USD394844S - Temporary package for semiconductor dice - Google Patents

Temporary package for semiconductor dice Download PDF

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Publication number
USD394844S
USD394844S US29/070,050 US7005097F USD394844S US D394844 S USD394844 S US D394844S US 7005097 F US7005097 F US 7005097F US D394844 S USD394844 S US D394844S
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US
United States
Prior art keywords
semiconductor dice
temporary package
temporary
package
dice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/070,050
Inventor
Warren M. Farnworth
Alan G. Wood
David R. Hembree
Salman Akram
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Micron Technology Inc
Original Assignee
Micron Technology Inc
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Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to US29/070,050 priority Critical patent/USD394844S/en
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEMBREE, DAVID R., WOOD, ALAN G., AKRAM, SALMAN, FARNWORTH, WARREN M.
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Publication of USD394844S publication Critical patent/USD394844S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a front side elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear side elevation view thereof.

Claims (1)

  1. The ornamental design for a temporary package for semiconductor dice, as shown and described.
US29/070,050 1997-04-25 1997-04-25 Temporary package for semiconductor dice Expired - Lifetime USD394844S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/070,050 USD394844S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/070,050 USD394844S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Publications (1)

Publication Number Publication Date
USD394844S true USD394844S (en) 1998-06-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/070,050 Expired - Lifetime USD394844S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

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US (1) USD394844S (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222379B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
US6353326B2 (en) 1998-08-28 2002-03-05 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6558600B1 (en) 2000-05-04 2003-05-06 Micron Technology, Inc. Method for packaging microelectronic substrates
US6576494B1 (en) 2000-06-28 2003-06-10 Micron Technology, Inc. Recessed encapsulated microelectronic devices and methods for formation
US6638595B2 (en) 2000-06-28 2003-10-28 Micron Technology, Inc. Method and apparatus for reduced flash encapsulation of microelectronic devices
US6653173B2 (en) 2000-06-16 2003-11-25 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6656769B2 (en) 2000-05-08 2003-12-02 Micron Technology, Inc. Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US20040026773A1 (en) * 2002-08-08 2004-02-12 Koon Eng Meow Packaged microelectronic components
US20040031621A1 (en) * 2002-08-19 2004-02-19 Heng Puah Kia Packaged microelectronic component assemblies
US20040038447A1 (en) * 2002-08-21 2004-02-26 Corisis David J Packaged microelectronic devices and methods for assembling microelectronic devices
US20040155331A1 (en) * 2003-02-11 2004-08-12 Blaine Thurgood Packaged microelectronic devices and methods for packaging microelectronic devices
US6796028B2 (en) 2000-08-23 2004-09-28 Micron Technology, Inc. Method of Interconnecting substrates for electrical coupling of microelectronic components
US6838760B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US20050019988A1 (en) * 2002-04-04 2005-01-27 Tongbi Jiang Method and apparatus for attaching microelectronic substrates and support members
US6876066B2 (en) 2001-08-29 2005-04-05 Micron Technology, Inc. Packaged microelectronic devices and methods of forming same
US6921860B2 (en) 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts
US6951982B2 (en) 2002-11-22 2005-10-04 Micron Technology, Inc. Packaged microelectronic component assemblies
US6979595B1 (en) 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20060035503A1 (en) * 2003-08-29 2006-02-16 Seng Eric T S Invertible microfeature device packages and associated methods
US20060040422A1 (en) * 2002-08-08 2006-02-23 Micron Technology, Inc. Microelectronic devices and methods for manufacturing and operating packaged microelectronic device
US7057281B2 (en) 2003-03-04 2006-06-06 Micron Technology Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US20060189036A1 (en) * 2005-02-08 2006-08-24 Micron Technology, Inc. Methods and systems for adhering microfeature workpieces to support members
US20060208366A1 (en) * 2004-07-23 2006-09-21 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US7157310B2 (en) 2004-09-01 2007-01-02 Micron Technology, Inc. Methods for packaging microfeature devices and microfeature devices formed by such methods
US20070045875A1 (en) * 2005-08-30 2007-03-01 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US7218001B2 (en) 2003-10-31 2007-05-15 Micron Technology, Inc. Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US20070181989A1 (en) * 2006-02-08 2007-08-09 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US7273769B1 (en) 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US20080206930A1 (en) * 2007-02-23 2008-08-28 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US20080224329A1 (en) * 2007-03-13 2008-09-18 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US7745944B2 (en) 2005-08-31 2010-06-29 Micron Technology, Inc. Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US20100276814A1 (en) * 2005-12-29 2010-11-04 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US8202754B2 (en) 2006-03-29 2012-06-19 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
1994 Dram Data Book, Micron Semiconductor, Inc., pp. 7-7-7-13, Apr., 1994.

