USRE36746E - Plasma descaling of titanium and titanium alloys - Google Patents
Plasma descaling of titanium and titanium alloys Download PDFInfo
- Publication number
- USRE36746E USRE36746E US09/154,926 US15492698A USRE36746E US RE36746 E USRE36746 E US RE36746E US 15492698 A US15492698 A US 15492698A US RE36746 E USRE36746 E US RE36746E
- Authority
- US
- United States
- Prior art keywords
- titanium
- scale
- plasma
- aircraft component
- iaddend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000010936 titanium Substances 0.000 title claims abstract description 38
- 229910052719 titanium Inorganic materials 0.000 title claims abstract description 38
- 229910001069 Ti alloy Inorganic materials 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000007789 gas Substances 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 9
- -1 fluoride ions Chemical class 0.000 claims description 5
- WKFBZNUBXWCCHG-UHFFFAOYSA-N phosphorus trifluoride Chemical class FP(F)F WKFBZNUBXWCCHG-UHFFFAOYSA-N 0.000 claims description 3
- QTJXVIKNLHZIKL-UHFFFAOYSA-N sulfur difluoride Chemical class FSF QTJXVIKNLHZIKL-UHFFFAOYSA-N 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical class FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
- 210000002381 plasma Anatomy 0.000 description 23
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000002920 hazardous waste Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
Definitions
- the invention relates to the surface treatment of metals and metallic alloys to remove surface scales that arise naturally or from heat treatment processes. More particularly, the invention relates to a method of subjecting the surfaces of titanium and titanium alloy aircraft components to a reactive plasma to remove these surface scales.
- Titanium and its alloys are used in the fabrication of aircraft. These metals are used to form not only the outer skin of the aircraft, but also internal support structures because of their light weight and high strength.
- the titanium alloys are first heat treated. However, heat treatment results in the formation of a dense, tightly adherent oxide on outer surfaces of the metal. This oxide ranges in thickness from about 0.001 to about 0.010 inches and must be removed before subsequent machining, forming or joining operations. Scale covered parts cannot be joined by welding. Alpha case is difficult to machine, causing excessive tool wear and breakage. Also, alpha case scale can cause cracking of the titanium that may result in catastrophic failure.
- the oxide scale is removed through treatment of the metal in a series of chemical baths.
- Some of these chemical baths contain concentrated alkaline solutions while others contain highly toxic and corrosive acids, including nitric acid and hydrofluoric acid.
- the baths and ancillary equipment that come into contact with these corrosive chemicals must be fabricated from expensive exotic materials that are resistant to attack.
- the heat treated titanium alloy is immersed in each of the chemical baths for a period of time.
- the time of immersion is estimated to allow sufficient time for the scale to dissolve in the acids, without significant intergranular attack on the underlying titanium alloy substrate.
- Such estimates are, at best, inexact, sometimes resulting in overimmersion accompanied by some resultant intergranular attack, or underimmersion, and at other times resulting in the retention of a residual thin scale layer.
- some surfaces of the same aircraft component may be overexposed (and hence etched) on some portions of its surface, and underexposed (and hence retain a thin scale layer) at other portions of its surface.
- parts are sometimes designed with excessive material in areas that will be over-etched, or the areas are covered with masking composition during part of the cycle.
- the part may be inverted at least once during the etching cycle since upper portions of the part etch faster than lower submerged portions.
- Some of the hydrogen generated during acid-etching may also migrate into the alloy structure causing "hydrogen-embrittlement"--a serious problem that reduces fatigue strength significantly.
- treated parts may have to be baked to remove the hydrogen.
- the chemical bath treatment system generates a hazardous waste containing heavy metal ions that must be disposed of in an environmentally acceptable manner. Such disposal is becoming increasingly costly.
- the invention provides a method of removing the oxide scale produced by the heat treatment of crystalline titanium and titanium alloys.
- the method is particularly well suited for the removal of such scales from large titanium or titanium alloys substrates, such as aircraft components. Moreover, the method generates very little hazardous waste, in comparison with the chemical bath immersion technique.
- the method is cost-effective and removes scale at a rate of at least about 0.0001, and preferably at least about 0.0005 to about 0.002, inches per hour.
- the method includes heating the surface scale-covered titanium or titanium alloy substrate to a temperature that is sufficiently high to promote reaction of chemical components of the scale at commercially useful rates with a plasma generated from a gas that produces fluoride ions, such as CF 4 and SF 6 , and the like.
- a plasma generated from a gas that produces fluoride ions such as CF 4 and SF 6 , and the like.
- the substrate is heated to a temperature in the range from about 100° C. to about 600° C.
