Particular waxes may be selected for any particular application of the heat sink, for example from the data listed in the "Handbook of Chemistry and Physics" published from time to time by CRC Press, Inc. (for example, the 65th edition published in 1984/5) . The waxes may be long-chain hydrocarbons or silicone based materials. They are selected because they are inexpensive and non-toxic, usually with a melting temperature below 150°C. Also, they have comparatively low thermal conductivity.
An embodiment of the present invention will now be described by way of example with reference to the accompany diagrammatic drawing.
The drawing shows a heat sink 10 comprising a unitary metal framework made of aluminium which is a highly thermally-conductive metal. The framework is formed of a pair of substantially parallel walls 1 which are comparatively thick and which are interconnected and held in spaced mutual relationship by a plurality of spaced fins 2 which are comparatively thin. The fins 2 are substantially parallel to each other and extend transversely, preferably orthogonally, to the walls 1. The spaces between adjacent fins 2 and bonded by the walls 1 define cells 4 which are substantially filled with wax
material of low thermal conductivity and high latent heat of fusion.
The fins 2 are about 0.15 mm thick and have a pitch or spacing 3 which is less than 1.5 mm and for example 0.'65mm. The walls 1 are typically 0.4mm in thickness and are spaced apart typically by about 5 to 10mm although this is not critical. The wax may for example be Naphthalene 1,7- dichloro which has a melting point of about 63°C and a latent heat of fusion of about 250 KJ/kg.
In use, one of the metal walls 1 forms the heat input face of the heat sink 10 and is placed in intimate contact with a device which is to be cooled. Because the aluminium is highly thermally conductive heat is rapidly transferred by conduction to each of the fins 2. The fins 2 are both thin and closely spaced so that there is a very large increase in surface area of fins and wax. The thickness of each wax filled cell 4 is comparatively small so that the thermal path length to the centre of each cell 4 is comparatively small and accordingly the thermal resistance of the sink 10 is comparatively low notwithstanding the low thermal conductivity of the wax. This results in the temperature of the heat input face 1 being held at not more than about 68°C which is only 5°C more than the temperature at which the wax melts until such time as the entirety of the wax has melted. Heat dissipation is therefore highly efficient without any requirement to have forced cooling or large exposed surface areas with fin pitches typically greater than 2mm suitable for natural or forced convection.
Claims
Claims
1 A heat sink comprising a unitary metal framework made of highly thermally-conductive metal, having a pair of metal walls (1) extending substantially parallel to each other and held in spaced mutual relationship by a plurality of metal fins (2) , the fins (2) being substantially parallel to each other and extending transversely to the metal walls (1) , the arrangement being such that the framework defines a plurality of cells (4) between adjacent fins, the cells being substantially filled with a fill material of low thermal conductivity and high latent heat of fusion, characterised by selecting the following features in combination: i) the metal is aluminium; ii) the fins have a thickness in the range 0.10 to 0.20 mm; iii) the spacing between the fins is in the range 0.5 to 1.5 mm; iv) the fill material is a wax.
2 A heat sink as claimed in Claim 1, wherein the walls (1) are about 0.4mm in thickness and are spaced apart by a distance in the range 5 to 10mm.
