WO1995007789A1 - Apparatus and process for using fresnel zone plate array for processing materials - Google Patents

Apparatus and process for using fresnel zone plate array for processing materials Download PDF

Info

Publication number
WO1995007789A1
WO1995007789A1 PCT/US1994/010383 US9410383W WO9507789A1 WO 1995007789 A1 WO1995007789 A1 WO 1995007789A1 US 9410383 W US9410383 W US 9410383W WO 9507789 A1 WO9507789 A1 WO 9507789A1
Authority
WO
WIPO (PCT)
Prior art keywords
work piece
plate
subaperture
subapertures
fresnel zone
Prior art date
Application number
PCT/US1994/010383
Other languages
French (fr)
Inventor
Adlai H. Smith
Robert O. Hunter, Jr.
Bruce B. Mcarthur
Original Assignee
Litel Instruments
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litel Instruments filed Critical Litel Instruments
Priority to AU76872/94A priority Critical patent/AU7687294A/en
Publication of WO1995007789A1 publication Critical patent/WO1995007789A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Definitions

  • This invention relates to a machine and process for utilizing so-called "Fresnel zone plate arrays" to process materials.
  • Fresnel zone plate arrays can be utilized for patterning a work piece such as polyimide with small precise features -- such as precise circles and polygons useful in such fields as ink jets or electronic circuits.
  • each subaperture brings coherent light -- typically from a laser source -- incident upon the subaperture to a confluence at a discrete distance and angularity from the subaperture.
  • the same subaperture -- utilizing constructive and destructive interference at a discrete distance from the subaperture produces an image.
  • An example of such a plate can be a number of discrete subapertures each focusing incident light to drill a group of precisely spaced and precisely dimensioned side-by-side holes or "vias. " Such an array of holes can have utility for ink jet printer heads or ultichip modules. This patent application is incorporated herein by reference. In the following disclosure, an apparatus for the use of the Fresnel zone plate arrays is specifically set forth.
  • An apparatus for using and a process of using a Fresnel zone plate array is utilized for processing materials.
  • An optically stable frame receives coherent light and passes the coherent light through beam processing optics such as a collimator, a beam expanding telescope and an aperture. Thereafter, the beam is routed to scanning mirrors immediately overlying a Fresnel zone plate array.
  • the Fresnel zone plate array has a plurality of discrete Fresnel zones with each subaperture containing image information at a discrete distance from the plate; each image produced by a subaperture of the Fresnel zone plate array typically differs from adjacent images produce by subapertures typically in size, shape or gain.
  • the beam is scanned and registered to a discrete selected subaperture on the plate to cause an image from the subaperture to form on a work piece located at a discrete distance from the scanned subaperture.
  • the work piece is moved relative to the Fresnel zone plate array to register the image of the discrete subaperture at the required location for processing on the work piece.
  • the work piece is positioned, and the laser pulsed with the selected image causing processing of the work piece.
  • a work piece can be configured by multiple image exposures from arbitrarily selected subapertures on the Fresnel zone plate array to produce a precisely spaced and precisely configured array of holes or vias of extreme small dimension. Consequently, the array produced on the work piece is an arbitrarily assembled composite of the array of images of the Fresnel zone plate array. Additionally, the work piece can contain complex processed areas such as apertures resulting from coincident multiple image exposures from the discrete subapertures of the Fresnel zone plate array.
  • BRIEF DESCRIPTION OF THE DRAWINGS Fig. l is a perspective view of the apparatus of this invention illustrating an optical frame with mounted beam processing optics for addressing and scanning a beam to a Fresnel zone plate array for production of working images to a moveable work piece;
  • Fig. 2 is an elevation section of the machine of Fig. 1 illustrating the mounting of the work piece relative to the Fresnel zone plate array;
  • Fig. 3A is a plan view of a plate containing the subapertures of this invention;
  • Fig. 3B is a detail of one of the subapertures of the plate of Fig. 3A;
  • Fig. 4 is a detail of a plate having more complex shapes
  • Fig. 5A is a "fly's eye" matrix of subapertures -- Fresnel zone plates or otherwise -- utilized to average beam intensity at the work piece, the averaging technique being applicable to any of the elements of the plates of Figs. 3A and 4;
  • Fig. 5B illustrates a solidly ablated circular region created by the fly's eye subaperture plate of Fig. 5A;
  • Fig. 6A is a Fresnel zone plate array pattern and Fig. 6B is the resultant image, this pattern being used to align the Fresnel zone subaperture plate array with respect to the work piece;
  • Fig. 7 is a view of a work piece including a roll of material being dispensed across an optical table for processing in accordance with this invention
  • Fig. 8 is a block diagram useful in understanding the complete optical train illustrated in Figs. 1 and 2 from a functional aspect
  • Fig. 9 is an illustration of a double exposure
  • Fig. 10 illustrates the differences between a partially ablated pattern and a fully ablated pattern
  • Fig. 11 is a detail adjacent the work piece of the Fresnel zone plate array proximity plate and the Fresnel zone plate array, work piece proximity plate and work piece and table, this diagram illustrating the relative degrees of motion of the beam, Fresnel zone plate array and work piece.
  • Fig. 1 is a perspective view of the apparatus of this invention.
  • the laser source (not shown) is chosen based upon the absorption characteristics of the work piece as well as the desired beam divergence and uniformity.
  • the laser beam is directed by folding mirrors 46 and 47 into beam expanding/condensing lenses 49 and beam collimating lenses 48. Folding mirrors 44 and 54 then direct the beam to Fresnel zone plate array 55. Plate 55 is mounted to angular or ⁇ positioner 52. After the beam is shaped by plate 55, it impinges on work piece 53' . Work piece 53' is mounted to an XY stage. Ducts 50 is used either to direct air onto the work piece or to exhaust fumes away from the work piece.
  • Desirable appurtenance to the lens train can include a laser beam pointing stabilizer before or after 46. This devices assures that the laser source is given the correct angularity during laser operation. Such devices are known.