- the plasma reacts with the scale, removing the oxide scale and any alpha case. Importantly, this is achieved without intergranular attack on the underlying crystalline titanium or titanium alloy substrate.
- the plasma reaction self-terminates when the plasma has reacted with the scale and the plasma encounters the underlying metallic substrate. Consequently, the invention provides a method that is not only capable of removing the surface scale, but is also capable of doing so uniformly, on all surfaces of the substrate.
- the method of the invention may be carried out in certain commercially available plasma generation chambers, especially when suitably modified in accordance with the invention.
- the plasma chamber is supplied with either radiation, inductive, kinetic, or conductive heating means so that a titanium or titanium alloy substrate placed within the chamber may be heated to within the desired temperature range, as explained above. Thereafter, the heated component is subjected to plasma that reacts with and removes the surface scale.
- FIGURE is a schematic cross-sectional view showing a titanium alloy substrate with one side of its upper surface exposed for etching, and the other side of the upper surface covered with an adhered silicon mask.
- the invention addresses a significant problem in the surface treatment of heat-treated titanium, and titanium alloys, for removal of thick scales of oxide and alpha case formed during the heat-treatment process.
- the oxide scale, and alpha case, if any is readily removed without significant generation of hazardous waste byproducts.
- the method of the invention can be practiced using conventional equipment, with suitable modification.
- the plasma descaling step may be conducted in any suitable chamber for generation of a plasma from a gas able to produce fluoride ions.
- the chamber may optionally be modified, by installation of convective, inductive, or radiation heating means, to first preheat the substrate to be treated to a temperature in the range from about 100° C. to about 600° C., preferably about 150° to about 550° C., most preferably about 220° to about 520° C.
- the titanium or titanium alloy substrate may be preheated in an oven and then transferred to the plasma chamber.
- the surface of the heat-treated titanium or titanium alloy substrate to be descaled is first cleaned using conventional techniques to remove surface grime and dirt. Since the titanium, or titanium alloy, has been heat-treated, the metal is in crystalline form and the surface scale is tightly adherent to this underlying crystalline metal. Typically, an oxide scale ranges in thickness from about 0.001 to 0.010 inch. Moreover, in some instances a thin scale or layer of alpha case also forms at the surface of the heat-treated metal. This alpha case layer typically has a thickness in the range from 0.001 to about 0.007 inches. As explained above, in order to prepare the metallic part for subsequent machining, forming or joining operations, the surface scales, whether oxide, alpha case, or both, must be removed.
- the cleaned metallic substrate is first heated to a temperature in that temperature range where a plasma formed from a fluoride-ion producing gas, such as CF 4 or SF 6 gas, will react with and remove the scale without intergranular attack on the underlying crystalline metal substrate.
- a plasma formed from a fluoride-ion producing gas such as CF 4 or SF 6 gas
- the substrate is heated to a temperature in the range from about 100° C. to about 600° C., more preferably to a temperature in the range from about 150° C. to about 550° C., and most preferably about 200° C. to about 520° C.
- the substrate is optionally preheated outside the chamber and then placed in the chamber, or is heated inside the chamber by radiative, conductive, inductive, or kinetic methods.
- the chamber is then evacuated to a pressure of about 2 to about 10 Pascal, preferably less than 8 Pascal.
- the water-free gas from which the plasma is formed is introduced into the chamber at a flow rate sufficient to produce a useful concentration of fluoride ions.
- the flow rate is from about 20 to about 80 standard cubic centimeters per minute fluoride ion-producing gas, along with lesser amounts of water-free oxygen and/or argon at the flow rate of from about 1 to about 5 standard cubic centimeters per minute.
- the gas from which the plasma is formed may be selected from any of the gasses that produce a fluoride ion when subjected to a radio frequency discharge.
- the fluoride ion-producing gas is exemplified by fluorocarbons, sulfur fluorides, phosphorous fluorides, and the like.
- the power concentration is at least about 1.0 watt per centimeter for SF 6 , and at least about 0.5 watts per centimeter for CF 4 .
- the temperature of the substrate By controlling the temperature of the substrate, descaling may be achieved without intergranular attack of the underlying crystalline metal.
- the temperature of the substrate may be carefully raised to allow light etching of the substrate surface.
- the plasma reaction self-terminates when the plasma has reacted with all the scale, whether oxide or alpha case, and the plasma encounters the underlying crystalline metallic substrate. Since alpha case forms unevenly over the surface of the metallic substrate, the removal of the alpha case results in a surface that has a certain roughness, by microelectronic standards. However, the surface finish is excellent by aerospace standards.
