USD785578S1 - Substrate supporting arm for semiconductor manufacturing apparatus - Google Patents

Substrate supporting arm for semiconductor manufacturing apparatus Download PDF

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Publication number
USD785578S1
USD785578S1 US29/558,827 US201629558827F USD785578S US D785578 S1 USD785578 S1 US D785578S1 US 201629558827 F US201629558827 F US 201629558827F US D785578 S USD785578 S US D785578S
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United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
supporting arm
substrate supporting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/558,827
Inventor
Woo Chan Kim
Jeong Ho Lee
Hyun Soo JANG
Jong Su Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM IP Holding BV
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ASM IP Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to US29/558,827 priority Critical patent/USD785578S1/en
Assigned to ASM IP HOLDING B.V. reassignment ASM IP HOLDING B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, JONG SU, JANG, HYUN SOO, KIM, WOO CHAN, LEE, JEONG HO
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Description

FIG. 1 is a perspective view of a substrate supporting arm for a semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate supporting arm for a semiconductor manufacturing apparatus, as shown and described.
US29/558,827 2016-03-22 2016-03-22 Substrate supporting arm for semiconductor manufacturing apparatus Active USD785578S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/558,827 USD785578S1 (en) 2016-03-22 2016-03-22 Substrate supporting arm for semiconductor manufacturing apparatus

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US29/558,827 USD785578S1 (en) 2016-03-22 2016-03-22 Substrate supporting arm for semiconductor manufacturing apparatus

Publications (1)

Publication Number Publication Date
USD785578S1 true USD785578S1 (en) 2017-05-02

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US29/558,827 Active USD785578S1 (en) 2016-03-22 2016-03-22 Substrate supporting arm for semiconductor manufacturing apparatus

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD825498S1 (en) * 2017-07-17 2018-08-14 Oculus Vr, Llc Heat sink assembly
USD831086S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD831085S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD847237S1 (en) * 2016-12-09 2019-04-30 Hitachi High-Technologies Corporation Substrate processing unit
US10379583B2 (en) 2017-04-19 2019-08-13 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132160A (en) * 1997-06-27 2000-10-17 Tokyo Electron Limited Substrate transferring apparatus
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6614201B2 (en) * 2000-02-07 2003-09-02 Tazmo Co., Ltd. Substrate transfer system
US6893507B2 (en) * 1997-11-03 2005-05-17 Asm America, Inc. Self-centering wafer support system
US6991419B2 (en) * 2001-04-16 2006-01-31 Samsung Electronics Co., Ltd. Method and apparatus for transferring a wafer
US7186297B2 (en) * 2000-12-15 2007-03-06 Kabushiki Kaisha Yaskawa Denki Wafer holding apparatus
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
USD614152S1 (en) * 2008-07-21 2010-04-20 Asm Genitech Korea, Ltd. Substrate transfer device for semiconductor deposition apparatus
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD666979S1 (en) * 2010-12-14 2012-09-11 Tokyo Electron Limited Substrate holder
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6132160A (en) * 1997-06-27 2000-10-17 Tokyo Electron Limited Substrate transferring apparatus
US6893507B2 (en) * 1997-11-03 2005-05-17 Asm America, Inc. Self-centering wafer support system
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US6614201B2 (en) * 2000-02-07 2003-09-02 Tazmo Co., Ltd. Substrate transfer system
US7186297B2 (en) * 2000-12-15 2007-03-06 Kabushiki Kaisha Yaskawa Denki Wafer holding apparatus
US6991419B2 (en) * 2001-04-16 2006-01-31 Samsung Electronics Co., Ltd. Method and apparatus for transferring a wafer
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
USD614152S1 (en) * 2008-07-21 2010-04-20 Asm Genitech Korea, Ltd. Substrate transfer device for semiconductor deposition apparatus
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD666979S1 (en) * 2010-12-14 2012-09-11 Tokyo Electron Limited Substrate holder
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office Action dated Jul. 5, 2016 in Korean Design application No. 30-2016-0000963.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD831086S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD831085S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD847237S1 (en) * 2016-12-09 2019-04-30 Hitachi High-Technologies Corporation Substrate processing unit
US10379583B2 (en) 2017-04-19 2019-08-13 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US10656690B2 (en) 2017-04-19 2020-05-19 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US11029730B2 (en) 2017-04-19 2021-06-08 Facebook Technologies, Llc System for discharging heat out of head-mounted display based on hybrid fan
US11435784B2 (en) 2017-04-19 2022-09-06 Meta Platforms Technologies, Llc System for discharging heat out of head-mounted display
USD825498S1 (en) * 2017-07-17 2018-08-14 Oculus Vr, Llc Heat sink assembly
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers

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