WO1989006442A1 - Semiconductor package - Google Patents

Semiconductor package Download PDF

Info

Publication number
WO1989006442A1
WO1989006442A1 PCT/US1989/000006 US8900006W WO8906442A1 WO 1989006442 A1 WO1989006442 A1 WO 1989006442A1 US 8900006 W US8900006 W US 8900006W WO 8906442 A1 WO8906442 A1 WO 8906442A1
Authority
WO
WIPO (PCT)
Prior art keywords
leadframe
semiconductor package
copper
metal
cap
Prior art date
Application number
PCT/US1989/000006
Other languages
French (fr)
Inventor
Jacob Crane
Barry C. Johnson
Deepak Mahulikar
Sheldon H. Butt
Original Assignee
Olin Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corporation filed Critical Olin Corporation
Priority to KR1019890701529A priority Critical patent/KR900701038A/en
Publication of WO1989006442A1 publication Critical patent/WO1989006442A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Abstract

A semiconductor package (10''') for an electrical component (26) which has a metal or metal alloy leadframe (18) with first (20) and second (22) surfaces. The leadframe (18) is adapted to have an electrical component (26) connected thereto. The leadframe (18) is boned by means of a polymer to a copper or copper alloy base member (12''). The leadframe (18) is bonded by means of a polymer (60) to a copper or copper alloy cap member (42). The cap (42) and base (12'') members have coated to their inside surfaces (41, 14) a metal or metal alloy (70). The coating (70) improves the polymer bond between the leadframe (18) and the base (12'') and cap (42) members. The surface area of the base member is increased to transfer more heat from the silicon chip (26) in the semiconductor package (10'') and to reduce the thermal stresses between the silicon chip (26) and the base member (12'').
PCT/US1989/000006 1988-01-04 1989-01-04 Semiconductor package WO1989006442A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890701529A KR900701038A (en) 1988-01-04 1989-01-04 Semiconductor Package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/140,859 US4888449A (en) 1988-01-04 1988-01-04 Semiconductor package
US140,859 1988-01-04

Publications (1)

Publication Number Publication Date
WO1989006442A1 true WO1989006442A1 (en) 1989-07-13

Family

ID=22493123

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1989/000006 WO1989006442A1 (en) 1988-01-04 1989-01-04 Semiconductor package

Country Status (8)

Country Link
US (1) US4888449A (en)
EP (1) EP0400023A4 (en)
JP (1) JPH03502024A (en)
KR (1) KR900701038A (en)
AU (1) AU2926789A (en)
CA (1) CA1303251C (en)
MX (1) MX163727B (en)
WO (1) WO1989006442A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0508195A1 (en) * 1991-04-10 1992-10-14 International Business Machines Corporation Method of forming a microelectronic package having a copper substrate
EP0621981A1 (en) * 1992-01-17 1994-11-02 Olin Corporation Lead frames with improved adhesion
US7085294B2 (en) 1998-11-05 2006-08-01 Nokia Networks Oy Frame synchronization mechanism