  • Folding mirrors 44' and 54 serve multiple functions in the preferred embodiment.
  • the mirrors are used to address separate subapertures of the Fresnel zone plate array 55 with the laser beam.
  • the laser beam can be continuously scanned across an individual subaperture on plate 55, or the laser can be pulsed while dwelling on a subaperture of 55, the beam moved to a different subaperture on plate 55, and then the process repeated.
  • Two different embodiments of scanning and repositioning are possible with the invention.
  • mirrors 44' and 54 can be used to reposition the laser beam relative to zone plate array 55.
  • the X-Y stage moves the work piece 53' .
  • the position of the laser beam can be held constant and zone plate array 55 moved relative to the beam.
  • X-Y stage 53' moves the work piece.
  • both positioning mechanisms are used thereby gaining the maximum number of degrees of freedom in operation.
  • both zone plate array 55 and work piece 53' can be rotated within their respective X-Y planes.
  • Fig. 2 illustrates the relation of work piece 53' to Fresnel zone plate array 55.
  • Fold mirrors 44' and 54 direct the beam down to plate 55 which is mounted to an independent XYZ stage.
  • This view shows the mounting of air duct 50 directly to the Fresnel zone plate array positioning stage.
  • Work piece positioning stage 53 is mounted to an isolated granite slab 56. This insures stability of the work piece during processing.
  • Fig. 3A is a plan view of a plate containing a series of Fresnel zone plate arrays.
  • Each of the areas marked A through X indicates an individual subaperture.
  • each subaperture would ablate a hole in the work piece, the size of the hole being defined by the Fresnel zone plate.
  • These subapertures could also define other patterns.
  • subaperture X could define a doughnut shaped pattern. Although the effect would still be to create a hole in the work piece, the doughnut shaped pattern would allow a larger hole to be made with less laser energy. This is because the total required energy is lower when the beam is confined to a smaller area on the work piece.
  • Fig. 3B is a detail of one of the individual subapertures of the plate shown in Fig. 3A.
  • Area 32 is the active region of the subaperture. This is the area which is used to shape the beam to the desired pattern.
  • Area 34 defines the region of the impinging beam which is not used in the formation of the final pattern on the work piece. Area 34 can either define an absorber, a reflector, or a deflector. Thus if the impinging beam is the diameter of area 34, then only the central portion of the beam, that defined by area 32, will be used in the actual processing of the work piece.
  • Area 34 can operate in several ways. In the preferred embodiment area 34 diffracts the energy away from the desired image on the work piece. Area 34 can also be covered by an absorber or with a reflective coating.
  • Fig. 4 is a plan view of a more complex Fresnel zone plate array showing subapertures A through .
  • Each subaperture contains an active region and a surrounding throw away region similar to that shown in Fig. 3B.
  • the throw away or beam discard area is shown by cross hatching.
  • Subapertures A-C create slots of varying length running along the X-axis while subapertures D-F would create similar slots running perpendicular to the X-axis. Note that by rotating either the Fresnel zone plate array or the work piece, one set of slots can be used to create both sets of slots as well as slots running at any other angle to the X-axis.
  • Subaperture G creates a 360° circular ring of light on the work piece.
  • Subapertures H-I create circular holes in the work piece.
  • Representative dimensions produced by the apertures can be instructive.
  • Table 1 illustrates the dimensions of images produced by the plate of Fig. 3A;
  • Table 2 illustrates the dimensions of the plate of Fig. 4.
  • apertures A though L and M through X produce the same dimension holes. However, due to the larger plate zones of apertures M through X, the latter in collecting more light have large gain at their respective working images.
  • Dlen diameter of active part of lens (mm)
  • T lens types. S, solid ablation. C, cutout.
  • G lens creating full circle cutouts or excisions.
  • Fig. 5A is an illustration of a "fly's eye" lens in which each element 42 produces the same pattern at the work piece.
  • each element would create an individual circle, all of the circles lying coincident at the plane of the work piece.
  • the advantage of this plate over that of one with a single subaperture is that the inherent non-uniformities of the laser beam are somewhat averaged out.
  • the fly's eye plate would create a completely ablated circle.
  • each subaperture must be controlled.
  • the individual patterns all accurately overlie one another and produce the image of Fig. 5B.
  • each pattern's working distance from the particular lens of the fly's eye that produces it must individually adjusted to produce the required coincidence.
  • the actual pattern must be individually controlled to have the proper angularity to produce the required co-incidence.
  • the individual elements can be simple lenses or the more complex Fresnel zone regions, thereby allowing more complex shapes to be created. In the case of simple Fresnel lenses, the circles of Fig. 5A correspond to individual lens boundaries.
  • 5A is a hexagonal array of circular subapertures. In general, it consists of an array of subapertures. Thus, it could be an array of rectangles packed in a rectangular array. It goes without saying that Fresnel type lenses are not required in the disclosed fly's eye arrangement. Further, although a hexagonal array is shown here, other regular arrays of elements can be used.
  • Fig. 6A is a Fresnel zone plate array pattern F and Fig. 6B is the resultant image F' , this pattern being used to reference the Fresnel zone plate array with respect to table 53 supporting the work piece.
  • subapertures 60 create a square comprised of lines 60' at the work piece, this square being used for coarse location of the other fiducials.
  • Subaperture 61 creates a single point, 61', at the work piece.
  • Subapertures 62 and 63 are used to create a focussing or Z-axis fiduciary. If the work piece is in the proper plane, then lines 62* and 63' should be coincident.