Cited By (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222379B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
US6353326B2 (en) 1998-08-28 2002-03-05 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6544461B1 (en) 1998-08-28 2003-04-08 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6642730B1 (en) 1998-08-28 2003-11-04 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6558600B1 (en) 2000-05-04 2003-05-06 Micron Technology, Inc. Method for packaging microelectronic substrates
US20030209831A1 (en) * 2000-05-04 2003-11-13 Williams Vernon M. Method and apparatus for packaging microelectronic substrates
US6656769B2 (en) 2000-05-08 2003-12-02 Micron Technology, Inc. Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US6664139B2 (en) 2000-06-16 2003-12-16 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6683388B2 (en) 2000-06-16 2004-01-27 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6677675B2 (en) 2000-06-16 2004-01-13 Micron Technology, Inc. Microelectronic devices and microelectronic die packages
US6653173B2 (en) 2000-06-16 2003-11-25 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6819003B2 (en) 2000-06-28 2004-11-16 Micron Technology Inc. Recessed encapsulated microelectronic devices and methods for formation
US6644949B2 (en) 2000-06-28 2003-11-11 Micron Technology, Inc. Apparatus for reduced flash encapsulation of microelectronic devices
US6638595B2 (en) 2000-06-28 2003-10-28 Micron Technology, Inc. Method and apparatus for reduced flash encapsulation of microelectronic devices
US6841423B2 (en) 2000-06-28 2005-01-11 Micron Technology, Inc. Methods for formation of recessed encapsulated microelectronic devices
US6576494B1 (en) 2000-06-28 2003-06-10 Micron Technology, Inc. Recessed encapsulated microelectronic devices and methods for formation
US7273769B1 (en) 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US7405487B2 (en) 2000-08-16 2008-07-29 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US6796028B2 (en) 2000-08-23 2004-09-28 Micron Technology, Inc. Method of Interconnecting substrates for electrical coupling of microelectronic components
US6983551B2 (en) 2000-08-23 2006-01-10 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US6982386B2 (en) 2000-08-23 2006-01-03 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US20060180907A1 (en) * 2000-08-24 2006-08-17 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices
US6979595B1 (en) 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20070063335A1 (en) * 2000-08-28 2007-03-22 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units
US7332376B2 (en) 2000-08-28 2008-02-19 Micron Technology, Inc. Method of encapsulating packaged microelectronic devices with a barrier
US7101737B2 (en) 2000-08-28 2006-09-05 Micron Technology, Inc. Method of encapsulating interconnecting units in packaged microelectronic devices
US6838760B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US6943450B2 (en) 2001-08-29 2005-09-13 Micron Technology, Inc. Packaged microelectronic devices and methods of forming same
US6876066B2 (en) 2001-08-29 2005-04-05 Micron Technology, Inc. Packaged microelectronic devices and methods of forming same
US20070020811A1 (en) * 2002-04-04 2007-01-25 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US7091064B2 (en) 2002-04-04 2006-08-15 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US7615871B2 (en) 2002-04-04 2009-11-10 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US7109588B2 (en) 2002-04-04 2006-09-19 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US20050019988A1 (en) * 2002-04-04 2005-01-27 Tongbi Jiang Method and apparatus for attaching microelectronic substrates and support members
US8637973B2 (en) 2002-08-08 2014-01-28 Micron Technology, Inc. Packaged microelectronic components with terminals exposed through encapsulant
US20080067642A1 (en) * 2002-08-08 2008-03-20 Micron Technology, Inc. Packaged microelectronic components
US9418872B2 (en) 2002-08-08 2016-08-16 Micron Technology, Inc. Packaged microelectronic components
US7306974B2 (en) 2002-08-08 2007-12-11 Micron Technology, Inc. Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies
US20060040422A1 (en) * 2002-08-08 2006-02-23 Micron Technology, Inc. Microelectronic devices and methods for manufacturing and operating packaged microelectronic device
US7067905B2 (en) 2002-08-08 2006-06-27 Micron Technology, Inc. Packaged microelectronic devices including first and second casings
US20040026773A1 (en) * 2002-08-08 2004-02-12 Koon Eng Meow Packaged microelectronic components
US6836009B2 (en) 2002-08-08 2004-12-28 Micron Technology, Inc. Packaged microelectronic components
US7195957B2 (en) 2002-08-08 2007-03-27 Micron Technology, Inc. Packaged microelectronic components
US6933170B2 (en) 2002-08-19 2005-08-23 Micron Technology, Inc. Packaged microelectronic component assemblies
US20040031621A1 (en) * 2002-08-19 2004-02-19 Heng Puah Kia Packaged microelectronic component assemblies
US6781066B2 (en) 2002-08-19 2004-08-24 Micron Technology, Inc. Packaged microelectronic component assemblies
US20040038447A1 (en) * 2002-08-21 2004-02-26 Corisis David J Packaged microelectronic devices and methods for assembling microelectronic devices
US6924550B2 (en) 2002-08-21 2005-08-02 Micron Technology, Inc. Packaged microelectronic devices and methods for assembling microelectronic devices