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US5155299A (en) * 1988-10-05 1992-10-13 Olin Corporation Aluminum alloy semiconductor packages
US5205036A (en) * 1988-10-17 1993-04-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device with selective coating on lead frame
US5276351A (en) * 1988-10-17 1994-01-04 Semiconductor Energy Laboratory Co., Ltd. Electronic device and a manufacturing method for the same
JP2647194B2 (en) * 1989-04-17 1997-08-27 住友電気工業株式会社 Semiconductor package sealing method
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
US5025114A (en) * 1989-10-30 1991-06-18 Olin Corporation Multi-layer lead frames for integrated circuit packages
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
US5098864A (en) * 1989-11-29 1992-03-24 Olin Corporation Process for manufacturing a metal pin grid array package
US5278429A (en) * 1989-12-19 1994-01-11 Fujitsu Limited Semiconductor device having improved adhesive structure and method of producing same
KR960010146B1 (en) * 1990-05-31 1996-07-26 가부시키가이샤 도시바 Lead frame and semiconductor package
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
GB9018764D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Packaging of electronic devices
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
US5261157A (en) * 1991-01-22 1993-11-16 Olin Corporation Assembly of electronic packages by vacuum lamination
US5155579A (en) * 1991-02-05 1992-10-13 Advanced Micro Devices Molded heat sink for integrated circuit package
JPH04283953A (en) * 1991-03-12 1992-10-08 Dainippon Printing Co Ltd Lead frame material for semiconductor, and manufacture of lead frame
US5328870A (en) * 1992-01-17 1994-07-12 Amkor Electronics, Inc. Method for forming plastic molded package with heat sink for integrated circuit devices
JPH06120374A (en) * 1992-03-31 1994-04-28 Amkor Electron Inc Semiconductor package structure, semicon- ductor packaging method and heat sink for semiconductor package
US5239131A (en) * 1992-07-13 1993-08-24 Olin Corporation Electronic package having controlled epoxy flow
US5367196A (en) * 1992-09-17 1994-11-22 Olin Corporation Molded plastic semiconductor package including an aluminum alloy heat spreader
TW238419B (en) * 1992-08-21 1995-01-11 Olin Corp
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
US5309321A (en) * 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
US5265321A (en) * 1992-09-22 1993-11-30 Microelectronics And Computer Technology Corporation Integrated circuit structure with heat exchanger elements secured thereto and method of making
US5317107A (en) * 1992-09-24 1994-05-31 Motorola, Inc. Shielded stripline configuration semiconductor device and method for making the same
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5825042A (en) * 1993-06-18 1998-10-20 Space Electronics, Inc. Radiation shielding of plastic integrated circuits
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5580825A (en) * 1993-09-20 1996-12-03 International Technology Exchange Corp. Process for making multilevel interconnections of electronic components
US5540378A (en) * 1993-09-27 1996-07-30 Olin Corporation Method for the assembly of an electronic package
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
US5728285A (en) * 1993-12-27 1998-03-17 National Semiconductor Corporation Protective coating combination for lead frames
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
AU2231795A (en) * 1994-04-14 1995-11-10 Olin Corporation Electronic package having improved wire bonding capability
US5701034A (en) * 1994-05-03 1997-12-23 Amkor Electronics, Inc. Packaged semiconductor die including heat sink with locking feature
US5969414A (en) * 1994-05-25 1999-10-19 Advanced Technology Interconnect Incorporated Semiconductor package with molded plastic body
US5436407A (en) * 1994-06-13 1995-07-25 Integrated Packaging Assembly Corporation Metal semiconductor package with an external plastic seal
US5454929A (en) * 1994-06-16 1995-10-03 National Semiconductor Corporation Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
JP3417079B2 (en) * 1994-08-31 2003-06-16 ソニー株式会社 Method for manufacturing semiconductor device
US5573845A (en) * 1994-12-09 1996-11-12 Olin Corporation Superficial coating layer having acicular structures for electrical conductors
US5545850A (en) * 1995-01-13 1996-08-13 Olin Corporation Guard ring for integrated circuit package