3 A heat sink as claimed in Claim 1 and substantially as hereinbefore described with reference to the accompanying drawing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9505069.6 | 1995-03-14 | ||
GBGB9505069.6A GB9505069D0 (en) | 1995-03-14 | 1995-03-14 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996028846A1 true WO1996028846A1 (en) | 1996-09-19 |
Family
ID=10771136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1996/000567 WO1996028846A1 (en) | 1995-03-14 | 1996-03-12 | Heat sink |
Country Status (3)
Country | Link |
---|---|
GB (1) | GB9505069D0 (en) |
IL (1) | IL117464A0 (en) |
WO (1) | WO1996028846A1 (en) |
Cited By (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0987799A2 (en) * | 1998-09-11 | 2000-03-22 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
WO2000037873A1 (en) * | 1998-12-22 | 2000-06-29 | Telefonaktiebolaget Lm Ericsson (Publ) | A device for temperature control |
WO2001069360A1 (en) * | 2000-03-16 | 2001-09-20 | Ekl Ag | Cooling device for electronic components |
US6351478B1 (en) | 1998-09-11 | 2002-02-26 | Cutting Edge Optronics, Inc. | Passively cooled solid-state laser |
CN100568492C (en) * | 2006-12-06 | 2009-12-09 | 中国科学院电工研究所 | Heat radiator of computer CPU |
CN102065669A (en) * | 2010-11-16 | 2011-05-18 | 浙江大学 | Efficient cooling system for outdoor mobile communication base station equipment |
US20110309800A1 (en) * | 2010-06-18 | 2011-12-22 | Bertness Kevin I | Battery maintenance device with thermal buffer |
WO2012107523A1 (en) * | 2011-02-11 | 2012-08-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Heat-absorbing device with phase-change material |
US8513949B2 (en) | 2000-03-27 | 2013-08-20 | Midtronics, Inc. | Electronic battery tester or charger with databus connection |
US20140268564A1 (en) * | 2013-03-15 | 2014-09-18 | Finsix Corporation | Method and apparatus for controlling heat in power conversion systems |
US8872516B2 (en) | 2000-03-27 | 2014-10-28 | Midtronics, Inc. | Electronic battery tester mounted in a vehicle |
US8872517B2 (en) | 1996-07-29 | 2014-10-28 | Midtronics, Inc. | Electronic battery tester with battery age input |
US8937976B2 (en) | 2012-08-15 | 2015-01-20 | Northrop Grumman Systems Corp. | Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier |
US8958998B2 (en) | 1997-11-03 | 2015-02-17 | Midtronics, Inc. | Electronic battery tester with network communication |
US8963550B2 (en) | 2004-08-20 | 2015-02-24 | Midtronics, Inc. | System for automatically gathering battery information |
US9018958B2 (en) | 2003-09-05 | 2015-04-28 | Midtronics, Inc. | Method and apparatus for measuring a parameter of a vehicle electrical system |
US9052366B2 (en) | 2000-03-27 | 2015-06-09 | Midtronics, Inc. | Battery testers with secondary functionality |
US9201120B2 (en) | 2010-08-12 | 2015-12-01 | Midtronics, Inc. | Electronic battery tester for testing storage battery |
US9229062B2 (en) | 2010-05-27 | 2016-01-05 | Midtronics, Inc. | Electronic storage battery diagnostic system |
US9244100B2 (en) | 2013-03-15 | 2016-01-26 | Midtronics, Inc. | Current clamp with jaw closure detection |
US9255955B2 (en) | 2003-09-05 | 2016-02-09 | Midtronics, Inc. | Method and apparatus for measuring a parameter of a vehicle electrical system |
US9274157B2 (en) | 2007-07-17 | 2016-03-01 | Midtronics, Inc. | Battery tester for electric vehicle |
US9312575B2 (en) | 2013-05-16 | 2016-04-12 | Midtronics, Inc. | Battery testing system and method |
US9335362B2 (en) | 2007-07-17 | 2016-05-10 | Midtronics, Inc. | Battery tester for electric vehicle |