  • the Fresnel zone plate array 55 is installed. Then a piece of scrap material that is the same thickness as the intended product is placed on table 53. Thereafter, using the fiducials on the mask (See F 1# F 2 and F 3 on Figs. 3A and 4) the mask is aligned so that it has no tilt or de-focus with respect to the work piece. Also of course, you try to make it so that roughly by eye the Fresnel zone plate array has the right angular orientation to within reason. Then after having focused and leveled the work piece, the work piece 53' is shot with an image. Thereafter, the table is translated over to the microscope camera assembly 51. The required translation is precisely measured. This information is saved.
  • This calibration data is saved and utilized with any error correction data for the particular table 53 which error correction data is determined using techniques well known.
  • error correction data is determined using techniques well known.
  • you put a real work piece down you measure where the location of some fiducial marks on that work piece are. Knowing that then you can mathematically figure out what translation and rotation the work piece needs so that the projected hologram or Fresnel zone plate array subaperture patterns line up with the underlying pattern on the work piece. That is basically the alignment procedure.
  • the regular images present can be utilized for alignment. Specifically, you can do vertical alignment using a low precision Johansen block, just spacing the block so that level is obtained between the Fresnel zone plate array and table. For the transverse alignment any other 2 or 4 preferably small features generated by the Fresnel zone plate array itself can be used for alignment.
  • FIG. 7 is a view of a work piece including a roll of material being dispensed across a table for processing in accordance with this invention.
  • the material is contained on two rollers 36, one on either side of the processing area. After a section of film has been processed, the material is spooled across the area, realigned, and a second set of patterns created. This procedure can continue indefinitely.
  • Fig. 7 shows a second embodiment of the alignment system. In this embodiment, two video camera sensors 35 are used in conjunction with subaperture plate 37 (containing fiduciary marks) , XYZ positioner 38 and computer controller 39 to properly align the work piece film. As illustrated by Fig.
  • Fig. 8 is a block diagram of the beam delivery system employed in Figs. 1 and 2.
  • the laser beam (step L) is aligned (step Z) , stabilized (step P) , collimated (step CT) , and expanded (step XT) .
  • the steps of alignment, stabilization, collimation and expansion are well known in the art.
  • laser L is chosen for its beam divergence and brightness.
  • Z-path (46 and 47 of Fig. 1) allows the laser to be aligned to the tool of Fig. 1.
  • Pointer P of Fig. 8) utilizes active, closed loop feedback to stabilize the laser beam pointing direction.
  • the expansion telescope (XT of Fig. 8, 49 of Fig. 1) allows the beam to be either expanded or compressed in size, the output being collimated light.
  • Fig. 1 Although drawn in Fig. 1 as two separately mounted lenses, in general it could be packaged as a unit for easily switching or as a zoom system allowing for discrete or continuous adjustment at different expansion/compression ratios.
  • a variable aperture 45 (see Fig. 2) is used to control the beam size (step VA) . This prevents the beam from addressing more than one subaperture at a time (illustrated in Figs. 3A and 4).
  • the beam then encounters two fold mirrors. These fold mirrors not only position the beam onto the Fresnel zone plate array, but also can be used for scanning the beam either in the X-direction (step SX) , the Y-direction (step SY) , or both.
  • the beam then traverses a coarse blocking mask that is either contact or proximity mounted to Fresnel zone plate array 55 (step B) . This mask 62 (See Fig.
  • Such a mask can be easily understood. Such a mask would define a dimension similar to areas 34 of the apertures (See Fig. 5B) . Typically, the mask will have apertures spaced apart one from another to the end that adjacent apertures will not be inadvertently illuminated.
  • step PM/M the beam impinges on the zone plate 55
  • step PrM the beam impinges on the zone plate 55
  • step PrM the beam impinges on the work piece
  • step WP the work piece which, in the preferred embodiment, is mounted to an XYZ stage work table 53.
  • This table 53 may be provided with rotational capability (step Tbl) .
  • beam B is moveable in directions X 1# Y x .
  • Fresnel zone plate array 55 is scanned in directions X 2 , Y , and ⁇ .
  • Fig. 9 illustrates a pattern generated on a work piece, parts of this pattern being exposed twice.
  • the Fresnel zone plate array generating this pattern would have two individual subapertures. The first subaperture creates rectangle 92. The second subaperture creates circle 96. Thus region 94, shown in dotted lines, has been exposed twice.
  • a Fresnel zone plate array with a limited set of specific shapes e.g., holes, lines
  • a specific subaperture does not have to be fabricated for each desired pattern.
  • Another use of the present invention is its ability to create arbitrary excisions in a dragging spot mode of operation.
  • the scanners 44 and 54 address a subaperture of plate 55, the subaperture being one which creates a small spot on the work piece 53' of suitable size and intensity.
  • the X-Y table 53 moves the work piece around in the outline of the desired excision pattern.
  • This technique is generally slower than creating a pattern using the full set of shapes on the plate, it is an option available to the user and supplements the use of the full set of shapes.
  • This dragging excision technique can use any of the shapes available on plate 55. Thus, if a relatively large rectangular region requires ablation, subaperture D of Fig. 4 could be dragged back and forth, creating the desired effect.
  • FIG. 10 is a cross-sectional view of a work piece.
  • Region 102 shows a hole which has been completely ablated while region 104 shows only a partially ablated hole.
  • the partially ablated hole can be formed by controlling the energy density of the beam or the number of pulses.
  • Partially ablated hole 106 is formed by a different technique; the placement of a separate, non-absorbing layer 108 within the work piece.
  • the pattern used to form regions 102 and 106 may be the same, but because of the underlying non-absorbing layer 108 the results are different.
  • Beams should be of a relatively long pulse and can preferably include about at least 5 round trips within the cavity.
  • Other lasers can be used - applicable re-coating of the mirrors for optimum reflections may be required. In all other material aspects, the apparatus will remain unchanged.

