USRE35549E - Solderable lead - Google Patents
Solderable lead Download PDFInfo
- Publication number
- USRE35549E USRE35549E US08/135,461 US13546193A USRE35549E US RE35549 E USRE35549 E US RE35549E US 13546193 A US13546193 A US 13546193A US RE35549 E USRE35549 E US RE35549E
- Authority
- US
- United States
- Prior art keywords
- solder
- lead
- conductive area
- edge
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 3
- 239000012634 fragment Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Definitions
- the present invention relates to solderable terminals and leads, particularly solder clips intended for connection to contact pads on edges of substrates.
- solderable clips are shown in U.S. Pat Nos. 4,120,558; 4,019,803; 4,203,648; 4,357,069; 4,367,910; 4,592,617; 4,605,278; 4,697,865; 4,728,305; and 4,780,098.
- these terminals generally involve complex structures, such as curved fingers or tabs, for forming the lead and holding the solder mass in place until the assembly is heated, requiring specialized tooling and production techniques.
- a device disclosed in U.S. Pat. No. 4,900,279 to Dennis partially solves this problem.
- This devices uses a basically C-shaped clip that is coated on the interior of the C with solder.
- the substrate is inserted into the interior of the C, bringing the contact pads of the substrate in contact with the solder, which is then melted, forming when re-solidified a mechanical and electrical connection between the clip and the substrate.
- the solder melts the significant layer of liquid solder between the clip and the substrate create an unstable hold on the substrate.
- the substrate tends to float or slide around in relation to the clip during this period. This can potentially lead to a solder connection of the clip to an area partially or completely off of its desired contact pad, which may cause a short-circuit to an adjacent, closely spaced contact pad.
- solder terminal be easily and simply fabricated with a minimum of manufacturing steps.
- a solderable lead is fashioned with a C-shaped contact element formed along its length.
- the interior of the C-element is dimensioned to receive and resiliently engage a substrate at a predetermined contact point such as a contact pad on the substrate.
- a layer of solder is provided on the exterior side of the C-element. During heating, the solder migrates to the interior of the C-element by capillary action to the area between the contact pad of the substrate and the C-element. Thus, while the solder is liquid, the resilient C-element holds the lead engaged with the substrate.
- the side edges of the layer of solder are curved toward the interior of the C-element by simple expedients during manufacture.
- FIG. 1 is a front view of a fragment of a conductive strip shoWing two solderable leads according to the invention connected to a carrier strip.
- FIG. 2 is a side view of a solderable lead according to the invention, taken along the line 2--2 of FIG. 1.
- FIG. 3 is a rear view of a fragment of a conductive strip during manufacture of solderable leads according to the invention.
- FIG. 4 is a cross-section of the contact portion of the solderable lead, mounted on a substrate, viewed along line 4--4 of FIG. 2.
- FIGS. 1 and 2 show a preferred embodiment of the invention in the form of aseries of leads 10 each having a C-clip 12 for receiving and grasping a substrate 50 (such as a printed circuit board, integrated circuit, chip carrier or the like).
- the leads 10 are formed from a continuous strip 11 of semi-resilient conductive material through a series of steps, such as by progressive stamping, including punching and bending.
- FIG. 3 shows a fragmentary portion of the strip 11 from which the leads 10 are formed.
- the semi-resilient conductive material such as beryllium copper
- Other methods of applying the solder bands 28 to the strip 11 may of course by used.
- the strip 11 is punched at lines 15 to form the individual lead bodies 17. Indexing holes 16 are also punched along the edge of strip 11 to form a carrier strip 14.
- the leads 10 remain connected to the carrier strip 14.
- the indexing holes 16 are used to move the leads 10 through a manufacturing apparatus such as a progressive stamping machine, and to maintain the precise inter-lead spacing necessary for the leads 10 to matewith respective similarly spaced contact pads 18 on the substrate 50.
- Extending from the carrier strip 14 for each lead 10 is an elongated body portion 20 for eventual connection of the lead 10 to other electronic components.
