WO1992009908A1 - A large solid state sensor assembly formed from smaller sensors - Google Patents
A large solid state sensor assembly formed from smaller sensors Download PDFInfo
- Publication number
- WO1992009908A1 WO1992009908A1 PCT/US1991/008642 US9108642W WO9209908A1 WO 1992009908 A1 WO1992009908 A1 WO 1992009908A1 US 9108642 W US9108642 W US 9108642W WO 9209908 A1 WO9209908 A1 WO 9209908A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor
- solid state
- sensors
- ray
- detector
- Prior art date
Links
- 239000007787 solid Substances 0.000 title claims abstract description 59
- 230000005855 radiation Effects 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000003491 array Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052711 selenium Inorganic materials 0.000 claims description 3
- 239000011669 selenium Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000011976 chest X-ray Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/02—Devices for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computerised tomographs
- A61B6/032—Transmission computed tomography [CT]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Medical Informatics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biomedical Technology (AREA)
- Theoretical Computer Science (AREA)
- Biophysics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Pulmonology (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Measurement Of Radiation (AREA)
Abstract
A large solid state sensor assembly (14) is formed from a plurality of smaller solid state sensors (18, 20, 22, 24, 32, 34) which are positioned contiguously to each other. The large solid state sensor assembly (14) is preferably a solid state X-ray assembly and includes at least a first solid state sensor (18, 20, 22, 24) having an X-ray detector region and a blind non-detector border region, and a second solid state sensor (32) having an X-ray detector region and a blind non-detector border region. The second sensor (32) is positioned adjacent to the first sensor (18, 20, 22, 24) with respective non-detector regions being contiguous. A third solid state sensor (34) having an X-ray detector region, is positioned to overlie the first (18, 20, 22, 24), and second (32) solid state sensors so that the X-ray detector region of the third sensor (34) overlies the blind non-detector regions of the first and second sensors. Thus, a large continuous X-ray detector region formed of said first, second, and third sensor detector regions is provided.
Description
A LARGE SOLID STATE SENSOR ASSEMBLY FORMED FROM SMALLER SENSORS
BACKGROUND OF THE INVENTION This invention relates in general to apparatus for sensing radiation such as X-rays and, more particularly, relates to a large solid state X-ray sensor assembly formed of smaller solid state X-ray sensor assemblies in which blind non-detector regions are eliminated.
X-ray detection systems are used widely in medical and industrial applications to image the interior of a structure in a non-invasive manner. Typically, an X-ray system includes a source of X-rays, which are directed to penetrate a region of interest of an object, and X-ray sensitive film which forms an image of the irradiated region of the object. The latent image in the film must be developed before it is available for examination and diagnosis. In order to simplify and speed up the X-ray examination system, various electronic detection systems have evolved. Older systems have utilized scintillators or other X- ray sensitive devices to convert an X-ray image into a visible image. The visible image is then detected by means of an array of photomultiplier tubes or a cathode ray tube to convert the visible image into an electrical image representative of the X-ray image. The electrical image may then be processed electrically to enhance, display or store the image. More recently, solid state semi-conductor sensors have replaced photomultiplier tubes and cathode ray tubes as visible image detectors. The solid state sensors are combined with X-ray sensitive phosphors or X-ray sensitive image intensifier arrangements. However, the sequential conversion of an X-ray image into a visible image and then to an electrical image is disadvantageous because of reduced sensitivity and
resolution as compared to a system which is capable of directly converting an X-ray image into" a corresponding electrical image. Moreover, currently available solid state or cathode ray tube X-ray systems are not large enough to image the area of the largest X-ray film. Thus, the frequently used chest X-ray film has a 14 x 17 inch size whereas present day single crystal semi¬ conductor solid state sensors are considerably smaller in size. There is also a need for a simple, inexpensive and large solid state sensor assembly which senses other types of radiation (such as light) than X- rays.
SUMMARY QF THE INVENTION
In general, according to the present invention, there is provided a large solid state sensor assembly formed from a plurality of smaller solid state sensors. A large radiation sensitive region is effected by filling in blind, non-sensor regions between contiguous sensor regions by means of smaller solid state radiation sensors.
According to a feature of the present invention, there is provided a solid state X-ray sensor assembly which directly converts an X-ray image into a corresponding electrical image. According to another feature of the present invention, a large solid state X-ray sensor assembly is formed from a plurality of smaller solid state X-ray sensors. A large X-ray sensitive region is effected by filling in blind non- sensor regions between contiguous X-ray sensor regions by means of small solid state X-ray sensors.
