| Publication number | USD656910 S1 |
| Publication type | Grant |
| Application number | 29/389,797 |
| Publication date | 3 Apr 2012 |
| Filing date | 15 Apr 2011 |
| Priority date | 15 Oct 2010 |
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Adhesive tape for semiconductor manufacturing
US D656910 S1
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The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
FIG. 1 is a top plan view of our new design;
FIG. 2 is a bottom plan view;
FIG. 3 is a left side view;
FIG. 4 is a right side view;
FIG. 5 is a rear side view;
FIG. 6 is a front side view;
FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;
FIG. 8 is an exploded view; and,
FIG. 9 is an enlarged view of the middle and left portion of the claimed design shown in FIG. 1 for completeness of illustration.
| Reference |
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| 1 | U.S. Appl. No. 29/389,788, filed Apr. 15, 2011, Taniguchi et al. |
| 2 | U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al. |
| 3 | U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al. |
