WO1994029887A1 - Molded electric part and its manufacture - Google Patents
Molded electric part and its manufacture Download PDFInfo
- Publication number
- WO1994029887A1 WO1994029887A1 PCT/JP1994/000960 JP9400960W WO9429887A1 WO 1994029887 A1 WO1994029887 A1 WO 1994029887A1 JP 9400960 W JP9400960 W JP 9400960W WO 9429887 A1 WO9429887 A1 WO 9429887A1
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- WIPO (PCT)
- Prior art keywords
- molded
- electrodes
- conductive pattern
- component according
- electric component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- Patent application title Molded electrical component and method of manufacturing the same
- the present invention relates to a molded electrical component that can be easily surface-mounted by molding an active element or a passive element such as a transistor, a diode, a resistor, or a film capacitor with a resin. Further, the present invention relates to a method for manufacturing such a molded electric component.
- active and passive elements are formed into chips for circuit integration.
- Typical examples of such an active element and a passive element include a three-terminal surface-mounted molded mini-transistor having a short lead wire, and a molded film capacitor as shown in the perspective view of FIG. .
- the film capacitor 102 is connected to a gold lead frame 127.127 through a wire 128.128 fixed by a pin 128.
- the film capacitor 102 is molded with a resin 126 so as to protect the film capacitor 102 from external moisture.
- FIGS. 9A to 9C The manufacturing method of the film capacitor will be described with reference to FIGS. 9A to 9C.
- a plurality of lead frames 1 2 7 , 127,..., 127 are formed into a metal frame 130 formed continuously.
- a film capacitor element 102 was connected to each pair of lead frames 127 by a wire bonding method using a wire 128 and a solder 129. I do.
- each film capacitor element 102 and lead frame pair 127.127 are molded with a molding resin as shown in FIG. 8, and then cut.
- An object of the present invention is to solve the above-mentioned problems and provide a compact and lightweight molded electric component having a structure without lead wires.
- Another object of the present invention is to prevent the degradation of purple particles by molding the element with a resin.
- Still another object of the present invention is to produce a large number of products having excellent air permeability at a fixed size by injection molding using a multi-cavity mold.
- a molded air-permeable component of the present invention which is made of an element, has an element having an electrode and an element accommodating body in which an element accommodating recess for accommodating the element is formed at a predetermined position.
- Element housing formed of a synthetic resin having a high thickness, a conductive pattern formed by applying a plating to the surface of the element housing, and an external connection terminal set on at least one surface of the purple container. And the electrode of the element and the external connection terminal are electrically connected via the conductive pattern. That is, "9.
- Examples of the molded electric component of the present invention include a molded film capacitor, a molded drain capacitor, a molded thermistor, a molded thyristor, and a molded resistor resistor.
- the method of the present invention further comprises:
- the electrodes of the element are electrically connected to at least one external connection terminal set on one surface via an S conductive pattern formed on the surface of the element housing, so that one surface is connected to the wiring board. Electrical connection with the above electric circuit and the like becomes possible. Therefore, the various problems caused by the existence of the lead wire and the like can be eliminated. In addition, there is no need for a processing step of forming the lead wire insertion hole in the wiring board, and the contact surface is slightly shifted from the center in the air connection between the surface set as the external connection terminal and the connection surface of the wiring board. Even if it is misaligned, accurate electrical alignment is not required, since the air conduction is ensured. Further, since the external connection terminal can be set on a desired surface of the element housing, the degree of freedom in mounting the electric component is large.
- the element containers can be simultaneously molded by pouring a large amount of synthetic resin into a multi-cavity mold, manufacturing costs can be reduced. Since it is an injection molded product, the product dimensions are constant, so the stray capacitance and inductance are constant, and stable electrical characteristics can be obtained.
- FIG. 1 is a perspective view showing a mold-type electric component as a first embodiment of the present invention, which accommodates a film capacitor element,
- FIG. 2A is a plan view showing the molded electrical component of FIG. 1,
- FIG. 2B is a cross-sectional view of FIG.
- FIG. 2C is a bottom view of the molded air component of FIG. 1,
- FIG. 3A is a perspective view showing a molded hail component as a second embodiment of the present invention in which a transistor element is housed
- FIG. 3B is a bottom view showing the molded electrical component of FIG. 3A
- FIG. 4 is a perspective view showing a molded electronic component as a third embodiment of the present invention, which accommodates a cylindrical element,
- FIG. 5 is a perspective view showing a molded electric component as a fourth embodiment of the present invention, in which a thermistor element is accommodated.