BRIEF DESCRIPTION OF THE DRAWINGS In the detailed description of the invention presented below, reference is made to the accompanying
drawings in which like elements are numbered with like numbers.
FIG. 1 is a partially diagrammatic, block diagram of an X-ray system including an embodiment of the present invention;
FIGS. 2 and 3 are diagrammatic views of solid state sensors which are useful in describing the present invention;
FIG. 4 is a diagrammatic view of one embodiment of the present invention;
FIG. 5 is a diagrammatic view of another embodiment of the present invention; and
FIGS. 6 and 7 are respectively elevational and exploded views of another embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring now to FIG. 1, there is shown a medical X-ray system incorporating an embodiment of the present invention. It will be understood that the present invention may be incorporated in other X-ray systems used in industrial, government, and scientific applications. It will also be understood that radiation other than X-rays may be sensed by the sensor assembly of the present invention. As shown, a source 10 of X-rays directs X-rays through the region of interest of the body of an individual 12. An X-ray image of the region is detected by X-ray sensor apparatus 14. Apparatus 14 directly detects the X-ray image and converts it into an electrical signal which is provided to signal utilization device 16. Device 16 may, for example, be a video monitor for displaying the X-ray image or a magnetic or optical storage device for storing the electrical image in digital form. Since conventional X-ray film comes in a variety of sizes (the size for chest X-rays being one of the largest at 14 inches by 17 inches) , X-ray sensor
14 is sized to detect the largest X-ray image. However, because present day solid state sensor technology is limited to sensor sizes smaller than 14 x 17 inches (except in very expensive custom built applications) , in order to detect a large X-ray image using solid state sensors of commonly available sizes, according to the present invention, a number of sensors are grouped together to form a large sensor assembly. Typically, a solid state sensor has an active detector region including an array of solid state X-ray detectors and a blind non-detector border region which accommodates input and output terminals and related circuitry. When a plurality of smaller sensors are grouped together to form a larger sensor assembly, blind regions containing no radiation detectors result. This is illustrated in FIG. 2 , which sr.-_ ,*ε solid state sensors 18, 20, 22, and 24 grouped together to form a larger sensor assembly. Each solid state sensor respectively includes a radiation detector region 18a, 20a, 22a, and 24a, and a blind non-detector region, 18b, 20b, 22b, and 24b. Detector regions 18a, 20a, 22a, and 24a include two-dimensional arrays of - individual detectors 18c, 20c, 22c, and 24c, respectively. Solid state detectors may be of any semiconductor which is capable of directly detecting X- rays. Suitable semiconductors are germanium, cadmium sulfide/selenium, etc.
Blind non-detector regions 28 and 30 are formed by segments of blind border regions 18b, 20b, 22b, and 24b. Thus, an X-ray image would be imperfectly detected by sensors 18, 20, 22, and 24 and would have non-detected portions thereof missing in the electrical image produced by the sensors. Thus, because the region of greatest diagnostic interest in the X-ray image may be excluded, such a sensor assembly is impractical. According to the present invention, a large solid state X-ray sensor assembly includes a
plurality of contiguous smaller solid state X-ray sensors having additional solid state X-ray sensors overlying the blind non-detector regions 28 and 30. Thus, an entire large X-ray image is detected without missing image regions. As shown in FIG. 3, elongated sensors 32 and 34 have detector regions which are dimensioned to fill in blind regions 28 and 30. In FIG. 4, elongated solid state sensor 32 overlies the blind region 30 of the sensor assembly of FIG. 2 and elongated solid state sensor 34 overlies blind region 28 of the sensor assembly of FIG. 2.
Thus, in the embodiment shown in FIG. 4, a continuous X-ray detection region is formed from the composite detector regions of solid state sensors 18, 20, 22, and 24 and elongated sensors 32 and 34.
Referring now to FIG. 5, there is shown another embodiment of the present invention. As shown, solid state sensors 36 and 38 include two-dimensional arrays of solid state X-ray detectors 36a and 38a. Sensor 39 having a one-dimensional array of X-ray detectors 40 overlies the blind region 42 formed by blind non-detector border regions 36b and 38b of detectors 36 and 38 respectively.