US9425487B2 (en) | 2010-03-03 | 2016-08-23 | Midtronics, Inc. | Monitor for front terminal batteries |
US9496720B2 (en) | 2004-08-20 | 2016-11-15 | Midtronics, Inc. | System for automatically gathering battery information |
US9588185B2 (en) | 2010-02-25 | 2017-03-07 | Keith S. Champlin | Method and apparatus for detecting cell deterioration in an electrochemical cell or battery |
US9590388B2 (en) | 2011-01-11 | 2017-03-07 | Northrop Grumman Systems Corp. | Microchannel cooler for a single laser diode emitter based system |
US9851411B2 (en) | 2012-06-28 | 2017-12-26 | Keith S. Champlin | Suppressing HF cable oscillations during dynamic measurements of cells and batteries |
US9923289B2 (en) | 2014-01-16 | 2018-03-20 | Midtronics, Inc. | Battery clamp with endoskeleton design |
US9966676B2 (en) | 2015-09-28 | 2018-05-08 | Midtronics, Inc. | Kelvin connector adapter for storage battery |
US10046649B2 (en) | 2012-06-28 | 2018-08-14 | Midtronics, Inc. | Hybrid and electric vehicle battery pack maintenance device |
US10222397B2 (en) | 2014-09-26 | 2019-03-05 | Midtronics, Inc. | Cable connector for electronic battery tester |
US10317468B2 (en) | 2015-01-26 | 2019-06-11 | Midtronics, Inc. | Alternator tester |
US10429449B2 (en) | 2011-11-10 | 2019-10-01 | Midtronics, Inc. | Battery pack tester |
US10473555B2 (en) | 2014-07-14 | 2019-11-12 | Midtronics, Inc. | Automotive maintenance system |
US10608353B2 (en) | 2016-06-28 | 2020-03-31 | Midtronics, Inc. | Battery clamp |
US10843574B2 (en) | 2013-12-12 | 2020-11-24 | Midtronics, Inc. | Calibration and programming of in-vehicle battery sensors |
US11054480B2 (en) | 2016-10-25 | 2021-07-06 | Midtronics, Inc. | Electrical load for electronic battery tester and electronic battery tester including such electrical load |
US11325479B2 (en) | 2012-06-28 | 2022-05-10 | Midtronics, Inc. | Hybrid and electric vehicle battery maintenance device |
US11474153B2 (en) | 2019-11-12 | 2022-10-18 | Midtronics, Inc. | Battery pack maintenance system |
US11486930B2 (en) | 2020-01-23 | 2022-11-01 | Midtronics, Inc. | Electronic battery tester with battery clamp storage holsters |
US11513160B2 (en) | 2018-11-29 | 2022-11-29 | Midtronics, Inc. | Vehicle battery maintenance device |
US11545839B2 (en) | 2019-11-05 | 2023-01-03 | Midtronics, Inc. | System for charging a series of connected batteries |
US11566972B2 (en) | 2019-07-31 | 2023-01-31 | Midtronics, Inc. | Tire tread gauge using visual indicator |
US11650259B2 (en) | 2010-06-03 | 2023-05-16 | Midtronics, Inc. | Battery pack maintenance for electric vehicle |
US11668779B2 (en) | 2019-11-11 | 2023-06-06 | Midtronics, Inc. | Hybrid and electric vehicle battery pack maintenance device |
US11740294B2 (en) | 2010-06-03 | 2023-08-29 | Midtronics, Inc. | High use battery pack maintenance |
US11973202B2 (en) | 2020-12-29 | 2024-04-30 | Midtronics, Inc. | Intelligent module interface for battery maintenance device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1106423B (en) * | 1959-06-23 | 1961-05-10 | Licentia Gmbh | Heat sink for semiconductor rectifier |
US3215194A (en) * | 1963-08-13 | 1965-11-02 | Astro Dynamics Inc | Heat sink and method of operating the same |
JPH04101450A (en) * | 1990-08-20 | 1992-04-02 | Meidensha Corp | Cooling apparatus |
JPH04263000A (en) * | 1991-02-19 | 1992-09-18 | Aisin Seiki Co Ltd | Body temperature remover for space suit |
-
1995
- 1995-03-14 GB GBGB9505069.6A patent/GB9505069D0/en active Pending
-
1996
- 1996-03-12 WO PCT/GB1996/000567 patent/WO1996028846A1/en active Application Filing
