Adhesive tape for semiconductor manufacturing
US D656910 S1
The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
FIG. 1 is a top plan view of our new design;
FIG. 2 is a bottom plan view;
FIG. 3 is a left side view;
FIG. 4 is a right side view;
FIG. 5 is a rear side view;
FIG. 6 is a front side view;
FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;
FIG. 8 is an exploded view; and,
FIG. 9 is an enlarged view of the middle and left portion of the claimed design shown in FIG. 1 for completeness of illustration.
|1||U.S. Appl. No. 29/389,788, filed Apr. 15, 2011, Taniguchi et al.|
|2||U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al.|
|3||U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al.|