USD437603S1 - Device for the application of mechanical force to a gel/sensor assembly - Google Patents
Device for the application of mechanical force to a gel/sensor assembly Download PDFInfo
- Publication number
- USD437603S1 USD437603S1 US29/120,510 US12051000F USD437603S US D437603 S1 USD437603 S1 US D437603S1 US 12051000 F US12051000 F US 12051000F US D437603 S USD437603 S US D437603S
- Authority
- US
- United States
- Prior art keywords
- gel
- application
- sensor assembly
- mechanical force
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a closed device for the application of mechanical force to a gel/sensor assembly showing the new design.
FIG. 2 is a perspective view of an opened device for the application of mechanical force to a gel/sensor assembly.
FIG. 3 is a top plan view of the device for the application of mechanical force to a gel/sensor assembly.
FIG. 4 is a bottom plan view of the device for the application of mechanical force to a gel/sensor assembly.
FIG. 5 is a side elevation view of a first side of the device for the application of mechanical force to a gel/sensor assembly.
FIG. 6 is a front elevation view of the device for the application of mechanical force to a gel/sensor assembly.
FIG. 7 is a rear elevation view of the device for the application of mechanical force to a gel/sensor assembly; and,
FIG. 8 is a side elevation view of a second side of the device for the application of mechanical force to a gel/sensor assembly.
Claims (1)
- The ornamental design for a device for the application of mechanical force to a gel/sensor assembly, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/120,510 USD437603S1 (en) | 1998-09-17 | 2000-03-20 | Device for the application of mechanical force to a gel/sensor assembly |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10091898 | 1998-09-17 | ||
US39898499 | 1999-09-17 | ||
US29/120,510 USD437603S1 (en) | 1998-09-17 | 2000-03-20 | Device for the application of mechanical force to a gel/sensor assembly |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/398,984 Continuation US6398562B1 (en) | 1998-09-17 | 1999-09-17 | Device and methods for the application of mechanical force to a gel/sensor assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
USD437603S1 true USD437603S1 (en) | 2001-02-13 |
Family
ID=26797691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/120,510 Expired - Lifetime USD437603S1 (en) | 1998-09-17 | 2000-03-20 | Device for the application of mechanical force to a gel/sensor assembly |
Country Status (1)
Country | Link |
---|---|
US (1) | USD437603S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6687522B2 (en) | 1994-06-24 | 2004-02-03 | Cygnus, Inc. | Device for sample of substances using alternating polarity |
US20060063984A1 (en) * | 2004-07-26 | 2006-03-23 | Kenichi Uchiyama | Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip |
-
2000
- 2000-03-20 US US29/120,510 patent/USD437603S1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6687522B2 (en) | 1994-06-24 | 2004-02-03 | Cygnus, Inc. | Device for sample of substances using alternating polarity |
US20060063984A1 (en) * | 2004-07-26 | 2006-03-23 | Kenichi Uchiyama | Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip |
US7410614B2 (en) * | 2004-07-26 | 2008-08-12 | Kabushiki Kaisha Toshiba | Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip |
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