- aerospace titanium pans to be welded typically have a surface finish of Ra ranging from about 30 to about 60.
- This surface finish range is achieved using the plasma descale process of the invention alone, without further treatment.
- the prior an chemical tank immersion processes, described above, typically produce rougher surfaces, surfaces having Ra's in the range about 40 to about 120.
- the surface produced by the descaring process of the invention is suitable for dye penetrant inspection. Importantly, since the titanium substrate is not exposed to hydrogen during the process of the invention, the risk of hydrogen embrittlement does not arise. Moreover, the need for subsequent baking cycles to remove entrapped hydrogen is eliminated.
- the descaling with CF 4 was carried out with a flow rate of 45 ccs per minute of CF 4 through the chamber, along with 2 ccs per minute of oxygen.
- the plasma descaling was carried out for in periods of 30 minutes, that included 6 cycles at 200 watts, 6 cycles at 300 watts, and thereafter a further cycle at 300 watts.
- the total descaling time was 6 hours and 30 minutes.
- the SF 6 descaling was carried out with a flow rate of 45 ccs per minute of SF 6 and 2 ccs per minute of oxygen for a total of 2 hours.
- the descaling included 3 15-minute cycles at 350 watts, 4 15-minute cycles at 400 watts, and a final 15-minute cycle at 400 watts.
Abstract
The invention provides a method of removing surface scale from a titanium or titanium alloy substrate. The method includes the steps of heating the substrate to a temperature in the range from about 100° C. to about 600° C., and thereafter subjecting the heated surface to a plasma formed from a gas selected from the group of consisting of CF4 and SF6. The plasma reacts with the surface scale, removing the scale, without attacking the underlying crystalline titanium or titanium alloy. Properly controlled, the plasma reaction terminates when the plasma has penetrated the scale, and encounters the underlying crystalline metal. As a result, the method of the invention is capable of uniform removal of the entire surface scale of a crystalline titanium-containing substrate, without intergranular attack of the substrate.
Description
The invention relates to the surface treatment of metals and metallic alloys to remove surface scales that arise naturally or from heat treatment processes. More particularly, the invention relates to a method of subjecting the surfaces of titanium and titanium alloy aircraft components to a reactive plasma to remove these surface scales.
Titanium and its alloys are used in the fabrication of aircraft. These metals are used to form not only the outer skin of the aircraft, but also internal support structures because of their light weight and high strength. In order to achieve desired physical properties, the titanium alloys are first heat treated. However, heat treatment results in the formation of a dense, tightly adherent oxide on outer surfaces of the metal. This oxide ranges in thickness from about 0.001 to about 0.010 inches and must be removed before subsequent machining, forming or joining operations. Scale covered parts cannot be joined by welding. Alpha case is difficult to machine, causing excessive tool wear and breakage. Also, alpha case scale can cause cracking of the titanium that may result in catastrophic failure.
Generally, in current methods, the oxide scale is removed through treatment of the metal in a series of chemical baths. Some of these chemical baths contain concentrated alkaline solutions while others contain highly toxic and corrosive acids, including nitric acid and hydrofluoric acid. As a consequence, the baths and ancillary equipment that come into contact with these corrosive chemicals must be fabricated from expensive exotic materials that are resistant to attack.
In order to remove the surface oxide scale, the heat treated titanium alloy is immersed in each of the chemical baths for a period of time. The time of immersion is estimated to allow sufficient time for the scale to dissolve in the acids, without significant intergranular attack on the underlying titanium alloy substrate. Such estimates are, at best, inexact, sometimes resulting in overimmersion accompanied by some resultant intergranular attack, or underimmersion, and at other times resulting in the retention of a residual thin scale layer. In some instances, some surfaces of the same aircraft component may be overexposed (and hence etched) on some portions of its surface, and underexposed (and hence retain a thin scale layer) at other portions of its surface. To minimize these effects, parts are sometimes designed with excessive material in areas that will be over-etched, or the areas are covered with masking composition during part of the cycle. Also, the part may be inverted at least once during the etching cycle since upper portions of the part etch faster than lower submerged portions. Some of the hydrogen generated during acid-etching may also migrate into the alloy structure causing "hydrogen-embrittlement"--a serious problem that reduces fatigue strength significantly. To minimize this problem, treated parts may have to be baked to remove the hydrogen. In addition to all of these problems, the chemical bath treatment system generates a hazardous waste containing heavy metal ions that must be disposed of in an environmentally acceptable manner. Such disposal is becoming increasingly costly.
