USRE35693E - Leadless chip carrier socket - Google Patents
Leadless chip carrier socket Download PDFInfo
- Publication number
- USRE35693E USRE35693E US08/406,734 US40673495A USRE35693E US RE35693 E USRE35693 E US RE35693E US 40673495 A US40673495 A US 40673495A US RE35693 E USRE35693 E US RE35693E
- Authority
- US
- United States
- Prior art keywords
- base member
- socket
- carrier
- contact
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to a socket and will have application to a carrier socket for a leadless integrated circuit.
- Leadless chip carriers are formed of ceramic materials which have a thermal coefficient of expansion which is not ideally suited for the epoxy/glass material from which printed circuit boards are normally constructed. Therefore, in order to utilize a leadless chip carrier, a receiving device is used to connect the carrier onto a printed circuit board. These receiving devices or sockets are designed to accomodate the differential in thermal expansion of the carriers and printed circuit boards. Sockets are also utilized in testing chip carriers and have been developed to accomodate such carriers for burn-in and similar testing.
- U.S. Pat. No. 4,491,377 discloses a socket having conductive elongated contacts for holding the carrier within the socket.
- a spreader cams the inner edge of the contacts outwardly to allow insertion of the carrier. The contacts are then released to hold the carrier firmly within the socket.
- the socket of this invention includes a plurality of opposed cantilevered contacts positioned about the socket's central opening.
- Each contact includes an upper platform of diving board form which extends outwardly of the socket central opening.
- the platforms When the platforms are depressed, the contacts are flexed outwardly To allow insertion of a carrier. By releasing pressure on the platforms, the contacts are closed to secure the carrier within the socket.
- Another object of this invention is to provide a socket which is for a leadless chip carrier.
- Another object of this invention is to provide for a leadless chip carrier socket which has an improved carrier contacting member.
- FIG. 1 is a perspective view of the socket.
- FIG. 2 is an exploded view of the socket components.
- FIG. 3 is a top plan view of the socket with an integrated circuit device inserted.
- FIG. 4 is a side view of the socket.
- FIG. 5 is a side view of the socket.
- FIG. 6 is a bottom view of the socket.
- FIG. 7 is a sectional view of the socket showing a carrier being inserted.
- FIG. 8 is a sectional view taken along 8--8 of FIG. 3 showing the carrier in its clamped position.
- FIG. 9 is a sectional view taken along line 9--9 of FIG. 1.
- the socket 10 shown in the drawings includes a base member 12 having a top face 14 and bottom face 16.
- Base member 12 includes a central opening 18 and a plurality of peripheral bores 20 about opening 18 which extended through faces 14 and 16.
- a plurality of grooves 22 are cut in base member face 14.
- a raised table section 24 extends about central opening 18 and includes grooves 26 which are aligned with grooves 22.
- Base member 12 also includes two pairs of opposed finger latches 30 each of which is flexible and includes an upper camming face 32 and lock tab 34.
- Socket 10 also provides for a plurality of contacts 36.
- Each contact 36 is constructed of resilient electrically conductive material and is of the general cross-sectional configuration shown in FIGS. 7-8.
- Each contact 36 has lower leads 38 which extend through base member bores 20.
- An integral curved neck 40 of each contact 36 is fitted into aligned grooves 22 and 26.
- Each contact 36 includes an integral upper head 42 having a bevelled inner edge 44 which terminates in a chin part 46 offset from the contact's neck 40 as seen in FIG. 8 and an outwardly extending integral platform 48.
- Socket 10 also includes a top 50 having the general configuration shown in FIG. 2 and includes shoulder parts 58.
- Top 50 includes a central opening 60 to allow for the insertion of an integrated circuit carrier 62 into socket 10 and an abutment part 64 at each of its sides 54.
- top 50 includes an open channel 66 at each of its side faces 54 into center opening 60 below abutment parts 64.
- a plurality of grooves 72 are formed in the top next to abutment parats 64 and over channels 66.
- top 50 With contacts 36 positioned in grooves 22, 26 of base member 12 and with leads 38 extending through base member bores 20, top 50 is placed over and pushed downwardly upon base member 12 until finger latches 30 of the base member engage shoulder parts 58 to secure the top of the base member.
- the heads 42 of contacts 36 fit into top grooves 72 with each contact platform 48 bearing against a top abutment part 64 to urge the top into its upper position as seen in FIG. 1.
- top 50 is pushed downwardly towards base member 12 into its lower position as seen in FIG. 7.
