USRE40781E1 - Method of providing a hydrophobic layer and condenser microphone having such a layer - Google Patents
Method of providing a hydrophobic layer and condenser microphone having such a layer Download PDFInfo
- Publication number
- USRE40781E1 USRE40781E1 US11/502,577 US50257706A USRE40781E US RE40781 E1 USRE40781 E1 US RE40781E1 US 50257706 A US50257706 A US 50257706A US RE40781 E USRE40781 E US RE40781E
- Authority
- US
- United States
- Prior art keywords
- diaphragm
- plate
- microphone according
- hydrophobic
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime, expires
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
Definitions
- the static distance between the diaphragm and the back-plate is preferably smaller than 10 ⁇ m, such as smaller than 7 ⁇ m, such as smaller than 5 ⁇ m, such as smaller than 3 ⁇ m, such as smaller than 1 ⁇ m, such as smaller than 0.7 ⁇ m, such as smaller than 0.5 ⁇ m, such smaller than 0.3 ⁇ m, such as approximately 0.2 ⁇ m.
- the static distance between the diaphragm and the back-plate may, thus, be approximately 1 ⁇ m, such as approximately 0.5 ⁇ m, approximately 0.7 ⁇ m, approximately 0.9 ⁇ m, approximately 1.2 ⁇ m, or approximately 1.5 ⁇ m.
- the method may further comprise the step of positioning at least part of the diaphragm and at least part of the back-plate in a container comprising a gaseous phase of the hydrophobic layer base material to be provided on the inner surfaces.
- the container may alternatively or additionally comprise a vapour of the hydrophobic layer base material.
- the hydrophobic layer is provided using a vapour deposition method.
Abstract
Description
-
- providing a condenser microphone comprising a diaphragm and a back-plate, wherein an inner surface of said diaphragm forms a capacitor in combination with an inner surface of said back-plate, and
- providing the hydrophobic layer onto the inner surfaces of the diaphragm and the back-plate through a number of openings, said openings being in the back-plate, in the diaphragm and/or between the diaphragm and the back-plate.
-
- forming a molecule monolayer, and
- cross linking between molecules and multi binding to surfaces
CnH2n+1C2H4SiX3; X═OCH3 or OCH2CH3 or Cl; n=1, 2, 3, . . .
CnH2n+1C2H4SiX2Y; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
or
CnH2n+1C2H4SiXY2; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
CnF2n+1C2H4SiX3; X═OCH3 or OCH2CH3 or Cl; n=1, 2, 3, . . .
CnF2n+1C2H4SiX2Y; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
or
CnF2n+1C2H4SiXY2; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
CnH2n+1C2H4SiX3; X═OCH3 or OCH2CH3 or Cl; n=1, 2, 3, . . .
CnH2n+1C2H4SiX2Y; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
or
CnH2n+1C2H4SiXY2; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
CnF2n+1C2H4SiX3; X═OCH3 or OCH2CH3 or Cl; n=1, 2, 3, . . .
CnF2n+1C2H4SiX2Y; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . . ; m=1, 2, 3, . . .
or
CnF2n+1C2H4SiXY2; X═OCH3 or OCH2CH3 or Cl; Y═CmH2m+1; n=1, 2, 3, . . .
Claims (73)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/502,577 USRE40781E1 (en) | 2001-05-31 | 2006-08-10 | Method of providing a hydrophobic layer and condenser microphone having such a layer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/867,606 US6859542B2 (en) | 2001-05-31 | 2001-05-31 | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US11/502,577 USRE40781E1 (en) | 2001-05-31 | 2006-08-10 | Method of providing a hydrophobic layer and condenser microphone having such a layer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/867,606 Reissue US6859542B2 (en) | 2001-05-31 | 2001-05-31 | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE40781E1 true USRE40781E1 (en) | 2009-06-23 |
Family
ID=25350120
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/867,606 Ceased US6859542B2 (en) | 2001-05-31 | 2001-05-31 | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US11/502,577 Expired - Lifetime USRE40781E1 (en) | 2001-05-31 | 2006-08-10 | Method of providing a hydrophobic layer and condenser microphone having such a layer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/867,606 Ceased US6859542B2 (en) | 2001-05-31 | 2001-05-31 | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
Country Status (7)
Country | Link |
---|---|
US (2) | US6859542B2 (en) |
EP (1) | EP1397936B1 (en) |
JP (1) | JP3974574B2 (en) |
CN (2) | CN1849016B (en) |
AT (1) | ATE284120T1 (en) |
DE (1) | DE60202145T2 (en) |
WO (1) | WO2002098166A1 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090067659A1 (en) * | 2007-09-12 | 2009-03-12 | Christian Wang | Miniature microphone assembly with hydrophobic surface coating |
US20090146527A1 (en) * | 2007-12-07 | 2009-06-11 | Electronics And Telecommunications Research Institute | Piezoelectric microspeaker using microelectromechanical systems and method of manufacturing the same |
US20100107758A1 (en) * | 2007-01-19 | 2010-05-06 | Canon Kabushiki Kaisha | Structural member having a plurality of conductive regions |
US20110006381A1 (en) * | 2007-12-07 | 2011-01-13 | Epcos Ag | Mems package and method for the production thereof |
US20110158439A1 (en) * | 2009-12-31 | 2011-06-30 | Texas Instruments Incorporated | Silicon Microphone Transducer |
US20120033832A1 (en) * | 2009-03-09 | 2012-02-09 | Nxp B.V. | Microphone and accelerometer |
US20120308053A1 (en) * | 2011-06-01 | 2012-12-06 | Infineon Technologies Ag | Plate, Transducer and Methods for Making and Operating a Transducer |
US8617934B1 (en) | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
US8624387B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone package |
US20140015070A1 (en) * | 2012-07-11 | 2014-01-16 | Robert Bosch Gmbh | Component having a micromechanical microphone pattern |
US9056760B2 (en) | 2010-01-29 | 2015-06-16 | Epcos Ag | Miniaturized electrical component comprising an MEMS and an ASIC and production method |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US9374643B2 (en) | 2011-11-04 | 2016-06-21 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
US9487386B2 (en) | 2013-01-16 | 2016-11-08 | Infineon Technologies Ag | Comb MEMS device and method of making a comb MEMS device |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
Families Citing this family (135)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7045459B2 (en) * | 2002-02-19 | 2006-05-16 | Northrop Grumman Corporation | Thin film encapsulation of MEMS devices |
DE10219679A1 (en) * | 2002-05-02 | 2003-11-20 | Audio Service Gmbh As | Hearing aid or hearing aid parts for use in the ear canal and / or auricle of a wearer |
DE10260304B3 (en) | 2002-12-20 | 2004-07-08 | Siemens Audiologische Technik Gmbh | Hearing aid system with side-specific hearing aid devices that can be worn behind the ears |
DE10260307B4 (en) | 2002-12-20 | 2007-02-22 | Siemens Audiologische Technik Gmbh | Electroacoustic miniature transducer for a hearing aid |
JP2004356708A (en) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | Sound detection mechanism and manufacturing method thereof |
US6806993B1 (en) * | 2003-06-04 | 2004-10-19 | Texas Instruments Incorporated | Method for lubricating MEMS components |
JP4181580B2 (en) * | 2003-11-20 | 2008-11-19 | 松下電器産業株式会社 | Electret and electret condenser |
US7706554B2 (en) * | 2004-03-03 | 2010-04-27 | Panasonic Corporation | Electret condenser |
US7853027B2 (en) * | 2004-03-05 | 2010-12-14 | Panasonic Corporation | Electret condenser |
DE102004022178B4 (en) * | 2004-05-05 | 2008-03-20 | Atmel Germany Gmbh | Method for producing a conductor track on a substrate and component with a conductor track produced in this way |
EP1599067B1 (en) | 2004-05-21 | 2013-05-01 | Epcos Pte Ltd | Detection and control of diaphragm collapse in condenser microphones |
US7795695B2 (en) | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
JP4559250B2 (en) * | 2005-02-16 | 2010-10-06 | シチズンファインテックミヨタ株式会社 | Actuator and manufacturing method thereof |
KR100638057B1 (en) * | 2005-02-21 | 2006-10-24 | 주식회사 비에스이 | Double Diaphragm Micro speaker |
US7825484B2 (en) | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
US7885423B2 (en) * | 2005-04-25 | 2011-02-08 | Analog Devices, Inc. | Support apparatus for microphone diaphragm |
US20070071268A1 (en) * | 2005-08-16 | 2007-03-29 | Analog Devices, Inc. | Packaged microphone with electrically coupled lid |
US7449356B2 (en) * | 2005-04-25 | 2008-11-11 | Analog Devices, Inc. | Process of forming a microphone using support member |
