USD667801S1 - Package for light emitting diode (LED) lighting - Google Patents
Package for light emitting diode (LED) lighting Download PDFInfo
- Publication number
- USD667801S1 USD667801S1 US29/397,017 US201129397017F USD667801S US D667801 S1 USD667801 S1 US D667801S1 US 201129397017 F US201129397017 F US 201129397017F US D667801 S USD667801 S US D667801S
- Authority
- US
- United States
- Prior art keywords
- package
- led
- lighting
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Description
Broken lines immediately adjacent to the shaded areas represent the boundaries of the claimed design. Other broken lines are for illustrative purpose only and form no part of the claimed design. None of the broken lines form part of the claimed design.
Claims (1)
- The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/397,017 USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/365,939 USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/365,939 Division USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/432,988 Division USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Publications (1)
Publication Number | Publication Date |
---|---|
USD667801S1 true USD667801S1 (en) | 2012-09-25 |
Family
ID=44455808
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/365,939 Active USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 Active USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 Active USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/365,939 Active USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/432,988 Active USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Country Status (1)
Country | Link |
---|---|
US (3) | USD643819S1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110031865A1 (en) * | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
USD704358S1 (en) | 2011-01-03 | 2014-05-06 | Cree, Inc. | High brightness LED package |
USD708156S1 (en) * | 2010-07-16 | 2014-07-01 | Cree, Inc. | Package for light emitting diode (LED) lighting |
US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
US8866166B2 (en) | 2009-06-05 | 2014-10-21 | Cree, Inc. | Solid state lighting device |
US8878217B2 (en) | 2010-06-28 | 2014-11-04 | Cree, Inc. | LED package with efficient, isolated thermal path |
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
US9634209B2 (en) | 2011-03-02 | 2017-04-25 | Cree, Inc. | Miniature surface mount device |
US9685592B2 (en) | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
US9691949B2 (en) | 2014-05-30 | 2017-06-27 | Cree, Inc. | Submount based light emitter components and methods |
USD796076S1 (en) | 2014-12-22 | 2017-08-29 | Lunera Lighting Inc. | Horizontal LED lamp |
US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US10957736B2 (en) | 2018-03-12 | 2021-03-23 | Cree, Inc. | Light emitting diode (LED) components and methods |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
Families Citing this family (8)
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---|---|---|---|---|
USD738027S1 (en) * | 2013-11-18 | 2015-09-01 | Koninklijke Philips N.V. | Illuminated OLED panel |
USD731825S1 (en) * | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
USD731214S1 (en) * | 2014-01-15 | 2015-06-09 | Winston Products Llc | Merchandising containers for vehicle lights |
USD731826S1 (en) * | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
USD778848S1 (en) * | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
USD777694S1 (en) * | 2015-05-15 | 2017-01-31 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD782989S1 (en) * | 2015-05-15 | 2017-04-04 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US10576557B2 (en) | 2017-11-17 | 2020-03-03 | Greenlee Tools, Inc. | Workpiece shearing apparatus |
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