- 1996-03-13 IL IL11746496A patent/IL117464A0/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1106423B (en) * | 1959-06-23 | 1961-05-10 | Licentia Gmbh | Heat sink for semiconductor rectifier |
US3215194A (en) * | 1963-08-13 | 1965-11-02 | Astro Dynamics Inc | Heat sink and method of operating the same |
JPH04101450A (en) * | 1990-08-20 | 1992-04-02 | Meidensha Corp | Cooling apparatus |
JPH04263000A (en) * | 1991-02-19 | 1992-09-18 | Aisin Seiki Co Ltd | Body temperature remover for space suit |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 336 (E - 1237) 21 July 1992 (1992-07-21) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 053 (M - 1361) 3 February 1993 (1993-02-03) * |
S.S. FURKAY ET AL: "Clip-On Module Thermal Capacitor", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 27, no. 3, August 1984 (1984-08-01), pages 1779, XP002005397 * |
Cited By (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8872517B2 (en) | 1996-07-29 | 2014-10-28 | Midtronics, Inc. | Electronic battery tester with battery age input |
US8958998B2 (en) | 1997-11-03 | 2015-02-17 | Midtronics, Inc. | Electronic battery tester with network communication |
EP0987799A3 (en) * | 1998-09-11 | 2001-01-10 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
US6351478B1 (en) | 1998-09-11 | 2002-02-26 | Cutting Edge Optronics, Inc. | Passively cooled solid-state laser |
US6570895B2 (en) | 1998-09-11 | 2003-05-27 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
EP0987799A2 (en) * | 1998-09-11 | 2000-03-22 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
WO2000037873A1 (en) * | 1998-12-22 | 2000-06-29 | Telefonaktiebolaget Lm Ericsson (Publ) | A device for temperature control |
WO2001069360A1 (en) * | 2000-03-16 | 2001-09-20 | Ekl Ag | Cooling device for electronic components |
DE10012990A1 (en) * | 2000-03-16 | 2001-10-11 | Ekl Ag | Cooling device for electronic components has latent heat store for heat from electronic component that can no longer be absorbed by passive cooling element |
US8513949B2 (en) | 2000-03-27 | 2013-08-20 | Midtronics, Inc. | Electronic battery tester or charger with databus connection |
US9052366B2 (en) | 2000-03-27 | 2015-06-09 | Midtronics, Inc. | Battery testers with secondary functionality |
US8872516B2 (en) | 2000-03-27 | 2014-10-28 | Midtronics, Inc. | Electronic battery tester mounted in a vehicle |
US9018958B2 (en) | 2003-09-05 | 2015-04-28 | Midtronics, Inc. | Method and apparatus for measuring a parameter of a vehicle electrical system |
US9255955B2 (en) | 2003-09-05 | 2016-02-09 | Midtronics, Inc. | Method and apparatus for measuring a parameter of a vehicle electrical system |
US8963550B2 (en) | 2004-08-20 | 2015-02-24 | Midtronics, Inc. | System for automatically gathering battery information |
US9496720B2 (en) | 2004-08-20 | 2016-11-15 | Midtronics, Inc. | System for automatically gathering battery information |
CN100568492C (en) * | 2006-12-06 | 2009-12-09 | 中国科学院电工研究所 | Heat radiator of computer CPU |
US9335362B2 (en) | 2007-07-17 | 2016-05-10 | Midtronics, Inc. | Battery tester for electric vehicle |
US9274157B2 (en) | 2007-07-17 | 2016-03-01 | Midtronics, Inc. | Battery tester for electric vehicle |
US9588185B2 (en) | 2010-02-25 | 2017-03-07 | Keith S. Champlin | Method and apparatus for detecting cell deterioration in an electrochemical cell or battery |
US9425487B2 (en) | 2010-03-03 | 2016-08-23 | Midtronics, Inc. | Monitor for front terminal batteries |
