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Publication numberUSD323173 S
Publication typeGrant
Application numberUS 07/301,996
Publication date14 Jan 1992
Filing date25 Jan 1989
Priority date25 Jul 1988
Publication number07301996, 301996, US D323173 S, US D323173S, US-S-D323173, USD323173 S, USD323173S
InventorsKatsumi Ishii, Mitsuo Katoh
Original AssigneeTel Sagami Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Instrument for transferring boats for thermal treatment of semiconductor wafers
US D323173 S
Images(4)
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Claims(1)
  1. The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown and described.
Description

FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is a left side elevational view;

FIG. 3 is a front elevational view, the rear elevational view being a mirror image;

FIG. 4 is a top plan view;

FIG. 5 is a bottom plan view; and

FIG. 6 is a right side elevational view thereof.

Classifications
U.S. ClassificationD15/199