- the C-clip 12 Adjacent the end of the body portion 20 remote from the carrier 14 is the C-clip 12.
- the C-clip 12 is formed of four generally right angle bends, the two outer bends being convex with respect to the front of the lead 10,while the two inner bends are concave.
- the bends may be formed at the linesmarked "a", "b", "c", and "d” on FIG. 3.
- the lengths of the top and bottom walls 22,24 of the C-clip 12, as well as the length of the rear wall 26 are determined by the thickness of the substrate 50 on which the clip 12 is to be mounted and the positioning of the contact points 18 thereon.
- the bands of solder 28 are deposited on the back side of the leads 10 in the area that is to be bent into the C-clip 12.
- the solder bands 28 may be formed in a single band, adapted to cover not only the top and bottom walls 22,24 of the C-clip 12,but also its rear wall 26. Where connection is desired to only one contact pad 18 on one side of substrate 50, a corresponding one of the solder bands 28 may be omitted.
- the solder bands 28 are thick enough to provide asufficient amount of solder to positively connect the C-clip 12 to the contact pad 18 of the substrate 50 after heating.
- the flow of solder to the contact pad is facilitated by specially forming the solder band or bands 28 on theindividual lead 10.
- solder band or bands 28 on theindividual lead 10.
- some of the sheet material 11 may also be bent in a burr 32 toward the interior of the C-clip 12. As can be seen in FIG. 4, this may cause the main area of the C-clip 12 to be held slightly away from the surface of the contact pad 18 of the substrate 50 to form a very narrow gap 34.
- a comb-like section of the carrier strip 14 with a desired number of leads 10 (for example, 10 to 50 in various applications) is engaged over the edge of a substrate 50.
- the leads 10 are spaced in correspondence with the spacing of the contact pads 18 on the substrate 50, which may be on either side or both sides of the substrate 50.
- Each C-clip 12 then resiliently engages a corresponding substrate contact pad 18, and the leads 10 are thereby held in proper position with respect to the substrate 50 for further operations.
- the clip/substrate assembly is moved through a heater, which melts the solder layer 28.
- the liquid solder will migrate by capillary action into the intervening gap 34 between the C-clip 12 and the contact point 18.
- the gap34 caused by a burr 32 on the lead edges improves the capillary action causing the solder to flow between the C-clip 12, and contact point 18 to improve the soldered bond.
- the solder will still sufficiently migrate into the space between the C-clip 12 and the contact pad 18 because of inevitable irregularities between the C-clip 12 and the contact pad 18 when they are engaged.
- the carrier strip 14 is cut off.
- the end of the body 20 previously near the carrier 14 may be used as a terminal.
- This terminal portion may take any desired configuration. It may, for example, be formed as a pin tobe received in a connector or in an opening of a further printed circuit board or the like, so as for example to be soldered thereto, or as a wire-wrap post.
- the portions of lead 10 beyond the C-clip may be configured to be used as the terminal portion.
- small apertures 52 may be formed in the lead 10underneath the solder layer 28, which will facilitate flow of molten solderinto the gap 34, by capillary action, without significantly weakening the lead 10.
- That portion of the lead body may be bowed slightly above a longitudinal axis, to be slightly concave facing inwardly to provide thespace 34 between the C-clip interior and the substrate conductive pad.