- Abutment parts 64 urge contact platforms 48 downwardly, as shown be arrows 51 in FIG. 7. This creates a moment about contact necks 40 which causes contact heads 42 to shift outwardly so as to allow integrated circuit carrier 62 when inserted into top opening 60 to be supported atop table section 24 of the base member.
- Top 50 is then released.
- Contact platforms 48 under the influence of flexed contacts 36, urge the top upwardly away from base member 12 to allow contact chin parts 46 to compressively contact the pads of carrier 62 as shown by arrows 75 in FIG. 8.
- Carrier 62 is released from clamping engagement with contacts 36 by pushing top 50 downwardly into its lower position. This causes the spreading of contact heads 42 away from the carrier.
- Carrier 62 may be inserted and clamped within socket 10 without pushing downwardly upon top 50. This is accomplished by simply pushing the carrier downwardly against the bevelled inner edges 44 of the contacts which in turn cams the contacts outwardly until the carrier leads engage the contact chin parts 46. The carrier is then released.
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/406,734 USRE35693E (en) | 1985-04-03 | 1995-03-20 | Leadless chip carrier socket |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/719,718 US4623208A (en) | 1985-04-03 | 1985-04-03 | Leadless chip carrier socket |
US08/406,734 USRE35693E (en) | 1985-04-03 | 1995-03-20 | Leadless chip carrier socket |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/719,718 Reissue US4623208A (en) | 1985-04-03 | 1985-04-03 | Leadless chip carrier socket |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE35693E true USRE35693E (en) | 1997-12-16 |
Family
ID=24891084
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/719,718 Ceased US4623208A (en) | 1985-04-03 | 1985-04-03 | Leadless chip carrier socket |
US08/406,734 Expired - Lifetime USRE35693E (en) | 1985-04-03 | 1995-03-20 | Leadless chip carrier socket |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/719,718 Ceased US4623208A (en) | 1985-04-03 | 1985-04-03 | Leadless chip carrier socket |
Country Status (7)
Country | Link |
---|---|
US (2) | US4623208A (en) |
JP (1) | JPS6334874A (en) |
DE (1) | DE3624579C2 (en) |
FR (1) | FR2601825B1 (en) |
GB (1) | GB2192495B (en) |
NL (1) | NL8601937A (en) |
SE (1) | SE454310B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6217341B1 (en) | 1999-04-01 | 2001-04-17 | Wells-Cti, Inc. | Integrated circuit test socket having torsion wire contacts |
US8167630B2 (en) | 1996-10-10 | 2012-05-01 | Fci Americas Technology Llc | High density connector and method of manufacture |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4808119A (en) * | 1985-08-30 | 1989-02-28 | Pfaff Wayne | Zero insertion force mounting housings for electronic device packages |
JPS6293964A (en) * | 1985-10-21 | 1987-04-30 | Dai Ichi Seiko Co Ltd | Ic testing socket |
US4799897A (en) * | 1985-12-30 | 1989-01-24 | Dai-Ichi Seiko Kabushiki Kaisha | IC tester socket |
JPS62160676A (en) * | 1985-12-31 | 1987-07-16 | 日本テキサス・インスツルメンツ株式会社 | Socket |
US4678255A (en) * | 1986-04-03 | 1987-07-07 | Wells Electronics, Inc. | Chip connector |
JPS632275A (en) * | 1986-06-23 | 1988-01-07 | 山一電機工業株式会社 | Ic withdrawing mechanism for ic socket |
JPH0775182B2 (en) * | 1986-09-02 | 1995-08-09 | 日本テキサス・インスツルメンツ株式会社 | Socket |
JPS6369375U (en) * | 1986-10-27 | 1988-05-10 | ||
JPH0739188Y2 (en) * | 1987-04-13 | 1995-09-06 | 三菱電機株式会社 | IC Socket |
US4789345A (en) * | 1987-05-15 | 1988-12-06 | Wells Electronics, Inc. | Socket device for fine pitch lead and leadless integrated circuit package |
JPS63299257A (en) * | 1987-05-29 | 1988-12-06 | Dai Ichi Seiko Co Ltd | Socket for inspection of ic |
US4750890A (en) * | 1987-06-18 | 1988-06-14 | The J. M. Ney Company | Test socket for an integrated circuit package |