Referring now to FIGS. 6 and 7, there is shown another embodiment of the present invention. As shown in FIG. 6, X-ray source 10' directs X-rays through object 12' to form an X-ray image which is detected by solid state X-ray sensor assembly 14' of the type shown in FIG. 4. Assembly 14' includes solid state sensors 20', 18', 22', and 24' which are formed into a large solid-state X-ray sensor assembly. Assembly 14' includes elongated sensors 32 ' and 34' which overlie the blind regions formed by the non- detecting borders of sensors 18', 20', 22', and 24' (See FIG. 4). As depicted in FIG. 6, sensors 18', 20', 22 ' , and 24' are coplanar and located at a distance D3 from X-ray source 10'. Sensor 34' is located at a
distance D2 from X-ray source 10' , and sensor 32' is located at a distance Oλ from X-ray source 10' . In order to equalize the sensitivity of the X-ray detectors which are located at different distances from X-ray source 10' , according to another embodiment of the present invention, the size of X-ray detectors increases as the distance of the detector from the X- ray source increases. Thus, as shown in FIG. 7, the size Si of a detector of sensor 32' is less than the size S2 of an X-ray detector of sensor 34' which is less than the size S3 of an X-ray detector of sensors 18', 20*, 22 ' , and 24'.
Although specific embodiments of the present invention have been described and shown herein, it will be understood that variations and modifications of thereof are within the knowledge of one skilled in the art. Thus, a large solid state X-ray sensor assembly may include any number of coplanar, two-dimensional sensor arrays and any number of corresponding overlying sensor arrays to effect a continuous X-ray detector array. Moreover, the embodiments of the invention described above may be configured to sense radiation images other than X-ray images. Thus, sensor assemblies according to the invention may sense radiation images in the ultraviolet, visible and infrared regions, in the alpha, beta and gamma regions etc.
Industrial Application The disclosed sensor assembly finds application in the-health field for diagnostic imaging and in industry for the X-ray analysis of industrial components.
Claims
1. A solid state radiation sensor assembly comprising: a first solid state sensor having a radiation detector region and a blind non-detector border region; a second solid state sensor having a radiation detector region and a blind non-detector border region; said second sensor being positioned adjacent to said first sensor such that said non- detector regions of said first and second sensors are contiguous; and a third solid state sensor having a radiation detector region, said third sensor overlying said first and second sensors so that said radiation detector region of said third sensor is positioned over said blind non-detector regions of said first and second sensors and forms a continuous radiation detection region with the radiation detector regions of said first and second radiation sensors.
2. The assembly of claim 1 including a radiation source and wherein said first and second sensors are positioned at a farther distance from said radiation source than said third sensor and wherein said first, second and third sensors respectively have a plurality of solid state radiation detectors such that said detectors of said third sensor are smaller in size than said detectors of said first and second sensors.
3. The assembly of claim 1 wherein said first and second sensors have respective two dimensional arrays -of solid state radiation detectors and wherein said third sensor has an array of radiation detectors which are aligned with the detectors of said first and second sensors.
4. The assembly of claim 1 wherein said first, second, and third solid state sensors are made of germanium semiconductor.
5. The assembly of claim 1 wherein said first, second, and third solid state sensors are made of cadmium sulfide/selenium semiconductor.
6. A solid state X-ray sensor assembly comprising: a first solid state sensor having an X-ray detector region and a blind non-detector border region; a second solid state sensor having an X-ray detector region and a blind non-detector border region; said second sensor being positioned adjacent to said first sensor such that said non-detector regions of said first and second sensors are contiguous; and a third solid state sensor having an X-ray detector region, said third sensor overlying said first and second sensors so that said X-ray detector region of said third sensor is positioned over said blind non- detector regions of said first and second sensors and forms a continuous X-ray detection region with the X- ray detector regions of said first and second X-ray sensors.
7. The assembly of claim 6 including an X- ray source and wherein said first and second sensors are positioned at a farther distance from said X-ray source than said third sensor and wherein said first, second and third sensors respectively have a plurality of solid state X-ray detectors such that said detectors of said third sensor are smaller in size than said detectors of said first and second sensors.
8. The assembly of claim 6 wherein said first and second sensors have respective two dimensional arrays .of solid state X-ray detectors and wherein said third sensor has an array of X-ray detectors which are aligned with the detectors of said first and second sensors.
9. The assembly of claim 6 wherein said first, second, and third solid state sensors are made of germanium semiconductor.
