USD401567S - Temporary package for semiconductor dice - Google Patents
Temporary package for semiconductor dice Download PDFInfo
- Publication number
- USD401567S USD401567S US29/070,005 US7000597F USD401567S US D401567 S USD401567 S US D401567S US 7000597 F US7000597 F US 7000597F US D401567 S USD401567 S US D401567S
- Authority
- US
- United States
- Prior art keywords
- semiconductor dice
- temporary package
- temporary
- package
- dice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a front side elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear side elevation view thereof.
Claims (1)
- The ornamental design for a temporary package for testing semiconductor dice, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/070,005 USD401567S (en) | 1997-04-25 | 1997-04-25 | Temporary package for semiconductor dice |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/070,005 USD401567S (en) | 1997-04-25 | 1997-04-25 | Temporary package for semiconductor dice |
Publications (1)
Publication Number | Publication Date |
---|---|
USD401567S true USD401567S (en) | 1998-11-24 |
Family
ID=71576007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/070,005 Expired - Lifetime USD401567S (en) | 1997-04-25 | 1997-04-25 | Temporary package for semiconductor dice |
Country Status (1)
Country | Link |
---|---|
US (1) | USD401567S (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6222379B1 (en) | 1991-06-04 | 2001-04-24 | Micron Technology, Inc. | Conventionally sized temporary package for testing semiconductor dice |
US6242931B1 (en) | 1999-05-03 | 2001-06-05 | Micron Technology, Inc. | Flexible semiconductor interconnect fabricated by backside thinning |
US6255840B1 (en) | 1997-04-25 | 2001-07-03 | Micron Technology, Inc. | Semiconductor package with wire bond protective member |
USD904991S1 (en) * | 2019-03-15 | 2020-12-15 | Tamura Corporation | Semiconductor element |
USD911987S1 (en) * | 2019-03-15 | 2021-03-02 | Tamura Corporation | Semiconductor element |
-
1997
- 1997-04-25 US US29/070,005 patent/USD401567S/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
Van Zant, Peter, Microchip Fabrication--A Practical Guide To Semiconductor Processing, Second Edition, 1990, pg. 493. |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6222379B1 (en) | 1991-06-04 | 2001-04-24 | Micron Technology, Inc. | Conventionally sized temporary package for testing semiconductor dice |
US6255840B1 (en) | 1997-04-25 | 2001-07-03 | Micron Technology, Inc. | Semiconductor package with wire bond protective member |
US6242931B1 (en) | 1999-05-03 | 2001-06-05 | Micron Technology, Inc. | Flexible semiconductor interconnect fabricated by backside thinning |
US6263566B1 (en) | 1999-05-03 | 2001-07-24 | Micron Technology, Inc. | Flexible semiconductor interconnect fabricated by backslide thinning |
US6300782B1 (en) | 1999-05-03 | 2001-10-09 | Micron Technology, Inc. | System for testing semiconductor components having flexible interconnect |
USD904991S1 (en) * | 2019-03-15 | 2020-12-15 | Tamura Corporation | Semiconductor element |
USD911987S1 (en) * | 2019-03-15 | 2021-03-02 | Tamura Corporation | Semiconductor element |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |