USRE44608E1 - Solder joint flip chip interconnection - Google Patents
Solder joint flip chip interconnection Download PDFInfo
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- USRE44608E1 USRE44608E1 US13/756,905 US201313756905A USRE44608E US RE44608 E1 USRE44608 E1 US RE44608E1 US 201313756905 A US201313756905 A US 201313756905A US RE44608 E USRE44608 E US RE44608E
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- lead
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Geometry (AREA)
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Abstract
Description
Claims (25)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/756,905 USRE44608E1 (en) | 2003-11-10 | 2013-02-01 | Solder joint flip chip interconnection |
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51886403P | 2003-11-10 | 2003-11-10 | |
US53391803P | 2003-12-31 | 2003-12-31 | |
US10/985,654 US7368817B2 (en) | 2003-11-10 | 2004-11-10 | Bump-on-lead flip chip interconnection |
US66520805P | 2005-03-25 | 2005-03-25 | |
US59764805P | 2005-12-14 | 2005-12-14 | |
US11/388,755 US20060216860A1 (en) | 2005-03-25 | 2006-03-24 | Flip chip interconnection having narrow interconnection sites on the substrate |
US11/640,468 US20070105277A1 (en) | 2004-11-10 | 2006-12-14 | Solder joint flip chip interconnection |
US12/624,482 US8129841B2 (en) | 2006-12-14 | 2009-11-24 | Solder joint flip chip interconnection |
US13/756,905 USRE44608E1 (en) | 2003-11-10 | 2013-02-01 | Solder joint flip chip interconnection |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/624,482 Reissue US8129841B2 (en) | 2003-11-10 | 2009-11-24 | Solder joint flip chip interconnection |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE44608E1 true USRE44608E1 (en) | 2013-11-26 |
Family
ID=46326822
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/640,468 Abandoned US20070105277A1 (en) | 2003-11-10 | 2006-12-14 | Solder joint flip chip interconnection |
US13/756,905 Active USRE44608E1 (en) | 2003-11-10 | 2013-02-01 | Solder joint flip chip interconnection |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/640,468 Abandoned US20070105277A1 (en) | 2003-11-10 | 2006-12-14 | Solder joint flip chip interconnection |
Country Status (1)
Country | Link |
---|---|
US (2) | US20070105277A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9902006B2 (en) | 2014-07-25 | 2018-02-27 | Raytheon Company | Apparatus for cleaning an electronic circuit board |
Families Citing this family (8)
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US7602062B1 (en) * | 2005-08-10 | 2009-10-13 | Altera Corporation | Package substrate with dual material build-up layers |
US8502362B2 (en) | 2011-08-16 | 2013-08-06 | Advanced Analogic Technologies, Incorporated | Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance |
US20090250814A1 (en) * | 2008-04-03 | 2009-10-08 | Stats Chippac, Ltd. | Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof |
US20100025862A1 (en) * | 2008-07-29 | 2010-02-04 | Peter Alfred Gruber | Integrated Circuit Interconnect Method and Apparatus |
TWI455263B (en) * | 2009-02-16 | 2014-10-01 | Ind Tech Res Inst | Chip package structure and chip package method |
WO2013157197A1 (en) | 2012-04-19 | 2013-10-24 | パナソニック株式会社 | Electronic component mounting method and electronic component mounting line |
US20160029486A1 (en) * | 2014-07-24 | 2016-01-28 | Samsung Electro-Mechanics Co., Ltd. | Solder joint structure and electronic component module including the same |
US9842819B2 (en) | 2015-08-21 | 2017-12-12 | Invensas Corporation | Tall and fine pitch interconnects |
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