WO1991003920A3 - Durchkontaktierte leiterplatte mit resist sowie verfahren zur herstellung derselben - Google Patents

Durchkontaktierte leiterplatte mit resist sowie verfahren zur herstellung derselben Download PDF

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Publication number
WO1991003920A3
WO1991003920A3 PCT/EP1990/001326 EP9001326W WO9103920A3 WO 1991003920 A3 WO1991003920 A3 WO 1991003920A3 EP 9001326 W EP9001326 W EP 9001326W WO 9103920 A3 WO9103920 A3 WO 9103920A3
Authority
WO
WIPO (PCT)
Prior art keywords
base
electrolytically
electrically conductive
circuit pattern
printed circuit
Prior art date
Application number
PCT/EP1990/001326
Other languages
English (en)
French (fr)
Other versions
WO1991003920A2 (de
Inventor
Juergen Hupe
Walter Kronenberg
Original Assignee
Blasberg Oberflaechentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg Oberflaechentech filed Critical Blasberg Oberflaechentech
Priority to SU905011486A priority Critical patent/RU2078405C1/ru
Priority to DE59007653T priority patent/DE59007653D1/de
Priority to AU61584/90A priority patent/AU644602B2/en
Priority to US07/836,261 priority patent/US5373629A/en
Priority to EP90912088A priority patent/EP0489759B1/de
Publication of WO1991003920A2 publication Critical patent/WO1991003920A2/de
Publication of WO1991003920A3 publication Critical patent/WO1991003920A3/de
Priority to FI920421A priority patent/FI920421A0/fi
Priority to BG95974A priority patent/BG61362B1/bg

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block

Abstract

Es wird ein Verfahren beschrieben zur Herstellung von durchkontaktierten ein- oder mehrlagigen Leiterplatten auf Basis eines gegebenenfalls beidseitig mit mindestens einer das elektrisch leitende Leitungsbild temporär freilegenden Photoresistschicht versehenen polymeren Trägermaterials oder Keramik durch galvanisches oder aussenstromloses Auftragen einer Metallschicht auch auf den Oberflächen, die nicht mit einer leitenden Metallschicht überzogen sind, dadurch gekennzeichnet, dass a) die Oberflächen des Trägers nach Bohren und anschliessender mechanischer Oberflächenbehandlung mit einem geeigneten Photoresist laminiert, belichtet und entwickelt werden, so dass das Leiterbild freiliegt, b) die Oberflächen des Trägers in einer oxidierend wirkenden Lösung vorbehandelt werden, c) nach Entfernung der Lösungsreste durch Spülen der Träger in eine Lösung gebracht wird, welche ein heterocyclisches Monomeres, insbesondere Pyrrol, Thiophen, Furan oder deren Derivate, das in polymerer Form elektrisch leitend ist, enthält, d) der Träger danach in eine saure Lösung gebracht wird, wobei sich eine elektrisch leitende polymere Schicht ausbildet, woraufhin gegebenenfalls Lösungsreste durch Spülen entfernt werden und anschliessend Bohrlöcher und Schaltungsbild in einem Schritt bevorzugt galvanisch oder aber aussenstromlos metallisiert werden.
PCT/EP1990/001326 1989-08-31 1990-08-11 Durchkontaktierte leiterplatte mit resist sowie verfahren zur herstellung derselben WO1991003920A2 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SU905011486A RU2078405C1 (ru) 1989-08-31 1990-08-11 Способ изготовления однослойной или многослойной печатной платы
DE59007653T DE59007653D1 (de) 1989-08-31 1990-08-11 Verfahren zur herstellung einer durchkontaktierten leiterplatte.
AU61584/90A AU644602B2 (en) 1989-08-31 1990-08-11 Plated-through printed circuit board with resist and process for producing it
US07/836,261 US5373629A (en) 1989-08-31 1990-08-11 Through-hole plate printed circuit board with resist and process for manufacturing same
EP90912088A EP0489759B1 (de) 1989-08-31 1990-08-11 Verfahren zur herstellung einer durchkontaktierten leiterplatte
FI920421A FI920421A0 (fi) 1989-08-31 1992-01-30 Genomkontakterad kontaktskiva med resist samt foerfarande foer dess framstaellning.
BG95974A BG61362B1 (en) 1989-08-31 1992-02-26 Process for producing plated-through printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3928832A DE3928832C2 (de) 1989-08-31 1989-08-31 Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
DEP3928832.3 1989-08-31

Publications (2)

Publication Number Publication Date
WO1991003920A2 WO1991003920A2 (de) 1991-03-21
WO1991003920A3 true WO1991003920A3 (de) 1991-04-18

Family

ID=6388281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1990/001326 WO1991003920A2 (de) 1989-08-31 1990-08-11 Durchkontaktierte leiterplatte mit resist sowie verfahren zur herstellung derselben

Country Status (10)

Country Link
US (1) US5373629A (de)
EP (1) EP0489759B1 (de)
JP (1) JP2883445B2 (de)
AT (1) ATE113785T1 (de)
BG (1) BG61362B1 (de)
DD (1) DD295503A5 (de)
DE (2) DE3928832C2 (de)
FI (1) FI920421A0 (de)
RU (1) RU2078405C1 (de)
WO (1) WO1991003920A2 (de)

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BR112014027624B1 (pt) 2012-06-11 2021-01-19 Stamford Devices Ltd método de fabricar uma lâmina de placa de orifícios de formação de aerossol, placa de orifícios, dispositivo de formação de aerossol e lâmina de placa de orifícios
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Title
CHEMISCHE INDUSTRIE vol. 8, no. 6, 1987, Seiten 59 - 64; NAARMANN: "Elektrisch leitfähige Polymere: Anwendungs-Spektrum noch nicht ausgereizt" siehe das ganze Dokument *
IBM TECHNICAL DISCLOSURE BULLETIN. vol. 22, no. 1, Juni 1979, NEW YORK US Seite 393 ENGLER: "Simple metallization procedure for insulating materials" siehe das ganze Dokument *
PATENT ABSTRACTS OF JAPAN vol. 12, no. 373 (C-534)(3220) 6 Oktober 1988, & JP-A-63 125696 (SEIZO MITAYA) 28 Mai 1988, siehe das ganze Dokument *

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DD295503A5 (de) 1991-10-31
JPH04507480A (ja) 1992-12-24
US5373629A (en) 1994-12-20
ATE113785T1 (de) 1994-11-15
EP0489759B1 (de) 1994-11-02
FI920421A0 (fi) 1992-01-30
RU2078405C1 (ru) 1997-04-27
DE3928832A1 (de) 1991-03-21
JP2883445B2 (ja) 1999-04-19
DE59007653D1 (de) 1994-12-08
WO1991003920A2 (de) 1991-03-21
DE3928832C2 (de) 1995-04-20
BG61362B1 (en) 1997-06-30
EP0489759A1 (de) 1992-06-17

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