USD401567S - Temporary package for semiconductor dice - Google Patents

Temporary package for semiconductor dice Download PDF

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Publication number
USD401567S
USD401567S US29/070,005 US7000597F USD401567S US D401567 S USD401567 S US D401567S US 7000597 F US7000597 F US 7000597F US D401567 S USD401567 S US D401567S
Authority
US
United States
Prior art keywords
semiconductor dice
temporary package
temporary
package
dice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/070,005
Inventor
Warren M. Farnworth
Alan G. Wood
David R. Hembree
Salman Akram
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to US29/070,005 priority Critical patent/USD401567S/en
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEMBREE, DAVID R., WOOD, ALAN G., AKRAM, SALMAN, FARNWORTH, WARREN M.
Application granted granted Critical
Publication of USD401567S publication Critical patent/USD401567S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a front side elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear side elevation view thereof.

Claims (1)

  1. The ornamental design for a temporary package for testing semiconductor dice, as shown and described.
US29/070,005 1997-04-25 1997-04-25 Temporary package for semiconductor dice Expired - Lifetime USD401567S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/070,005 USD401567S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/070,005 USD401567S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Publications (1)

Publication Number Publication Date
USD401567S true USD401567S (en) 1998-11-24

Family

ID=71576007

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/070,005 Expired - Lifetime USD401567S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Country Status (1)

Country Link
US (1) USD401567S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222379B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
US6242931B1 (en) 1999-05-03 2001-06-05 Micron Technology, Inc. Flexible semiconductor interconnect fabricated by backside thinning
US6255840B1 (en) 1997-04-25 2001-07-03 Micron Technology, Inc. Semiconductor package with wire bond protective member
USD904991S1 (en) * 2019-03-15 2020-12-15 Tamura Corporation Semiconductor element
USD911987S1 (en) * 2019-03-15 2021-03-02 Tamura Corporation Semiconductor element

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Van Zant, Peter, Microchip Fabrication--A Practical Guide To Semiconductor Processing, Second Edition, 1990, pg. 493.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222379B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
US6255840B1 (en) 1997-04-25 2001-07-03 Micron Technology, Inc. Semiconductor package with wire bond protective member
US6242931B1 (en) 1999-05-03 2001-06-05 Micron Technology, Inc. Flexible semiconductor interconnect fabricated by backside thinning
US6263566B1 (en) 1999-05-03 2001-07-24 Micron Technology, Inc. Flexible semiconductor interconnect fabricated by backslide thinning
US6300782B1 (en) 1999-05-03 2001-10-09 Micron Technology, Inc. System for testing semiconductor components having flexible interconnect
USD904991S1 (en) * 2019-03-15 2020-12-15 Tamura Corporation Semiconductor element
USD911987S1 (en) * 2019-03-15 2021-03-02 Tamura Corporation Semiconductor element

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