There exists a need for a process of removing the dense oxide scale that forms on titanium and titanium alloy components used in the aircraft industry. The method should generate no, or very little, hazardous waste for disposal. Furthermore, it should be cost effective, allowing rapid cleaning of large components. The process should be controllable to avoid significant intergranular attack of the underlying metal, while at the same time completely removing the surface scale.
The invention provides a method of removing the oxide scale produced by the heat treatment of crystalline titanium and titanium alloys. The method is particularly well suited for the removal of such scales from large titanium or titanium alloys substrates, such as aircraft components. Moreover, the method generates very little hazardous waste, in comparison with the chemical bath immersion technique. The method is cost-effective and removes scale at a rate of at least about 0.0001, and preferably at least about 0.0005 to about 0.002, inches per hour.
The method includes heating the surface scale-covered titanium or titanium alloy substrate to a temperature that is sufficiently high to promote reaction of chemical components of the scale at commercially useful rates with a plasma generated from a gas that produces fluoride ions, such as CF4 and SF6, and the like. Usually, the substrate is heated to a temperature in the range from about 100° C. to about 600° C. The plasma reacts with the scale, removing the oxide scale and any alpha case. Importantly, this is achieved without intergranular attack on the underlying crystalline titanium or titanium alloy substrate. The plasma reaction self-terminates when the plasma has reacted with the scale and the plasma encounters the underlying metallic substrate. Consequently, the invention provides a method that is not only capable of removing the surface scale, but is also capable of doing so uniformly, on all surfaces of the substrate.
Advantageously, the method of the invention may be carried out in certain commercially available plasma generation chambers, especially when suitably modified in accordance with the invention. Preferably, but not necessarily, the plasma chamber is supplied with either radiation, inductive, kinetic, or conductive heating means so that a titanium or titanium alloy substrate placed within the chamber may be heated to within the desired temperature range, as explained above. Thereafter, the heated component is subjected to plasma that reacts with and removes the surface scale.
The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings: the FIGURE is a schematic cross-sectional view showing a titanium alloy substrate with one side of its upper surface exposed for etching, and the other side of the upper surface covered with an adhered silicon mask.
The invention addresses a significant problem in the surface treatment of heat-treated titanium, and titanium alloys, for removal of thick scales of oxide and alpha case formed during the heat-treatment process. According to the invention, the oxide scale, and alpha case, if any, is readily removed without significant generation of hazardous waste byproducts.
Advantageously, the method of the invention can be practiced using conventional equipment, with suitable modification. Thus, for example, the plasma descaling step may be conducted in any suitable chamber for generation of a plasma from a gas able to produce fluoride ions. The chamber may optionally be modified, by installation of convective, inductive, or radiation heating means, to first preheat the substrate to be treated to a temperature in the range from about 100° C. to about 600° C., preferably about 150° to about 550° C., most preferably about 220° to about 520° C. Otherwise, the titanium or titanium alloy substrate may be preheated in an oven and then transferred to the plasma chamber.
Optionally, in accordance with the invention, the surface of the heat-treated titanium or titanium alloy substrate to be descaled is first cleaned using conventional techniques to remove surface grime and dirt. Since the titanium, or titanium alloy, has been heat-treated, the metal is in crystalline form and the surface scale is tightly adherent to this underlying crystalline metal. Typically, an oxide scale ranges in thickness from about 0.001 to 0.010 inch. Moreover, in some instances a thin scale or layer of alpha case also forms at the surface of the heat-treated metal. This alpha case layer typically has a thickness in the range from 0.001 to about 0.007 inches. As explained above, in order to prepare the metallic part for subsequent machining, forming or joining operations, the surface scales, whether oxide, alpha case, or both, must be removed.
In accordance with the invention, the cleaned metallic substrate is first heated to a temperature in that temperature range where a plasma formed from a fluoride-ion producing gas, such as CF4 or SF6 gas, will react with and remove the scale without intergranular attack on the underlying crystalline metal substrate. Preferably, the substrate is heated to a temperature in the range from about 100° C. to about 600° C., more preferably to a temperature in the range from about 150° C. to about 550° C., and most preferably about 200° C. to about 520° C.