- 6A to 6C are exploded views showing a manufacturing process of a molded electric component embodying the present invention.
- FIG. 7 is a flowchart showing a method of manufacturing a molded electric component embodying the present invention.
- FIG. 8 is a perspective view showing a conventional film capacitor
- 9A to 9C are exploded views showing steps of manufacturing the conventional film capacitor of FIG.
- FIG. 1 shows a film capacitor element that is an example of a two-terminal type element.
- FIG. 2 is a plan view showing the molded electric component of FIG. 1
- FIG. 2B is a plan view showing the molded electric component of FIG.
- FIG. 2C is a bottom view showing the molded electric component of FIG. 1.
- the molded film capacitor 1 shown in FIG. 1 includes a film capacitor element 2 and an element container 3 formed of a highly insulative synthetic resin.
- the film capacitor element 2 is accommodated in an element accommodating recess 7 formed in the center of the element accommodating body 3, and the electrodes 2 formed on both side surfaces of the film capacitor cable 2 are provided.
- a and 2a are electrically connected to a film-shaped conductive pattern 4 formed by metal plating by solders 5 and 5, respectively.
- Part of the conductive pattern 4 is formed as a film-like external connection terminal 8 on the bottom surface of the element housing 3.
- the film condenser Shiko 2 is molded with a sealing resin 6, and hermetically sealed so that moisture does not enter the cord accommodating recess 7 from the outside.
- the electrical connection between the film capacitor element 2 and the wiring board or the like is formed on the surface of the wire container 3 without using a lead frame. Since the conductive pattern 4 is used, moisture does not infiltrate from the gap formed at the boundary between the molding resin and the lead frame as in the related art, and the element does not deteriorate. In addition, there is no occurrence of inductance or breakage of the lead frame due to the twisting of the frame, and in the mounting process, the external connection terminals and the contact surface on the wiring board can be electrically connected by surface contact. Therefore, unlike the case where the legs of the lead frame are connected, electrical connection can be ensured even if the center of the contact surface is slightly shifted. That is, the application of the surface solid-state technology (SMT) is facilitated, and the incidence of defective products due to connection errors can be reduced. Further, since there is no metal lead frame, the weight and size can be reduced.
- SMT surface solid-state technology
- two-terminal thyristor elements such as silicon symmetrical switches, diers, and inks, as well as two-terminal type elements such as diodes, filter elements, and resistor elements, are housed in the element container.
- two-terminal thyristor elements such as silicon symmetrical switches, diers, and inks
- two-terminal type elements such as diodes, filter elements, and resistor elements
- FIG. 3A is a perspective view showing a molded electric component as a second embodiment of the present invention, which also contains a transistor Shiko, which is an example of a three-terminal element
- FIG. 3B is a bottom view thereof.
- the molded transistor 9 shown in FIG. 3 includes a transistor element 10 and an element container 11.
- the transistor element 10 is housed in an element housing recess 13 formed in the element housing 11, and the three electrodes 1 Oa on the transistor element 10 are connected to the element housing 11.
- the film-like conductive pattern 12 formed on the surface is electrically connected to each other by a wire bonding method or a soldering method as in the first embodiment.
- the transistor element 10 is molded with a sealing resin similarly to the film capacitor element to achieve hermeticity. Further, as shown in FIG. 3B, a part of the conductive pattern 12 is formed on the bottom surface of the element housing 11 as a film-like external connection terminal.
- the molded transistor 9 of the second embodiment thus configured is the
- the airtightness is achieved as in the case of the molded film capacitor of the embodiment, the element does not deteriorate due to the invasion of moisture.
- the structure without lead wires there is no need for a processing step of drilling lead wire insertion holes in the wiring board, and there is no inductance or disconnection of the lead wire caused by twisting of the lead wire.
- thyristors such as SCRs and triacs, and three-terminal wires such as various FETs, etc.
- shaped FETs can also be formed.
- FIG. 4 is a perspective view showing a molded electric component as a third embodiment of the present invention accommodating a resistor element which is an example of a columnar two-terminal type element.
- the resistor 15 includes a resistor element 16 and an element container 17 having a recess 19 for accommodating the element 16 for accommodating the resistor element 16.
- the two electrodes 16 a and 16 a formed on the resistor probe 16 are soldered to the film-like conductive pattern 18 formed on the surface of the element housing 17. Each is connected airly.
