WO1995017993A1

WO1995017993A1 - Method and apparatus for continuously producing a multiplicity of types

Info

Publication number: WO1995017993A1
Application number: PCT/JP1994/002210
Authority: WO
Inventors: Yoichiro Tamoto; Sadao Shimoyashiro; Hiroyasu Sasaki; Takemasa Iwasaki; Masao Sakata; Tomoyuki Masui; Hiroyoshi Matsumura
Original assignee: Hitachi, Ltd.
Priority date: 1993-12-27
Filing date: 1994-12-26
Publication date: 1995-07-06

Abstract

A semiconductor production method for moving products between respective processing devices as if there were some flow shops to thereby reduce labor hours between respective processes, improve reliability through stable supply and promptly deal with production of a multiplicity of types which comprises a work area comprising the processing devices, transfer systems for connecting work areas with each other and devices for connecting the work areas with the transfer systems, whereby the entire processing is prevented from totally getting down only due to the failure of a part of the processing devices through control by a computer to thereby fullfil a production schedule (tact) in a predetermined fashion, eventually resulting in reduction of time required for completion of the process. In addition, a series of processes for respective products can be solved through software, and since there is needed no rearrangement of devices and change to the transfer paths, it is possible to promptly deal with production of a multiplicity of types.

Description

Description Multi-product continuous production method and equipment

Technical field ' '

The present invention relates to a production and manufacturing system, and more particularly to a multi-product continuous production method and a multi-product continuous production method for realizing a suitable production system for a multi-product variable quantity production line having a long working process and a repetitive process. .

Background art

Conventionally, production lines for semiconductors and thin-film process products have, for example, processes for processing, transporting and storing workpieces (e-ha) as disclosed in Japanese Patent Application Laid-Open No. 56-196355. The equipment was separated into a work area that requires a clean atmosphere, where equipment is installed, and a maintenance area that does not require a high degree of cleanliness, where ancillary equipment utilities are installed. Therefore, in order to arrange them efficiently, a structure called a pay system was adopted, in which a work area (pay) and a maintenance area were alternately provided on both sides of the central passage. The processing equipment was arranged in a so-called job shop system in which equipment for performing the same kind of processing was arranged in one bay.

In the Bay system, the wafer that has completed the process in this process is transported to the processing equipment in the next process by Bay transport and inter-pay transport, and is connected to the entrance and exit of the bay, which is the connection point. There was a stocker for accommodating the cassette containing the. That is, the intra-bay transfer is performed in accordance with the stock force provided at the entrance of the pay. The cassettes are transported between the processing devices, and the transport between the bays transports the cassettes from the stocking force of each bay to the stocking force of another bay. In general, the transfer of wafers from the processing apparatus to the processing apparatus was performed by a route such as a transport vehicle in a bay, a stocker, a transport vehicle between bays, a stocking force, and a transport vehicle in a bay.

However, these conventional production methods have the following problems.

First, in the semiconductor manufacturing process, the number of processing steps is large, and the same steps are often repeated. Therefore, in the conventional bay method, the transport route between bays becomes complicated as shown in Fig. 19, and You will spend time on In FIG. 19, the zigzag solid line indicates the transport route of the wafer. In addition, since the state of the device in the preceding process and the device in the subsequent process cannot be known, it is difficult to synchronize the processing between the devices. As a result, the amount of work in progress for each bay increases, and as a result, there is a problem that the completion (time until the product is completed) becomes longer.

In order to solve this problem, as described in the literature (IEEJ: Electrical Engineering Handbook, New Edition (Showa 63, 1988), p. 166, p. 6), a production line is arranged with processing equipment arranged in process order. It may be possible to adopt a so-called flow shop system in which products are supplied and processed at time intervals (tacts) of, and production is performed in a series of continuous operations. In the case of the flow shop method, since the process is different for each product type, it is necessary to provide lines in which processing equipment is arranged for each process flow. is there.

