USD802790S1 - Cover ring for a plasma processing apparatus - Google Patents

Cover ring for a plasma processing apparatus Download PDF

Info

Publication number
USD802790S1
USD802790S1 US29/544,069 US201529544069F USD802790S US D802790 S1 USD802790 S1 US D802790S1 US 201529544069 F US201529544069 F US 201529544069F US D802790 S USD802790 S US D802790S
Authority
US
United States
Prior art keywords
processing apparatus
plasma processing
cover ring
view
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/544,069
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAUCHI, SUSUMU, UEMURA, TAKASHI, SATO, KOHEI
Application granted granted Critical
Publication of USD802790S1 publication Critical patent/USD802790S1/en
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME AND ADDRESS Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a front, top and right side perspective view of a cover ring for a plasma processing apparatus showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6; and,
FIG. 9 is an enlarged portion view taken along line 9-9 of FIG. 8.

Claims (1)

    CLAIM
  1. The ornamental design for a cover ring for a plasma processing apparatus, as shown and described.
US29/544,069 2015-06-12 2015-10-30 Cover ring for a plasma processing apparatus Active USD802790S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-013036 2015-06-12
JPD2015-13036F JP1551512S (en) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
USD802790S1 true USD802790S1 (en) 2017-11-14

Family

ID=56105200

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/544,069 Active USD802790S1 (en) 2015-06-12 2015-10-30 Cover ring for a plasma processing apparatus

Country Status (3)

Country Link
US (1) USD802790S1 (en)
JP (1) JP1551512S (en)
TW (1) TWD175853S (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD872859S1 (en) * 2017-03-09 2020-01-14 Pieter Van Weenen & Co. Gmbh Part of an apparatus for medical and laboratory diagnosis
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD881767S1 (en) * 2018-11-30 2020-04-21 Warn Automotive, Llc Latch ring
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1584784S (en) 2017-01-31 2017-08-28
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6423175B1 (en) * 1999-10-06 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for reducing particle contamination in an etcher
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050258280A1 (en) * 2004-05-24 2005-11-24 Shin-Etsu Chemical Co., Ltd. Shower plate for plasma processing apparatus and plasma processing apparatus
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20080041820A1 (en) * 2002-09-20 2008-02-21 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6423175B1 (en) * 1999-10-06 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for reducing particle contamination in an etcher
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
US20080041820A1 (en) * 2002-09-20 2008-02-21 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050258280A1 (en) * 2004-05-24 2005-11-24 Shin-Etsu Chemical Co., Ltd. Shower plate for plasma processing apparatus and plasma processing apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD872859S1 (en) * 2017-03-09 2020-01-14 Pieter Van Weenen & Co. Gmbh Part of an apparatus for medical and laboratory diagnosis
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD881767S1 (en) * 2018-11-30 2020-04-21 Warn Automotive, Llc Latch ring
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Also Published As

Publication number Publication date
JP1551512S (en) 2016-06-13
TWD175853S (en) 2016-05-21

Similar Documents

Publication Publication Date Title
USD802790S1 (en) Cover ring for a plasma processing apparatus
USD770992S1 (en) Electrode cover for a plasma processing apparatus
USD988502S1 (en) Elbow of a breathing apparatus
USD804436S1 (en) Upper chamber for a plasma processing apparatus
USD812578S1 (en) Upper chamber for a plasma processing apparatus
USD780031S1 (en) Ring
USD781588S1 (en) Cleansing apparatus
USD780024S1 (en) Ring
USD780025S1 (en) Ring
USD794497S1 (en) Ring
USD780020S1 (en) Ring
USD730430S1 (en) Processing goggles for produce
USD749979S1 (en) Ring
USD802545S1 (en) Lower chamber for a plasma processing apparatus
USD802723S1 (en) Sealing ring
USD781765S1 (en) Rim
USD764674S1 (en) Finger ring
USD753999S1 (en) Lid
USD771780S1 (en) Elbow fitting
USD746509S1 (en) Lens
USD733840S1 (en) Electric sprayer
USD780013S1 (en) Ring
USD799437S1 (en) Substrate retaining ring
USD759533S1 (en) Ring
USD793275S1 (en) Ring