JP2007013509A (en) * | 2005-06-30 | 2007-01-18 | Sanyo Electric Co Ltd | Acoustic sensor and diaphragm |
US20070003081A1 (en) * | 2005-06-30 | 2007-01-04 | Insound Medical, Inc. | Moisture resistant microphone |
WO2007015593A1 (en) * | 2005-08-02 | 2007-02-08 | Bse Co., Ltd | Silicon based condenser microphone and packaging method for the same |
KR100675027B1 (en) * | 2005-08-10 | 2007-01-30 | 주식회사 비에스이 | Silicon based condenser microphone and mounting method for the same |
US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
KR100675025B1 (en) * | 2005-08-20 | 2007-01-29 | 주식회사 비에스이 | Silicon based condenser microphone |
KR100644730B1 (en) * | 2005-08-20 | 2006-11-10 | 주식회사 비에스이 | Silicon based condenser microphone |
US8351632B2 (en) * | 2005-08-23 | 2013-01-08 | Analog Devices, Inc. | Noise mitigating microphone system and method |
US7961897B2 (en) * | 2005-08-23 | 2011-06-14 | Analog Devices, Inc. | Microphone with irregular diaphragm |
US8477983B2 (en) * | 2005-08-23 | 2013-07-02 | Analog Devices, Inc. | Multi-microphone system |
KR100737405B1 (en) | 2006-01-05 | 2007-07-09 | 한국표준과학연구원 | Manufacturing method of micromachined silicon condenser microphone |
US8344487B2 (en) * | 2006-06-29 | 2013-01-01 | Analog Devices, Inc. | Stress mitigation in packaged microchips |
JP4951067B2 (en) * | 2006-07-25 | 2012-06-13 | アナログ デバイシス, インコーポレイテッド | Multiple microphone systems |
CA2661144C (en) * | 2006-08-31 | 2013-08-06 | Widex A/S | Filter for a hearing aid and a hearing aid |
US8165323B2 (en) * | 2006-11-28 | 2012-04-24 | Zhou Tiansheng | Monolithic capacitive transducer |
TW200847827A (en) * | 2006-11-30 | 2008-12-01 | Analog Devices Inc | Microphone system with silicon microphone secured to package lid |
CA2674136A1 (en) * | 2007-01-03 | 2008-07-10 | Widex A/S | A component for a hearing aid and a method of making a component for a hearing aid |
US20080192962A1 (en) | 2007-02-13 | 2008-08-14 | Sonion Nederland B.V. | Microphone with dual transducers |
US7694610B2 (en) * | 2007-06-27 | 2010-04-13 | Siemens Medical Solutions Usa, Inc. | Photo-multiplier tube removal tool |
JP2009038732A (en) * | 2007-08-03 | 2009-02-19 | Panasonic Corp | Electronic component and manufacturing method thereof, and electronic device provided with electronic component |
US8135163B2 (en) * | 2007-08-30 | 2012-03-13 | Klipsch Group, Inc. | Balanced armature with acoustic low pass filter |
US20090087010A1 (en) * | 2007-09-27 | 2009-04-02 | Mark Vandermeulen | Carrier chip with cavity |
US8208671B2 (en) * | 2008-01-16 | 2012-06-26 | Analog Devices, Inc. | Microphone with backside cavity that impedes bubble formation |
JP4366666B1 (en) * | 2008-09-12 | 2009-11-18 | オムロン株式会社 | Semiconductor device |
US7892937B2 (en) | 2008-10-16 | 2011-02-22 | Micron Technology, Inc. | Methods of forming capacitors |
US8238018B2 (en) | 2009-06-01 | 2012-08-07 | Zhou Tiansheng | MEMS micromirror and micromirror array |
US8507306B2 (en) * | 2009-09-28 | 2013-08-13 | Analog Devices, Inc. | Reduced stiction MEMS device with exposed silicon carbide |
DE102010008044B4 (en) * | 2010-02-16 | 2016-11-24 | Epcos Ag | MEMS microphone and method of manufacture |
US10551613B2 (en) | 2010-10-20 | 2020-02-04 | Tiansheng ZHOU | Micro-electro-mechanical systems micromirrors and micromirror arrays |
US9036231B2 (en) | 2010-10-20 | 2015-05-19 | Tiansheng ZHOU | Micro-electro-mechanical systems micromirrors and micromirror arrays |
US8575037B2 (en) | 2010-12-27 | 2013-11-05 | Infineon Technologies Ag | Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same |
US9181087B2 (en) * | 2011-03-02 | 2015-11-10 | Epcos Ag | Flat back plate |
US9357287B2 (en) | 2011-07-07 | 2016-05-31 | Sonion Nederland B.V. | Multiple receiver assembly and a method for assembly thereof |
US8980387B2 (en) | 2011-10-27 | 2015-03-17 | General Electric Company | Method of coating a surface and article incorporating coated surface |
US8995690B2 (en) * | 2011-11-28 | 2015-03-31 | Infineon Technologies Ag | Microphone and method for calibrating a microphone |
US9045328B2 (en) | 2011-12-20 | 2015-06-02 | Analog Devices, Inc. | Method for wafer-level surface micromachining to reduce stiction |
US9385634B2 (en) | 2012-01-26 | 2016-07-05 | Tiansheng ZHOU | Rotational type of MEMS electrostatic actuator |
US9029179B2 (en) | 2012-06-28 | 2015-05-12 | Analog Devices, Inc. | MEMS device with improved charge elimination and methods of producing same |
ITTO20120753A1 (en) * | 2012-08-30 | 2014-03-01 | St Microelectronics Srl | ENCAPSULATED DEVICE EXPOSED TO AIR, ENVIRONMENT AND LIQUIDS AND RELATIVE PROCESS OF MANUFACTURE |
US9247359B2 (en) | 2012-10-18 | 2016-01-26 | Sonion Nederland Bv | Transducer, a hearing aid comprising the transducer and a method of operating the transducer |
US9066187B2 (en) | 2012-10-18 | 2015-06-23 | Sonion Nederland Bv | Dual transducer with shared diaphragm |
US9807525B2 (en) | 2012-12-21 | 2017-10-31 | Sonion Nederland B.V. | RIC assembly with thuras tube |
DK2750413T3 (en) | 2012-12-28 | 2017-05-22 | Sonion Nederland Bv | Hearing aid |
US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
US9401575B2 (en) | 2013-05-29 | 2016-07-26 | Sonion Nederland Bv | Method of assembling a transducer assembly |
EP2849463B1 (en) | 2013-09-16 | 2018-04-04 | Sonion Nederland B.V. | A transducer comprising moisture transporting element |
DK3550852T3 (en) | 2014-02-14 | 2021-02-01 | Sonion Nederland Bv | A joiner for a receiver assembly |
US10021498B2 (en) | 2014-02-18 | 2018-07-10 | Sonion A/S | Method of manufacturing assemblies for hearing aids |
DK2914018T3 (en) | 2014-02-26 | 2017-01-30 | Sonion Nederland Bv | Speaker, luminaire and method |
DK2928207T3 (en) | 2014-04-02 | 2018-09-17 | Sonion Nederland Bv | Curved luminaire transducer |
TWI477159B (en) * | 2014-05-27 | 2015-03-11 | Cotron Corp | Vibrating element |
EP2953380A1 (en) | 2014-06-04 | 2015-12-09 | Sonion Nederland B.V. | Acoustical crosstalk compensation |
DE102014108740B4 (en) * | 2014-06-23 | 2016-03-03 | Epcos Ag | MEMS microphone with improved sensitivity and method of manufacture |
DE102014217152A1 (en) * | 2014-08-28 | 2016-03-03 | Robert Bosch Gmbh | MEMS component |
US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
DK3041263T3 (en) | 2014-12-30 | 2022-04-11 | Sonion Nederland Bv | Hybrid receiver module |
US10009693B2 (en) | 2015-01-30 | 2018-06-26 | Sonion Nederland B.V. | Receiver having a suspended motor assembly |
DK3057339T3 (en) | 2015-02-10 | 2021-01-04 | Sonion Nederland Bv | Microphone module with common middle audio input device |
DK3073764T3 (en) | 2015-03-25 | 2021-05-10 | Sonion Nederland Bv | A hearing aid comprising an insert member |
EP3073765B1 (en) | 2015-03-25 | 2022-08-17 | Sonion Nederland B.V. | A receiver-in-canal assembly comprising a diaphragm and a cable connection |
EP3133829B1 (en) | 2015-08-19 | 2020-04-08 | Sonion Nederland B.V. | Receiver unit with enhanced frequency response |
EP3139627B1 (en) | 2015-09-02 | 2019-02-13 | Sonion Nederland B.V. | Ear phone with multi-way speakers |
US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
US9668065B2 (en) | 2015-09-18 | 2017-05-30 | Sonion Nederland B.V. | Acoustical module with acoustical filter |
EP3157270B1 (en) | 2015-10-14 | 2021-03-31 | Sonion Nederland B.V. | Hearing device with vibration sensitive transducer |
DK3160157T3 (en) | 2015-10-21 | 2018-12-17 | Sonion Nederland Bv | Vibration-compensated vibroacoustic device |
US10582303B2 (en) | 2015-12-04 | 2020-03-03 | Sonion Nederland B.V. | Balanced armature receiver with bi-stable balanced armature |
DK3468231T3 (en) | 2015-12-21 | 2022-08-29 | Sonion Nederland Bv | RECEIVER ASSEMBLY HAVING A DISTINCT LONGITUDINAL DIRECTION |
US9718677B1 (en) * | 2016-01-19 | 2017-08-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
US9866959B2 (en) | 2016-01-25 | 2018-01-09 | Sonion Nederland B.V. | Self-biasing output booster amplifier and use thereof |
EP3200479A3 (en) | 2016-01-28 | 2017-08-30 | Sonion Nederland B.V. | An assembly comprising an electrostatic sound generator and a transformer |
DK3232685T3 (en) | 2016-04-13 | 2021-04-19 | Sonion Nederland Bv | A dome for a personal audio device |
EP3252444B1 (en) | 2016-06-01 | 2023-12-20 | Sonion Nederland B.V. | Vibration or acceleration sensor applying squeeze film damping |
DK3279621T5 (en) | 2016-08-26 | 2021-05-31 | Sonion Nederland Bv | VIBRATION SENSOR WITH LOW FREQUENCY ROLL-OFF RESPONSE CURVE |