10. The assembly of claim 6 wherein said first, second, and third solid state sensors are made of cadmium sulfide/selenium semiconductor.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69124225T DE69124225T2 (en) | 1990-11-28 | 1991-11-21 | EXTENDED SOLID BODY DETECTOR ARRANGEMENT MADE FROM SMALLER DETECTORS |
EP92901128A EP0515630B1 (en) | 1990-11-28 | 1991-11-21 | A large solid state sensor assembly formed from smaller sensors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US618,810 | 1990-11-28 | ||
US07/618,810 US5105087A (en) | 1990-11-28 | 1990-11-28 | Large solid state sensor assembly formed from smaller sensors |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1992009908A1 true WO1992009908A1 (en) | 1992-06-11 |
Family
ID=24479233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1991/008642 WO1992009908A1 (en) | 1990-11-28 | 1991-11-21 | A large solid state sensor assembly formed from smaller sensors |
Country Status (5)
Country | Link |
---|---|
US (1) | US5105087A (en) |
EP (1) | EP0515630B1 (en) |
JP (1) | JPH05504001A (en) |
DE (1) | DE69124225T2 (en) |
WO (1) | WO1992009908A1 (en) |
Families Citing this family (31)
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US5464984A (en) * | 1985-12-11 | 1995-11-07 | General Imaging Corporation | X-ray imaging system and solid state detector therefor |
FR2679687B1 (en) * | 1991-07-26 | 1997-03-14 | Commissariat Energie Atomique | LARGE-DIMENSIONAL IMAGE DISPLAY DEVICE OR SOCKET. |
FR2687494B1 (en) * | 1992-02-18 | 1996-10-25 | Thomson Tubes Electroniques | MATRIX SCREEN IN PARTICULAR OF LARGE DIMENSIONS AND METHOD FOR THE PRODUCTION OF SUCH A MATRIX SCREEN. |
US5254480A (en) * | 1992-02-20 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Process for producing a large area solid state radiation detector |
US5336879A (en) * | 1993-05-28 | 1994-08-09 | David Sarnoff Research Center, Inc. | Pixel array having image forming pixel elements integral with peripheral circuit elements |
US5436458A (en) * | 1993-12-06 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Solid state radiation detection panel having tiled photosensitive detectors arranged to minimize edge effects between tiles |
US5381014B1 (en) * | 1993-12-29 | 1997-06-10 | Du Pont | Large area x-ray imager and method of fabrication |
US5444756A (en) * | 1994-02-09 | 1995-08-22 | Minnesota Mining And Manufacturing Company | X-ray machine, solid state radiation detector and method for reading radiation detection information |
GB2289983B (en) * | 1994-06-01 | 1996-10-16 | Simage Oy | Imaging devices,systems and methods |
EP0853427B1 (en) * | 1994-06-01 | 2008-10-15 | Ipl Intellectual Property Licensing Limited | Imaging devices, systems and methods |
US6035013A (en) * | 1994-06-01 | 2000-03-07 | Simage O.Y. | Radiographic imaging devices, systems and methods |
BR9510290A (en) * | 1994-12-23 | 1997-11-11 | Digirad | Semiconductor gamma ray camera and medical imaging system |
US6055450A (en) * | 1994-12-23 | 2000-04-25 | Digirad Corporation | Bifurcated gamma camera system |
US5742060A (en) * | 1994-12-23 | 1998-04-21 | Digirad Corporation | Medical system for obtaining multiple images of a body from different perspectives |
US5498880A (en) * | 1995-01-12 | 1996-03-12 | E. I. Du Pont De Nemours And Company | Image capture panel using a solid state device |
US5635718A (en) * | 1996-01-16 | 1997-06-03 | Minnesota Mining And Manufacturing Company | Multi-module radiation detecting device and fabrication method |
US6236050B1 (en) * | 1996-02-02 | 2001-05-22 | TüMER TüMAY O. | Method and apparatus for radiation detection |
US5834782A (en) * | 1996-11-20 | 1998-11-10 | Schick Technologies, Inc. | Large area image detector |
US5822392A (en) * | 1996-12-26 | 1998-10-13 | General Electric Company | Multi-resolution detection for increasing in an x-ray imaging implementation of an object |
US5844243A (en) * | 1997-07-15 | 1998-12-01 | Direct Radiography Co. | Method for preparing digital radiography panels |