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/135,461 USRE35549E (en) | 1991-02-26 | 1993-10-12 | Solderable lead |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/661,252 US5090926A (en) | 1991-02-26 | 1991-02-26 | Solderable lead |
US08/135,461 USRE35549E (en) | 1991-02-26 | 1993-10-12 | Solderable lead |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/661,252 Reissue US5090926A (en) | 1990-04-13 | 1991-02-26 | Solderable lead |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE35549E true USRE35549E (en) | 1997-07-01 |
Family
ID=24652817
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/661,252 Ceased US5090926A (en) | 1990-04-13 | 1991-02-26 | Solderable lead |
US08/135,461 Expired - Lifetime USRE35549E (en) | 1991-02-26 | 1993-10-12 | Solderable lead |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/661,252 Ceased US5090926A (en) | 1990-04-13 | 1991-02-26 | Solderable lead |
Country Status (1)
Country | Link |
---|---|
US (2) | US5090926A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050061854A1 (en) * | 2003-09-19 | 2005-03-24 | Advanced Semiconductor Engineering, Inc. | Method for mounting a semiconductor package onto PCB |
US6969286B1 (en) | 2004-06-28 | 2005-11-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
US20100173507A1 (en) * | 2009-01-07 | 2010-07-08 | Samtec, Inc. | Electrical connector having multiple ground planes |
US7837522B1 (en) | 2009-11-12 | 2010-11-23 | Samtec, Inc. | Electrical contacts with solder members and methods of attaching solder members to electrical contacts |
US8167630B2 (en) | 1996-10-10 | 2012-05-01 | Fci Americas Technology Llc | High density connector and method of manufacture |
US20120252274A1 (en) * | 2011-03-29 | 2012-10-04 | Lotes Co., Ltd. | Electrical connector |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2705500B1 (en) * | 1993-05-14 | 1995-08-18 | Proner Comatel Sa | Electrical connection device and corresponding manufacturing method. |
US5571034A (en) * | 1995-01-20 | 1996-11-05 | North American Specialties Corporation | Method of making an array of electrical components with leads attached and the product thereof |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2250156A (en) * | 1939-06-02 | 1941-07-22 | Bell Telephone Labor Inc | Electrical connection |
US3324230A (en) * | 1965-08-23 | 1967-06-06 | Raychem Corp | Electrical connector with preplaced solder |
US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
US3780433A (en) * | 1972-05-01 | 1973-12-25 | Amp Inc | A method of making an electrical connection using a coined post with solder stripe |
US4019803A (en) * | 1975-10-15 | 1977-04-26 | E. I. Du Pont De Nemours And Company | Solder substrate clip |
US4311267A (en) * | 1979-05-04 | 1982-01-19 | Gte Automatic Electric Laboratories, Inc. | Method of screening paste solder onto leaded hybrid substrates |
US4357069A (en) * | 1981-02-04 | 1982-11-02 | Western Electric Company, Inc. | Solder-bearing lead having solder-confining stop means |
US4396140A (en) * | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
JPS60130132A (en) * | 1983-12-19 | 1985-07-11 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
US4586764A (en) * | 1985-01-07 | 1986-05-06 | Motorola, Inc. | Electrical subassembly structure |
US4718863A (en) * | 1986-05-02 | 1988-01-12 | Thomas & Betts Corporation | Jumper cable having clips for solder connections |
US4900279A (en) * | 1989-04-24 | 1990-02-13 | Die Tech, Inc. | Solder terminal |
US5015206A (en) * | 1990-04-05 | 1991-05-14 | Die Tech, Inc. | Solder terminal |
US5063660A (en) * | 1988-05-26 | 1991-11-12 | Siemens Aktiengesellschaft | Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions |
-
1991
- 1991-02-26 US US07/661,252 patent/US5090926A/en not_active Ceased
-
1993
- 1993-10-12 US US08/135,461 patent/USRE35549E/en not_active Expired - Lifetime
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2250156A (en) * | 1939-06-02 | 1941-07-22 | Bell Telephone Labor Inc | Electrical connection |
US3324230A (en) * | 1965-08-23 | 1967-06-06 | Raychem Corp | Electrical connector with preplaced solder |
US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