Abstract

An apparatus and a process of using a Fresnel zone plate array (55) is utilized for processing materials. The Fresnel zone plate array (55) has a plurality of discrete subapertures (A - X) with each subaperture containing image information at a discrete working distance from the plate; each image produced by a subaperture (A - X) of the Fresnel zone plate array (55) typically differs from adjacent images from adjacent subapertures typically in size, shape or gain. A beam is scanned and registered to a discrete selected subaperture on the plate to cause an image from the subaperture to form on a work piece (53') located at the working distance of a scanned subaperture. At each location for processing utilizing a particular selected image, the work piece (53') is positioned, and the laser pulsed with the selected image causing processing of the work piece (53').

Description

Apparatus and Process for Using Fresnel Zone PlateArray for Processing Materials
This invention relates to a machine and process for utilizing so-called "Fresnel zone plate arrays" to process materials. Specifically an apparatus and process is disclosed in which Fresnel zone plate arrays can be utilized for patterning a work piece such as polyimide with small precise features -- such as precise circles and polygons useful in such fields as ink jets or electronic circuits.
BACKGROUND OF THE INVENTION In United States Patent Application Serial No.
07/612,212 entitled "Use of Fresnel Zone Plates for Material Processing" filed November 9, 1990 by Bruce G. MacDonald, Robert 0. Hunter, Jr; Adlai H. Smith, and Clark C. Guest, now U.S. Patent _, , issued , a Fresnel zone plate array for the processing of materials is disclosed. The plate contains discrete subapertures. Each discrete subaperture includes image information.
The image information of each subaperture brings coherent light -- typically from a laser source -- incident upon the subaperture to a confluence at a discrete distance and angularity from the subaperture. The same subaperture -- utilizing constructive and destructive interference at a discrete distance from the subaperture produces an image. An example of such a plate can be a number of discrete subapertures each focusing incident light to drill a group of precisely spaced and precisely dimensioned side-by-side holes or "vias. " Such an array of holes can have utility for ink jet printer heads or ultichip modules. This patent application is incorporated herein by reference. In the following disclosure, an apparatus for the use of the Fresnel zone plate arrays is specifically set forth. SUMMARY OF THE INVENTION An apparatus for using and a process of using a Fresnel zone plate array is utilized for processing materials. An optically stable frame receives coherent light and passes the coherent light through beam processing optics such as a collimator, a beam expanding telescope and an aperture. Thereafter, the beam is routed to scanning mirrors immediately overlying a Fresnel zone plate array. The Fresnel zone plate array has a plurality of discrete Fresnel zones with each subaperture containing image information at a discrete distance from the plate; each image produced by a subaperture of the Fresnel zone plate array typically differs from adjacent images produce by subapertures typically in size, shape or gain. The beam is scanned and registered to a discrete selected subaperture on the plate to cause an image from the subaperture to form on a work piece located at a discrete distance from the scanned subaperture. Once the image is selected, the work piece is moved relative to the Fresnel zone plate array to register the image of the discrete subaperture at the required location for processing on the work piece. At each location for processing utilizing a particular selected image, the work piece is positioned, and the laser pulsed with the selected image causing processing of the work piece. Utilizing the disclosed apparatus and process, a work piece can be configured by multiple image exposures from arbitrarily selected subapertures on the Fresnel zone plate array to produce a precisely spaced and precisely configured array of holes or vias of extreme small dimension. Consequently, the array produced on the work piece is an arbitrarily assembled composite of the array of images of the Fresnel zone plate array. Additionally, the work piece can contain complex processed areas such as apertures resulting from coincident multiple image exposures from the discrete subapertures of the Fresnel zone plate array. BRIEF DESCRIPTION OF THE DRAWINGS Fig. l is a perspective view of the apparatus of this invention illustrating an optical frame with mounted beam processing optics for addressing and scanning a beam to a Fresnel zone plate array for production of working images to a moveable work piece;
Fig. 2 is an elevation section of the machine of Fig. 1 illustrating the mounting of the work piece relative to the Fresnel zone plate array; Fig. 3A is a plan view of a plate containing the subapertures of this invention;
Fig. 3B is a detail of one of the subapertures of the plate of Fig. 3A;
Fig. 4 is a detail of a plate having more complex shapes;
Fig. 5A is a "fly's eye" matrix of subapertures -- Fresnel zone plates or otherwise -- utilized to average beam intensity at the work piece, the averaging technique being applicable to any of the elements of the plates of Figs. 3A and 4;
Fig. 5B illustrates a solidly ablated circular region created by the fly's eye subaperture plate of Fig. 5A;
Fig. 6A is a Fresnel zone plate array pattern and Fig. 6B is the resultant image, this pattern being used to align the Fresnel zone subaperture plate array with respect to the work piece;
Fig. 7 is a view of a work piece including a roll of material being dispensed across an optical table for processing in accordance with this invention; Fig. 8 is a block diagram useful in understanding the complete optical train illustrated in Figs. 1 and 2 from a functional aspect; and
Fig. 9 is an illustration of a double exposure; Fig. 10 illustrates the differences between a partially ablated pattern and a fully ablated pattern; and,
Fig. 11 is a detail adjacent the work piece of the Fresnel zone plate array proximity plate and the Fresnel zone plate array, work piece proximity plate and work piece and table, this diagram illustrating the relative degrees of motion of the beam, Fresnel zone plate array and work piece.
DESCRIPTION OF THE PREFERRED EMBODIMENT Fig. 1 is a perspective view of the apparatus of this invention. The laser source (not shown) is chosen based upon the absorption characteristics of the work piece as well as the desired beam divergence and uniformity. The laser beam is directed by folding mirrors 46 and 47 into beam expanding/condensing lenses 49 and beam collimating lenses 48. Folding mirrors 44 and 54 then direct the beam to Fresnel zone plate array 55. Plate 55 is mounted to angular or θ positioner 52. After the beam is shaped by plate 55, it impinges on work piece 53' . Work piece 53' is mounted to an XY stage. Ducts 50 is used either to direct air onto the work piece or to exhaust fumes away from the work piece. It is also possible to use two separate duct systems so that the functions of blowing and exhausting can be performed simultaneously. If debris is not removed during the processing of the work piece, it is possible for portions of the work piece to be partially obscured, resulting in an incomplete pattern being formed. Desirable appurtenance to the lens train can include a laser beam pointing stabilizer before or after 46. This devices assures that the laser source is given the correct angularity during laser operation. Such devices are known.
Folding mirrors 44' and 54 serve multiple functions in the preferred embodiment. First, the mirrors are used to address separate subapertures of the Fresnel zone plate array 55 with the laser beam. Second, they are used to scan the laser beam across plate 55. In the scanning mode, the laser beam can be continuously scanned across an individual subaperture on plate 55, or the laser can be pulsed while dwelling on a subaperture of 55, the beam moved to a different subaperture on plate 55, and then the process repeated. Two different embodiments of scanning and repositioning are possible with the invention. First, as discussed above, mirrors 44' and 54 can be used to reposition the laser beam relative to zone plate array 55. The X-Y stage moves the work piece 53' . Second, the position of the laser beam can be held constant and zone plate array 55 moved relative to the beam. Again, X-Y stage 53' moves the work piece. In the preferred embodiment both positioning mechanisms are used thereby gaining the maximum number of degrees of freedom in operation. Further, in this embodiment both zone plate array 55 and work piece 53' can be rotated within their respective X-Y planes.