US4872845A (en) * | 1987-11-03 | 1989-10-10 | Amp Incorporated | Retention means for chip carrier sockets |
JPH01143168A (en) * | 1987-11-27 | 1989-06-05 | Yamaichi Electric Mfg Co Ltd | Contact mechanism in socket for electric part |
WO1989011210A1 (en) * | 1988-05-06 | 1989-11-16 | Amp Incorporated | Improved retention means for chip carrier sockets |
US4886470A (en) * | 1988-05-24 | 1989-12-12 | Amp Incorporated | Burn-in socket for gull wing integrated circuit package |
US4919623A (en) * | 1989-02-13 | 1990-04-24 | Amp Incorporated | Burn-in socket for integrated circuit device |
US5053199A (en) * | 1989-02-21 | 1991-10-01 | Boehringer Mannheim Corporation | Electronically readable information carrier |
JP2593218B2 (en) * | 1989-03-23 | 1997-03-26 | 山一電機工業株式会社 | IC take-out mechanism in IC socket |
US4993955A (en) * | 1990-03-08 | 1991-02-19 | Minnesota Mining And Manufacturing Company | Top-load socket for integrated circuit device |
JPH0448567A (en) * | 1990-06-15 | 1992-02-18 | Yamaichi Electron Co Ltd | Socket for electric component |
JPH0632241B2 (en) * | 1990-10-17 | 1994-04-27 | 山一電機工業株式会社 | Socket for electrical parts |
JPH0656784B2 (en) * | 1990-12-25 | 1994-07-27 | 山一電機株式会社 | Socket for electrical parts |
US5114358A (en) * | 1991-03-11 | 1992-05-19 | Wells Electronics, Inc. | Chip carrier socket |
US5108302A (en) * | 1991-06-17 | 1992-04-28 | Pfaff Wayne | Test socket |
JPH0734379B2 (en) * | 1991-10-15 | 1995-04-12 | 山一電機株式会社 | Socket for electrical parts |
JPH05144530A (en) * | 1991-11-25 | 1993-06-11 | Yamaichi Electron Co Ltd | Electric contact unit |
US5240429A (en) * | 1992-03-06 | 1993-08-31 | Wells Electronics, Inc. | Chip carrier socket |
JPH05343142A (en) * | 1992-06-02 | 1993-12-24 | Minnesota Mining & Mfg Co <3M> | Ic socket |
JP3302045B2 (en) * | 1992-06-02 | 2002-07-15 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | IC socket |
JPH05343145A (en) * | 1992-06-10 | 1993-12-24 | Minnesota Mining & Mfg Co <3M> | Ic socket |
US5228866A (en) * | 1992-07-06 | 1993-07-20 | Wells Electronics, Inc. | Socket for integrated circuit carrier |
JP3205814B2 (en) * | 1992-09-24 | 2001-09-04 | 日本テキサス・インスツルメンツ株式会社 | socket |
JPH06105630B2 (en) * | 1992-12-26 | 1994-12-21 | 山一電機株式会社 | IC socket |
JPH0752662B2 (en) * | 1992-12-26 | 1995-06-05 | 山一電機株式会社 | IC socket |
JPH0831348B2 (en) * | 1993-04-30 | 1996-03-27 | 株式会社秩父富士 | IC package socket |
US5358421A (en) * | 1993-08-06 | 1994-10-25 | Minnesota Mining And Manufacturing Company | Zero-insertion-force socket for gull wing electronic devices |
JPH07254469A (en) * | 1994-03-16 | 1995-10-03 | Texas Instr Japan Ltd | Socket |
JP2667638B2 (en) * | 1994-05-18 | 1997-10-27 | 山一電機株式会社 | IC socket |
JP3076782B2 (en) * | 1997-12-01 | 2000-08-14 | 山一電機株式会社 | IC socket |
JP2895039B1 (en) | 1998-02-02 | 1999-05-24 | 山一電機株式会社 | IC socket |
US6672912B2 (en) * | 2000-03-31 | 2004-01-06 | Intel Corporation | Discrete device socket and method of fabrication therefor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753211A (en) * | 1971-10-06 | 1973-08-14 | Amp Inc | Connecting means for ceramic substrate package |
US3763462A (en) * | 1971-08-06 | 1973-10-02 | Ibm | Control wipe electrical connector for circuit cards |
US4332431A (en) * | 1979-12-18 | 1982-06-01 | Amp Incorporated | Preassembled electrical connector |
US4491377A (en) * | 1982-04-19 | 1985-01-01 | Pfaff Wayne | Mounting housing for leadless chip carrier |
US4715823A (en) * | 1985-12-31 | 1987-12-29 | Texas Instruments Incorporated | Plug-in socket assembly for integrated circuit package |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2107136B (en) * | 1981-10-02 | 1985-09-11 | Int Computers Ltd | Devices and methods of mounting intergrated circuit packages on a printed circuit board |
US4533192A (en) * | 1984-04-25 | 1985-08-06 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket |
US4678255A (en) * | 1986-04-03 | 1987-07-07 | Wells Electronics, Inc. | Chip connector |
-
1985
- 1985-04-03 US US06/719,718 patent/US4623208A/en not_active Ceased
-
1986
- 1986-07-10 GB GB8616822A patent/GB2192495B/en not_active Expired - Fee Related
- 1986-07-15 SE SE8603128A patent/SE454310B/en not_active IP Right Cessation
- 1986-07-16 FR FR868610356A patent/FR2601825B1/en not_active Expired - Fee Related
- 1986-07-21 DE DE3624579A patent/DE3624579C2/en not_active Expired - Fee Related
- 1986-07-22 JP JP61172672A patent/JPS6334874A/en active Pending
- 1986-07-28 NL NL8601937A patent/NL8601937A/en not_active Application Discontinuation
-
1995
- 1995-03-20 US US08/406,734 patent/USRE35693E/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3763462A (en) * | 1971-08-06 | 1973-10-02 | Ibm | Control wipe electrical connector for circuit cards |
US3753211A (en) * | 1971-10-06 | 1973-08-14 | Amp Inc | Connecting means for ceramic substrate package |
US4332431A (en) * | 1979-12-18 | 1982-06-01 | Amp Incorporated | Preassembled electrical connector |
US4491377A (en) * | 1982-04-19 | 1985-01-01 | Pfaff Wayne | Mounting housing for leadless chip carrier |
US4715823A (en) * | 1985-12-31 | 1987-12-29 | Texas Instruments Incorporated | Plug-in socket assembly for integrated circuit package |
Non-Patent Citations (1)
Title |
---|
IBM Bulletin, Brearley, vol. 13, No. 9, p. 2590, Feb. 1971. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8167630B2 (en) | 1996-10-10 | 2012-05-01 | Fci Americas Technology Llc | High density connector and method of manufacture |
US6217341B1 (en) | 1999-04-01 | 2001-04-17 | Wells-Cti, Inc. | Integrated circuit test socket having torsion wire contacts |
Also Published As
Publication number | Publication date |
---|---|
SE454310B (en) | 1988-04-18 |
NL8601937A (en) | 1988-02-16 |
JPS6334874A (en) | 1988-02-15 |
SE8603128D0 (en) | 1986-07-15 |
DE3624579A1 (en) | 1988-01-28 |
FR2601825B1 (en) | 1994-06-24 |
GB2192495B (en) | 1990-10-31 |
GB2192495A (en) | 1988-01-13 |
US4623208A (en) | 1986-11-18 |
GB8616822D0 (en) | 1986-08-20 |
SE8603128L (en) | 1988-01-16 |
FR2601825A1 (en) | 1988-01-22 |
DE3624579C2 (en) | 1994-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FLEET NATIONAL BANK, MASSACHUSETTS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WELLS ELECTRONICS, INC.;REEL/FRAME:009350/0588 Effective date: 19971226 |
|
AS | Assignment |
Owner name: WELLS-CTI, INC., INDIANA Free format text: MERGER AND CHANGE OF NAME;ASSIGNOR:WELLS ELECTRONICS, INC.;REEL/FRAME:009375/0722 Effective date: 19980731 |
|
AS | Assignment |
Owner name: FLEET NATIONAL BANK, AS AGENT, MASSACHUSETTS Free format text: SECURITY AGREEMENT;ASSIGNOR:WELLS-CTI INC.;REEL/FRAME:012795/0323 Effective date: 20020227 |
|
FEPP | Fee payment procedure |
Free format text: PETITION RELATED TO MAINTENANCE FEES FILED (ORIGINAL EVENT CODE: PMFP); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FEPP | Fee payment procedure |
Free format text: PETITION RELATED TO MAINTENANCE FEES FILED (ORIGINAL EVENT CODE: PMFP); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: KABUSHIKI WELLS-CTI, LLC., OREGON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WELLS-CTI, INC.;REEL/FRAME:013746/0292 Effective date: 20030503 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
SULP | Surcharge for late payment | ||
FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FEPP | Fee payment procedure |
Free format text: PETITION RELATED TO MAINTENANCE FEES GRANTED (ORIGINAL EVENT CODE: PMFG); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PETITION RELATED TO MAINTENANCE FEES FILED (ORIGINAL EVENT CODE: PMFP); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
PRDP | Patent reinstated due to the acceptance of a late maintenance fee |
Effective date: 19971216 |