US3780433A (en) * | 1972-05-01 | 1973-12-25 | Amp Inc | A method of making an electrical connection using a coined post with solder stripe |
US4019803A (en) * | 1975-10-15 | 1977-04-26 | E. I. Du Pont De Nemours And Company | Solder substrate clip |
US4311267A (en) * | 1979-05-04 | 1982-01-19 | Gte Automatic Electric Laboratories, Inc. | Method of screening paste solder onto leaded hybrid substrates |
US4396140A (en) * | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
US4357069A (en) * | 1981-02-04 | 1982-11-02 | Western Electric Company, Inc. | Solder-bearing lead having solder-confining stop means |
JPS60130132A (en) * | 1983-12-19 | 1985-07-11 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
US4586764A (en) * | 1985-01-07 | 1986-05-06 | Motorola, Inc. | Electrical subassembly structure |
US4718863A (en) * | 1986-05-02 | 1988-01-12 | Thomas & Betts Corporation | Jumper cable having clips for solder connections |
US5063660A (en) * | 1988-05-26 | 1991-11-12 | Siemens Aktiengesellschaft | Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions |
US4900279A (en) * | 1989-04-24 | 1990-02-13 | Die Tech, Inc. | Solder terminal |
US5015206A (en) * | 1990-04-05 | 1991-05-14 | Die Tech, Inc. | Solder terminal |
Non-Patent Citations (2)
Title |
---|
"High Purity Precision Alloys", Semi-Alloys Corp, Tech. Bull. CM-64, 4 pp, 1968. |
High Purity Precision Alloys , Semi Alloys Corp, Tech. Bull. CM 64, 4 pp, 1968. * |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8167630B2 (en) | 1996-10-10 | 2012-05-01 | Fci Americas Technology Llc | High density connector and method of manufacture |
US20050061854A1 (en) * | 2003-09-19 | 2005-03-24 | Advanced Semiconductor Engineering, Inc. | Method for mounting a semiconductor package onto PCB |
US7357294B2 (en) * | 2003-09-19 | 2008-04-15 | Advanced Semiconductor Engineering, Inc. | Method for mounting a semiconductor package onto PCB |
US20050287830A1 (en) * | 2004-06-28 | 2005-12-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
US7125293B2 (en) | 2004-06-28 | 2006-10-24 | Samtec, Inc. | Connector having improved contacts with fusible members |
US20050287832A1 (en) * | 2004-06-28 | 2005-12-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
US20050287879A1 (en) * | 2004-06-28 | 2005-12-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
US20050287844A1 (en) * | 2004-06-28 | 2005-12-29 | Samtec Inc. | Connector having improved contacts with fusible members |
US20050287845A1 (en) * | 2004-06-28 | 2005-12-29 | Samtec Inc. | Connector having improved contacts with fusible members |
US7052337B2 (en) | 2004-06-28 | 2006-05-30 | Samtec, Inc. | Connector having improved contacts with fusible members |
US20050287831A1 (en) * | 2004-06-28 | 2005-12-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
US7159312B2 (en) | 2004-06-28 | 2007-01-09 | Samtec, Inc. | Connector having improved contacts with fusible members |
US7178232B2 (en) | 2004-06-28 | 2007-02-20 | Samtec, Inc. | Connector having improved contacts with fusible members |
US6979238B1 (en) | 2004-06-28 | 2005-12-27 | Samtec, Inc. | Connector having improved contacts with fusible members |
US6969286B1 (en) | 2004-06-28 | 2005-11-29 | Samtec, Inc. | Connector having improved contacts with fusible members |
US20100173507A1 (en) * | 2009-01-07 | 2010-07-08 | Samtec, Inc. | Electrical connector having multiple ground planes |
US7837522B1 (en) | 2009-11-12 | 2010-11-23 | Samtec, Inc. | Electrical contacts with solder members and methods of attaching solder members to electrical contacts |
US20120252274A1 (en) * | 2011-03-29 | 2012-10-04 | Lotes Co., Ltd. | Electrical connector |
US8360790B2 (en) * | 2011-03-29 | 2013-01-29 | Lotes Co., Ltd. | Electrical connector |
Also Published As
Publication number | Publication date |
---|---|
US5090926A (en) | 1992-02-25 |
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Legal Events
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FPAY | Fee payment |
Year of fee payment: 8 |
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FPAY | Fee payment |
Year of fee payment: 12 |
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