Fig. 2 illustrates the relation of work piece 53' to Fresnel zone plate array 55. Fold mirrors 44' and 54 direct the beam down to plate 55 which is mounted to an independent XYZ stage. This view shows the mounting of air duct 50 directly to the Fresnel zone plate array positioning stage. Work piece positioning stage 53 is mounted to an isolated granite slab 56. This insures stability of the work piece during processing.
Fig. 3A is a plan view of a plate containing a series of Fresnel zone plate arrays. Each of the areas marked A through X indicates an individual subaperture. In the simplest configuration, each subaperture would ablate a hole in the work piece, the size of the hole being defined by the Fresnel zone plate. These subapertures could also define other patterns. For example, subaperture X could define a doughnut shaped pattern. Although the effect would still be to create a hole in the work piece, the doughnut shaped pattern would allow a larger hole to be made with less laser energy. This is because the total required energy is lower when the beam is confined to a smaller area on the work piece.
Fig. 3B is a detail of one of the individual subapertures of the plate shown in Fig. 3A. Area 32 is the active region of the subaperture. This is the area which is used to shape the beam to the desired pattern. Area 34 defines the region of the impinging beam which is not used in the formation of the final pattern on the work piece. Area 34 can either define an absorber, a reflector, or a deflector. Thus if the impinging beam is the diameter of area 34, then only the central portion of the beam, that defined by area 32, will be used in the actual processing of the work piece. Area 34 can operate in several ways. In the preferred embodiment area 34 diffracts the energy away from the desired image on the work piece. Area 34 can also be covered by an absorber or with a reflective coating.
Fig. 4 is a plan view of a more complex Fresnel zone plate array showing subapertures A through . Each subaperture contains an active region and a surrounding throw away region similar to that shown in Fig. 3B. The throw away or beam discard area is shown by cross hatching. Subapertures A-C create slots of varying length running along the X-axis while subapertures D-F would create similar slots running perpendicular to the X-axis. Note that by rotating either the Fresnel zone plate array or the work piece, one set of slots can be used to create both sets of slots as well as slots running at any other angle to the X-axis. Subaperture G creates a 360° circular ring of light on the work piece. Subapertures H-I create circular holes in the work piece. Subaperture J creates a 90° partial ring of light; subaperture K creates a full, solidly ablated quarter circle of light, while subaperture L creates the outline of a rectangle. Representative dimensions produced by the apertures can be instructive. Table 1 illustrates the dimensions of images produced by the plate of Fig. 3A; Table 2 illustrates the dimensions of the plate of Fig. 4. In the following Table 1, it will be seen that apertures A though L and M through X produce the same dimension holes. However, due to the larger plate zones of apertures M through X, the latter in collecting more light have large gain at their respective working images.
Further, and in the following Table 1, several of the apertures are described as "cutouts." These respective cutouts burn a ring in the material. The central portion is not burned but either evacuated by the blower apparatus or left as scraps when the work piece is removed. Table 1 - legend for Fig. 3A
L Dv Dlen DtOt T
A 1.0 0.92 4.92 S
B 1.5 1.38 5.38 s
C 2.0 1.64 5.84 s
D 2.5 2.28 6.28 s
E 3.0 2.72 6.72 s
F 3.5 3.11 7.11 s
G 4.0 3.50 7.50 s
H 4.5 4.0 8.0 s
I 5.0 4.0 8.0 s
J 15.0 4.0 8.0 C
K 31.0 4.0 8.0 C
L 62.0 4.0 8.0 C
M 1.0 1.04 5.84 s
N 1.5 2.76 6.76 s
0 2.0 3.68 7.68 s
P 2.5 4.56 8.56 s
Q 3.0 5.44 9.44 s
R 3.5 6.0 10.0 s
S 4.0 6.0 10.0 s
T 4.5 6.0 10.0 s
U 5.0 6.0 10.0 s
V 15.0 6.0 10.0 C
W 31.0 6.0 10.0 C
Figure imgf000010_0001
L = lens designator
Dv = via diameter (.001")
Dlen = diameter of active part of lens (mm)
Dtot = diameter including throw skirt (mm)
T = lens types. S, solid ablation. C, cutout.
Table 2 ' - Legend for figure 4
A, B, C - lenses creating horizontal slots of various lengths. D, E, F - lenses creating vertical slots of various lengths. G - lens creating full circle cutouts or excisions. H, I - lenses creating a solidly ablated circle. J - lens creating a quarter circle slot. K - lens creating a solidly ablated quarter circle. L - lens creating a solidly ablated square.
Fig. 5A is an illustration of a "fly's eye" lens in which each element 42 produces the same pattern at the work piece. For example, if such a lens is used to produce the solidly ablated circle of Fig. 5B then each element would create an individual circle, all of the circles lying coincident at the plane of the work piece. The advantage of this plate over that of one with a single subaperture is that the inherent non-uniformities of the laser beam are somewhat averaged out. Thus while a non-uniform beam processed through a single subaperture plate might create only a partially ablated circle due to areas of insufficient energy density, the fly's eye plate would create a completely ablated circle. In order to create the fly's eye element of Fig. 5A, three individual characteristics of each subaperture must be controlled. First, when the element distance is properly set, the individual patterns all accurately overlie one another and produce the image of Fig. 5B. Second, each pattern's working distance from the particular lens of the fly's eye that produces it must individually adjusted to produce the required coincidence. Third, the actual pattern must be individually controlled to have the proper angularity to produce the required co-incidence. Note that the individual elements can be simple lenses or the more complex Fresnel zone regions, thereby allowing more complex shapes to be created. In the case of simple Fresnel lenses, the circles of Fig. 5A correspond to individual lens boundaries. More generally, they correspond to the point at which the relative amplitude of the individual element drops below a threshold value (~.3=.5 range usually). In this more general case, the influence of neighboring elements overlaps one another. As drawn, 5A is a hexagonal array of circular subapertures. In general, it consists of an array of subapertures. Thus, it could be an array of rectangles packed in a rectangular array. It goes without saying that Fresnel type lenses are not required in the disclosed fly's eye arrangement. Further, although a hexagonal array is shown here, other regular arrays of elements can be used.
Fig. 6A is a Fresnel zone plate array pattern F and Fig. 6B is the resultant image F' , this pattern being used to reference the Fresnel zone plate array with respect to table 53 supporting the work piece. In the preferred embodiment, subapertures 60 create a square comprised of lines 60' at the work piece, this square being used for coarse location of the other fiducials. Subaperture 61 creates a single point, 61', at the work piece. Subapertures 62 and 63 are used to create a focussing or Z-axis fiduciary. If the work piece is in the proper plane, then lines 62* and 63' should be coincident.
Overall alignment is easily understood. First the Fresnel zone plate array 55 is installed. Then a piece of scrap material that is the same thickness as the intended product is placed on table 53. Thereafter, using the fiducials on the mask (See F1# F2 and F3 on Figs. 3A and 4) the mask is aligned so that it has no tilt or de-focus with respect to the work piece. Also of course, you try to make it so that roughly by eye the Fresnel zone plate array has the right angular orientation to within reason. Then after having focused and leveled the work piece, the work piece 53' is shot with an image. Thereafter, the table is translated over to the microscope camera assembly 51. The required translation is precisely measured. This information is saved. Further, it can be repeated for more than one position. This calibration data is saved and utilized with any error correction data for the particular table 53 which error correction data is determined using techniques well known. When you put a real work piece down you measure where the location of some fiducial marks on that work piece are. Knowing that then you can mathematically figure out what translation and rotation the work piece needs so that the projected hologram or Fresnel zone plate array subaperture patterns line up with the underlying pattern on the work piece. That is basically the alignment procedure.