The substrate is optionally preheated outside the chamber and then placed in the chamber, or is heated inside the chamber by radiative, conductive, inductive, or kinetic methods. As is conventional, the chamber is then evacuated to a pressure of about 2 to about 10 Pascal, preferably less than 8 Pascal. Then, the water-free gas from which the plasma is formed, is introduced into the chamber at a flow rate sufficient to produce a useful concentration of fluoride ions. Thus, for instance, for a 6.3 liter volume chamber the flow rate is from about 20 to about 80 standard cubic centimeters per minute fluoride ion-producing gas, along with lesser amounts of water-free oxygen and/or argon at the flow rate of from about 1 to about 5 standard cubic centimeters per minute. The gas from which the plasma is formed may be selected from any of the gasses that produce a fluoride ion when subjected to a radio frequency discharge. Thus, for example, the fluoride ion-producing gas is exemplified by fluorocarbons, sulfur fluorides, phosphorous fluorides, and the like. Preferably, the power concentration is at least about 1.0 watt per centimeter for SF6, and at least about 0.5 watts per centimeter for CF4.
By controlling the temperature of the substrate, descaling may be achieved without intergranular attack of the underlying crystalline metal. Optionally, thereafter, the temperature of the substrate may be carefully raised to allow light etching of the substrate surface. Advantageously, however, in accordance with the invention, the plasma reaction self-terminates when the plasma has reacted with all the scale, whether oxide or alpha case, and the plasma encounters the underlying crystalline metallic substrate. Since alpha case forms unevenly over the surface of the metallic substrate, the removal of the alpha case results in a surface that has a certain roughness, by microelectronic standards. However, the surface finish is excellent by aerospace standards.
Importantly, aerospace titanium pans to be welded typically have a surface finish of Ra ranging from about 30 to about 60. This surface finish range is achieved using the plasma descale process of the invention alone, without further treatment. The prior an chemical tank immersion processes, described above, typically produce rougher surfaces, surfaces having Ra's in the range about 40 to about 120.
The surface produced by the descaring process of the invention is suitable for dye penetrant inspection. Importantly, since the titanium substrate is not exposed to hydrogen during the process of the invention, the risk of hydrogen embrittlement does not arise. Moreover, the need for subsequent baking cycles to remove entrapped hydrogen is eliminated.
The following example illustrates the method of the invention and is not limiting of the invention as described above and claimed herebelow.
Two samples of heat-treated titanium alloy were descaled, one in SF6 and the other in CF4 plasmas. Each sample measured 0.5×1.5 inches and was 0.125 inches thick. Since the 6.3 liter volume plasma chamber used for descaling was only able to accept 5-inch wide wafers, each sample 10 was adhered to an upper surface of a 5-inch silicon wafer 12 with photoresist material 14 in order to lead the sample into the chamber, as illustrated in the FIGURE. Moreover, in order to provide a comparison between the descaled and original surfaces, one side of the upper surface 10a of each sample was covered with a strip of silicon 16 adhered to the face of the sample with photoresist 14 to provide a mask, while the other side 10b was exposed to the plasma.
The descaling with CF4 was carried out with a flow rate of 45 ccs per minute of CF4 through the chamber, along with 2 ccs per minute of oxygen. The plasma descaling was carried out for in periods of 30 minutes, that included 6 cycles at 200 watts, 6 cycles at 300 watts, and thereafter a further cycle at 300 watts. The total descaling time was 6 hours and 30 minutes.
The SF6 descaling was carried out with a flow rate of 45 ccs per minute of SF6 and 2 ccs per minute of oxygen for a total of 2 hours. The descaling included 3 15-minute cycles at 350 watts, 4 15-minute cycles at 400 watts, and a final 15-minute cycle at 400 watts.
Each sample was descaled until its surface appeared visually clear, and free of surface scale. Scale removal was confirmed by cross section of the specimens and examination at 1,000 times magnification. No intergranular attack was visible.
While the preferred embodiments of the invention have been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.
Claims (17)
1. A method of removing a heat-treatment induced scale from surfaces of an underlying crystalline titanium or titanium alloy body of an aircraft component, the method comprising:
(a) heating at least the surfaces of the aircraft component having the heat-treatment induced scale to a temperature in the range from about 100° C. to about 600° C.;
(b) removing the scale from the surfaces by reacting the heated surfaces of the aircraft component with a plasma formed from a gas selected from the group consisting of CF4 and SF6 to remove the scale without intergranular attack of the underlying crystalline titanium or titanium alloy body beneath the scale; and
(c) auto-terminating the reacting when the plasma has reacted through the scale and encounters the underlying crystalline titanium or titanium alloy body.
2. The method of claim 1, wherein the scale comprises an oxide scale from about 0.001 to about 0.005 of an inch in thickness.
3. The method of claim 1, wherein heating of step (a) comprises heating to a temperature is in the range from about 220° C. to about 520° C.
