US D323173 S
Abstract available in
FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a left side elevational view;
FIG. 3 is a front elevational view, the rear elevational view being a mirror image;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and
FIG. 6 is a right side elevational view thereof.