In the processing of semiconductor products, etc., the time required for processing varies greatly depending on the processing step. For example, heat treatment for making the ion concentration distribution in the wafer uniform takes several hours, but the step of implanting ions in the wafer takes only several minutes. In order to make the tact the same in the flow line, If the processing time differs greatly, the idle time of the processing apparatus having a short processing time increases, and the operation rate decreases significantly. Furthermore, even if a single device can process multiple processes, since the devices are arranged in the order of processes, the number of devices required for each process is required, and there is a problem that the number of devices in the entire line increases. . ·

In addition, as described in the literature (Nikkan Kogyo Shimbun: Multi-product small-quantity production system (Showa 45), pp. 71-86), similar varieties are intensively processed in response to multi-product production. For this purpose, there is a production method based on a group techno-technique, in which varieties having similar processing orders are aggregated, and processing apparatuses corresponding to the processing orders are grouped to form a line. As a result, when grouping is performed, the number of processes is large in the case of semiconductors, and the process order is different for each product type, so that the number of groups becomes enormous.

The present invention provides a method and apparatus for efficiently producing products of each type. Disclosure of the invention

In order to solve the above problems, the present invention has considered a method of producing a semiconductor like a flow line. Here, six means of 1) flow rectification, 2) module creation, 3) module grouping, 4) equipment arrangement method, 5) transport method and 6) control will be described.

Flow rectification: We focused on the uniqueness of the flow of the process of repeating the same type of process in the same device as typified by semiconductor manufacturing (see Fig. 11). Semiconductors are manufactured by laminating multiple layers of thin films. Each layer is formed in the order of film formation (diffusion process, deposition process) → circuit creation (photolithography process) → removal process (etching process). (This is called one cycle.) By repeating this cycle, thin layers are successively stacked. The flow of this process is rectified by the following procedure.

(1) Assuming that each process (diffusion process, photolithography process, etching process, etc.) always exists in each cycle unit, assuming the same flow, the classification shown in Fig. 12 is performed. In this case, the process that does not exist is the passing process. Each layer shall consist of 11 steps of cleaning, diffusion, low pressure C VD, C VD, photolithography (coating, exposure, development), inbra, cleaning, etching, and removal. By the way, if cleaning, diffusion, CVD, and etching are not in the process flow (Fig. 11) as in layer 8, it is assumed that the process without them is passed.

(2) Furthermore, assuming that there is equipment for each layer unit, create a flow in which lots are not complicated.

According to the procedures (1) and (2), as shown in FIG. 13, the process is rectified by the flow without one return.

Module creation: A cycle unit of each layer is defined as a module.

Module grouping: Here, the same process flow and the same equipment used in the process are grouped together. In this case, there are 4 groups of 15 modules.

Equipment arrangement: Similar to the conventional job shop method, the same type of equipment is put together (Figs. 1 and 2), and the equipment is classified and arranged by module group (Fig. 5 Example) A combination arrangement method in which a certain module uses a job shop method and a certain module uses a module-by-module method (the example in FIG. 7) may be used.

Transport means: Provide a dedicated transport system for each module group (Fig. 1, Fig. 2 Figure, example of Figure 5). However, if the module groups are similar, the transfer system may be shared (shared) (examples in FIGS. 4, 6, and 7). When the transport system is shared and used, control is performed so that a dedicated transport system for each module group exists. The following example is given as the similarity of the module group.

· The process of configuring the module group is the same, but the equipment used is different.

'When the process of configuring one module group includes the process of configuring another module group.

Control means: Consists of the following three main means. 1) Means for determining between modules, 2) Means for transferring tact within a module, 3) Means for selecting a processing device. Means for determining between modules: Based on the unique processing (flow) of the product (semiconductor), determine which module to use and in which module order.

In-module tact transfer means: A means for transferring each module within the product tact.

Processing device selection means: Selects a device to use the conveyed product. Figure 14 shows a simple flow of the product.

Hereinafter, the operation of the present invention will be described.

The manufacturing process is cut by a single flow to create a cycle. Here, a similar cycle is put together to create a module. This will rectify the flow of the traditionally complicated line and make it easier to control the flow. In addition, since a buffer is provided for each module and the flow flows to the tact, the transport system does not control the overall process order but simply transports to the next process. Control becomes easy.

When the processing of a product in a certain process is completed, the product is transported from the processing area where the process was performed to an area where the next process is performed by a dedicated transport system that transports the product in the order of processes, and the next process is performed. The dedicated transport path supplies products that have been processed at a fixed time interval (tact) to successive processes, so that products are supplied without interruption to each area, and products are processed at the same production speed in each processing area. Can be processed.

Fig. 15 shows a comparison between the conventional method (job shop method) and the example of the present invention (module device classification method 'partial module method'). According to the method of the present invention, the length can be shortened and the production variation is small as compared with the conventional method. This is due to module flow.

As shown in the example of Fig. 17, in the method of classifying the modules, three processes are performed one by one in series, so the probability that the line will not stop due to a failure is 34.3%. On the other hand, in the virtual module system, devices can be used in parallel, and line stoppage due to device failure can be avoided. In this case, if three processes are performed by three units, the reliability increases to 92.1%. The basis for this is shown in Figure 16. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an overall configuration diagram of a first embodiment of the present invention, FIG. 2 is a second embodiment of the present invention, and shows a line configuration in which work areas are arranged in a processing order, and FIG. 3 is a diagram of the present invention. FIG. 3 is a diagram showing a line configuration using an arbitrary combination of transport paths according to a third embodiment. FIG. 4 is a fourth embodiment of the present invention, which is a line using one transport path. FIG. 5 is a view showing a configuration, FIG. 5 is a view showing a fifth embodiment of the present invention, and is a view showing a line configuration for performing continuous processing in an area. FIG. 6 is a sixth embodiment of the present invention, showing a part of an area. FIG. 7 is a diagram showing a line configuration as a single process, FIG. 7 is a diagram showing a seventh embodiment of the present invention, showing a line configuration by one transport path, and FIG. 8 is a diagram showing a relationship between a process and the number of equipment. , FIG. 9 is a diagram showing a working procedure, FIG. 10 is a diagram of a communication form, FIG. 11 is a schematic diagram of a semiconductor manufacturing procedure (flow) diagram, and FIG. 12 is a diagram of the flow of FIG. Classification division diagram, Fig. 13 is process rectification diagram, Fig. 14 is product flow diagram, Fig. 15 is comparison diagram of conventional technology and the present invention, Fig. 16 and Fig. 17 are the present invention Fig. 18 is a Gantt chart of module production status, and Fig. 19 is an explanatory diagram of the prior art. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in detail with reference to the drawings.

(Example 1)

FIG. 1 shows a layout of a semiconductor manufacturing apparatus, for example. Each work area 6 includes a plurality of processing units 3 of the same type, and each processing apparatus 3 is connected by the transfer system 2 in the work area. The transport system 2 in the work area is connected to a controller 7a in the work area via a communication cable 8.

An ID reader 11 is provided in the work area 6 to read a code attached to a product (a semiconductor wafer or a cassette for transporting a wafer) to be carried into the work area 6, and to read the code. Notify the controller 7a.

In the embodiment shown in Fig. 1, an example in which seven work areas 6 are provided Is shown.

Each work area 6 is provided with an inter-transport system maintenance device 4 for carrying in and out the products to and from the work area, and the inter-transport system connecting device 4 is connected by an inter-work area transport system 5.

According to the present invention, the transport system 5 between the rice II II areas is not fixed, and a dedicated transport system with the highest efficiency is constructed according to the processing form of the product. In the embodiment shown in FIG. 1, it is shown that six types of transport systems from transport system A to transport system F are prepared as the transport system 5 between work areas. The host computer 1 controls each transport system via the inter-work area transport system controller 7d.

Next, the operation of the present device will be described.

This device has two main functions. One is the process of cutting a flow into partial flows at the time of line design, combining the cut partial flows, and creating a flow line called a module in this unit. The other is a process that controls the progress of products for each module and controls transport during actual production so that production can be performed in tact. First, the procedure for line design will be described.

Figure 11 shows the schematic semiconductor manufacturing procedure (flow). Here, a semiconductor consisting of 15 layers is shown. In the first layer, “Layer 1”, cleaning, diffusion, low-pressure CVD (chemical vapor deposition), photolithography (exposure), etching, removal (resist) Removal). The formation of such a layer is repeated 15 times to complete one semiconductor.

Next, focusing on this flow (Fig. 11) focusing on the photolithography process, Unit that forms one layer). The rules for division are shown below.

(1) Divide based on the photolithography process.

(2) Divide the flow into partial flows so that the order of steps such as washing and diffusion is not reversed.