US9229062B2 (en) | 2010-05-27 | 2016-01-05 | Midtronics, Inc. | Electronic storage battery diagnostic system |
US11740294B2 (en) | 2010-06-03 | 2023-08-29 | Midtronics, Inc. | High use battery pack maintenance |
US11650259B2 (en) | 2010-06-03 | 2023-05-16 | Midtronics, Inc. | Battery pack maintenance for electric vehicle |
CN102948002A (en) * | 2010-06-18 | 2013-02-27 | 密特电子公司 | Battery maintenance device with thermal buffer |
WO2011159455A1 (en) * | 2010-06-18 | 2011-12-22 | Midtronics, Inc. | Battery maintenance device with thermal buffer |
US20110309800A1 (en) * | 2010-06-18 | 2011-12-22 | Bertness Kevin I | Battery maintenance device with thermal buffer |
US9419311B2 (en) * | 2010-06-18 | 2016-08-16 | Midtronics, Inc. | Battery maintenance device with thermal buffer |
US9201120B2 (en) | 2010-08-12 | 2015-12-01 | Midtronics, Inc. | Electronic battery tester for testing storage battery |
CN102065669A (en) * | 2010-11-16 | 2011-05-18 | 浙江大学 | Efficient cooling system for outdoor mobile communication base station equipment |
US9590388B2 (en) | 2011-01-11 | 2017-03-07 | Northrop Grumman Systems Corp. | Microchannel cooler for a single laser diode emitter based system |
US9291406B2 (en) | 2011-02-11 | 2016-03-22 | Commissariat à l'énergie atomique et aux énergies alternatives | Heat-absorbing device with phase-change material |
WO2012107523A1 (en) * | 2011-02-11 | 2012-08-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Heat-absorbing device with phase-change material |
FR2971581A1 (en) * | 2011-02-11 | 2012-08-17 | Commissariat Energie Atomique | THERMAL ABSORBER DEVICE HAVING A PHASE CHANGE MATERIAL |
US10429449B2 (en) | 2011-11-10 | 2019-10-01 | Midtronics, Inc. | Battery pack tester |
US11548404B2 (en) | 2012-06-28 | 2023-01-10 | Midtronics, Inc. | Hybrid and electric vehicle battery pack maintenance device |
US11926224B2 (en) | 2012-06-28 | 2024-03-12 | Midtronics, Inc. | Hybrid and electric vehicle battery pack maintenance device |
US11325479B2 (en) | 2012-06-28 | 2022-05-10 | Midtronics, Inc. | Hybrid and electric vehicle battery maintenance device |
US9851411B2 (en) | 2012-06-28 | 2017-12-26 | Keith S. Champlin | Suppressing HF cable oscillations during dynamic measurements of cells and batteries |
US10046649B2 (en) | 2012-06-28 | 2018-08-14 | Midtronics, Inc. | Hybrid and electric vehicle battery pack maintenance device |
US8937976B2 (en) | 2012-08-15 | 2015-01-20 | Northrop Grumman Systems Corp. | Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier |
US9276375B2 (en) | 2012-08-15 | 2016-03-01 | Northrop Grumman Systems Corp. | Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier |
US9861015B2 (en) * | 2013-03-15 | 2018-01-02 | Finsix Corporation | Method and apparatus for controlling heat in power conversion systems |
US20140268564A1 (en) * | 2013-03-15 | 2014-09-18 | Finsix Corporation | Method and apparatus for controlling heat in power conversion systems |
US9244100B2 (en) | 2013-03-15 | 2016-01-26 | Midtronics, Inc. | Current clamp with jaw closure detection |
US9312575B2 (en) | 2013-05-16 | 2016-04-12 | Midtronics, Inc. | Battery testing system and method |
US10843574B2 (en) | 2013-12-12 | 2020-11-24 | Midtronics, Inc. | Calibration and programming of in-vehicle battery sensors |
US9923289B2 (en) | 2014-01-16 | 2018-03-20 | Midtronics, Inc. | Battery clamp with endoskeleton design |
US10473555B2 (en) | 2014-07-14 | 2019-11-12 | Midtronics, Inc. | Automotive maintenance system |
US10222397B2 (en) | 2014-09-26 | 2019-03-05 | Midtronics, Inc. | Cable connector for electronic battery tester |