EP3826326A1 (en) | 2016-09-12 | 2021-05-26 | Sonion Nederland B.V. | Receiver with integrated membrane movement detection |
EP3313097B1 (en) | 2016-10-19 | 2020-08-26 | Sonion Nederland B.V. | An ear bud or dome |
EP3324538A1 (en) | 2016-11-18 | 2018-05-23 | Sonion Nederland B.V. | A sensing circuit comprising an amplifying circuit |
US10327072B2 (en) | 2016-11-18 | 2019-06-18 | Sonion Nederland B.V. | Phase correcting system and a phase correctable transducer system |
US20180145643A1 (en) | 2016-11-18 | 2018-05-24 | Sonion Nederland B.V. | Circuit for providing a high and a low impedance and a system comprising the circuit |
EP3324649A1 (en) | 2016-11-18 | 2018-05-23 | Sonion Nederland B.V. | A transducer with a high sensitivity |
US10516947B2 (en) | 2016-12-14 | 2019-12-24 | Sonion Nederland B.V. | Armature and a transducer comprising the armature |
EP3337191B1 (en) | 2016-12-16 | 2021-05-19 | Sonion Nederland B.V. | A receiver assembly |
EP3337192B1 (en) | 2016-12-16 | 2021-04-14 | Sonion Nederland B.V. | A receiver assembly |
US10699833B2 (en) | 2016-12-28 | 2020-06-30 | Sonion Nederland B.V. | Magnet assembly |
DK3343956T3 (en) | 2016-12-30 | 2021-05-03 | Sonion Nederland Bv | A circuit and a receiver comprising the circuit |
EP3702322A1 (en) | 2016-12-30 | 2020-09-02 | Sonion Nederland B.V. | Micro-electromechanical transducer |
DE102017102190B4 (en) * | 2017-02-03 | 2020-06-04 | Infineon Technologies Ag | Membrane components and method for forming a membrane component |
US10231061B2 (en) | 2017-04-28 | 2019-03-12 | Infineon Technologies Ag | Sound transducer with housing and MEMS structure |
EP3407625B1 (en) | 2017-05-26 | 2021-05-05 | Sonion Nederland B.V. | Receiver with venting opening |
EP3407626B1 (en) | 2017-05-26 | 2020-06-24 | Sonion Nederland B.V. | A receiver assembly comprising an armature and a diaphragm |
DK3429231T3 (en) | 2017-07-13 | 2023-04-11 | Sonion Nederland Bv | Hearing device including vibration prevention device |
US10820104B2 (en) | 2017-08-31 | 2020-10-27 | Sonion Nederland B.V. | Diaphragm, a sound generator, a hearing device and a method |
DK3451688T3 (en) | 2017-09-04 | 2021-06-21 | Sonion Nederland Bv | SOUND GENERATOR, SCREEN AND SPOUT |
GB201714956D0 (en) | 2017-09-18 | 2017-11-01 | Sonova Ag | Hearing device with adjustable venting |
US10805746B2 (en) | 2017-10-16 | 2020-10-13 | Sonion Nederland B.V. | Valve, a transducer comprising a valve, a hearing device and a method |
DK3471433T3 (en) | 2017-10-16 | 2022-11-28 | Sonion Nederland Bv | A PERSONAL HEARING DEVICE |
US10869119B2 (en) | 2017-10-16 | 2020-12-15 | Sonion Nederland B.V. | Sound channel element with a valve and a transducer with the sound channel element |
EP3567873B1 (en) | 2018-02-06 | 2021-08-18 | Sonion Nederland B.V. | Method for controlling an acoustic valve of a hearing device |
EP3531713B1 (en) | 2018-02-26 | 2022-11-02 | Sonion Nederland B.V. | Miniature speaker with acoustical mass |
EP3531720B1 (en) | 2018-02-26 | 2021-09-15 | Sonion Nederland B.V. | An assembly of a receiver and a microphone |
EP3995795A1 (en) | 2018-04-30 | 2022-05-11 | Sonion Nederland B.V. | Vibration sensor |
DK3579578T3 (en) | 2018-06-07 | 2022-05-02 | Sonion Nederland Bv | MINIATURE ANNOUNCER |
DE102018211332A1 (en) | 2018-07-10 | 2020-01-16 | Robert Bosch Gmbh | Process for producing a MEMS sensor and MEMS sensor |
US10951169B2 (en) | 2018-07-20 | 2021-03-16 | Sonion Nederland B.V. | Amplifier comprising two parallel coupled amplifier units |
US10848864B2 (en) * | 2018-09-07 | 2020-11-24 | Apple Inc. | Liquid-resistant modules, acoustic transducers and electronic devices |
CN110902642A (en) | 2018-09-17 | 2020-03-24 | 新科实业有限公司 | MEMS package and method of manufacturing the same |
EP3627856B1 (en) | 2018-09-19 | 2023-10-25 | Sonion Nederland B.V. | A housing comprising a sensor |
DE112019004979T5 (en) | 2018-10-05 | 2021-06-17 | Knowles Electronics, Llc | Process for making MEMS membranes comprising corrugations |
WO2020072920A1 (en) * | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Microphone device with ingress protection |
EP4300995A3 (en) | 2018-12-19 | 2024-04-03 | Sonion Nederland B.V. | Miniature speaker with multiple sound cavities |
EP3675522A1 (en) | 2018-12-28 | 2020-07-01 | Sonion Nederland B.V. | Miniature speaker with essentially no acoustical leakage |
US11190880B2 (en) | 2018-12-28 | 2021-11-30 | Sonion Nederland B.V. | Diaphragm assembly, a transducer, a microphone, and a method of manufacture |
EP3726855B1 (en) | 2019-04-15 | 2021-09-01 | Sonion Nederland B.V. | A personal hearing device with a vent channel and acoustic separation |
US11317199B2 (en) | 2019-05-28 | 2022-04-26 | Apple Inc. | Vented acoustic transducers, and related methods and systems |
US11310591B2 (en) | 2019-05-28 | 2022-04-19 | Apple Inc. | Vented acoustic transducers, and related methods and systems |
US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
US20220353621A1 (en) * | 2021-04-29 | 2022-11-03 | Aac Acoustic Technologies (Shenzhen) Co., Ltd. | Silicon microphone |
Citations (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963881A (en) | 1973-05-29 | 1976-06-15 | Thermo Electron Corporation | Unidirectional condenser microphone |
US4508613A (en) | 1983-12-19 | 1985-04-02 | Gould Inc. | Miniaturized potassium ion sensor |
US4746898A (en) | 1986-10-20 | 1988-05-24 | Gould Inc. | Bi-phase decoder |
US4760250A (en) | 1986-09-29 | 1988-07-26 | Spectramed, Inc. | Optoelectronics system for measuring environmental properties having plural feedback detectors |
WO1989003125A1 (en) | 1987-09-22 | 1989-04-06 | Ib Johannsen | A process for producing an electric circuit including josephson diodes |
US4910840A (en) | 1987-10-30 | 1990-03-27 | Microtel, B.V. | Electroacoustic transducer of the so-called "electret" type, and a method of making such a transducer |
US5178015A (en) | 1991-07-22 | 1993-01-12 | Monolithic Sensors Inc. | Silicon-on-silicon differential input sensors |
WO1993004495A1 (en) | 1991-08-13 | 1993-03-04 | Siemens Aktiengesellschaft | Electret feature, method of producing it, and its use in an electro-acoustic transducer |
US5208789A (en) | 1992-04-13 | 1993-05-04 | Lectret S. A. | Condenser microphones based on silicon with humidity resistant surface treatment |
EP0561566A2 (en) | 1992-03-18 | 1993-09-22 | Knowles Electronics, Inc. | Solid state condenser and microphone |
US5367429A (en) | 1991-10-18 | 1994-11-22 | Hitachi, Ltd | Electrostatic type micro transducer and control system using the same |
US5446413A (en) | 1994-05-20 | 1995-08-29 | Knowles Electronics, Inc. | Impedance circuit for a miniature hearing aid |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5658698A (en) | 1994-01-31 | 1997-08-19 | Canon Kabushiki Kaisha | Microstructure, process for manufacturing thereof and devices incorporating the same |
US5708123A (en) | 1993-06-11 | 1998-01-13 | Nkt Research Center A/S | Electroactive materials, a process for their preparation as well as the use thereof |
US5740261A (en) | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
WO1998018855A1 (en) | 1996-10-25 | 1998-05-07 | Blue River International, L.L.C. | Silicon coating compositions and uses thereof |
EP0849082A2 (en) | 1996-12-20 | 1998-06-24 | Seiko Epson Corporation | Electrostatic actuator and method of manufacturing it |
US5812496A (en) | 1997-10-20 | 1998-09-22 | Peck/Pelissier Partnership | Water resistant microphone |
US5822170A (en) | 1997-10-09 | 1998-10-13 | Honeywell Inc. | Hydrophobic coating for reducing humidity effect in electrostatic actuators |
US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
EP0899093A2 (en) | 1997-08-29 | 1999-03-03 | Toyo Ink Manufacturing Co., Ltd. | Method and coating agent for electrocoagulation printing |
US5889872A (en) | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
US6012021A (en) | 1997-02-28 | 2000-01-04 | Microtronic A/S | Microelectric position sensor |
US6012335A (en) | 1996-05-02 | 2000-01-11 | National Semiconductor Corporation | High sensitivity micro-machined pressure sensors and acoustic transducers |
US6088463A (en) | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
WO2000046278A1 (en) | 1999-02-01 | 2000-08-10 | Forskningscenter Risø | Composite capable of rapid volume change |
US6134333A (en) | 1998-03-17 | 2000-10-17 | Sonic Innovations, Inc. | Disposable oleophobic and hydrophobic barrier for a hearing aid |