4. The method of claim 1, wherein the titanium alloy is Ti-6A1-4V.
5. The method of claim 1, wherein the step of heating comprises heating by heating in an enclosed vacuum chamber.
6. The method of claim 5, wherein the reacting with plasma is in the enclosed chamber.
7. The method of claim 1, wherein the scale comprises alpha case.
8. The method of claim 1, wherein the reacting is at a rate sufficient to remove at least about 0.0005 to about 0.002 of an inch per hour.
9. A method of removing a heat-treatment induced scale from surfaces of a titanium or titanium alloy substrate, the method comprising:
(a) heating at least the surfaces of the substrate having the heat-treatment induced scale to a temperature in the range from about 220° C. to about 520° C.,
(b) subjecting the heated substrate to a reactive plasma, containing fluoride ions to remove the scale, without intergranular attack of the titanium or titanium alloy substrate; and
(c) terminating the subjecting step when the plasma has reacted through the scale and encounters underlying crystalline titanium or titanium alloy of the substrate.
10. The method of claim 9, wherein the subjecting comprises subjecting to a plasma of a gas selected from the group consisting of fluorocarbon compounds, sulfur fluorides and phosphorous fluorides.
11. The method of claim 9, wherein the subjecting to a plasma to remove scale comprises subjecting to a plasma at a concentration and under temperature conditions to cause removal of the scale at a rate of from about 0.0005 to about 0.002 inches per hour.
12. A method of removing a scale from surfaces of titanium or titanium alloy substrates, the method comprising:
(a) heating the substrate to a sufficient temperature to allow chemical components of the scale to react with a plasma generated from a gas selected from the group consisting of fluorocarbons, phosphorous fluorides and sulfur fluorides at a rate that removes at least about 0.0001 inch per hour from the scale; and
(b) reacting the scale with a plasma generated from the gas, the step of reacting carried out without intergranular attack of underlying substrate metal.
13. The method of claim 12, wherein the heating is to a temperature in the range from about 220° to about 520° C.
14. The method of claim 12, wherein the heating comprises heating to react at a rate of about 0.0005 to about 0.002 inches/hr.
15. The method of claim 12, wherein the heating is to a temperature in the range about 100° C. to about 600° C. .Iadd.
16. The method of claim 1, wherein removing step (b) comprises reacting the heated surfaces of the aircraft component with the plasma within an enclosed vacuum chamber at a pressure below atmospheric..Iaddend..Iadd.17. The method of claim 16, wherein the pressure is below 10 Pascal..Iaddend..Iadd.18. The method of claim 17, wherein the pressure is below 8 Pascal..Iaddend..Iadd.19. A heat treated titanium aircraft component produced in accordance with the method of claim 1, wherein the titanium aircraft component is free of scale and intergranular attack..Iaddend..Iadd.20. The titanium aircraft component of claim 19, wherein the titanium aircraft component is free of hydrogen inclusion so that hydrogen content of the titanium aircraft component is substantially the same as the content of the titanium aircraft component before the heat treatment that produced the scale..Iaddend..Iadd.21. The method of claim 9, wherein subjecting step (b) comprises subjecting the heated substrate to the reactive plasma within an enclosed vacuum chamber at a pressure below atmospheric..Iaddend..Iadd.22. The method of claim 21, wherein the pressure is below 10 Pascal..Iaddend..Iadd.23. The method of claim 22, wherein the pressure is below 8 Pascal..Iaddend..Iadd.24. A heat treated titanium part produced in accordance with the method of claim 1, wherein the part is free of scale and intergranular attack..Iaddend..Iadd.25. The substrate of claim 24, wherein the titanium aircraft component is free of hydrogen inclusion so that hydrogen content of the titanium aircraft component is substantially the same as the content of the titanium aircraft component before the heat treatment that produced the scale..Iaddend..Iadd.26. A heat treated titanium part that is free of