US6740546B2 (en) 2002-08-21 2004-05-25 Micron Technology, Inc. Packaged microelectronic devices and methods for assembling microelectronic devices
US6951982B2 (en) 2002-11-22 2005-10-04 Micron Technology, Inc. Packaged microelectronic component assemblies
US6879050B2 (en) 2003-02-11 2005-04-12 Micron Technology, Inc. Packaged microelectronic devices and methods for packaging microelectronic devices
US20040155331A1 (en) * 2003-02-11 2004-08-12 Blaine Thurgood Packaged microelectronic devices and methods for packaging microelectronic devices
US7057281B2 (en) 2003-03-04 2006-06-06 Micron Technology Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7691680B2 (en) 2003-03-04 2010-04-06 Micron Technologies, Inc. Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7425470B2 (en) 2003-03-04 2008-09-16 Micron Technology, Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US6921860B2 (en) 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts
US7259451B2 (en) 2003-08-29 2007-08-21 Micron Technology, Inc. Invertible microfeature device packages
US20060035503A1 (en) * 2003-08-29 2006-02-16 Seng Eric T S Invertible microfeature device packages and associated methods
US7368810B2 (en) 2003-08-29 2008-05-06 Micron Technology, Inc. Invertible microfeature device packages
US7218001B2 (en) 2003-10-31 2007-05-15 Micron Technology, Inc. Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US7691726B2 (en) 2003-10-31 2010-04-06 Micron Technology, Inc. Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US7250328B2 (en) 2004-07-23 2007-07-31 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US7696003B2 (en) 2004-07-23 2010-04-13 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US20060208366A1 (en) * 2004-07-23 2006-09-21 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US7365424B2 (en) 2004-07-23 2008-04-29 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US7157310B2 (en) 2004-09-01 2007-01-02 Micron Technology, Inc. Methods for packaging microfeature devices and microfeature devices formed by such methods
US7579684B2 (en) 2004-09-01 2009-08-25 Micron Technology, Inc. Methods for packing microfeature devices and microfeature devices formed by such methods
US20060189036A1 (en) * 2005-02-08 2006-08-24 Micron Technology, Inc. Methods and systems for adhering microfeature workpieces to support members
US9064973B2 (en) 2005-02-08 2015-06-23 Micron Technology, Inc. Die attached to a support member by a plurality of adhesive members
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US20070045875A1 (en) * 2005-08-30 2007-03-01 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US20100327462A1 (en) * 2005-08-30 2010-12-30 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US7807505B2 (en) 2005-08-30 2010-10-05 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US8704380B2 (en) 2005-08-30 2014-04-22 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US8703599B2 (en) 2005-08-31 2014-04-22 Micron Technology, Inc. Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US7745944B2 (en) 2005-08-31 2010-06-29 Micron Technology, Inc. Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US8319332B2 (en) 2005-08-31 2012-11-27 Micron Technology, Inc. Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US20100276814A1 (en) * 2005-12-29 2010-11-04 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US8772947B2 (en) 2005-12-29 2014-07-08 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US8203213B2 (en) 2005-12-29 2012-06-19 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US7671459B2 (en) 2006-02-08 2010-03-02 Micron Technologies, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US20070181989A1 (en) * 2006-02-08 2007-08-09 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US9362141B2 (en) 2006-02-28 2016-06-07 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US9768121B2 (en) 2006-02-28 2017-09-19 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US20100117212A1 (en) * 2006-02-28 2010-05-13 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US8450839B2 (en) 2006-02-28 2013-05-28 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US10211114B2 (en) 2006-02-28 2019-02-19 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US8202754B2 (en) 2006-03-29 2012-06-19 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods
US8441132B2 (en) 2006-03-29 2013-05-14 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods
US8975745B2 (en) 2006-03-29 2015-03-10 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods
US8138613B2 (en) 2006-05-12 2012-03-20 Micron Technology, Inc. Microelectronic devices
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US7833456B2 (en) 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US20080206930A1 (en) * 2007-02-23 2008-08-28 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US8866272B2 (en) 2007-03-13 2014-10-21 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US7955898B2 (en) 2007-03-13 2011-06-07 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US10163826B2 (en) 2007-03-13 2018-12-25 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US20080224329A1 (en) * 2007-03-13 2008-09-18 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
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