- the resistor element 16 is molded with a sealing resin to achieve airtightness, similarly to the film capacitor element of the first embodiment.
- a film-like external terminal is formed on the surface of the element container 17.
- the molded resistor 15 of the third embodiment configured in this way is also free from deterioration due to moisture, making it easy to apply surface mounting technology.
- a columnar cable such as a varistor capacitor
- a sealing resin whereby a molded varistor, a molded capacitor, or the like can be formed.
- the shape of the element to be housed may be a polygonal pillar such as a square pillar or a hexagonal pillar in addition to the columnar shape, and the shape of the recess for housing the element may be changed according to the shape of the element.
- FIG. 5 is a perspective view showing a molded electric component as a fourth embodiment of the present invention that accommodates a thermistor element as an example of an element having a detection unit.
- the mold-type thermistor 20 includes a thermistor element 21 and an element housing 22 having an element housing recess 24 for housing the thermistor purple 21. Is provided.
- the two electrodes 21 a and 21 a formed on the thermistor element 21 electrically connect to the film-shaped conductive pattern 23 formed on the surface of the element housing 22 by soldering. Connected.
- the element housing recess 24 is molded with a sealing resin so as to expose the detection part 21 b of the thermistor element 21 to achieve airtightness, and the back surface of the element housing 22 is provided.
- the external connection terminals in the form of a film similar to those of the molded film capacitor of the first embodiment are formed in the first embodiment.
- the molded thermistor of the fourth embodiment thus formed does not deteriorate due to moisture, and the application of surface mounting technology becomes easy.
- a cord having a light receiving section such as a photodiode, a phototransistor, or a photoconductive cell is similarly housed in an element housing so that only the light receiving section is exposed, and molded with a sealing resin.
- a molded photodiode, a molded phototransistor, a molded photoconductive cell, and the like can be formed.
- the present invention can be applied to a sensor such as a proximity switch or a photoelectric switch. In each of the above embodiments, the case where the external connection terminal is set on the bottom surface of the element housing has been described.
- the external connection terminal can also be set on the side according to the mounting condition of the air component.
- the shape of the purple accommodating concave portion can be appropriately changed according to the shape of the element other than the elements listed in each of the above embodiments, and the number of conductive patterns and external connection terminals is also the number of electrodes of the element. It can be formed according to.
- a multi-cavity mold is manufactured in which a plurality of cavities for forming an element container having the element accommodating recesses are arranged between the runner portions 25.
- a plurality of cord holders 3.3, 3,... are placed between the runner sections 25 by injecting highly insulative synthetic resin into the mold.
- Simultaneous molding step S1.
- a metal plating is applied to a predetermined surface of each element housing 3 to form a conductive pattern 4 and an external connection terminal 8 as shown in FIGS. 1 and 2 (step S 2).
- the film capacitor cords 2 are respectively housed in the element accommodating recesses 7 (see FIG. 1) of each cord accommodation body 3 (step S3).
- each element container 3 is passed through a superheater (not shown), and solder 5 is melted to electrically connect each film capacitor element 2 with the conductive pattern 4. (Step S5). Then, each film capacitor element 2 is molded with a sealing resin 6 (see FIG. 2B), and each molded film capacitor element 2 is separated from the runner section 25 by laser cutting (step S6).
- a time-consuming process such as wire bonding is not required, and a large number of devices can be manufactured at once with a small number of manufacturing processes, thereby reducing manufacturing costs. be able to.
- the product dimensions are constant, stray capacitance and inductance are constant. You. Also, there is no danger of the wire being cut, and everyone can improve. In addition, no metal waste is produced by punching and cutting the lead frame.
- the molded electrical parts enumerated in each of the above embodiments can also be manufactured by the method for manufacturing a molded film capacitor.
- the purple pattern and the conductive pattern are connected by the wire bonding method.
- the primary molding portion including the surface of the purple container containing the conductive pattern is injection-molded with a thermoplastic resin having good adhesion.
- the secondary molded part, which does not include the surface on which the conductive pattern is formed is integrally molded with a thermoplastic resin having poor adhesion, and the entire surface of the molded product is covered with gold plating.
- gold plating When applied, only the surface of the primary molded portion on which the conductive pattern is to be formed is plated to form a conductive pattern.