If you do not have the mark the alignment fuducials F, the regular images present can be utilized for alignment. Specifically, you can do vertical alignment using a low precision Johansen block, just spacing the block so that level is obtained between the Fresnel zone plate array and table. For the transverse alignment any other 2 or 4 preferably small features generated by the Fresnel zone plate array itself can be used for alignment.
The above procedure can be accomplished with alternatively designed sets of fiducials or by using the set of shapes (A-X of Fig. 3A, A-L of Fig. 4) generated by plate 55, the end result in both cases being identical. To register work piece 53' to the pattern projected by plate 55, fiducials on work piece 53' are first located by translating table 53 so they are within the field of view of offset microscope 51. Then a machine operator or a machine vision system can locate the fiducial center and store that information in central computer 39 (of Fig. 7) . This process is repeated with at least two fiducials to gather translation and rotational positions. The data concerning the plate alignment is combined with the work piece alignment data to determine the required rotational and positional offsets. Fig. 7 is a view of a work piece including a roll of material being dispensed across a table for processing in accordance with this invention. The material is contained on two rollers 36, one on either side of the processing area. After a section of film has been processed, the material is spooled across the area, realigned, and a second set of patterns created. This procedure can continue indefinitely. Fig. 7 shows a second embodiment of the alignment system. In this embodiment, two video camera sensors 35 are used in conjunction with subaperture plate 37 (containing fiduciary marks) , XYZ positioner 38 and computer controller 39 to properly align the work piece film. As illustrated by Fig. 7, the use of two offset microscope/camera combinations set up so a mechanically registered work piece is within the microscope field of view allows work piece translation and rotation to be quickly acquired by the central computer (39) machine vision subsystem and the required offset computed and executed. This two microscope/camera combination gets rid of the motion step required with only one microscope/camera.
Fig. 8 is a block diagram of the beam delivery system employed in Figs. 1 and 2. The laser beam (step L) is aligned (step Z) , stabilized (step P) , collimated (step CT) , and expanded (step XT) . The steps of alignment, stabilization, collimation and expansion are well known in the art. Briefly, laser L is chosen for its beam divergence and brightness. In the case of excimer lasers, unstable resonators, oscillator amplifier combinations and Raman shifted excimers are particularly suitable. Z-path (46 and 47 of Fig. 1) allows the laser to be aligned to the tool of Fig. 1. Specifically, the point of incidence of the laser beam and the angularity of light at the point of incidence can be controlled. Pointer (P of Fig. 8) utilizes active, closed loop feedback to stabilize the laser beam pointing direction. The collimating telescope (CT of Fig. 8, 48 of Fig.
1) takes out any residual focus in the laser beam. The expansion telescope (XT of Fig. 8, 49 of Fig. 1) allows the beam to be either expanded or compressed in size, the output being collimated light. Although drawn in Fig. 1 as two separately mounted lenses, in general it could be packaged as a unit for easily switching or as a zoom system allowing for discrete or continuous adjustment at different expansion/compression ratios.
A variable aperture 45 (see Fig. 2) is used to control the beam size (step VA) . This prevents the beam from addressing more than one subaperture at a time (illustrated in Figs. 3A and 4). The beam then encounters two fold mirrors. These fold mirrors not only position the beam onto the Fresnel zone plate array, but also can be used for scanning the beam either in the X-direction (step SX) , the Y-direction (step SY) , or both. The beam then traverses a coarse blocking mask that is either contact or proximity mounted to Fresnel zone plate array 55 (step B) . This mask 62 (See Fig. 2 and 11) , made of metal in the preferred embodiment, is mounted directly or just above or below the Fresnel zone plate array and has openings over each of the subaperture plate's active regions. This mask functions similarly to the throw away skirts surrounding the active regions, helping to eliminate undesired energy from ever reaching the work piece.
The shape of such a mask can be easily understood. Such a mask would define a dimension similar to areas 34 of the apertures (See Fig. 5B) . Typically, the mask will have apertures spaced apart one from another to the end that adjacent apertures will not be inadvertently illuminated.
Next the beam impinges on the zone plate 55 (step PM/M) which in the preferred embodiment is mounted to an XY stage which also has rotational capability. Between the plate and the work piece is a proximity mask 69 (step PrM) . This mask catches energy which has been diffracted away from the desired pattern by the throw away skirt surrounding each active region. Finally the patterned beam impinges on the work piece (step WP) which, in the preferred embodiment, is mounted to an XYZ stage work table 53. This table 53 may be provided with rotational capability (step Tbl) .
The particular degrees of motion can also be fully understood with reference to Fig. 11. Specifically, beam B is moveable in directions X1# Yx. Further, Fresnel zone plate array 55 is scanned in directions X2, Y , and θ.
Fig. 9 illustrates a pattern generated on a work piece, parts of this pattern being exposed twice. In this example the Fresnel zone plate array generating this pattern would have two individual subapertures. The first subaperture creates rectangle 92. The second subaperture creates circle 96. Thus region 94, shown in dotted lines, has been exposed twice. Although it would be possible to make a single subaperture capable of forming this pattern, one of the benefits of the present invention is that a Fresnel zone plate array with a limited set of specific shapes (e.g., holes, lines) can be used to create an infinite number of patterns. Thus a specific subaperture does not have to be fabricated for each desired pattern.
Another use of the present invention is its ability to create arbitrary excisions in a dragging spot mode of operation. In this mode, the scanners 44 and 54 address a subaperture of plate 55, the subaperture being one which creates a small spot on the work piece 53' of suitable size and intensity. With the laser on, the X-Y table 53 moves the work piece around in the outline of the desired excision pattern. Although this technique is generally slower than creating a pattern using the full set of shapes on the plate, it is an option available to the user and supplements the use of the full set of shapes. This dragging excision technique can use any of the shapes available on plate 55. Thus, if a relatively large rectangular region requires ablation, subaperture D of Fig. 4 could be dragged back and forth, creating the desired effect.
Another of the benefits of the present invention is the ability to either partially or completely ablate a pattern. Fig. 10 is a cross-sectional view of a work piece. Region 102 shows a hole which has been completely ablated while region 104 shows only a partially ablated hole. The partially ablated hole can be formed by controlling the energy density of the beam or the number of pulses. Partially ablated hole 106 is formed by a different technique; the placement of a separate, non-absorbing layer 108 within the work piece. Thus the pattern used to form regions 102 and 106 may be the same, but because of the underlying non-absorbing layer 108 the results are different.
It will be understood that the apparatus of this invention finds preferred use with an excimer laser. Beams should be of a relatively long pulse and can preferably include about at least 5 round trips within the cavity. Other lasers can be used - applicable re-coating of the mirrors for optimum reflections may be required. In all other material aspects, the apparatus will remain unchanged.
A photographic Appendix A is filed with this case. Specifically, photographs of the actual Fresnel zone plates illustrated in Figs. 3A and 5 are included.
The invention has now been explained with reference to specific embodiments. Other embodiments will be apparent to those of ordinary skill in the art. It is therefore not intended that this invention be limited, except as indicated by the appended claims.

Claims

WHAT IS CLAIMED IS:
1. Apparatus for processing a work piece with images produced by a Fresnel zone plate array having holographic images in a plurality of discrete subapertures on said plate, said apparatus including passing coherent light through said plate at selected zones to process said work piece comprising: an optical frame for supporting in optically stable manner a plurality of optical elements defining an optical path on said frame; a coherent light source for communicating coherent light to said optical path mounted on said frame; a Fresnel zone plate array mounted to said machine having a plurality of discrete subapertures, with each said subaperture containing image information for said coherent light at a preselected distance from said subaperture on said plate; means for addressing said coherent light from said optical path to discrete subapertures on said Fresnel zone plate array to produce from at least one of said subapertures and image; a work piece; means for mounting and moving said work piece relative to said image for producing said image on said work piece at arbitrarily selected locations.
2. A method for processing a work piece with images produced by -a Fresnel zone plate array illuminated with coherent light source having holographic images in a plurality of discrete subapertures on said plate, said method comprising the steps of: providing an optical frame for supporting in optically stable manner a plurality of optical elements defining an optical path on said frame; placing a plurality of optical elements on said optical frame to define an optical path for collimated light; providing and communicating a coherent light source to said optical path; providing a Fresnel zone plate array having a plurality of discrete subapertures, with each said subaperture containing image information by said coherent light at a preselected distance from said subaperture on said plate; mounting said Fresnel zone plate array to said optical frame in said optical path for producing said images; registering said coherent light from said optical path to discrete subapertures on said Fresnel zone plate array to produce from at least one of said subapertures and image; providing a work piece; mounting and moving said work piece relative to said image for producing said image on said work piece at arbitrarily selected locations on said work piece whereby said spatial relation of said images on said work piece is independent of said spatial relation of said images from said Fresnel zone plate array.
3. A method for processing a work piece with images produced by a Fresnel zone plate array illuminated with coherent light source according to claim 12 and wherein: rotating said Fresnel zone plate array relative to said work piece for causing rotation of images from said subapertures of said Fresnel zone plate array on said work piece.
4. A method for processing a work piece with images produced by a Fresnel zone plate array illuminated with coherent light source according to claim 12 and wherein: said registering of said light to one of said discrete subapertures of said Fresnel zone plate array including scanning said plate.
5. A Fresnel zone plate array for producing images on a work piece at a discrete distance from said plate comprising: a transparent plate for permitting the passage of light through said plate; a plurality of discrete subapertures on said plate, each said subaperture including, a first area containing means for shaping coherent light at a discrete distance from said plate and means for forming an image at said discrete distance from plate; a second area circumscribing said first area, said second area for preventing light incident thereon from incidence to said image whereby light hitting said second area forms no part of said image.
6. In a Fresnel zone plate array including: a plurality of discrete subapertures, with each said subaperture containing image information by said coherent light on a work piece at a preselected distance from said subaperture on said plate, a subaperture including a fiducial marker, said subaperture comprising: means for forming an image at a discrete distance from said plate for permitting alignment of said plate perpendicular to a normal between the plane of said plate and the plane of said work piece; first means for defining a first image at a first angle with respect to said plate; second means for defining a second image at a second angle different from said first angle with respect to said plate whereby the relation between said first and second images is a function of the distance of a work piece from said plate.
7. A process of producing a complex ablation on a work piece utilizing a composite of images from a Fresnel zone plate array, said process comprising: providing a Fresnel zone plate array having a plurality of discrete subapertures, with a first said subaperture containing first image information for said coherent light at a preselected distance from said first subaperture on said plate and a second said subaperture containing second and different image information for said coherent light at a preselected distance from said second subaperture on said plate; providing a light source for sequentially registering to said first and second subapertures of said plate whereby said images of said first and second subapertures can be sequentially formed by said coherent light from said plate; providing a work piece spaced relative to said plate for enabling images produced by said first and second subapertures of said plate to ablate said work piece; registering said light source, first subaperture and work piece to produce ablation of a first area on said work piece; registering said light source, second subaperture and work piece to produce ablation of a second area on said work piece, said second area at least continuous to a part of said first area whereby said ablation of said work piece is in a pattern which is a composite of said first and second images.
8. A process of producing a complex ablation on a work piece utilizing a composite of images from a Fresnel zone plate array according to claim 26 and wherein said registering steps include: registering said first and second images to said first and second areas includes overlapping said first and second areas.
9. A Fresnel zone plate array including: a plurality of discrete subapertures, with each said subaperture containing image information for said coherent light at a preselected distance from said subaperture on said plate; at least a first of said subapertures having a working distance and first angle with respect to said plate for forming an image at a discrete distance and angularity from said plate; at least a second of said subaperture having the same working distance and second angle with respect to said plate for forming a substantially identical image, said working distance and first and second angle chosen to register said identical images one to another on said work piece.
10. A process of utilizing a Fresnel zone plate array including the steps of: providing a Fresnel zone plate array having a plurality of discrete subapertures, with each said subaperture containing image information for said coherent light at a preselected working distance from said subaperture on said plate; providing at least a first of said subapertures having a working distance and first angle with respect to said plate for forming an image at a discrete distance and angularity from said plate; providing at least a second of said subaperture having the same working distance and second angle with respect to said plate for forming a substantially identical image, said working distance and first and second angle chosen to register said identical images one to another on said work piece; registering a beam of coherent light to be incident simultaneously on said first and second subapertures whereby said identical image is a combination of beam intensity at said first and second subapertures.
PCT/US1994/010383 1993-09-14 1994-09-14 Apparatus and process for using fresnel zone plate array for processing materials WO1995007789A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU76872/94A AU7687294A (en) 1993-09-14 1994-09-14 Apparatus and process for using fresnel zone plate array for processing materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/121,060 1993-09-14
US08/121,060 US5481407A (en) 1993-09-14 1993-09-14 Apparatus and process for using Fresnel zone plate array for processing materials