US10317468B2 (en) | 2015-01-26 | 2019-06-11 | Midtronics, Inc. | Alternator tester |
US9966676B2 (en) | 2015-09-28 | 2018-05-08 | Midtronics, Inc. | Kelvin connector adapter for storage battery |
US10608353B2 (en) | 2016-06-28 | 2020-03-31 | Midtronics, Inc. | Battery clamp |
US11054480B2 (en) | 2016-10-25 | 2021-07-06 | Midtronics, Inc. | Electrical load for electronic battery tester and electronic battery tester including such electrical load |
US11513160B2 (en) | 2018-11-29 | 2022-11-29 | Midtronics, Inc. | Vehicle battery maintenance device |
US11566972B2 (en) | 2019-07-31 | 2023-01-31 | Midtronics, Inc. | Tire tread gauge using visual indicator |
US11545839B2 (en) | 2019-11-05 | 2023-01-03 | Midtronics, Inc. | System for charging a series of connected batteries |
US11668779B2 (en) | 2019-11-11 | 2023-06-06 | Midtronics, Inc. | Hybrid and electric vehicle battery pack maintenance device |
US11474153B2 (en) | 2019-11-12 | 2022-10-18 | Midtronics, Inc. | Battery pack maintenance system |
US11486930B2 (en) | 2020-01-23 | 2022-11-01 | Midtronics, Inc. | Electronic battery tester with battery clamp storage holsters |
US11973202B2 (en) | 2020-12-29 | 2024-04-30 | Midtronics, Inc. | Intelligent module interface for battery maintenance device |
Also Published As
Publication number | Publication date |
---|---|
GB9505069D0 (en) | 1995-05-03 |
IL117464A0 (en) | 1996-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1996028846A1 (en) | Heat sink | |
CA2964864C (en) | Thermal capacitance system | |
US4145708A (en) | Power module with isolated substrates cooled by integral heat-energy-removal means | |
US6661664B2 (en) | Electronic module with high cooling power | |
JP5537777B2 (en) | Heat sink, cooling module and coolable electronic board | |
US20110026218A1 (en) | Thermal management of batteries using synthetic jets | |
EP0001153B1 (en) | Cooling heat generating electrical components in an electrical apparatus | |
US5285108A (en) | Cooling system for integrated circuits | |
EP0000244B1 (en) | Apparatus for cooling heat generating electrical components | |
JPH06120380A (en) | Heat distribution device for semiconductor device | |
US20050088823A1 (en) | Variable density graphite foam heat sink | |
CN111132520A (en) | Electronic device | |
AU6623698A (en) | Cooling apparatus based on heat energy bound to working fluid in phase transition | |
US6201221B1 (en) | Method and apparatus for heat regulating electronics products | |
CN101953240A (en) | Method of forming a heatsink | |
Gurrum et al. | Thermal management of high temperature pulsed electronics using metallic phase change materials | |
US7111666B2 (en) | Heat sink | |
US20210293490A1 (en) | Combined Integration Of Phase Change Materials Into Conduction-Convection-Latent Heat Optimized Thermal Management Through Novel Geometries Enabled In Additive Manufactured Heat Sinks | |
WO2022251187A1 (en) | Smart phase change composite for passive thermal management | |
CHEBI et al. | Heat dissipation in microelectronic systems using phase change materials with natural convection | |
EP3540770A1 (en) | Heat transfer device | |
Bhavnani et al. | Control of incipience hysteresis effects in liquid cooled electronics heat sinks | |
US20240068756A1 (en) | Heat sink with opposed elements providing temperature gradient | |
CN218827459U (en) | Heat radiation structure and battery package of battery package | |
JP2018181973A (en) | Electronics device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): GB PL US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |