WO1994019402A3 - Die-attach compositions - Google Patents

Die-attach compositions Download PDF

Info

Publication number
WO1994019402A3
WO1994019402A3 PCT/US1994/001776 US9401776W WO9419402A3 WO 1994019402 A3 WO1994019402 A3 WO 1994019402A3 US 9401776 W US9401776 W US 9401776W WO 9419402 A3 WO9419402 A3 WO 9419402A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
alkylphenol
preparation
attach paste
attach
Prior art date
Application number
PCT/US1994/001776
Other languages
French (fr)
Other versions
WO1994019402A2 (en
Inventor
Stephen M Dershem
Dennis B Patterson
Deborah L Derfelt
Original Assignee
Quantum Materials Inc
Stephen M Dershem
Dennis B Patterson
Deborah L Derfelt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/023,595 external-priority patent/US5489641A/en
Priority claimed from US08/023,962 external-priority patent/US5358992A/en
Application filed by Quantum Materials Inc, Stephen M Dershem, Dennis B Patterson, Deborah L Derfelt filed Critical Quantum Materials Inc
Priority to AU64417/94A priority Critical patent/AU6441794A/en
Priority to JP6519172A priority patent/JPH08510482A/en
Priority to EP94912153A priority patent/EP0686170A4/en
Publication of WO1994019402A2 publication Critical patent/WO1994019402A2/en
Publication of WO1994019402A3 publication Critical patent/WO1994019402A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer vehicle, electrically conductive filler, and a curing catalyst, preferably in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die-attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes. Indeed, it is desirable to eliminate alkylphenols from die-attach paste compositions because alkylphenols are acidic species that do not become incorporated into the final polymerized matrix of the cured attach paste. These acidic species can thus leach out, leaving voids in the cured composition and causing corrosion of sensitive electronic parts which come in contact therewith. Optional treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
PCT/US1994/001776 1993-02-26 1994-02-23 Die-attach compositions WO1994019402A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU64417/94A AU6441794A (en) 1993-02-26 1994-02-23 Die-attach compositions
JP6519172A JPH08510482A (en) 1993-02-26 1994-02-23 Die adhesive composition
EP94912153A EP0686170A4 (en) 1993-02-26 1994-02-23 Die-attach compositions

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US08/023,595 US5489641A (en) 1993-02-26 1993-02-26 Freeze resistant die-attach compositions
US08/023,962 US5358992A (en) 1993-02-26 1993-02-26 Die-attach composition comprising polycyanate ester monomer
US08/157,665 US5447988A (en) 1993-02-26 1993-11-23 Solvent free die-attach compositions
US08/157,665 1993-11-23
US08/023,962 1993-11-23
US08/023,595 1993-11-23

Publications (2)

Publication Number Publication Date
WO1994019402A2 WO1994019402A2 (en) 1994-09-01
WO1994019402A3 true WO1994019402A3 (en) 1994-10-13

Family

ID=27362121

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1994/001776 WO1994019402A2 (en) 1993-02-26 1994-02-23 Die-attach compositions

Country Status (5)

Country Link
EP (1) EP0686170A4 (en)
JP (1) JPH08510482A (en)
AU (1) AU6441794A (en)
SG (1) SG42790A1 (en)
WO (1) WO1994019402A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646241A (en) * 1995-05-12 1997-07-08 Quantum Materials, Inc. Bleed resistant cyanate ester-containing compositions

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144741A1 (en) * 1983-11-04 1985-06-19 Atsugi Research Institute Co., Ltd. Electrically conductive powder for mixing with cyanoacrylates and electrically conductive curable composition containing the same
US4552690A (en) * 1983-06-23 1985-11-12 Mitsubishi Gas Chemical Company, Inc. Electrically conductive resin composition
US4740343A (en) * 1985-04-17 1988-04-26 Mitsubishi Gas Chemical Company, Inc. Method for producing rigid resin molds
US4839442A (en) * 1986-11-24 1989-06-13 Hi-Tek Polymers, Inc. Low viscosity noncrystalline dicyanate ester blends with prepolymers of dicyanate esters
US4946928A (en) * 1989-02-15 1990-08-07 Shell Oil Company Curable resin from cyanate aromatic ester and propargyl aromatic ether
US5150195A (en) * 1990-10-24 1992-09-22 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5155066A (en) * 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552690A (en) * 1983-06-23 1985-11-12 Mitsubishi Gas Chemical Company, Inc. Electrically conductive resin composition
EP0144741A1 (en) * 1983-11-04 1985-06-19 Atsugi Research Institute Co., Ltd. Electrically conductive powder for mixing with cyanoacrylates and electrically conductive curable composition containing the same
US4740343A (en) * 1985-04-17 1988-04-26 Mitsubishi Gas Chemical Company, Inc. Method for producing rigid resin molds
US4839442A (en) * 1986-11-24 1989-06-13 Hi-Tek Polymers, Inc. Low viscosity noncrystalline dicyanate ester blends with prepolymers of dicyanate esters
US4946928A (en) * 1989-02-15 1990-08-07 Shell Oil Company Curable resin from cyanate aromatic ester and propargyl aromatic ether
US5150195A (en) * 1990-10-24 1992-09-22 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5155066A (en) * 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0686170A4 *

Also Published As

Publication number Publication date
EP0686170A1 (en) 1995-12-13
WO1994019402A2 (en) 1994-09-01
AU6441794A (en) 1994-09-14
EP0686170A4 (en) 1997-05-28
JPH08510482A (en) 1996-11-05
SG42790A1 (en) 1997-10-17

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