Publications (1)

Publication Number Publication Date
WO1995007789A1 true WO1995007789A1 (en) 1995-03-23

Family

ID=22394236

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1994/010383 WO1995007789A1 (en) 1993-09-14 1994-09-14 Apparatus and process for using fresnel zone plate array for processing materials

Country Status (3)

Country Link
US (1) US5481407A (en)
AU (1) AU7687294A (en)
WO (1) WO1995007789A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5702662A (en) * 1995-09-29 1997-12-30 Litel Instruments, Inc. Process for ablating high density vias in flexible substrate
US6037565A (en) * 1996-06-17 2000-03-14 The Regents Of The University Of California Laser illuminator and optical system for disk patterning
CA2271815C (en) 1996-11-15 2010-01-19 Diffraction Ltd. In-line holographic mask for micromachining
DE19860563C2 (en) * 1998-12-22 2001-09-06 Hertz Inst Heinrich Optical scanning head for data storage disks
JP3346374B2 (en) * 1999-06-23 2002-11-18 住友電気工業株式会社 Laser drilling machine
GB9922082D0 (en) * 1999-09-17 1999-11-17 Isis Innovation Laser apparatus for use in material processing
US6310701B1 (en) * 1999-10-08 2001-10-30 Nanovia Lp Method and apparatus for ablating high-density array of vias or indentation in surface of object
US7111423B2 (en) * 1999-10-08 2006-09-26 Identification Dynamics, Llc Method and apparatus for reading firearm microstamping
WO2001027665A1 (en) * 1999-10-08 2001-04-19 Nanovia, Lp Method control system and apparatus for ablating high-density array of vias or indentation in surface of object
US6886284B2 (en) * 1999-10-08 2005-05-03 Identification Dynamics, Llc Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles
US6833911B2 (en) 1999-10-08 2004-12-21 Identification Dynamics, Inc. Method and apparatus for reading firearm microstamping
US6653593B2 (en) 1999-10-08 2003-11-25 Nanovia, Lp Control system for ablating high-density array of vias or indentation in surface of object
US6256121B1 (en) * 1999-10-08 2001-07-03 Nanovia, Lp Apparatus for ablating high-density array of vias or indentation in surface of object
US7204419B2 (en) * 2003-05-01 2007-04-17 Identifcation Dynamics, Llc Method and apparatus for reading firearm microstamping
US20050241203A1 (en) * 2003-05-01 2005-11-03 Lizotte Todd E Method and apparatus for cartridge identification imprinting in difficult contexts by recess protected indicia
US7633034B2 (en) * 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7923306B2 (en) * 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US8148211B2 (en) * 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US8383982B2 (en) * 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US7687740B2 (en) * 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
US7435927B2 (en) * 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7629234B2 (en) * 2004-06-18 2009-12-08 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
US7935941B2 (en) * 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
DE102007058169A1 (en) * 2007-11-30 2009-06-10 Ovd Kinegram Ag Device and method for producing a window in a value document or security document
KR101346296B1 (en) * 2012-01-20 2014-01-02 참엔지니어링(주) Laser processing apparatus and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909818A (en) * 1988-11-16 1990-03-20 Jones William F System and process for making diffractive contact
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus
US5373137A (en) * 1994-01-28 1994-12-13 Litton Systems, Inc. Multiple-line laser writing apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909818A (en) * 1988-11-16 1990-03-20 Jones William F System and process for making diffractive contact
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus
US5373137A (en) * 1994-01-28 1994-12-13 Litton Systems, Inc. Multiple-line laser writing apparatus and method

Also Published As

Publication number Publication date
US5481407A (en) 1996-01-02
AU7687294A (en) 1995-04-03

Similar Documents

Publication Publication Date Title
US5481407A (en) Apparatus and process for using Fresnel zone plate array for processing materials
US5296673A (en) Laser machining
JP3929084B2 (en) How to irradiate the surface of an untreated product
US6130009A (en) Apparatus and process for nozzle production utilizing computer generated holograms
US7298453B2 (en) Method and apparatus for irradiating a microlithographic substrate
CA2217018C (en) Method and apparatus for step and repeat exposures
US4574180A (en) Beam alignment system for laser welding system
JP2830492B2 (en) Projection exposure apparatus and projection exposure method
KR100381943B1 (en) Material Machining Arrangement
US6577379B1 (en) Method and apparatus for shaping and/or orienting radiation irradiating a microlithographic substrate
JPH0513368B2 (en)
TWI309755B (en) Lithographic apparatus and device manufacturing method
JPS60130742A (en) Positioning device
JP2000228357A (en) High resolution projecting method
JPH09327925A (en) Manufacture of nozzle member and processing apparatus using it
CN106664798A (en) Apparatus and methods for performing laser ablation on a substrate
KR100392563B1 (en) Optical system for peripheral exposure apparatus
JP2001188007A (en) Device for measuring relative position error
JP3316697B2 (en) Projection optical apparatus, laser apparatus, scanning exposure apparatus, scanning exposure method, and device manufacturing method using the method
JPH08184781A (en) Projecting device and manufacture of orifice plate using it
JP4344162B2 (en) Pattern drawing apparatus and pattern drawing method
JP3316752B2 (en) Scanning exposure method, scanning exposure apparatus, and device manufacturing method using the method
JP3526165B2 (en) Optical processing machine and method of manufacturing orifice plate using the same
KR102012297B1 (en) The pattern formation method to use multi-beam scanner system
WO1996022751A1 (en) Apparatus for uniformly ablating a surface

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AM AT AU BB BG BR BY CA CH CN CZ DE DK ES FI GB GE HU JP KE KG KP KR KZ LK LT LU LV MD MG MN MW NL NO NZ PL PT RO RU SD SE SI SK TJ TT UA UZ VN

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): KE MW SD AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: CA