- the entire element housing is injection-molded with a thermoplastic resin having good adhesion to the surface, and the entire surface is subjected to an etching process, a catalyst process, and a copper plating process. Then, the entire surface is masked with an etching resist to image the portion where the conductive pattern is to be formed. Next, the metallization is performed, and the masked resist is separated, and the copper etched portion is imaged. A conductive pattern is formed on the substrate.
- liquid crystal polymer (LCP) is preferable as the thermoplastic resin material used in each of the above-described manufacturing methods. According to the liquid crystal polymer, it is possible to obtain the characteristics of orientation and rigidity of molecules by injection molding, so that it has â strength, â elastic modulus, dimensional stability, heat resistance, and chemical resistance. This is because it is possible to mold an excellent purple container.
- a liquid crystalline polyester resin is preferable, and for example, a copolyester type of p-hydroxybenzoic acid and 6-oxy-12-naphthoic acid is most preferably used.
- the melting point is relatively low (280 to 310 â C)
- injection molding is easy, and it has fluidity and is suitable for forming conductive patterns with minute irregularities and narrow spaces.
- a lower melting point because of its characteristics of excellent â Sunda heat resistance (260 ° C '1 0 seconds â 280 â C' 30 seconds), This is because it is suitable for mounting a molded electric component.
- liquid crystal polyester resins having the above-mentioned characteristics there are those having good adhesiveness and those having poor adhesion depending on the resin composition.
- the body can be easily formed. Since both substances are chemically the same and have high interface affinity, the adhesion between the primary material and the secondary material can be improved.
- the molded electric component of the present invention may be configured not to use the sealing resin, and is not limited to the above embodiment, and may be implemented in various modes without departing from the gist thereof. Is possible,
- the mold-type air-permeable component of the present invention since it has a structure without a lead wire, it is possible to reduce the size and weight, and at the same time, moisture enters from the protruding portion of the lead wire, and the element is mounted. Deterioration can be prevented.
- the product is an injection molded product, the dimensions of the product are constant, so that an electric component having excellent electric characteristics such as stray capacitance and inductance can be realized.
- the conductive pattern formed on the side surface or the upper surface of the cable holder can be used as an external connection terminal, the degree of freedom in mounting posture of the electric component is large.
- any portion of the crotch surface can be connected to the external connection terminal, precise positioning is not required.
- a large number of electric components can be easily produced at once by using a multi-cavity mold, and lead wires on a wiring board can be easily formed.
- the process of forming the insertion hole is not required.
- the manufacturing process can be shortened and the yield can be improved, for example, there is no disconnection of the lead wire.
Description
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Claims
1 . H:æ°éšåã§ã
é»æ¥µãæããçŽ åãšã
åèš 3çŽ åãå容ããããã®çŽ åå容çšå¹éšãæå®ã®éšäœã«åœ¢æããçŽ ååå®¹äœ ã§ã 絶緣æ§ã® Ÿãåææš¹èã§åœ¢æãããçŽ åå容äœãšã
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2 . åèšçŽ åå容çšå¹éšã«å容ãããåèšçŽ åãã¢ãŒã«ãããå°æ¢æš¹èéšãæŽ ã«åããããšãç¹åŸŽãšããè«æ±é
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3 . åèšçŽ«åãã 2端åã¿ã€ãã®çŽ åã§ããããšãç¹åŸŽãšãã æ±é
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4 . åèš 2端åã¿ã€ãã®çŽ åãã 2ã€ã®é»æ¥µãæãããã£ã«ã ã³ã³ãã³ãµçŽ å ã§ããã åèšãã£ã«ã ã³ã³ãã³ãµçŽ åã® 2ã€ã®é»æ¥µãã åèšå°éªæ§ãã¿ãŒã³ãšé» æ°çã«æ¥çµ±ãããŠããããšãç¹åŸµãšããè«æ±é
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5 . åèšçŽ åãã 3端åã¿ã€ãã®çŽ åã§ããããšãç¹åŸŽãšãã逜æ±é
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2 0èšèŒã®ã¢ãŒã«ã圢 Ÿæ°éšåã®è£œé æ¹æ³ã
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/367,191 US5679976A (en) | 1993-06-14 | 1994-06-14 | Molded electric parts and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14227793 | 1993-06-14 | ||
JP5/142277 | 1993-06-14 | ||
JP33722493A JP3323958B2 (ja) | 1993-06-14 | 1993-12-28 | ã¢ãŒã«ã圢é»æ°éšåã®è£œé æ¹æ³ |
JP5/337224 | 1993-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994029887A1 true WO1994029887A1 (en) | 1994-12-22 |
Family
ID=26474339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1994/000960 WO1994029887A1 (en) | 1993-06-14 | 1994-06-14 | Molded electric part and its manufacture |
Country Status (3)
Country | Link |
---|---|
US (1) | US5679976A (ja) |
JP (1) | JP3323958B2 (ja) |
WO (1) | WO1994029887A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3479570B2 (ja) * | 1994-04-28 | 2003-12-15 | ããŒã æ ªåŒäŒç€Ÿ | ããã±ãŒãžååºäœé»è§£ã³ã³ãã³ãµã®æ§é |
JP3012555B2 (ja) * | 1997-05-29 | 2000-02-21 | ç¥æžæ¥æ¬é»æ°ãœãããŠã§ã¢æ ªåŒäŒç€Ÿ | å€é¢äœïœïœããã±ãŒãž |
JPH11289023A (ja) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | åå°äœè£ 眮åã³ãã®è£œé æ¹æ³ |
JP2002025852A (ja) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | é»åéšå |
TW567714B (en) * | 2001-07-09 | 2003-12-21 | Nippon Sheet Glass Co Ltd | Light-emitting unit and illumination device and image reading device using light-emitting unit |
JP3888228B2 (ja) * | 2002-05-17 | 2007-02-28 | æ ªåŒäŒç€Ÿãã³ãœãŒ | ã»ã³ãµè£ 眮 |
DE102006030248A1 (de) * | 2006-06-30 | 2008-01-03 | Epcos Ag | GehÀuse zur Aufnahme eines elektronische Bauelements und elektronische Bauelementtaranordnung |
DE102008029192A1 (de) * | 2008-03-13 | 2009-09-24 | Epcos Ag | FÃŒhler zum Erfassen einer physikalischen GröÃe und Verfahren zur Herstellung des FÃŒhlers |
EP2845452A1 (de) | 2012-06-20 | 2015-03-11 | Siemens Medical Instruments Pte. Ltd. | Spritzgegossener leitungstrÀger mit integrierter leiterplatte |
JP2022021708A (ja) * | 2020-07-22 | 2022-02-03 | Tdkæ ªåŒäŒç€Ÿ | æš¹èã¢ãŒã«ãåé»åéšåã®è£œé æ¹æ³ãåã³æš¹èã¢ãŒã«ãåé»åéšå |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51157841U (ja) * | 1975-06-10 | 1976-12-15 | ||
JPS6324838U (ja) * | 1986-08-01 | 1988-02-18 | ||
JPH01121972U (ja) * | 1988-02-12 | 1989-08-18 | ||
JPH01315122A (ja) * | 1988-04-21 | 1989-12-20 | Siemens Ag | åè·¯æ¿ã«åºå®ããããã®ããã圢ããã€ã¹ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3600650A (en) * | 1968-12-30 | 1971-08-17 | Texas Instruments Inc | Protected semiconductor device having sensor thermally coupled to electrode |
JPS55140253A (en) * | 1979-04-18 | 1980-11-01 | Fujitsu Ltd | Semiconductor device |
JPS6292345A (ja) * | 1985-10-17 | 1987-04-27 | Nec Corp | æš¹èå°æ¢ååå°äœè£ 眮 |
JPH03205857A (ja) * | 1990-01-06 | 1991-09-09 | Fujitsu Ltd | æš¹èå°æ¢åé»åéšå |
-
1993
- 1993-12-28 JP JP33722493A patent/JP3323958B2/ja not_active Expired - Fee Related
-
1994
- 1994-06-14 WO PCT/JP1994/000960 patent/WO1994029887A1/ja active Application Filing
- 1994-06-14 US US08/367,191 patent/US5679976A/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51157841U (ja) * | 1975-06-10 | 1976-12-15 | ||
JPS6324838U (ja) * | 1986-08-01 | 1988-02-18 | ||
JPH01121972U (ja) * | 1988-02-12 | 1989-08-18 | ||
JPH01315122A (ja) * | 1988-04-21 | 1989-12-20 | Siemens Ag | åè·¯æ¿ã«åºå®ããããã®ããã圢ããã€ã¹ |
Also Published As
Publication number | Publication date |
---|---|
JPH0799131A (ja) | 1995-04-11 |
US5679976A (en) | 1997-10-21 |
JP3323958B2 (ja) | 2002-09-09 |
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