scale and intergranular attack..Iaddend..Iadd.27. The heat treated titanium part of claim 26, wherein the titanium aircraft component is free of hydrogen inclusion so that hydrogen content of the titanium aircraft component is substantially the same as the content of the titanium aircraft component before heat treatment..Iaddend.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/154,926 USRE36746E (en) | 1996-02-23 | 1998-09-16 | Plasma descaling of titanium and titanium alloys |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/606,419 US5681486A (en) | 1996-02-23 | 1996-02-23 | Plasma descaling of titanium and titanium alloys |
US09/154,926 USRE36746E (en) | 1996-02-23 | 1998-09-16 | Plasma descaling of titanium and titanium alloys |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/606,419 Reissue US5681486A (en) | 1996-02-23 | 1996-02-23 | Plasma descaling of titanium and titanium alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE36746E true USRE36746E (en) | 2000-06-27 |
Family
ID=24427889
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/606,419 Ceased US5681486A (en) | 1996-02-23 | 1996-02-23 | Plasma descaling of titanium and titanium alloys |
US09/154,926 Expired - Fee Related USRE36746E (en) | 1996-02-23 | 1998-09-16 | Plasma descaling of titanium and titanium alloys |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/606,419 Ceased US5681486A (en) | 1996-02-23 | 1996-02-23 | Plasma descaling of titanium and titanium alloys |
Country Status (5)
Country | Link |
---|---|
US (2) | US5681486A (en) |
EP (1) | EP0958406A1 (en) |
CN (1) | CN1212028A (en) |
AU (1) | AU1826997A (en) |
WO (1) | WO1997031136A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6010635A (en) * | 1997-11-21 | 2000-01-04 | The Boeing Company | Plasma descaling of metals |
US9499893B2 (en) * | 2012-03-23 | 2016-11-22 | Monogram Aerospace Fasteners, Inc. | Method of processing titanium |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3239440A (en) * | 1964-11-23 | 1966-03-08 | Titanium Metals Corp | Electrolytic pickling of titanium and titanium base alloy articles |
US3468774A (en) * | 1966-12-09 | 1969-09-23 | Rohr Corp | Electrolytic descaling of titanium and its alloys |
US3632490A (en) * | 1968-11-12 | 1972-01-04 | Titanium Metals Corp | Method of electrolytic descaling and pickling |
US4288283A (en) * | 1979-01-10 | 1981-09-08 | Hitachi, Ltd. | Method of forming a microscopic pattern |
US5108543A (en) * | 1984-11-07 | 1992-04-28 | Hitachi, Ltd. | Method of surface treatment |
US5176792A (en) * | 1991-10-28 | 1993-01-05 | At&T Bell Laboratories | Method for forming patterned tungsten layers |
US5221424A (en) * | 1991-11-21 | 1993-06-22 | Applied Materials, Inc. | Method for removal of photoresist over metal which also removes or inactivates corosion-forming materials remaining from previous metal etch |
US5354417A (en) * | 1993-10-13 | 1994-10-11 | Applied Materials, Inc. | Etching MoSi2 using SF6, HBr and O2 |
US5365515A (en) * | 1991-07-17 | 1994-11-15 | Tut Systems, Inc. | Network monitor and test apparatus |
US5399237A (en) * | 1994-01-27 | 1995-03-21 | Applied Materials, Inc. | Etching titanium nitride using carbon-fluoride and carbon-oxide gas |
US5419805A (en) * | 1992-03-18 | 1995-05-30 | Northern Telecom Limited | Selective etching of refractory metal nitrides |
US5467883A (en) * | 1992-12-14 | 1995-11-21 | At&T Corp. | Active neural network control of wafer attributes in a plasma etch process |
US5843289A (en) * | 1996-01-22 | 1998-12-01 | Etex Corporation | Surface modification of medical implants |
US5900104A (en) * | 1996-06-04 | 1999-05-04 | Boeing North American, Inc. | Plasma system for enhancing the surface of a material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB948554A (en) * | 1961-03-22 | 1964-02-05 | Joseph Edmund Harling And Dona | Method and apparatus for cleaning metal by plasma arcs |
US5071351A (en) * | 1986-07-02 | 1991-12-10 | Collagen Corporation | Dental implant system |
US4793896C1 (en) * | 1988-02-22 | 2001-10-23 | Texas Instruments Inc | Method for forming local interconnects using chlorine bearing agents |
US4877640A (en) * | 1988-04-13 | 1989-10-31 | Electro-Plasma, Inc. | Method of oxide removal from metallic powder |
US4896813A (en) * | 1989-04-03 | 1990-01-30 | Toyo Kohan Co., Ltd. | Method and apparatus for cold rolling clad sheet |
US5356515A (en) * | 1990-10-19 | 1994-10-18 | Tokyo Electron Limited | Dry etching method |
-
1996
- 1996-02-23 US US08/606,419 patent/US5681486A/en not_active Ceased
-
1997
- 1997-01-20 AU AU18269/97A patent/AU1826997A/en not_active Abandoned
- 1997-01-20 WO PCT/US1997/000463 patent/WO1997031136A1/en not_active Application Discontinuation
- 1997-01-20 CN CN97192426.0A patent/CN1212028A/en active Pending
- 1997-01-20 EP EP97903784A patent/EP0958406A1/en not_active Withdrawn