WO2000062580A1 (en) | 1999-04-12 | 2000-10-19 | Knowles Electronics, Llc | Package for micromachined silicon condenser microphone |
WO2000067526A2 (en) | 1999-04-30 | 2000-11-09 | Knowles Electronics, Llc. | Audio processor with ultrasonic control |
EP1052880A2 (en) | 1998-10-07 | 2000-11-15 | Knowles Electronics, LLC | Digital hearing aid microphone |
WO2001014248A2 (en) | 1999-08-24 | 2001-03-01 | Knowles Electronics, Llc | Assembly process for delicate silicon structures |
CA2383740A1 (en) | 1999-09-06 | 2001-03-15 | Microtronic A/S | Silicon-based sensor system |
CA2383901A1 (en) | 1999-09-06 | 2001-03-15 | Peter U. Scheel | A pressure transducer |
WO2001026136A2 (en) | 1999-10-05 | 2001-04-12 | Delta Danish Electronics, Light & Acoustics | Encapsulation for a three-dimensional microsystem |
US6225140B1 (en) | 1998-10-13 | 2001-05-01 | Institute Of Microelectronics | CMOS compatable surface machined pressure sensor and method of fabricating the same |
US6293148B1 (en) | 1999-04-30 | 2001-09-25 | Institute Of Microelectronics | Structural design for improving the sensitivity of a surface-micromachined vibratory gyroscope |
WO2002015636A2 (en) | 2000-08-11 | 2002-02-21 | Knowles Electronics, Llc | Miniature broadband transducer |
US20020031234A1 (en) | 2000-06-28 | 2002-03-14 | Wenger Matthew P. | Microphone system for in-car audio pickup |
US20020064292A1 (en) | 2000-09-29 | 2002-05-30 | Pirmin Rombach | Micromachined magnetically balanced membrane actuator |
WO2002052894A1 (en) | 2000-12-22 | 2002-07-04 | Brüel & Kjær Sound & Vibration Measurement A/S | A micromachined capacitive transducer |
WO2002052893A1 (en) | 2000-12-22 | 2002-07-04 | Brüel & Kjær Sound & Vibration Measurement A/S | A highly stable micromachined capacitive transducer |
US6512833B2 (en) | 2000-09-21 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Electret condenser microphone and method of producing same |
US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
US6552469B1 (en) | 1998-06-05 | 2003-04-22 | Knowles Electronics, Llc | Solid state transducer for converting between an electrical signal and sound |
US6578427B1 (en) | 1999-06-15 | 2003-06-17 | Envec Mess- Und Regeltechnik Gmbh + Co. | Capacitive ceramic relative-pressure sensor |
US6622368B1 (en) | 1998-06-11 | 2003-09-23 | Sonionmems A/S | Method of manufacturing a transducer having a diaphragm with a predetermined tension |
US6732588B1 (en) | 1999-09-07 | 2004-05-11 | Sonionmems A/S | Pressure transducer |
US6829131B1 (en) | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
US6847090B2 (en) | 2001-01-24 | 2005-01-25 | Knowles Electronics, Llc | Silicon capacitive microphone |
-
2001
- 2001-05-31 US US09/867,606 patent/US6859542B2/en not_active Ceased
-
2002
- 2002-05-29 EP EP02742842A patent/EP1397936B1/en not_active Expired - Lifetime
- 2002-05-29 WO PCT/DK2002/000365 patent/WO2002098166A1/en active IP Right Grant
- 2002-05-29 DE DE60202145T patent/DE60202145T2/en not_active Expired - Lifetime
- 2002-05-29 CN CN2006100801414A patent/CN1849016B/en not_active Expired - Lifetime
- 2002-05-29 CN CNB028106849A patent/CN1269383C/en not_active Expired - Lifetime
- 2002-05-29 AT AT02742842T patent/ATE284120T1/en not_active IP Right Cessation
- 2002-05-29 JP JP2003501227A patent/JP3974574B2/en not_active Expired - Lifetime
-
2006
- 2006-08-10 US US11/502,577 patent/USRE40781E1/en not_active Expired - Lifetime
Patent Citations (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963881A (en) | 1973-05-29 | 1976-06-15 | Thermo Electron Corporation | Unidirectional condenser microphone |
US4508613A (en) | 1983-12-19 | 1985-04-02 | Gould Inc. | Miniaturized potassium ion sensor |
US4760250A (en) | 1986-09-29 | 1988-07-26 | Spectramed, Inc. | Optoelectronics system for measuring environmental properties having plural feedback detectors |
US4746898A (en) | 1986-10-20 | 1988-05-24 | Gould Inc. | Bi-phase decoder |
WO1989003125A1 (en) | 1987-09-22 | 1989-04-06 | Ib Johannsen | A process for producing an electric circuit including josephson diodes |
US4910840A (en) | 1987-10-30 | 1990-03-27 | Microtel, B.V. | Electroacoustic transducer of the so-called "electret" type, and a method of making such a transducer |
US5178015A (en) | 1991-07-22 | 1993-01-12 | Monolithic Sensors Inc. | Silicon-on-silicon differential input sensors |
WO1993004495A1 (en) | 1991-08-13 | 1993-03-04 | Siemens Aktiengesellschaft | Electret feature, method of producing it, and its use in an electro-acoustic transducer |
US5367429A (en) | 1991-10-18 | 1994-11-22 | Hitachi, Ltd | Electrostatic type micro transducer and control system using the same |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
EP0561566A2 (en) | 1992-03-18 | 1993-09-22 | Knowles Electronics, Inc. | Solid state condenser and microphone |
US5208789A (en) | 1992-04-13 | 1993-05-04 | Lectret S. A. | Condenser microphones based on silicon with humidity resistant surface treatment |
US5708123A (en) | 1993-06-11 | 1998-01-13 | Nkt Research Center A/S | Electroactive materials, a process for their preparation as well as the use thereof |
US5658698A (en) | 1994-01-31 | 1997-08-19 | Canon Kabushiki Kaisha | Microstructure, process for manufacturing thereof and devices incorporating the same |
US5446413A (en) | 1994-05-20 | 1995-08-29 | Knowles Electronics, Inc. | Impedance circuit for a miniature hearing aid |
US5861779A (en) | 1994-05-20 | 1999-01-19 | Knowles Electronics, Inc. | Impedance circuit for a miniature hearing aid |
US6012335A (en) | 1996-05-02 | 2000-01-11 | National Semiconductor Corporation | High sensitivity micro-machined pressure sensors and acoustic transducers |
US5889872A (en) | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
WO1998018855A1 (en) | 1996-10-25 | 1998-05-07 | Blue River International, L.L.C. | Silicon coating compositions and uses thereof |
US5740261A (en) | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
EP0849082A2 (en) | 1996-12-20 | 1998-06-24 | Seiko Epson Corporation | Electrostatic actuator and method of manufacturing it |
US20010000329A1 (en) | 1996-12-20 | 2001-04-19 | Kazuhiko Sato | Electrostatic actuator and manufacturing method therefor |
US6410107B2 (en) | 1996-12-20 | 2002-06-25 | Seiko Epson Corporation | Methods for manufacturing an electrostatic actuator |
US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US6012021A (en) | 1997-02-28 | 2000-01-04 | Microtronic A/S | Microelectric position sensor |
EP0899093A2 (en) | 1997-08-29 | 1999-03-03 | Toyo Ink Manufacturing Co., Ltd. | Method and coating agent for electrocoagulation printing |
US5822170A (en) | 1997-10-09 | 1998-10-13 | Honeywell Inc. | Hydrophobic coating for reducing humidity effect in electrostatic actuators |
US5812496A (en) | 1997-10-20 | 1998-09-22 | Peck/Pelissier Partnership | Water resistant microphone |
US6134333A (en) | 1998-03-17 | 2000-10-17 | Sonic Innovations, Inc. | Disposable oleophobic and hydrophobic barrier for a hearing aid |
US6552469B1 (en) | 1998-06-05 | 2003-04-22 | Knowles Electronics, Llc | Solid state transducer for converting between an electrical signal and sound |
US6622368B1 (en) | 1998-06-11 | 2003-09-23 | Sonionmems A/S | Method of manufacturing a transducer having a diaphragm with a predetermined tension |
EP1052880A2 (en) | 1998-10-07 | 2000-11-15 | Knowles Electronics, LLC | Digital hearing aid microphone |
US6225140B1 (en) | 1998-10-13 | 2001-05-01 | Institute Of Microelectronics | CMOS compatable surface machined pressure sensor and method of fabricating the same |
US6088463A (en) | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
WO2000046278A1 (en) | 1999-02-01 | 2000-08-10 | Forskningscenter Risø | Composite capable of rapid volume change |
WO2000062580A1 (en) | 1999-04-12 | 2000-10-19 | Knowles Electronics, Llc | Package for micromachined silicon condenser microphone |
US6293148B1 (en) | 1999-04-30 | 2001-09-25 | Institute Of Microelectronics | Structural design for improving the sensitivity of a surface-micromachined vibratory gyroscope |
WO2000067526A2 (en) | 1999-04-30 | 2000-11-09 | Knowles Electronics, Llc. | Audio processor with ultrasonic control |
US6578427B1 (en) | 1999-06-15 | 2003-06-17 | Envec Mess- Und Regeltechnik Gmbh + Co. | Capacitive ceramic relative-pressure sensor |
WO2001014248A2 (en) | 1999-08-24 | 2001-03-01 | Knowles Electronics, Llc | Assembly process for delicate silicon structures |
CA2383740A1 (en) | 1999-09-06 | 2001-03-15 | Microtronic A/S | Silicon-based sensor system |
CA2383901A1 (en) | 1999-09-06 | 2001-03-15 | Peter U. Scheel | A pressure transducer |
US6732588B1 (en) | 1999-09-07 | 2004-05-11 | Sonionmems A/S | Pressure transducer |
US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
US20030128854A1 (en) | 1999-09-07 | 2003-07-10 | Matthias Mullenborn | Surface mountable transducer system |
US6829131B1 (en) | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
WO2001026136A2 (en) | 1999-10-05 | 2001-04-12 | Delta Danish Electronics, Light & Acoustics | Encapsulation for a three-dimensional microsystem |
US20020031234A1 (en) | 2000-06-28 | 2002-03-14 | Wenger Matthew P. | Microphone system for in-car audio pickup |
US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
WO2002015636A2 (en) | 2000-08-11 | 2002-02-21 | Knowles Electronics, Llc | Miniature broadband transducer |
EP1469701A2 (en) | 2000-08-11 | 2004-10-20 | Knowles Electronics, LLC | Raised microstructures |
US6512833B2 (en) | 2000-09-21 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Electret condenser microphone and method of producing same |
US20020064292A1 (en) | 2000-09-29 | 2002-05-30 | Pirmin Rombach | Micromachined magnetically balanced membrane actuator |
US20030034536A1 (en) | 2000-12-22 | 2003-02-20 | Bruel & Kjaer Sound & Vibration Measurement A/S | Micromachined capacitive electrical component |
WO2002052894A1 (en) | 2000-12-22 | 2002-07-04 | Brüel & Kjær Sound & Vibration Measurement A/S | A micromachined capacitive transducer |
US20030021432A1 (en) | 2000-12-22 | 2003-01-30 | Bruel & Kjaer Sound & Vibration Measurement A/S | Micromachined capacitive component with high stability |
US6788795B2 (en) | 2000-12-22 | 2004-09-07 | Brüel & Kjaer Sound & Vibration Measurement A/S | Micromachined capacitive component with high stability |
US6812620B2 (en) | 2000-12-22 | 2004-11-02 | Bruel & Kjaer Sound & Vibration Measurement A/S | Micromachined capacitive electrical component |
WO2002052893A1 (en) | 2000-12-22 | 2002-07-04 | Brüel & Kjær Sound & Vibration Measurement A/S | A highly stable micromachined capacitive transducer |
US6847090B2 (en) | 2001-01-24 | 2005-01-25 | Knowles Electronics, Llc | Silicon capacitive microphone |
Non-Patent Citations (99)
Title |
---|
"Anti-Stiction Hydrophobic Surfaces for Microsystems", by P. Vourmard, et al., CSEM scientific and technical report 1998. |
A Dry-Release Method Based on Polymer Columns for Microstructure Fabrication, C.H. Mastrangelo and G.S. Saloka, IEEE, 1993, pp. 77-81. |
A High Performance MEMS Thin-Film Teflon Electret Microphone, Wen H. Hsieh, Tze-Jung Yao and Yu-Chong Tai, Transducers '99, Sendai, Japan, Jun. 7-10, 1999, pp. 1064-1067. |
A Low-Voltage Silicon Condenser Microphone for Hearing Instrument Applications, Pirmin Rombach, Matthias Müllenborn, Udo Klein, Lis Nielsen and Roger Frehoff, Joint Meeting of ASA/EAA/DEGA, Session 2aEA, Engineering Acoustics: Silicon Sensors, J. Acoust. Soc. Am., vol. 105, No. 2, Pt. 2 Feb. 1999, p. 997. |
A Micromachined Thin-Film Teflon Electret Microphone, Wen H. Hsieh, Tseng-Yang Hsu and Yu-Chong Tai, Transducers '97, 1997 International Conference on Solid-State Sensors and Actuators, Chicago, Jun. 16-19, 1997, pp. 425-428. |
A New Class of Surface Modifiers for Stiction Reduction, Bong-Hwan Kim, Chang-Hoon Oh, Kukjin Chun, Taek-Dong Chung, Jang-Woong Byun and Yoon-Sik Lee, IEEE, 1999, pp. 189-193. |
A Piezoelectric Triaxial Accelerometer, Patrick Scheeper, Jens Ole Gulløv and Lars Munch Kofoed, J. Micromech. Microeng., 6, 1996, pp. 131-133. |
A Polymer Condenser Microphone on Silicon with On-Chip CMOS Amplifier, Michael Pedersen, Wouter Olthuis and Piet Bergveld, Transducers '97, 1997 International Conference on Solid-State Sensors and Actuators, Chicago, Jun. 16-19, 1997, pp. 445-446. |
A Review of Silicon Microphones, P.R. Scheeper, A.G.H. van der Donk, W. Olthuis and P. Bergveld, Sensors and Actuators A, 44, 1994, pp. 1-11. |
A Silicon Condenser Microphone With a Highly Perforated Backplate, J. Bergqvist, F. Rudolf, J. Maisano, F. Parodi and M. Rossi, IEEE, 1991, pp. 266-269. |
A Silicon Condenser Microphone with a Silicon Nitride Diaphragm and Backplate, P.R. Scheeper, W. Olthuis and P. Bergveld, J. Micromech. Microeng., 2, 1992, pp. 187-189. |
A Silicon Condenser Microphone with Polyimide Diaphragm and Backplate, Michael Pedersen, Wouter Olthuis and Piet Bergveld, Sensors and Actuators A, 63, 1997, pp. 97-104. |
A Silicon Condenser Microphone: Materials and Technology, P. Scheeper, 1993, 204 p. 25-page fax from Anthony G. Sitko of Marshall, Gerstein & Borun to Jorn Bjerragaar-Nielsen of Sonion A/S, dated Jul. 28, 2005, transmitting an analysis of Patrick Scheeper, A Silicon Condenser Microphone: Materials and Technology, 1993 and Gregory T.A. Kovacs, Micromachined Transducer Sourcebook, 1998 and further transmitting a draft Request For Exparte Reexamination. |
Ablation from Artificial or Laser-Induced Crater Surfaces of Silver by Laser Irradiation at 355nm, B. Toftmann, J. Schou and N.B. Larsen, Appl. Phys. A, 69 [Suppl.], 1999, pp. S811-S814. |
Advanced Microphone Technology, Peter V. Leoppert and Timothy K. Wickstrom, Emkay Innovative Products, Rolling Meadows, Illinois, Presented at AVIOS, 1999. |
Alkene Based Monolayer Films as Anti-Stiction Coatings for Polysilicone MEMS, W. Robert Ashurst, Christina Yau, Carlo Carraro, Roger T. Howe and Roya Maboudian, Sensors and Actuators A: Physical, vol. 91, No. 3, 2001. |
Alkyltrichlorosilane-Based Self-Assembled Monolayer Films for Stiction Reduction in Silicon Micromachines, Uthara Srinivasan, Michael R. Houston, Roger T. Howe and Roya Maboudian, Journal of Microelectromechanical Systems, vol. 7, No. 2, Jun. 1998, pp. 252-260. |
All-Surface-Micromachined Si Microphone, Flavio Pardo, R. Boie, G. Elko, R. Sarpeshkar and D.J. Bishop, Transducers '99, Sendai, Japan, Jun. 7-10, 1999, pp. 1068-1069. |
Amplitude-Modulated Electro-Mechanical Feedback System for Silicon Condenser Microphones, A.G.H. van der Donk, P.R. Scheeper, W. Olthuis and P. Bergveld, J. Micromech. Microeng., 2 1992, pp. 211-214. |
An Integrated Graphics to Pattern Generator System, G.W. Neudeck and P.V. Loeppert, IEEE, 1981, pp. 32-36. |
An Integrated Silicon Capacitive Microphone with Frequency-Modulated Digital Output, Michael Pedersen, Wouter Olthuis and Piet Bergveld, Sensors and Actuators A, 69, 1998, pp. 267-275. |
Anti-Stiction Coatings For Surface Micromachines, Roya Maboudian, SPIE Conference on Micromachining and Microfabrication Process Technology IV, Santa Clara, California, Sep. 1998, pp. 108-113. |
Anti-Stiction Methods for Micromechanical Devices: A Statistical Comparison of Performance, Svetlana Tatic-Lucic, Paul Jaramillo, James Bustillo, Shawn Cunningham and Judd Carper, Transducers '99, Sendai, Japan, 1999, pp. 522-525. |
Anti-Stiction Silanization Coating to Silicon Micro-Structures by a Vapor Phase Deposition Process, Jiro Sakata, Toshiyuki Tsuchiya, Atsuko Inoue, Sanae Tokumitsu and Hirofumi Funabashi, Technical Digest-Transducers '99, Sendai, Japan, Jun. 7-10, 1999. |
Applications of Fluorocarbon Polymers in Micromechanics and Micromachining, H.V. Jansen, J.G.E. Gardeniers, J. Elders, H.A.C. Tilmans and M. Elwenspoek, Sensors and Actuators A, 41-42, 1994, pp. 136-140. |
Characterization of Ultrathin Poly(ethylene glycol) Monolayers on Silicon Substrates, Alexander Papra, Nikolaj Gadegaard and Niels B. Larsen, Langmuir: The ACS Journal of Surfaces and Colloids, vol. 17, No. 5, 2001, pp. 1457-1460. |
Chemical Vapor Deposition Coating for Micromachines, S.S. Mani, J.G. Fleming, J.J. Sniegowski, M.P. de Boer, L.W. Irwin, J.A. Walraven, D.M. Tanner and M.T. Dugger, Material Research Society Symp. Proc., vol. 616, 2000, pp. 21-26. |
Complaint, Sonion MEMS A/S v. Knowles Electronics LLC, Civil Action No. 05-566-GMS, U.S. District Court for the District of Delaware, dated Aug. 4, 2005. |
Critical Review: Adhesion in Surface Micromechnical Structures, Roya Maboudian and Roger T. Howe, J. Vac. Sci. Technol. B, vol. 15(1), Jan./Feb. 1997, pp. 1-20. |
Crosstalk Study of an Integrated Ultrasound Transducer Array With a Micromachined Diaphragm Structure, Jian-Hua Mo, J. Brian Fowlkes, Andrew L. Robinson and Paul L. Carson, Transducers '91, 1991 International Conference on Solid-State Sensors and Actuators, 1991, pp. 258-265. |
Deposition and Characterization of ITO Films Produced by Laser Ablation at 355 nm, E. Holmelund, B. Thestrup, N.B. Larsen, M.M. Nielsen, E. Johnson and S. Tougaard, Applied Physics A, 74, 2002, pp. 147-152, paper received on Jan. 16, 2001 and published online on Oct. 17, 2001. |