The results are shown in FIG. The order of the steps is as follows: cleaning (for diffusion), diffusion, low-pressure CVD, photolithography, inbra (ion implantation), cleaning (for etching), etching, and removal.

Therefore, focusing only on the photolithography process, the first cycle consists of the first and second layers (because there is no photolithography process). However, if the flow is cut like this, “Layer 2 cleaning” comes after “Layer 1 removal”, and the cleaning process (for diffusion) is duplicated. With such duplication of processes, this first cycle does not become a flow line. Therefore, the second layer is divided into the second cycle using the division rule (2). The result is as shown in Fig. 12. In other words, the first layer consists of six steps: cleaning, diffusion, low-pressure CVD, photolithography, etching, and removal, and the second layer consists of three steps: cleaning, diffusion, and impeller. Similarly, the process flow is cut and divided into first to fifteenth cycles.

The result of this division is stored in the module definition file.

Next, we focus on the processes (cleaning, diffusion, photolithography, etc.) that appear in each layer, and combine similar cycles into modules. For example, this time, it is compiled into a module according to the following rules. As for the method of summarizing the modules, a computer may be used to search for a combination that minimizes the number of facilities from a large number of combinations. (1) Focus on the imbra process and divide it into modules with and without the inbra process.

(2) Focus on diffusion and low-voltage CVD processes, and divide them into modules with only diffusion processes, modules with only low-voltage CVD processes, and modules with both diffusion and low-pressure CVD processes.

When the cycles are classified by these two rules, they can be classified into four modules (A, B, C, D) shown in the lower part of Fig. 12. For example, cycles 1, 3, 6, and 11 can be categorized as module C, which consists of cleaning, diffusion, low pressure CVD, photolithography, etching, and removal. Similarly, the module name for each cycle is shown in the upper part of FIG.

The results of this cycle classification are also stored in the module definition file.

Next, how to determine the number of equipment and the buffer capacity for each process in the module will be described.

This section describes the number of modules C and the buffer capacity. First, the target production quantity is given. This is to determine the production volume produced by this production line in advance and set it as the target production volume.

Target production volume>

250 sheets day (25 sheets Z lot) = 10 lots Z day

As mentioned earlier, module C handles four cycles. Number of cycles>

4 cycles (cycles 1, 3, 6, 1 1) <Target tact>

2 4 Hr X 60 min Z l 0 lot Z 4 cycles = 36 min • The processing time and number of processing ports for each process are as follows ₍ wash

Processing time: · 7 minutes

Number of processing π-units: 1 π-unit

Diffusion>

Processing time: 360 minutes

Number of processing units: 6 π units

Processing time: 360 minutes

Number of processed lots: 6 lots

Processing time: 55 minutes

Number of processing slots: 1 lot

Etching>

Processing time: 70 minutes

Number of processed lots: 1 lot

Processing time: 77 minutes

Number of processing mouths: 1 lot

Therefore, the number of equipment in each process can be obtained by the following formula. <Number of equipment in each process> Number of equipment = [processing time] ÷ [target tact] ÷ [processing lot number] For example, in the cleaning process,

7 7 ÷ 3 6 + 1 = 2.1.4

So you need three units.

Similarly, in the diffusion process,

3 6 0 ÷ 36 ÷ 6 = 1.6 .7

So you need two.

The number of equipment obtained by the above procedure is stored in the module definition file. Next, Fig. 18 shows the production status of this module in the form of a Gantt chart based on the obtained number of facilities. In this figure, the horizontal axis represents time (in the case of the figure, 36 minutes, which is one tick per tact), the vertical axis represents the arrangement of processes, and the equipment for each process. For example, the first lot is processed for 77 minutes in the washing 1 facility and then stored in a buffer. In this case, the cleaning process is performed in units of one unit, whereas the diffusion process is performed in units of six lots. Therefore, a buffer is provided between the cleaning process and the diffusion process to temporarily store the lot.

When six lots are stored in this buffer, six lots are sent to the diffusion process. From a different perspective, it is considered that the buffer is in the diffusion process, and the lot is sent to the next process every 36 minutes from the washing process. That is, the cleaning process and the diffusion process operate as flow lines. In this way, if a lot is paid out between each process at the tact time, there is no in-process between the processes and production can be performed like a flow line. .

However, the diffusion process and the low pressure CVD process are batch processes, 'Lots are not sent on time. However, if you think about 6 tacts (2 16 minutes), 6 lots will be sent to the next process during 6 tacts, so it looks like a flow line.

Also, by providing a buffer between the low-pressure CVD process and the photolithography process, the six lots that came out of the low-pressure CVD process are divided and timed, so that lots can be created as if for each tact time. Low-pressure C VD process Produced as if it were paid off.

By performing production in a module in this way, one module can be operated as a flow line.

The size of the buffer obtained as described above is stored in the module definition file.

Of the two major functions of this equipment, two are operations that determine the procedure for operating the production line. The procedure is as follows.

(1) Update of work results: When the lot processing is completed in the equipment of each process, a completion report is transmitted to the progress management system in the host computer via the controller in the work area. In the progress management system, the lot status of the lot is changed from being processed to being transported.

(2) Destination calculation: Next, the progress management system determines the destination process from the module definition file, and then identifies the equipment corresponding to the destination process. (3) Transfer instruction: The progress management system issues an instruction to the transfer control system to transfer the port to the equipment determined by the transfer destination calculation. In accordance with this instruction, it is transported by the transport system.

(4) Start of construction instruction: When the mouth reaches the destination device, The start instruction is issued from the host computer to the controller in the work area.

With the above procedure, the production and distribution in the module can be controlled. Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 10.

In semiconductor manufacturing, as described above, a series of processing operations are performed several times in the entire manufacturing process. As an example, the following series of processing operations can be mentioned (washing → diffusion → resist coating → exposure-development). Assuming that a series of processing consists of the processing equipment (process (e), process (f), process (a), process (mouth), and process (c)) shown in Fig. 1, a special work area connecting these The transport system 5 is provided (here, the transport system 5a). The product moves to the next process through the inter-work area transfer system 5a in a predetermined order in a series of processes.

The transport system 5a between the work areas transports the product with the specified tact. At this time, the transfer of the product to the transfer system 5a between the work areas in each processing device 3 can be performed with a predetermined tact via the transfer system connection device 4. The specific flow will be described with reference to FIG.

Each product has a code attached to the wafer or cassette that carries the wafer so that it can be distinguished from other products. When the product processing is completed, the processing apparatus notifies the controller 7a in the work area of the completion (Step 1). The controller 7a in the work area asks whether the product can be transferred to the transfer system 2 in the work area (Step 2). If the answer is “No” from the transport system 2 in the work area, the product is waiting in the processing equipment 3. When the signal of “OK” is obtained from the transport system 2 in the work area, the controller 7a in the work area instructs the processing device 3 and the transport system 2 in the work area to transfer the product to the transport system 2 in the work area. (Step 4). Made When the controller 7a in the work area confirms that the product has been transferred to the transfer system 2 in the work area (Ste _P 5), a command is issued to the transfer system 2 in the work area to carry the product to the transfer system intermediary device 4. Yes (Step 6). Execute it in Step 7.

The controller 7a in the work area and the host computer 1 receive a transfer completion signal from the transfer device 4 (Step 8). In Step 9, the host computer 1 determines the next work area 6 and the transport system 5 between the work areas to be transported there, and in Step 10 the controller 7a in the work area and the transport system controller between the work areas are transported there. 7 Instruct d. The inter-transfer system controller 7c asks the inter-work carrier controller 7d whether the inter-work carrier system 5 can transfer the product (Step 1). If the answer from the inter-work area transfer system controller 7d is "No", the product is put on standby in the transfer system interlocking device 4, and if "Yes", the product is transferred to the inter-work area transfer system 5 (St mark 12) (Step 13) . When the transfer is completed, it is transported to the next area (Step 14 to Step 20).

When the product is transferred to the transfer system connecting device 4 in the next work area, the wafer is checked again (the identification code is checked) (Step 21). If it is wrong, the transfer system controller 7c puts the product on standby in the transfer system 4 and notifies the host computer 1 via the controller 7a in the work area, Computer 1 informs the outside (worker) (Step 22). If the product is correct, indicate the arrival of the product to the next controller 7a in the work area, indicate the ID and tact, and request processing (Step 23). .

The controller 7a in the work area listens to the processing device 3 for the acceptance of the product (Step 24). If any of the processing devices 3 is not accepted, the product is delivered. Controller 7a in the work area instructs the transfer system 2 in the work area to send the product to the processing device 3 if it is `` waited '' by the transmission intermediary device 4-(Step 25 to Step 34) . When the transfer is completed, the controller 7a in the work area instructs the processing device 3 to process (Step 35).

Some of this series of processing operations are provided, and a dedicated transport system 5 between the work areas is provided (in Fig. 1, transport systems 5a to 5f). Each inter-work area transfer system 5 a to 5 制御 is controlled to operate at each tact. When a series of processing is completed, the next series of processing is started (for example, the transport system 5a → the transport system 5b). The host computer 1 completes a series of processes from the transport system controller 7 in the ^ ϋ area of the transport system 5a, checks the status of the transport system 5 from the transport system controller 7 in the work area of the transport system 5b, and moves. If it can be loaded, transfer the product. If not, wait until the transport system B becomes empty. The product is changed one after another by changing the transfer system 5 between the work areas, that is, a series of processing is performed from one to the next, and the product is completed.

Here, a specific tact setting method will be described. In the manufacture of a product, the above-mentioned series of operations is, for example, 5a → 5b → 5c → 5d → 5b → 5c → 5a. The production volume to be manufactured per day is determined by the production plan, and here, it is assumed that 900 wafers are Z days. Semiconductors are usually assembled into 25 units of wafers in one unit (lot) and transported in a transport cassette. That is, the production number is 36 lots a day. Assuming 24 hours a day operation, production must be carried out at a production rate of 1.5 lots Zh from the time the product is put into the line to the time it is paid out. 5a → 5b → 5c → 5d → 5b- → 5c → 5a, the transfer tact of each transfer system is 0.75 lots / h for transfer system 5a, 0.75 lots for transfer system 5b / h, 0.5 lot / h for transfer system 5c and 1.5 lot / h for transfer system 5d.

Next, the processing function of the area will be described. Take the transport system 5c as an example. The transport system 5c includes work areas for process (a), process (mouth), process (c), process (h), process (g), and process (f). The number of processing devices is also set so that this series of operations is performed with the specified tact, and in accordance with the tact in hardware.

If the processing speed of the processing device 3 is faster than the tact, the product waits in the transfer system connecting device 4, and the transfer system connecting device 4 is transferred to the interworking transfer system 5a to match the tact. At this time, whether to wait in the transfer system connection device 4 for processing or to wait after finishing the processing differs depending on each product. Conversely, if the processing speed of the processing unit 3 is slower than the tact time, the processing unit 3 in the work area 6 is added to shorten the apparent processing time (for example, if a certain processing unit takes twice the tact time) Use two processing units instead of one). When one work area is used by a number of transport systems, the number of processing devices 3 is set so that the products in each transport system can be handled at once.

(Example 2)

Another embodiment is shown in FIG. In the method of arranging the work area 6, the work areas 6 are arranged in the order of a series of processes, and the work areas are connected.The transport system between the cells is linear, and the product is moved by reciprocating movement instead of circulation. I do. The product enters the next series of processing in the transfer system connection device 4. For example, in the transport realized by the transport system 5a shown in the first embodiment, the process (e) → the process (f) → the process (a) — the process (mouth) → the process (c) are arranged in order, and the work area Intermediate transfer system 5 Subtract a. The product is conveyed in a reciprocating motion, and the product that has completed a series of processing is transferred to the next series of processing (for example, the conveying system 5a to the conveying system 5b) on the conveying system connecting device 4.

(Example 3)

Another embodiment is shown in FIG. The transfer system 5 between work areas is provided with a transfer system 5 between work areas that arbitrarily connects the work area 6 with another work area 6.

In a certain series of processes, the transport system is selected and turned around in order by selecting the transport system. For example, in the transfer realized by the transfer system 5a described in the first embodiment, the process (e) and the process (h), the process (h) and the process (a), the process (a) and the process (mouth), the process Products are flowed in the order of the process by selecting the transfer system that connects the (mouth) and the process (c). (Example 4)

Another embodiment is shown in FIG. A transfer system between work areas is provided virtually, not physically, and only one transfer system 5 between work areas is provided. This transport system enables transport between any areas. The host computer 1 controls the transport system 5 between the dedicated work areas as if it were.