US5847398A (en) * | 1997-07-17 | 1998-12-08 | Imarad Imaging Systems Ltd. | Gamma-ray imaging with sub-pixel resolution |
DE59912639D1 (en) * | 1998-06-23 | 2006-02-23 | Siemens Ag | Mammography X-ray machine with a solid-state detector |
US6180944B1 (en) | 1998-07-07 | 2001-01-30 | Direct Radiography, Corp. | Large area X-ray imager with vented seam and method of fabrication |
AU4654499A (en) * | 1999-06-15 | 2001-01-02 | Star V-Ray Co., Ltd. | Apparatus and method for digital x-ray imaging |
DE10038328A1 (en) * | 2000-08-05 | 2002-02-14 | Philips Corp Intellectual Pty | Computer tomograph with conical rays and helical relative movement |
JP2006280576A (en) * | 2005-03-31 | 2006-10-19 | Fuji Photo Film Co Ltd | Radiographic equipment |
WO2006129282A2 (en) * | 2005-05-31 | 2006-12-07 | Arineta Ltd. | Graded resolution field of view ct scanner |
US20130201316A1 (en) | 2012-01-09 | 2013-08-08 | May Patents Ltd. | System and method for server based control |
CN111149141A (en) | 2017-09-04 | 2020-05-12 | Nng软件开发和商业有限责任公司 | Method and apparatus for collecting and using sensor data from a vehicle |
WO2020035852A2 (en) | 2018-08-14 | 2020-02-20 | Neurotrigger Ltd. | Method and apparatus for transcutaneous facial nerve stimulation and applications thereof |
WO2020170237A1 (en) | 2019-02-19 | 2020-08-27 | Edgy Bees Ltd. | Estimating real-time delay of a video data stream |
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US4037105A (en) * | 1976-06-01 | 1977-07-19 | Laurer Gerard R | Radiation detector with array of different scintillators |
US4398092A (en) * | 1979-08-08 | 1983-08-09 | Technicare Corporation | Shaped detector |
EP0219648A1 (en) * | 1985-10-18 | 1987-04-29 | Clayton Foundation for Research | Multiple layer positron emission tomography camera |
EP0312156A1 (en) * | 1987-10-16 | 1989-04-19 | Koninklijke Philips Electronics N.V. | X-ray line detector device and X-ray analysis apparatus comprising such a device |
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JPS5670482A (en) * | 1979-11-13 | 1981-06-12 | Toshiba Corp | Semiconductor radiation detector |
US4467342A (en) * | 1982-07-15 | 1984-08-21 | Rca Corporation | Multi-chip imager |
US4755681A (en) * | 1986-09-30 | 1988-07-05 | Shimadzu Corporation | Radiation image detecting apparatus with IC modules stacked stepwise |
US4873708A (en) * | 1987-05-11 | 1989-10-10 | General Electric Company | Digital radiographic imaging system and method therefor |
US6301136B1 (en) * | 2000-07-19 | 2001-10-09 | Honeywell International Inc. | Floating flame controller |
SG129994A1 (en) * | 2000-12-27 | 2007-03-20 | Sumitomo Chemical Co | Copolymer, adhesive containing the same and laminate |
-
1990
- 1990-11-28 US US07/618,810 patent/US5105087A/en not_active Expired - Lifetime
-
1991
- 1991-11-21 EP EP92901128A patent/EP0515630B1/en not_active Expired - Lifetime
- 1991-11-21 JP JP4501322A patent/JPH05504001A/en active Pending
- 1991-11-21 WO PCT/US1991/008642 patent/WO1992009908A1/en active IP Right Grant
- 1991-11-21 DE DE69124225T patent/DE69124225T2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4037105A (en) * | 1976-06-01 | 1977-07-19 | Laurer Gerard R | Radiation detector with array of different scintillators |
US4398092A (en) * | 1979-08-08 | 1983-08-09 | Technicare Corporation | Shaped detector |
EP0219648A1 (en) * | 1985-10-18 | 1987-04-29 | Clayton Foundation for Research | Multiple layer positron emission tomography camera |
EP0312156A1 (en) * | 1987-10-16 | 1989-04-19 | Koninklijke Philips Electronics N.V. | X-ray line detector device and X-ray analysis apparatus comprising such a device |
Also Published As
Publication number | Publication date |
---|---|
DE69124225T2 (en) | 1997-07-31 |
EP0515630A1 (en) | 1992-12-02 |
DE69124225D1 (en) | 1997-02-27 |
US5105087A (en) | 1992-04-14 |
EP0515630B1 (en) | 1997-01-15 |
JPH05504001A (en) | 1993-06-24 |
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