TW309654B (en) * 1995-03-29 1997-07-01 Olin Corp
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
KR19990028818A (en) * 1995-07-14 1999-04-15 와인스타인 폴 Metal ball grid electronic package
US5817544A (en) * 1996-01-16 1998-10-06 Olin Corporation Enhanced wire-bondable leadframe
US5805427A (en) * 1996-02-14 1998-09-08 Olin Corporation Ball grid array electronic package standoff design
DE19731424C1 (en) * 1997-07-22 1998-08-13 Daimler Benz Ag Embedding metallic conductors into plastic composition
US5952083A (en) * 1997-10-21 1999-09-14 Advanced Technology Interconnect, Inc. Aluminum alloys for electronic components
JP2000003988A (en) * 1998-06-15 2000-01-07 Sony Corp Lead frame and semiconductor device
US6369452B1 (en) * 1999-07-27 2002-04-09 International Business Machines Corporation Cap attach surface modification for improved adhesion
US6352935B1 (en) 2000-01-18 2002-03-05 Analog Devices, Inc. Method of forming a cover cap for semiconductor wafer devices
US6225684B1 (en) 2000-02-29 2001-05-01 Texas Instruments Tucson Corporation Low temperature coefficient leadframe
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
DE10035399A1 (en) * 2000-07-19 2002-01-31 Alcatel Sa Subcarrier, electronic assembly and method of manufacturing the same
TW521555B (en) * 2000-08-25 2003-02-21 Hitachi Aic Inc Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
US6876071B2 (en) * 2001-06-30 2005-04-05 Texas Instruments Incorporated Masking layer in substrate cavity
JP2003068965A (en) * 2001-08-30 2003-03-07 Hitachi Ltd Semiconductor device
JP3566269B2 (en) * 2002-06-07 2004-09-15 富士通株式会社 Lead frame, manufacturing method thereof, and semiconductor device.
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US6967390B2 (en) * 2003-02-13 2005-11-22 Freescale Semiconductor, Inc. Electronic component and method of manufacturing same
JP3883543B2 (en) * 2003-04-16 2007-02-21 新光電気工業株式会社 Conductor substrate and semiconductor device
JP3841768B2 (en) * 2003-05-22 2006-11-01 新光電気工業株式会社 Package parts and semiconductor packages
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
EP1668971A4 (en) * 2003-09-05 2009-04-08 Solid State Devices Inc Radiation shielded semiconductor device package
US7262491B2 (en) * 2005-09-06 2007-08-28 Advanced Interconnect Technologies Limited Die pad for semiconductor packages and methods of making and using same
JP2007287967A (en) * 2006-04-18 2007-11-01 Shinko Electric Ind Co Ltd Electronic-component apparatus
JPWO2008059693A1 (en) * 2006-11-15 2010-02-25 株式会社大真空 Electronic component package
US20090200359A1 (en) * 2008-02-13 2009-08-13 Gm Global Technology Operations, Inc. Reducing sheet distortion in friction stir processing
WO2009133717A1 (en) * 2008-05-02 2009-11-05 株式会社Ｎｅｏｍａｘマテリアル Hermetic sealing cap
WO2010085319A1 (en) 2009-01-22 2010-07-29 Aculon, Inc. Lead frames with improved adhesion to plastic encapsulant
US20100295160A1 (en) * 2009-05-22 2010-11-25 Advanced Semiconductor Engineering, Inc. Quad flat package structure having exposed heat sink, electronic assembly and manufacturing methods thereof
JP2011138968A (en) * 2009-12-28 2011-07-14 Senju Metal Ind Co Ltd Method for soldering surface-mount component, and surface-mount component
TWM409527U (en) * 2011-02-23 2011-08-11 Azurewave Technologies Inc Forming integrated circuit module
US9111869B2 (en) * 2011-07-29 2015-08-18 Semtech Corporation Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
US10636735B2 (en) * 2011-10-14 2020-04-28 Cyntec Co., Ltd. Package structure and the method to fabricate thereof
KR20130087249A (en) * 2012-01-27 2013-08-06 삼성전자주식회사 Semiconductor apparatus and image sensor package using the same
JP2015056608A (en) * 2013-09-13 2015-03-23 株式会社東芝 Semiconductor package and semiconductor device
US10014189B2 (en) * 2015-06-02 2018-07-03 Ngk Spark Plug Co., Ltd. Ceramic package with brazing material near seal member
US9768327B2 (en) * 2015-06-25 2017-09-19 Sunpower Corporation Etching techniques for semiconductor devices
CN109690765B (en) * 2016-09-12 2023-05-09 株式会社电装 Semiconductor device with a semiconductor device having a plurality of semiconductor chips
US20210398871A1 (en) * 2020-06-18 2021-12-23 Intel Corporation Integrated circuit heat spreader including sealant interface material
US20230084432A1 (en) * 2021-09-15 2023-03-16 Western Digital Technologies, Inc. Nickel-boron coatings for housings and enclosures

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697666A (en) * 1971-09-24 1972-10-10 Diacon Enclosure for incapsulating electronic components
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
US4651192A (en) * 1981-12-04 1987-03-17 Hitachi, Ltd. Ceramic packaged semiconductor device

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3422320A (en) * 1965-12-23 1969-01-14 Gen Motors Corp Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices
US3728177A (en) * 1970-07-30 1973-04-17 Olin Corp Method of producing a flexible laminate copper circuit
US3676292A (en) * 1970-10-07 1972-07-11 Olin Corp Composites of glass-ceramic-to-metal,seals and method of making same
US3726987A (en) * 1970-10-07 1973-04-10 Olin Corp Glass or ceramic-to-metal seals
US3740920A (en) * 1971-05-26 1973-06-26 Us Air Force Method for packaging hybrid circuits
US3914858A (en) * 1974-08-23 1975-10-28 Nitto Electric Ind Co Method of making sealed cavity molded semiconductor devices
US4149910A (en) * 1975-05-27 1979-04-17 Olin Corporation Glass or ceramic-to-metal composites or seals involving iron base alloys
US4105861A (en) * 1975-09-29 1978-08-08 Semi-Alloys, Inc. Hermetically sealed container for semiconductor and other electronic devices
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4521469A (en) * 1982-11-22 1985-06-04 Olin Corporation Casing for electronic components
US4582556A (en) * 1982-11-22 1986-04-15 Olin Corporation Adhesion primers for encapsulating epoxies
US4525422A (en) * 1982-11-22 1985-06-25 Olin Corporation Adhesion primers for encapsulating epoxies
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4552206A (en) * 1983-01-17 1985-11-12 Aavid Engineering, Inc. Heat sinks for integrated circuit modules
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4649083A (en) * 1983-02-17 1987-03-10 Olin Corporation Electrical component forming process
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
US4532222A (en) * 1983-03-21 1985-07-30 Olin Corporation Reinforced glass composites
US4572924A (en) * 1983-05-18 1986-02-25 Spectrum Ceramics, Inc. Electronic enclosures having metal parts
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
JPH0612796B2 (en) * 1984-06-04 1994-02-16 株式会社日立製作所 Semiconductor device
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
US4696851A (en) * 1985-03-25 1987-09-29 Olin Corporation Hybrid and multi-layer circuitry
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US4725333A (en) * 1985-12-20 1988-02-16 Olin Corporation Metal-glass laminate and process for producing same
US4796083A (en) * 1987-07-02 1989-01-03 Olin Corporation Semiconductor casing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697666A (en) * 1971-09-24 1972-10-10 Diacon Enclosure for incapsulating electronic components
US4651192A (en) * 1981-12-04 1987-03-17 Hitachi, Ltd. Ceramic packaged semiconductor device
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0400023A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0508195A1 (en) * 1991-04-10 1992-10-14 International Business Machines Corporation Method of forming a microelectronic package having a copper substrate
EP0621981A1 (en) * 1992-01-17 1994-11-02 Olin Corporation Lead frames with improved adhesion
EP0621981A4 (en) * 1992-01-17 1995-05-17 Olin Corp Lead frames with improved adhesion.
US7085294B2 (en) 1998-11-05 2006-08-01 Nokia Networks Oy Frame synchronization mechanism

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MX163727B (en) 1992-06-17
KR900701038A (en) 1990-08-17
AU2926789A (en) 1989-08-01
US4888449A (en) 1989-12-19
JPH03502024A (en) 1991-05-09
EP0400023A1 (en) 1990-12-05
EP0400023A4 (en) 1993-06-09
CA1303251C (en) 1992-06-09

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