US8812150B2 - Semiconductor manufacturing process modules - Google Patents
Semiconductor manufacturing process modules Download PDFInfo
- Publication number
- US8812150B2 US8812150B2 US11/876,869 US87686907A US8812150B2 US 8812150 B2 US8812150 B2 US 8812150B2 US 87686907 A US87686907 A US 87686907A US 8812150 B2 US8812150 B2 US 8812150B2
- Authority
- US
- United States
- Prior art keywords
- handling
- robotic
- wafer
- module
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/876,869 US8812150B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
Applications Claiming Priority (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51882303P | 2003-11-10 | 2003-11-10 | |
US60764904P | 2004-09-07 | 2004-09-07 | |
US10/985,834 US7458763B2 (en) | 2003-11-10 | 2004-11-10 | Mid-entry load lock for semiconductor handling system |
US77744306P | 2006-02-27 | 2006-02-27 | |
US77970706P | 2006-03-05 | 2006-03-05 | |
US77947806P | 2006-03-05 | 2006-03-05 | |
US77946306P | 2006-03-05 | 2006-03-05 | |
US77960906P | 2006-03-05 | 2006-03-05 | |
US77968406P | 2006-03-05 | 2006-03-05 | |
US78483206P | 2006-03-21 | 2006-03-21 | |
US74616306P | 2006-05-01 | 2006-05-01 | |
US80718906P | 2006-07-12 | 2006-07-12 | |
US82345406P | 2006-08-24 | 2006-08-24 | |
US11/679,829 US20070269297A1 (en) | 2003-11-10 | 2007-02-27 | Semiconductor wafer handling and transport |
US11/681,978 US20070286710A1 (en) | 2003-11-10 | 2007-03-05 | Semiconductor manufacturing process modules |
US11/876,869 US8812150B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/681,978 Continuation US20070286710A1 (en) | 2003-11-10 | 2007-03-05 | Semiconductor manufacturing process modules |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080219808A1 US20080219808A1 (en) | 2008-09-11 |
US8812150B2 true US8812150B2 (en) | 2014-08-19 |
Family
ID=39870072
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/876,865 Abandoned US20080219807A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,887 Abandoned US20080219811A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,860 Abandoned US20080219806A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,886 Abandoned US20080219810A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,869 Active 2027-05-19 US8812150B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,876 Active 2026-04-18 US8267632B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,896 Active 2026-01-12 US8602716B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/876,865 Abandoned US20080219807A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,887 Abandoned US20080219811A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,860 Abandoned US20080219806A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,886 Abandoned US20080219810A1 (en) | 2007-03-05 | 2007-10-23 | Semiconductor manufacturing process modules |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/876,876 Active 2026-04-18 US8267632B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
US11/876,896 Active 2026-01-12 US8602716B2 (en) | 2003-11-10 | 2007-10-23 | Semiconductor manufacturing process modules |
Country Status (1)
Country | Link |
---|---|
US (7) | US20080219807A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140308815A1 (en) * | 2011-07-13 | 2014-10-16 | Tokyo Electron Limited | Etching method and device |
US10998209B2 (en) | 2019-05-31 | 2021-05-04 | Applied Materials, Inc. | Substrate processing platforms including multiple processing chambers |
US11600507B2 (en) | 2020-09-09 | 2023-03-07 | Applied Materials, Inc. | Pedestal assembly for a substrate processing chamber |
US11610799B2 (en) | 2020-09-18 | 2023-03-21 | Applied Materials, Inc. | Electrostatic chuck having a heating and chucking capabilities |
US11674227B2 (en) | 2021-02-03 | 2023-06-13 | Applied Materials, Inc. | Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure |
US11749542B2 (en) | 2020-07-27 | 2023-09-05 | Applied Materials, Inc. | Apparatus, system, and method for non-contact temperature monitoring of substrate supports |
US11817331B2 (en) | 2020-07-27 | 2023-11-14 | Applied Materials, Inc. | Substrate holder replacement with protective disk during pasting process |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5118288B2 (en) * | 2002-05-16 | 2013-01-16 | エフ ホフマン−ラ ロッシュ アクチェン ゲゼルシャフト | Method for producing polymer layer |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US8573919B2 (en) * | 2005-07-11 | 2013-11-05 | Brooks Automation, Inc. | Substrate transport apparatus |
JP4707749B2 (en) * | 2009-04-01 | 2011-06-22 | 東京エレクトロン株式会社 | Substrate replacement method and substrate processing apparatus |
US9111729B2 (en) * | 2009-12-03 | 2015-08-18 | Lam Research Corporation | Small plasma chamber systems and methods |
JP5282021B2 (en) * | 2009-12-14 | 2013-09-04 | 株式会社日立ハイテクノロジーズ | Semiconductor processing system and semiconductor processing method |
KR101092586B1 (en) * | 2010-03-15 | 2011-12-13 | 정원국 | Metal organic chemical?vapor deposition?apparatus having satellite n-type and p-type doping chambers |
KR101271246B1 (en) * | 2011-08-02 | 2013-06-07 | 주식회사 유진테크 | Equipment for manufacturing semiconductor |
JP2013045817A (en) * | 2011-08-23 | 2013-03-04 | Hitachi High-Technologies Corp | Vacuum processing apparatus and vacuum processing method |
CN104584188B (en) * | 2012-08-08 | 2017-05-31 | 应用材料公司 | Link type vacuum processing tool and the method using the instrument |
US9064807B2 (en) * | 2013-02-27 | 2015-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated platform for improved wafer manufacturing quality |
KR102161160B1 (en) * | 2013-10-31 | 2020-09-29 | 삼성전자주식회사 | Method of inspecting a surface of a substrate and apparatus for performing the same |
US11024531B2 (en) * | 2017-01-23 | 2021-06-01 | Lam Research Corporation | Optimized low energy / high productivity deposition system |
US11315238B2 (en) * | 2019-12-12 | 2022-04-26 | Innolux Corporation | Method for manufacturing a product |
US11862499B2 (en) * | 2020-08-19 | 2024-01-02 | Applied Materials, Inc. | Multiplexing control of multiple positional sensors in device manufacturing machines |
Citations (75)
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US6658463B1 (en) | 1999-06-10 | 2003-12-02 | Hughes Electronics Corporation | Satellite multicast performance enhancing multicast HTTP proxy system and method |
-
2007
- 2007-10-23 US US11/876,865 patent/US20080219807A1/en not_active Abandoned
- 2007-10-23 US US11/876,887 patent/US20080219811A1/en not_active Abandoned
- 2007-10-23 US US11/876,860 patent/US20080219806A1/en not_active Abandoned
- 2007-10-23 US US11/876,886 patent/US20080219810A1/en not_active Abandoned
- 2007-10-23 US US11/876,869 patent/US8812150B2/en active Active
- 2007-10-23 US US11/876,876 patent/US8267632B2/en active Active
- 2007-10-23 US US11/876,896 patent/US8602716B2/en active Active
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Also Published As
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US20080219810A1 (en) | 2008-09-11 |
US20080219812A1 (en) | 2008-09-11 |
US20080219806A1 (en) | 2008-09-11 |
US8602716B2 (en) | 2013-12-10 |
US20080219809A1 (en) | 2008-09-11 |
US8267632B2 (en) | 2012-09-18 |
US20080219811A1 (en) | 2008-09-11 |
US20080219807A1 (en) | 2008-09-11 |
US20080219808A1 (en) | 2008-09-11 |
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