Design of a Silicon Microphone with Differential Read-Out of a Sealed Double Parallel-Plate Capacitor, Jesper Bay, Ole Hansen, and Siebe Bouwstra, 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, Jun. 25-29, 1995, pp. 700-703. |
Development and Fabrication of Capacitive Sensors in Polyimide, Michael Pedersen, Wouter Olthuis and Piet Bergveld, Sensors and Materials, vol. 10, No. 1, 1998, pp. 1-20. |
Development of a Modal Analysis Accelerometer Based on a Tunneling Displacement Transducer, Patrick R. Scheeper, J. Kurth Reynolds and Thomas W. Kenny, IEEE, Transducers '97, International Conference on Solid-State Sensors and Actuators, Chicago, Jun. 16-19, 1997, pp. 867-870. |
Dichlorodimethylsilane as an Anti-Stiction Monolayer for MEMS: A Comparison to the Octadecyltrichlosilane Self-Assembled Monolayer, W. Robert Ashurst, Christina Yau, Carlo Carraro, Roya Maboudian and Michael T. Dugger, Journal of Microelectromechanical Systems, vol. 10, No. 1, Mar. 2001, pp. 41-49. |
Directed Self-Assembly of Amphiphilic Regioregular Polythiophenes on the Nanometer Scale, D.R. Greve, Niels Reitzel, Tue Hassenkam, Jesper Bøgelund, Kristian Kjaer, Paul B. Howes, Niels B. Larsen, Manikandan Jayaraman, Manikandan Jayaraman, R.D. McCullough and T. Bjørnholm, Synthetic Metals, 102, 1999, pp. 1502-1505. |
Electroacoustical Measurements of Silicon Microphones on Wafer Scale, Michael Pedersen, Ralf Schellin, Wouter Olthuis and Piet Bergveld, J. Acoust. Soc. Am., vol. 101, No. 4, Apr. 1997, pp. 2122-2128. |
Elimination of Post-Release Adhesion in Microstructures Using Conformal Fluorocarbon Coatings, Piu Francis Man, Bishnu P. Gogoi and Carlos H. Mastrangelo, Journal of Microelectromechanical Systems, vol. 6, No. 1, Mar. 1997, pp. 25-34. |
Fabrication and Characterization of a Piezoelectric Accelerometer, Roger de Rues, Jens Ole Gullov and Patrick R. Scheeper, J. Micromech. Microeng., vol. 9, 1999, pp. 123-126. |
Fabrication of a Subminiature Silicone Condenser Microphone Using The Sacrificial Layer Technique, P. R. Scheeper, W. Olthuis and P. Bergveld, IEEE, 1991, pp. 408-411. |
Fabrication of Silicon Condenser Microphones Using Single Wafer Technology, P.R. Scheeper, A.G.H. van der Donk, W. Olthuis and P. Bergveld, Journal of Microelectromechanical Systems, vol. 1, No. 3, Sep. 1992, pp. 147-154. |
Fluorocarbon Film for Protection from Alkaline Etchant and Elimination of In-Use Stiction, Yoshinori Matsumoto, Kazumasa Yoshida and Makoto Ishida, Transducers '97, International Conference on Solid-State Sensors and Actuators, Chicago, Jun. 16-19, 1997, pp. 695-698. |
Future of MEMS: An Industry Point of View, Benedetto Vigna, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSim E 2006, IEEE, 2006 (first page only). |
Harmonic Distortion in Silicon Condenser Microphones, Michael Pedersen, Wouter Olthuis and Piet Bergveld, J. Acoust. Soc. Am., vol. 102, No. 3, Sep. 1997, pp. 1582-1587. |
High Sensitivity Acoustic Transducers With Thin p + Membranes and Gold Back-Plate, A.E. Kabir, R. Bashir, J. Bernstein, J. De Santis, R. Mathews, J.O. O'Boyle and C. Bracken, Sensors and Actuators, vol. 78, 1999, pp. 138-142. |
High-Performance Condenser Microphone with Fully Integrated CMOS Amplifier and DC-DC Voltage Converter, Michael Pedersen, Wouter Olthuis and Piet Bergveld, Journal of Microelectromechanical Systems, vol. 7, No. 4, Dec. 1998, pp. 387-394. |
Improved Autoadhesion Measurement Method for Micromachined Polysilicon Beams, Maarten P. de Boer and Terry A. Michalske, Materials Research Society Symp. Proc., vol. 444, 1997, pp. 87-92. |
Improved IC-Compatible Piezoelectric Microphone and CMOS Process, E.S. Kim, J.R. Kim and R.S. Muller, IEEE, 1991, pp. 270-273. |
Improvement of the Performance of Microphones with a Silicon Nitride Diaphragm and Backplate, P.R. Scheeper, W. Olthuis and P. Bergveld, Sensors and Actuators A, 40, 1994, pp. 179-186. |
Investigation of Attractive Forces Between PECVD Silicon Nitride Microstructures and an Oxidized Silicon Substrate, P. R. Scheeper, J.A. Voorthuyzen, W. Olthuis and P. Bergveld, Sensors and Actuators A, 30, 1992, pp. 231-239. |
Langmuir-Blodgett Films of a Functionalized Molecule with Cross-Sectional Mismatch Between Head and Tail, J. Garnaes, N.B. Larsen, T. Bjørnholm, M. Jørgensen, K. Kjaer, J. Als-Nielsen, J. Jørgensen and J.A. Zasadzinski, Science, vol. 264, May 27, 1994, pp. 1301-1304. |
Lubricating Effect of Thin Films of Styrene-Dimethylsiloxane Block Copolymers, Sokol Ndoni, Patric Jannasch, Niels Bent Larsen and Kristoffer Almdal, Langmuir: The ACS Journal of Surfaces and Colloids, vol. 15, No. 11, 1999, pp. 3859-3865. |
Lubrication of Digital Micromirror Devices(TM), Steven A. Henck, Tribology Letters, vol. 3, 1997, pp. 239-247. |
Lubrication of Polysilicon Micromechanisms with Self-Assembled Monolayers, Uthara Srinivasan, Jonathan D. Foster, Usman Habib, Roger T. Howe, Roya Maboudian, Donna Cowell Senft and Michael T. Dugger, Solid-State Sensor and Actuator Workshop, Milton Head Island, South Carolina, Jun. 8-11, 1998, pp. 156-161. |
Measuring and Modeling Electrostatic Adhesion in Micromachines, M.P. de Boer, M.R. Tabbara, M.T. Dugger, P.J. Clews and T.A. Michalskim, Transducers '97, International Conference on Solid State Sensors and Actuators, Chicago, Jun. 16-19, 1997, vol. 1, pp. 229-232. |
Mechanistic Aspects of Alkylchlororsilane Coupling Reactions, R.R. Rye, G.C. Nelson and M.T. Dugger, Langmuir, vol. 13, 1997, pp. 2965-2972. |
Microfluidic Networks Made of Poly(dimethylsiloxane), Si, and Au Coated with Polyethylene Glycol for Patterning Proteins onto Surfaces, Alexander Papra, Andre Bernard, David Juncker, Niels B. Larsen, Bruno Michel and Emmanuel Delmarche, Langmuir: The ACS Journal of Surfaces and Colloids, vol. 17, 2001, pp. 4090-4095. |
Micromachined Microphones Have Amplified Opportunities, Sensor Business Digest, vol. 6, No. 7, Apr. 1, 1997. |
Micromachined Transducers Sourcebook, Gregory T.A. Kovacs, WCB McGaw-Hill, 1998, 911 p. |
Modelling of Silicon Condenser Microphones, A.G.H. van der Donk, P.R. Scheeper, W. Olthuis and P. Bergveld, Sensors and Actuators A, 40, 1994, pp. 203-216. |
Morphology Evolution of Polycarbonate-Polystrene Blends During Compounding, Chengzhi Chuai, Kristoffer Almdal, Ib Johannsen and Jørgen Lyngaae-Jørgensen, The Danish Polymer Center at The Technical University of Denmark, Roskilde, Denmark, 2001. |
New Applications and Services in Smart Buildings Using Multifunctional Transponders, Gerd von Bögel and Klaus Scherer, MST News, Feb. 2001, pp. 34-35. |
Ning et al., "Fabrication of a silicon miceomachined capacitive microphone using a dry-etch process" Sensors and Actuators A 53 (1996) 237-242. |
On the Electromechanical Behaviour of Thin Perforated Backplates in Silicon Condenser Microphones, M. Pedersen, W. Olthuis and P. Bergveld, 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, 234-A7, Jun. 25-29, 1995, pp. 13-16. |
On the Mechanical Behaviour of Thin Perforated Plates and Their Application in Silicon Condenser Microphones, M. Pedersen, W. Olthuis and P. Bergveld, Sensors and Actuators A, 54, 1996, pp. 499-504. |
Optimization of Capative Microphone and Pressure Sensor Perfomance by Capacitor-Electrode Shaping, J.A. Voorthuyzen, A.J. Spenkels, A.G.H. van deer Donk, P.R. Scheeper and P. Bergveld, Sensors and Actuators A, 25-27, 1991, pp. 331-336. |
Ordering of the Disk-Like 2,3,6,7,10,11-Hexakis(hexylthio)triphenylene in Solution and at a Liquid-Solid Interface, J.C. Gabriel, N.B. Larsen, M. Larsen, N. Harrit, J.S. Pedersen, K. Schaumburg and K. Bechgaard, Langmuir: The ACS Journal of Surfaces and Colloids, vol. 12, 1996, pp. 1690-1692. |
PCT International Preliminary Examination Report, European Patent Office, completed Jun. 13, 2003, for International application No. PCT/DK02/00365 which claims priority to U.S. Appl. No. 09/867,606 (now U.S. Patent No. 6,859,542). |
PECVD Silicon Nitride Diaphragms for Condenser Microphones, P.R. Scheeper, J.A. Voorthuyzen and P. Bergveld, Sensors and Actuators B, 4, 1991, pp. 79-84. |
Phase Transitions in Diglyceride Monolayers Studied by Computer Simulations, Pressure-Area Isotherms and X-Ray Diffraction, G.H. Peters, S. Toxvaerd, N.B. Larsen, T. Bjørnholm, K. Schaumburg and K. Kjaer, Il Nuovo Cimento, vol. 16D, No. 9, 1994, pp. 1479-1485. |
Polymer Durability, Afshin Ghanbari-Siahkali, Peter Kingshott, Niels Bent Larsen, Lutfi Fakhri Al-Saidi, Kristoffer Almdal, and Ib Johannsen, MONOPOL Centerkontrakten at Danish Polymercenter, May 22, 2001. |
Pulsed Laser Deposited Coating for Stiction and Wear Reduction in MEMS Device, J.S. Pelt, M.E. Ramsey, R. Magaña Jr., E. Poindexter Jr., M.P. de Boer, D.A. LaVan, M.T. Dugger, J.H. Smith and S.M. Durbin, Part of the SPIE Conference on Micromachining and Microfabrication Process Technology V, Santa Clara, California, SPIE vol. 3874, Sep. 1999, pp. 76-84. |
Redacted version of Stipulated Order Of Dismissal With Prejudice, Sonion MEMS A/S v. Knowles Electronics LLC, Civil Action No. 05-566-GMS, U.S. District Court for the District of Delaware; non-redacted version filed under seal on Mar. 14, 2006 and signed by Judge Sleet on Mar. 31, 2006; redacted version entered into court docket on Apr. 7, 2006. |
Selective W for Coating and Releasing MEMS Devices, S.S. Mani, J.G. Fleming, J.J. Sniegowski, M.P. de Boer, L.W. Irwin, J.A. Walraven, D.M. Tanner, D.A. LaVan, Material Research Society Symp. Proc., vol. 605, 2000, pp. 135-140. |
Self-Assembled Fluorocarbon Films for Enhanced Stiction Reduction, Uthara Srinivasan, Michael R. Houston, Roger T. Howe and Roya Maboudian, Transducers '97, International Conference on Solid-State Sensors and Actuators, Chicago, June 16-19, 1997, pp. 1399-1402. |
Self-Assembled Monolayer Films as Durable Anti-Stiction Coatings for Polysilicon Microstructures, Michael R. Houston, Roya Maboudian and Roger T. Howe, Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, Jun. 2-6, 1996, pp. 42-47. |
Self-Assembled Monolayers As Anti-Stiction Coatings For MEMS: Characteristics and Recent Developments, Roya Maboudian, W. Robert Ashurst and Carlo Carraro, Sensors and Actuators, vol. 82, 2000, pp. 219-223. |
Self-Assembly of Regioregular, Amphiphilic Polythiophenes into Highly Ordered pi-Stacked Conjugated Polymer Thin Films and Nanocircuits, Thomas Bjørnholm, Daniel R. Greve, Niels Reitzel, Tue Hassenkam, Kristian Kjaer, Paul B. Howes, Niels B. Larsen, Jesper Bøgelund, Manikandan Jayaraman, Paul C. Ewbank and Richard D. McCullough, J. Am. Chem. Soc., vol. 120, No. 30, 1998, pp. 7643-7644. |
Silanization of Solid Substrates: A Step Toward Reproducibility, J.B. Brzoska, I. Ben Azouz and F. Rondelez, Langmuir, vol. 10, 1994, pp. 4367-4373. |
Silicon Microphone for Hearing Aid Applications, Jesper Bay, Ph.D Thesis, ATV Industrial Research Education Project, Erhvervsforskerprojekt EF 498, Jun. 1997, 136 p. |
Silicon Microphones-A Danish Perspective, Siebe Bouwstra, Torben Storgaard-Larsen, Patrick Scheeper, Jens Ole Gullov, Jesper Bay, Matthias Müllenborn and Pirmin Rombach, J. Micromech. Microeng., 8, 1998, pp. 64-68. |
Stiction in Surface Micromachining, Niels Tas, Tonny Sonnenberg, Henri Jansen, Rob Legtenberg and Miko Elwenspoek, J. Micromech. Microeng., 6, 1996, pp. 385-397. |
Structural Studies of Langmuir and Langmuir-Blodgett Films of Functionalized Surfactants, N.B. Larsen, T. Bjørnholm, J. Garnaes, J. Als-Nielsen and K. Kjaer, Synthetic Metals, vol. 71, 1995, pp. 1985-1988. |
Structure and Dynamics of Lipid Monolayers: Implications for Enzyme Catalysed Lipolysis, Günther H. Peters, S. Toxvaerd, N.B. Larsen, T. Bjørnholm, K. Schaumburg and K. Kjaer, Structural Biology, vol. 2, No. 5, May 1995, pp. 395-401. |
Suppression of Stiction in MEMS, C.H. Mastrangelo, 1999 Spring MRS Meeting, Boston, MA, Dec. 1999, pp. 1-12. |
Surface Micromachined Driven Shielded Condenser Microphone With a Sacrificial Layer Etched From the Backside, M. Ikeda, N. Shimizu and M. Esashi, Transducers '99, Sendai, Japan, Jun. 7-10, 1999, pp. 1070-1073. |
Surface Modification of Polystyrene by Blending Substituted Styrene Copolymers, Xianyi Chen, Katja Jankova, Joergen Kops, Niels B. Larsen, Walther Batsberg and Ib Johannsen, Journal of Polymer Science: Part B, vol. 39, 2001, pp. 1046-1054. |
Surface Morphology of PS-PDMS Diblock Copolymer Films, T.H. Andersen, S. Tougaard, N.B. Larsen, K. Almdal and I. Johannsen, Journal of Electron Spectroscopy and Related Phenomena, vol. 121, 2001, pp. 93-110. |
Surface Texturing and Chemical Treatment Methods for Reducing High Adhesion Forces at Micromachine Interfaces, K. Komvopoulos, Part of the SPIE Conference on Materials and Device Characterization in Micromachining, Santa Clara, California, SPIE vol. 3512, Sep. 1998, pp. 106-122. |
The Design, Fabrication, and Testing of Corrugated Silicon Nitride Diaphragms, Patrick R. Scheeper, Wouter Olthuis and Piet Bergveld, Journal of Microelectromechanical Systems, vol. 3, No. 1, Mar. 1994, pp. 36-42. |
The Effect of Release-Etch Processing on Surface Microstructure Stiction, R.L. Alley G.J.Cuan, R.T. Howe and K. Komvopoulos, IEEE, 1992, pp. 202-207. |
The Incredible Shrinking Microphone, Jennifer Ouellette, The Industrial Physicist, Aug. 1999, pp. 7-9. |
The Influence of Coating Structure on Micromachine Stiction, J.G. Kushmerick, M.G. Hankins, M.P. de Boer, P.J. Clews, R.W. Carpick and B.C. Bunker, Tribology Letters, vol. 10, No. 1-2, 2001, pp. 103-108. |
The Lamellar Period in Symmetric Diblock Copolymer Thin Films Studied by Neutron Reflectivity and AFM, Nikolaj Gadegaard Kristoffer Almdal, Niels Bent Larsen and Kell Mortensen, Applied Surface Science, vol. 142, 1999, pp. 608-613. |
Thoughts on the Structure of Alkylsilane Monolayers, Mark J. Stevens, Langmuir, vol. 15, 1999, pp. 2773-2778. |
Transport Mechanisms of Alkanethiols During Microcontact Printing on Gold, E. Delamarche, H. Schmid, A. Bietsch, N.B. Larsen, H. Rothuizen, B. Michel and H. Biebuyck, J. Phys. Chem. B, vol. 102, No. 18, 1998, pp. 3324-3334. |
Vapor Phase Self-Assembly of Fluorinated Monolayers on Silicon and Germanium Oxide, Patrick W. Hoffmann, Martin Stelzle and John F. Rabolt, Langmuir, vol. 13, 1997, pp. 1877-1880. |
Wettability Modification of Polysilicon for Stiction Reduction in Silicon Based Micro-Electromechanical Structures, Angeles Marcia Almanza-Workman, Srini Raghaven, Pierre Deymier, David J. Monk and Ray Roop, Solid State Phenomena, vol. 76-77, 2001, pp. 23-26. |
X-ray Diffraction and Molecular-Dynamics Studies: Structural Analysis of Phases in Diglyceride Monolayers, G.H. Peters, N.B. Larsen, T. Bjørnholm, S. Toxvaerd, K. Schaumburg and K. Kjaer, American Physical Society, Physical Review E, vol. 57, No. 3, Mar. 1998, pp. 3153-3163. |
Cited By (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9139421B1 (en) | 2000-11-28 | 2015-09-22 | Knowles Electronics, Llc | Top port surface mount MEMS microphone |
US9133020B1 (en) | 2000-11-28 | 2015-09-15 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount MEMS microphones |
US10321226B2 (en) | 2000-11-28 | 2019-06-11 | Knowles Electronics, Llc | Top port multi-part surface mount MEMS microphone |
US8704360B1 (en) | 2000-11-28 | 2014-04-22 | Knowles Electronics, Llc | Top port surface mount silicon condenser microphone package |
US9980038B2 (en) | 2000-11-28 | 2018-05-22 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone |
US8765530B1 (en) | 2000-11-28 | 2014-07-01 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount silicon condenser microphone packages |
US9338560B1 (en) | 2000-11-28 | 2016-05-10 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone |
US9156684B1 (en) | 2000-11-28 | 2015-10-13 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount MEMS microphones |
US9150409B1 (en) | 2000-11-28 | 2015-10-06 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount MEMS microphones |
US9148731B1 (en) | 2000-11-28 | 2015-09-29 | Knowles Electronics, Llc | Top port surface mount MEMS microphone |
US9139422B1 (en) | 2000-11-28 | 2015-09-22 | Knowles Electronics, Llc | Bottom port surface mount MEMS microphone |
US8617934B1 (en) | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
US9096423B1 (en) | 2000-11-28 | 2015-08-04 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount MEMS microphones |
US8624387B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone package |
US8623710B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
US8623709B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount silicon condenser microphone packages |
US8624384B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Bottom port surface mount silicon condenser microphone package |
US8624386B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Bottom port multi-part surface mount silicon condenser microphone package |
US8624385B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Top port surface mount silicon condenser microphone package |
US8629005B1 (en) | 2000-11-28 | 2014-01-14 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount silicon condenser microphone packages |
US8629552B1 (en) | 2000-11-28 | 2014-01-14 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone package |
US8629551B1 (en) | 2000-11-28 | 2014-01-14 | Knowles Electronics, Llc | Bottom port surface mount silicon condenser microphone package |
US9067780B1 (en) | 2000-11-28 | 2015-06-30 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount MEMS microphones |
US8633064B1 (en) | 2000-11-28 | 2014-01-21 | Knowles Electronics, Llc | Methods of manufacture of top port multipart surface mount silicon condenser microphone package |
US8652883B1 (en) | 2000-11-28 | 2014-02-18 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount silicon condenser microphone packages |
US9061893B1 (en) | 2000-11-28 | 2015-06-23 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphones |
US9040360B1 (en) | 2000-11-28 | 2015-05-26 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount MEMS microphones |
US9023689B1 (en) | 2000-11-28 | 2015-05-05 | Knowles Electronics, Llc | Top port multi-part surface mount MEMS microphone |
US9051171B1 (en) | 2000-11-28 | 2015-06-09 | Knowles Electronics, Llc | Bottom port surface mount MEMS microphone |
US9024432B1 (en) | 2000-11-28 | 2015-05-05 | Knowles Electronics, Llc | Bottom port multi-part surface mount MEMS microphone |
US9006880B1 (en) | 2000-11-28 | 2015-04-14 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone |
US8596121B2 (en) * | 2007-01-19 | 2013-12-03 | Canon Kabushiki Kaisha | Structural member having a plurality of conductive regions |
US20100107758A1 (en) * | 2007-01-19 | 2010-05-06 | Canon Kabushiki Kaisha | Structural member having a plurality of conductive regions |
US8542850B2 (en) | 2007-09-12 | 2013-09-24 | Epcos Pte Ltd | Miniature microphone assembly with hydrophobic surface coating |
US20090067659A1 (en) * | 2007-09-12 | 2009-03-12 | Christian Wang | Miniature microphone assembly with hydrophobic surface coating |
US7812505B2 (en) * | 2007-12-07 | 2010-10-12 | Electronics And Telecommunications Research Institute | Piezoelectric microspeaker using microelectromechanical systems and method of manufacturing the same |
US20110006381A1 (en) * | 2007-12-07 | 2011-01-13 | Epcos Ag | Mems package and method for the production thereof |
US8674498B2 (en) | 2007-12-07 | 2014-03-18 | Epcos Ag | MEMS package and method for the production thereof |
US20090146527A1 (en) * | 2007-12-07 | 2009-06-11 | Electronics And Telecommunications Research Institute | Piezoelectric microspeaker using microelectromechanical systems and method of manufacturing the same |
US8855337B2 (en) * | 2009-03-09 | 2014-10-07 | Nxp, B.V. | Microphone and accelerometer |
US20120033832A1 (en) * | 2009-03-09 | 2012-02-09 | Nxp B.V. | Microphone and accelerometer |
US20110158439A1 (en) * | 2009-12-31 | 2011-06-30 | Texas Instruments Incorporated | Silicon Microphone Transducer |
US8617960B2 (en) * | 2009-12-31 | 2013-12-31 | Texas Instruments Incorporated | Silicon microphone transducer |
US9056760B2 (en) | 2010-01-29 | 2015-06-16 | Epcos Ag | Miniaturized electrical component comprising an MEMS and an ASIC and production method |
US9876446B2 (en) | 2011-06-01 | 2018-01-23 | Infineon Technologies Ag | Plate, transducer and methods for making and operating a transducer |
US20120308053A1 (en) * | 2011-06-01 | 2012-12-06 | Infineon Technologies Ag | Plate, Transducer and Methods for Making and Operating a Transducer |
US10263542B2 (en) | 2011-06-01 | 2019-04-16 | Infineon Technologies Ag | Plate, transducer and methods for making and operating a transducer |
US9362853B2 (en) | 2011-06-01 | 2016-06-07 | Infineon Technologies Ag | Plate, transducer and methods for making and operating a transducer |
US8503699B2 (en) * | 2011-06-01 | 2013-08-06 | Infineon Technologies Ag | Plate, transducer and methods for making and operating a transducer |
US9374643B2 (en) | 2011-11-04 | 2016-06-21 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
US20140015070A1 (en) * | 2012-07-11 | 2014-01-16 | Robert Bosch Gmbh | Component having a micromechanical microphone pattern |
US8816454B2 (en) * | 2012-07-11 | 2014-08-26 | Robert Bosch Gmbh | Component having a micromechanical microphone pattern |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US9487386B2 (en) | 2013-01-16 | 2016-11-08 | Infineon Technologies Ag | Comb MEMS device and method of making a comb MEMS device |
US10259701B2 (en) | 2013-01-16 | 2019-04-16 | Infineon Technologies Ag | Comb MEMS device and method of making a comb MEMS device |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
Also Published As
Publication number | Publication date |
---|---|
EP1397936B1 (en) | 2004-12-01 |
ATE284120T1 (en) | 2004-12-15 |
DE60202145T2 (en) | 2005-12-01 |
CN1849016A (en) | 2006-10-18 |
CN1849016B (en) | 2012-08-08 |
WO2002098166A1 (en) | 2002-12-05 |
US20020181725A1 (en) | 2002-12-05 |
CN1269383C (en) | 2006-08-09 |
CN1511429A (en) | 2004-07-07 |
JP3974574B2 (en) | 2007-09-12 |
US6859542B2 (en) | 2005-02-22 |
EP1397936A1 (en) | 2004-03-17 |
JP2005508579A (en) | 2005-03-31 |
DE60202145D1 (en) | 2005-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE40781E1 (en) | Method of providing a hydrophobic layer and condenser microphone having such a layer | |
Ashurst et al. | Vapor phase anti-stiction coatings for MEMS | |
US6815361B1 (en) | Method of fabricating anti-stiction micromachined structures | |
Ashurst et al. | Wafer level anti-stiction coatings for MEMS | |
Maboudian et al. | Self-assembled monolayers as anti-stiction coatings for MEMS: characteristics and recent developments | |
US9257256B2 (en) | Templates including self-assembled block copolymer films | |
US6698295B1 (en) | Microstructures comprising silicon nitride layer and thin conductive polysilicon layer | |
US6666979B2 (en) | Dry etch release of MEMS structures | |
Zhuang et al. | Thermal stability of vapor phase deposited self-assembled monolayers for MEMS anti-stiction | |
Zhao et al. | Synthetic Butterfly Scale Surfaces with Compliance‐Tailored Anisotropic Drop Adhesion | |
US20030166342A1 (en) | Integrated method for release and passivation of MEMS structures | |
KR101174504B1 (en) | Hydrophobic coating for oxide surfaces | |
Herrmann et al. | Conformal hydrophobic coatings prepared using atomic layer deposition seed layers and non-chlorinated hydrophobic precursors | |
Doms et al. | Hydrophobic coatings for MEMS applications | |
US7138672B2 (en) | Apparatus and method for making a tensile diaphragm with an insert | |
US7201937B2 (en) | Methods for forming composite coatings on MEMS devices | |
Kobrin et al. | Durable Anti-Stiction Coatings by Molecular Vapor Deposition (MVD) | |
Burgmann et al. | Approaching the Limits of Aspect Ratio in Free‐Standing Al2O3 3D Shell Structures | |
US9045328B2 (en) | Method for wafer-level surface micromachining to reduce stiction | |
Zhu et al. | Optimizing geometrical design of superhydrophobic surfaces for prevention of microelectromechanical system (MEMS) stiction | |
Rissanen et al. | Vapor-phase self-assembled monolayers for improved MEMS reliability | |
Herrmann et al. | Hydrophobic coatings using atomic layer deposition and non-chlorinated precursors | |
US20240067520A1 (en) | Encapsulated mems device and method for manufacturing the mems device | |
Jun et al. | Novel chemistry for surface engineering in MEMS | |
Kim et al. | " SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SONION MEMS A/S, DENMARK Free format text: CHANGE OF NAME;ASSIGNOR:SONIONMEMS A/S;REEL/FRAME:018392/0681 Effective date: 20010709 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: PULSE MEMS A/S, DENMARK Free format text: CHANGE OF NAME;ASSIGNOR:SONION MEMS A/S;REEL/FRAME:029967/0872 Effective date: 20080604 Owner name: PULSE MEMS APS, DENMARK Free format text: CHANGE OF NAME;ASSIGNOR:PULSE MEMS A/S;REEL/FRAME:029967/0899 Effective date: 20080908 Owner name: EPCOS PTE LTD, SINGAPORE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PULSE MEMS APS;REEL/FRAME:029966/0907 Effective date: 20120730 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: TDK CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:EPCOS PTE LTD;REEL/FRAME:041132/0144 Effective date: 20161101 |