An example of the control method will be described below. The transport system 5 between work areas is composed of several transport vehicles, and one transport vehicle cannot carry one unit of power. This one unit ゥ eha may be either a single unit or a lot unit. The processed product is placed on the transport trolley of the interworking transfer system 5 via the interworking transfer device 4 for the work area and transferred to the next work area. At this time, the transfer system connecting device 4 reads the identification of the product and sends the data to the host computer 1. The host computer 1 is a product of this series of processing. Which is the product of the transport system 5 between the storage areas?) Recognize and send the product X (i) that has been processed just before this product to the next work area 6 from the transport area 5 Ask the controller 7a in the next work area and the controller 7c for the inter-transportation system to determine whether or not it has been received by the inter-transportation system 4.

When the signal of "received" returns, the host computer 1 allows the transport inter-connection device 4 to flow the processed product Xi to the inter-work area transport system 5, and transports the "unreceived" signal. The intermediary device 4 is put on standby. At this time, even if the product Y (j) of another series of processing is completed after the product X (i) in the same area, the processing was completed immediately before in the next work error in that series of processing work If the product Y (j-1) has been received, it shall flow to the inter-work area transport system 5 first. For example, it is assumed that the inter-work area transfer systems 5a to 5f shown in the first embodiment virtually exist in the present embodiment. The transport system 5a and the transport system 5b use the same work area process (e).

The product for the transport system 5a has been processed and should be transported to the next process (F), but there is no signal from the controller 7a in the work area of the process (F) that received the preprocessing and product. In this case, the product waits in the transfer system connecting device 4. If the processing of the product for the transport system 5b is completed after the product for the transport system 5a, and there is already a signal that the pre-processed product has been received from the next work area process (a), the transport system The splicer 4 first feeds the products of the transfer system 5 b to the transfer system 5 between work areas. In this way, the product flows as if several transport systems exist.

(Example 5)

Another embodiment is shown in FIG. Working area 6 of the previous embodiment is optional continuous The equipment will consist of equipment that sequentially and sequentially processes multiple series of processes (A, B, C). For example, in the semiconductor manufacturing, an apparatus of the same kind of repetition process (cleaning-diffusion → resist coating-exposure-development) is arranged in one work area 6. A transport system will be provided to directly splice these five types of equipment. This transport system is only instructed to transfer the product from cleaning to diffusion → resist coating → exposure → development. This washing → diffusion → resist coating → exposure → development is apparently performed as one continuous apparatus.

(Example 6)

Another embodiment is shown in FIG. In the apparatus arrangement method of the apparently continuous apparatus (that is, in the work area) of the previous embodiment, the processing apparatuses required for a series of processing are collected instead of being arranged consistently as shown in the previous embodiment. These processing devices 3 and one shared transfer system connection device 4, and the transfer system connection device 4 work and a transfer system in a work area that connects several processing devices 3 to each other. The transfer system 2 in the work area is installed radially with respect to the transfer system connecting device 4, and the processing device 3 is connected to each transfer system connecting device 4. Products undergoing a series of processing are transferred to the next processing apparatus 3 via the shared transfer system connecting apparatus 4. Further, the products that have completed a series of processing are transferred to another work area 6 via the shared transfer system connection device 4.

Conversely, products that require a series of processing in the work area 6 obtain the transfer system connecting device 4 from the work area transfer system 5 and enter the work area. By arranging the devices radially, the efficiency of the space used can be increased. Further, in the previous embodiment, when the processing device 3 fails, the product stops in the work area 6, but in this method, the shared transfer system connection device 4 is used. It can be transferred to the place 3 and does not stop in the work area. There is also a method of providing a buffer or the like in preparation for a failure of the processing device, but in the previous embodiment, a buffer is required for each device, but in the present embodiment, the buffer is performed by the transfer system connection device 4 and the buffer is provided. Saves cost and space.

FIG. 7 shows still another embodiment of the present invention.

In the present apparatus, work areas 6 having different processes are grouped to form a work area 9 in which one continuous process is apparently executed. In the present embodiment, six ^^ areas 9 a to 9 形成 are formed. These work areas are connected by a single work area transfer system similar to that shown in the embodiment of FIG. The control method of the transfer system is the same as that of the embodiment of FIG. In the present invention, a line with a small amount of work in process and a short time can be realized with a simple transfer system without providing a dedicated production line for each product type and without changing the line layout. FIG. 8 shows one effect of the present invention. Fig. 8 shows the results and the number of devices when a semiconductor production line producing 680 wafers per day is realized by a job shop, a flow shop, and the present invention. As for job completion, in the case of a job shop, there is no special consideration on how to flow products, so waiting occurs for each process, and the job completion is greatly lengthened. On the other hand, according to the present invention, since the product flows at the tact time, there is an effect that the completion is greatly reduced. In the case of a flow shop, even if a single device can process a plurality of processes, the number of devices required for the number of processes is required, whereas in the present invention, the process can be performed within one area Therefore, since one apparatus can process the plurality of processes, there is an effect that the number of apparatuses does not increase. Another advantage of the present invention is that even if one processing device fails in the area, another processing device can be substituted, so that the entire processing is not stopped. In addition, a series of processes corresponding to each product can be solved on software, and there is no need to rearrange the equipment and change the transport path.

Claims

The scope of the claims

1. In a production process in which continuous work is performed, equipment with the same processing function is gathered, several work areas are created, and the areas are connected by several transport systems and connected to the transport system. A multi-product continuous production method characterized in that products are supplied and produced at the same production rate between different working areas.

2. Provide a transfer system that arbitrarily connects between the work area and the other storage areas. Depending on the type of the product to be worked on, a combination of work carriers with the same production speed is used. A multi-product continuous production method characterized by controlling the transport of products and supplying and producing products at the same production speed in the combined area.

3. A multi-product continuous production method characterized in that the transfer system in claim 2 is a single transfer system, and the control of the transfer system is performed simultaneously so that an arbitrary series of operations is performed as if a dedicated transfer system is provided. .

4. The multi-product continuous production method as set forth in claim 1, wherein the work area includes a collection of equipment for sequentially and continuously processing a plurality of continuous processes.

5. The multi-product continuous production method according to claim 4, wherein the work area comprises a group of equipment of the same kind of repetitive process.

6. A plurality of work areas composed of a plurality of devices that perform the same type of processing, a transport system in the work area that transports products to each processing device in the work area, and control in the work area. The controller in the work area to be performed, the transfer system between work areas for transferring products between work areas, and the transfer between work areas It is equipped with a transfer splicing device that connects the transfer system and the transfer system in the work area, a controller of the transfer system splicer, a controller of the transfer system between work areas, and a host computer that controls the entire production device. Multi-product continuous production. The transport system between work areas is a dedicated transport system that connects each work area. Products are transported to each work area sequentially by the dedicated transport system according to a series of processing steps. 7. The multi-product continuous production apparatus according to claim 6, characterized in that: The transfer system between work areas is a transfer system that connects the work areas in a straight line, and the product is transferred in a reciprocating manner through the transfer system according to a series of processing steps. A multi-product continuous production apparatus as described.

7. The transfer system according to claim 6, wherein the transfer system between the work areas is a transfer system for arbitrarily connecting between the work areas, and the product is transferred by an arbitrary route according to a series of processing steps. Multi-product continuous production equipment.

0. The transport system between work areas is a transport system that virtually connects each work area, and products are transported by a virtual transport system constructed by the host computer according to a series of processing steps. Claim 6 characterized by

1. The work area is made up of a plurality of devices that sequentially and continuously process a series of arbitrary continuous processing steps, and the transport system in the work area is a transport device that directly connects each device. Claims 6

2. The work area is formed by collecting the processing equipment required for a series of processing, and is carried in the work area to one transfer splicer installed in the work area. 7. The multi-variety according to claim 6, wherein the transmission systems are radially connected.

3. The work area is a work area in which one continuous process is executed by apparently grouping work areas with different processes, and the transport system between the work areas is a virtual work soil layer. 7. The multi-product continuous production apparatus according to claim 6, wherein the multi-product continuous production apparatus is a transfer system connected to a continuous feeder.