Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD323173 S
Publication typeGrant
Application numberUS 07/301,996
Publication date14 Jan 1992
Filing date25 Jan 1989
Priority date25 Jul 1988
Publication number07301996, 301996, US D323173 S, US D323173S, US-S-D323173, USD323173 S, USD323173S
InventorsKatsumi Ishii, Mitsuo Katoh
Original AssigneeTel Sagami Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Instrument for transferring boats for thermal treatment of semiconductor wafers
US D323173 S
Abstract  available in
Images(4)
Previous page
Next page
Claims(1)
  1. The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown and described.
Description

FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is a left side elevational view;

FIG. 3 is a front elevational view, the rear elevational view being a mirror image;

FIG. 4 is a top plan view;

FIG. 5 is a bottom plan view; and

FIG. 6 is a right side elevational view thereof.

Classifications
U.S. ClassificationD15/199