USD785578S1 - Substrate supporting arm for semiconductor manufacturing apparatus - Google Patents
Substrate supporting arm for semiconductor manufacturing apparatus Download PDFInfo
- Publication number
- USD785578S1 USD785578S1 US29/558,827 US201629558827F USD785578S US D785578 S1 USD785578 S1 US D785578S1 US 201629558827 F US201629558827 F US 201629558827F US D785578 S USD785578 S US D785578S
- Authority
- US
- United States
- Prior art keywords
- manufacturing apparatus
- semiconductor manufacturing
- supporting arm
- substrate supporting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a substrate supporting arm for a semiconductor manufacturing apparatus, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/558,827 USD785578S1 (en) | 2016-03-22 | 2016-03-22 | Substrate supporting arm for semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/558,827 USD785578S1 (en) | 2016-03-22 | 2016-03-22 | Substrate supporting arm for semiconductor manufacturing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
USD785578S1 true USD785578S1 (en) | 2017-05-02 |
Family
ID=58629001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/558,827 Active USD785578S1 (en) | 2016-03-22 | 2016-03-22 | Substrate supporting arm for semiconductor manufacturing apparatus |
Country Status (1)
Country | Link |
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US (1) | USD785578S1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD825498S1 (en) * | 2017-07-17 | 2018-08-14 | Oculus Vr, Llc | Heat sink assembly |
USD831086S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD831085S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD847237S1 (en) * | 2016-12-09 | 2019-04-30 | Hitachi High-Technologies Corporation | Substrate processing unit |
US10379583B2 (en) | 2017-04-19 | 2019-08-13 | Facebook Technologies, Llc | System for discharging heat out of head-mounted display based on hybrid fan and heat pipe |
USD938373S1 (en) * | 2019-10-25 | 2021-12-14 | Applied Materials, Inc. | Substrate transfer structure |
USD997892S1 (en) * | 2019-11-28 | 2023-09-05 | Kokusai Electric Corporation | End effector for handling wafers |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6132160A (en) * | 1997-06-27 | 2000-10-17 | Tokyo Electron Limited | Substrate transferring apparatus |
US6183183B1 (en) * | 1997-01-16 | 2001-02-06 | Asm America, Inc. | Dual arm linear hand-off wafer transfer assembly |
US6234738B1 (en) * | 1998-04-24 | 2001-05-22 | Mecs Corporation | Thin substrate transferring apparatus |
US6293749B1 (en) * | 1997-11-21 | 2001-09-25 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
US6614201B2 (en) * | 2000-02-07 | 2003-09-02 | Tazmo Co., Ltd. | Substrate transfer system |
US6893507B2 (en) * | 1997-11-03 | 2005-05-17 | Asm America, Inc. | Self-centering wafer support system |
US6991419B2 (en) * | 2001-04-16 | 2006-01-31 | Samsung Electronics Co., Ltd. | Method and apparatus for transferring a wafer |
US7186297B2 (en) * | 2000-12-15 | 2007-03-06 | Kabushiki Kaisha Yaskawa Denki | Wafer holding apparatus |
USD559805S1 (en) * | 2005-08-12 | 2008-01-15 | Tokyo Electron Limited | Stage arm for a semiconductor wafer delivery apparatus |
US7578649B2 (en) * | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
USD614152S1 (en) * | 2008-07-21 | 2010-04-20 | Asm Genitech Korea, Ltd. | Substrate transfer device for semiconductor deposition apparatus |
USD665759S1 (en) * | 2010-12-14 | 2012-08-21 | Tokyo Electron Limited | Substrate transfer holder |
USD666979S1 (en) * | 2010-12-14 | 2012-09-11 | Tokyo Electron Limited | Substrate holder |
USD695240S1 (en) * | 2011-10-20 | 2013-12-10 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
USD701498S1 (en) * | 2011-10-20 | 2014-03-25 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
-
2016
- 2016-03-22 US US29/558,827 patent/USD785578S1/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6183183B1 (en) * | 1997-01-16 | 2001-02-06 | Asm America, Inc. | Dual arm linear hand-off wafer transfer assembly |
US6132160A (en) * | 1997-06-27 | 2000-10-17 | Tokyo Electron Limited | Substrate transferring apparatus |
US6893507B2 (en) * | 1997-11-03 | 2005-05-17 | Asm America, Inc. | Self-centering wafer support system |
US6293749B1 (en) * | 1997-11-21 | 2001-09-25 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
US6234738B1 (en) * | 1998-04-24 | 2001-05-22 | Mecs Corporation | Thin substrate transferring apparatus |
US6614201B2 (en) * | 2000-02-07 | 2003-09-02 | Tazmo Co., Ltd. | Substrate transfer system |
US7186297B2 (en) * | 2000-12-15 | 2007-03-06 | Kabushiki Kaisha Yaskawa Denki | Wafer holding apparatus |
US6991419B2 (en) * | 2001-04-16 | 2006-01-31 | Samsung Electronics Co., Ltd. | Method and apparatus for transferring a wafer |
US7578649B2 (en) * | 2002-05-29 | 2009-08-25 | Brooks Automation, Inc. | Dual arm substrate transport apparatus |
USD559805S1 (en) * | 2005-08-12 | 2008-01-15 | Tokyo Electron Limited | Stage arm for a semiconductor wafer delivery apparatus |
USD614152S1 (en) * | 2008-07-21 | 2010-04-20 | Asm Genitech Korea, Ltd. | Substrate transfer device for semiconductor deposition apparatus |
USD665759S1 (en) * | 2010-12-14 | 2012-08-21 | Tokyo Electron Limited | Substrate transfer holder |
USD666979S1 (en) * | 2010-12-14 | 2012-09-11 | Tokyo Electron Limited | Substrate holder |
USD695240S1 (en) * | 2011-10-20 | 2013-12-10 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
USD701498S1 (en) * | 2011-10-20 | 2014-03-25 | Tokyo Electron Limited | Arm for wafer transportation for manufacturing semiconductor |
Non-Patent Citations (1)
Title |
---|
Office Action dated Jul. 5, 2016 in Korean Design application No. 30-2016-0000963. |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD831086S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD831085S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD847237S1 (en) * | 2016-12-09 | 2019-04-30 | Hitachi High-Technologies Corporation | Substrate processing unit |
US10379583B2 (en) | 2017-04-19 | 2019-08-13 | Facebook Technologies, Llc | System for discharging heat out of head-mounted display based on hybrid fan and heat pipe |
US10656690B2 (en) | 2017-04-19 | 2020-05-19 | Facebook Technologies, Llc | System for discharging heat out of head-mounted display based on hybrid fan and heat pipe |
US11029730B2 (en) | 2017-04-19 | 2021-06-08 | Facebook Technologies, Llc | System for discharging heat out of head-mounted display based on hybrid fan |
US11435784B2 (en) | 2017-04-19 | 2022-09-06 | Meta Platforms Technologies, Llc | System for discharging heat out of head-mounted display |
USD825498S1 (en) * | 2017-07-17 | 2018-08-14 | Oculus Vr, Llc | Heat sink assembly |
USD938373S1 (en) * | 2019-10-25 | 2021-12-14 | Applied Materials, Inc. | Substrate transfer structure |
USD997892S1 (en) * | 2019-11-28 | 2023-09-05 | Kokusai Electric Corporation | End effector for handling wafers |
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