FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is a left side elevational view;

FIG. 3 is a front elevational view, the rear elevational view being a mirror image;

FIG. 4 is a top plan view;

FIG. 5 is a bottom plan view; and

FIG. 6 is a right side elevational view thereof.