-
1998
- 1998-09-16 US US09/154,926 patent/USRE36746E/en not_active Expired - Fee Related
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3239440A (en) * | 1964-11-23 | 1966-03-08 | Titanium Metals Corp | Electrolytic pickling of titanium and titanium base alloy articles |
US3468774A (en) * | 1966-12-09 | 1969-09-23 | Rohr Corp | Electrolytic descaling of titanium and its alloys |
US3632490A (en) * | 1968-11-12 | 1972-01-04 | Titanium Metals Corp | Method of electrolytic descaling and pickling |
US4288283A (en) * | 1979-01-10 | 1981-09-08 | Hitachi, Ltd. | Method of forming a microscopic pattern |
US5108543A (en) * | 1984-11-07 | 1992-04-28 | Hitachi, Ltd. | Method of surface treatment |
US5365515A (en) * | 1991-07-17 | 1994-11-15 | Tut Systems, Inc. | Network monitor and test apparatus |
US5176792A (en) * | 1991-10-28 | 1993-01-05 | At&T Bell Laboratories | Method for forming patterned tungsten layers |
US5221424A (en) * | 1991-11-21 | 1993-06-22 | Applied Materials, Inc. | Method for removal of photoresist over metal which also removes or inactivates corosion-forming materials remaining from previous metal etch |
US5419805A (en) * | 1992-03-18 | 1995-05-30 | Northern Telecom Limited | Selective etching of refractory metal nitrides |
US5467883A (en) * | 1992-12-14 | 1995-11-21 | At&T Corp. | Active neural network control of wafer attributes in a plasma etch process |
US5354417A (en) * | 1993-10-13 | 1994-10-11 | Applied Materials, Inc. | Etching MoSi2 using SF6, HBr and O2 |
US5399237A (en) * | 1994-01-27 | 1995-03-21 | Applied Materials, Inc. | Etching titanium nitride using carbon-fluoride and carbon-oxide gas |
US5843289A (en) * | 1996-01-22 | 1998-12-01 | Etex Corporation | Surface modification of medical implants |
US5900104A (en) * | 1996-06-04 | 1999-05-04 | Boeing North American, Inc. | Plasma system for enhancing the surface of a material |
Non-Patent Citations (1)
Title |
---|
Caplus 1995: 974;077 No Month Available. * |
Also Published As
Publication number | Publication date |
---|---|
WO1997031136A1 (en) | 1997-08-28 |
US5681486A (en) | 1997-10-28 |
AU1826997A (en) | 1997-09-10 |
EP0958406A1 (en) | 1999-11-24 |
CN1212028A (en) | 1999-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100299569B1 (en) | Surface treatment method and plasma treatment device of aluminum member | |
CN108884546B (en) | Coated semiconductor processing component with resistance to chlorine and fluorine plasma erosion and composite oxide coating thereof | |
US6810887B2 (en) | Method for cleaning semiconductor fabrication equipment parts | |
US5660640A (en) | Method of removing sputter deposition from components of vacuum deposition equipment | |
KR102059692B1 (en) | Method of cleaning aluminum plasma chamber parts | |
EP2031088A2 (en) | Wet clean process for recovery of chamber parts | |
TW200524833A (en) | Methods of finishing quartz glass surfaces and components made by the methods | |
EP1295317A2 (en) | Semiconductor processing equipment having improved particle performance | |
EP2339612A1 (en) | Semiconductor processing component | |
JP3017528B2 (en) | Plasma processing equipment | |
JP3148878B2 (en) | Aluminum plate, method of manufacturing the same, and anti-adhesive cover using the aluminum plate | |
JP2003126795A (en) | Method for cleaning ceramic insulator | |
USRE36746E (en) | Plasma descaling of titanium and titanium alloys | |
US6027792A (en) | Coating film excellent in resistance to halogen-containing gas corrosion and halogen-containing plasma corrosion, laminated structure coated with the same, and method for producing the same | |
US10450668B2 (en) | Development of a passivated stainless steel surface | |
MXPA02010475A (en) | Surface treatments to improve corrosion resistance of austenitic stainless steels. | |
JP2004239505A (en) | Continuous heating treatment furnace, steel pipe and heat treating method using the same | |
US6010635A (en) | Plasma descaling of metals | |
JP2008153272A (en) | Method of cleaning semiconductor device manufacturing component, and cleaning solution composition | |
JPH09326384A (en) | Plasma processing system | |
JP3471507B2 (en) | Metal surface treatment | |
KR100439478B1 (en) | Method for cleaning a shield of a metal film deposition apparatus | |
JPH0499282A (en) | Electrode for generating high frequency plasma | |
EP4039845B1 (en) | Corrosion-resistant member | |
Bhushan | Techniques for removing surface contaminants in thin film deposition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees |