US8666551B2 - Semiconductor-processing apparatus equipped with robot diagnostic module - Google Patents
Semiconductor-processing apparatus equipped with robot diagnostic module Download PDFInfo
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- US8666551B2 US8666551B2 US12/341,869 US34186908A US8666551B2 US 8666551 B2 US8666551 B2 US 8666551B2 US 34186908 A US34186908 A US 34186908A US 8666551 B2 US8666551 B2 US 8666551B2
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- end effector
- wafer transfer
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- diagnostic module
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37125—Photosensor, as contactless analog position sensor, signal as function of position
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37608—Center and diameter of hole, wafer, object
Definitions
- the present invention relates to a semiconductor manufacturing apparatus, as well as a diagnostic module for semiconductor wafer transfer equipment that constitutes a semiconductor manufacturing apparatus.
- Wafer displacement that occurs on the semiconductor wafer transfer equipment of the semiconductor manufacturing apparatus has become a major problem in the production of semiconductor wafers in recent years.
- process problems such as non-uniform film occur.
- Other problems may also occur, such as a semiconductor wafer dropping inside the semiconductor wafer storage chamber, or hitting the chamber and consequently getting damaged, in the process of returning the semiconductor wafer to the semiconductor wafer storage chamber.
- One cause of this wafer displacement is change in the shape of the semiconductor wafer transfer equipment.
- some processes implemented in semiconductor wafer processing chambers apply heat to semiconductor wafers.
- the tip parts of the semiconductor wafer transfer equipment that hold a semiconductor wafer (this tip part is sometimes called an “end effector”) undergo heat expansion as they transfer heated semiconductor wafers.
- the coefficient of expansion varies depending on the material used to make the tip part of the semiconductor wafer transfer equipment. In the case of aluminum, for example, which is used for tip parts of semiconductor wafer transfer equipment, if the temperature of the semiconductor wafer is 400° C. and the temperature of the tip part is approx. 200° C., the tip part expands by approx. 1.5 mm.
- FIGS. 2 , 3 and 4 illustrate examples of a semiconductor wafer transfer equipment with a semiconductor wafer clamping mechanism.
- FIG. 3 shows an example of a semiconductor wafer clamping mechanism in a semiconductor wafer transfer equipment.
- FIG. 4 shows an example of a condition where a semiconductor wafer W is placed on a semiconductor wafer transfer equipment.
- This semiconductor wafer transfer equipment has an end effector 22 on a transfer arm 26 which in turn is installed rotatably on a base 27 , and a wafer damper 21 is provided on a proximal end of the end effector 22 .
- the damper 21 has arms on both sides of the end effector and a pad 25 which is used to push the substrate is provided on a distal end of each arm.
- the semiconductor wafer is secured at the pads 23 at the tips (locations indicated by circles) by means of the clamping mechanism. If the end effector itself extends, however, the distance to each pad 23 becomes longer, as shown in FIG. 9 , and consequently the semiconductor wafer is pushed toward the outer periphery, or in the direction of the arrow, and becomes displaced.
- FIG. 9 is exaggerated for the purpose of illustration.
- a semiconductor wafer manufacturing apparatus is characterized in that it can have a diagnostic module for semiconductor wafer transfer equipment on one side of the semiconductor wafer transfer chamber in which no semiconductor wafer processing chamber is installed for the purpose of maintenance, for example, while one or more sensors are installed inside or outside of this module, so that when the semiconductor wafer transfer equipment is inserted into this module the position or shape of each end effector of the semiconductor wafer transfer equipment is detected and compared against the pre-registered normal condition, thereby diagnosing the integrity of the end effector of the semiconductor wafer transfer equipment.
- the sensors installed inside or outside the module they may be linear sensors if installed inside the module, or planar sensors (CCD) if installed outside the module. If linear sensors are used, the light emission unit and light receiving unit of a sensor may be installed vertically to detect changes in the end effector of the semiconductor wafer transfer equipment, and the light emission unit and light receiving unit of a sensor may additionally be installed in the horizontal direction to detect changes in the end effector of the semiconductor wafer transfer equipment in the height direction.
- FIG. 1 is a schematic drawing showing an example of a conventional semiconductor manufacturing apparatus having four semiconductor wafer processing chambers, two semiconductor wafer I/O chambers, and one semiconductor wafer transfer chamber that houses a semiconductor wafer transfer equipment having two arms.
- FIG. 2 is a schematic drawing showing an example of a conventional semiconductor wafer transfer equipment with a semiconductor wafer clamping mechanism.
- FIG. 3 is a schematic drawing showing an example of a semiconductor wafer clamping mechanism located inside a conventional semiconductor wafer transfer equipment.
- FIG. 4 is a schematic drawing showing an example of a condition where a semiconductor wafer is placed on a conventional semiconductor wafer transfer equipment.
- FIG. 5 is a schematic drawing showing an example of a semiconductor manufacturing apparatus in which a diagnostic module for semiconductor wafer transfer equipment is installed according to a configuration in an embodiment of the present invention.
- FIG. 6 is a schematic drawing showing an example of a condition of a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention, where an end effector of the semiconductor wafer transfer equipment is inserted into the module.
- FIG. 7 is a schematic drawing showing an example of positions where photosensors should be located inside a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention.
- FIG. 8 is a schematic drawing showing an example of a condition where light for an photosensor (linear sensor) with a width is partially blocked.
- FIG. 9 is a schematic drawing showing an example of an end effector of a semiconductor wafer transfer equipment which has extended in the direction of transferring semiconductor wafers due to heat expansion.
- FIG. 10 provides a schematic drawing of a longitudinal section view from the moving direction, showing an example of positions where photosensors should be located inside a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention in order to detect the position in the height direction of the end effector of the semiconductor wafer transfer equipment, as well as a schematic drawing of a plan view of the end effector.
- FIG. 11 is a schematic drawing showing an example of positions of photosensors if photosensors are to be added inside a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention.
- FIG. 12 a schematic drawing showing the operating principle of a reflection-type photosensor.
- FIG. 13 provides a schematic drawing of a side view from the moving direction, showing an example of positions of photosensors when photosensors are to be added inside a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention in order to detect the position in the height direction of the end effector of the semiconductor wafer transfer equipment, as well as a schematic drawing of a plan view of the end effector.
- FIG. 14 a schematic drawing of a top view of the diagnostic module for semiconductor wafer transfer equipment and photosensors shown in FIG. 13 .
- FIG. 15 is a schematic drawing of a section view from the moving direction, showing an example of installing a planar sensor (CCD) outside a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention, as well as a schematic drawing of a plan view of the end effector.
- CCD planar sensor
- FIG. 16 is a schematic drawing showing an example of positions where photosensors should be installed inside a diagnostic module for semiconductor wafer transfer equipment according to a configuration in an embodiment of the present invention, in a condition where the semiconductor wafer transfer equipment on which a semiconductor is placed is inserted into the module.
- An embodiment of the present invention provides a semiconductor-processing apparatus comprising: (i) a wafer transfer chamber provided with a wafer transfer robot therein, said wafer transfer robot having an end effector for carrying a wafer; (ii) at least one reactor connected to the wafer transfer chamber, and accessible to the wafer transfer robot; and (iii) a robot diagnostic module connected to the wafer transfer chamber and accessible to the wafer transfer robot, for diagnosing the transfer robot, said robot diagnostic module comprising at least one sensor for detecting a position of the end effector when the end effector is located inside the robot diagnostic module.
- the apparatus may further comprise a controller operating the reactor, the wafer transfer robot, and the robot diagnostic module, storing data on a reference position of the end effector, and comparing the detected position with the reference position, thereby detecting a deviation of the end effector, if any.
- the senor may be disposed in the robot diagnostic module at a position to detect a distal end of the end effector.
- the senor may be a photosensor comprised of a light emission unit for emitting light and a light receiving unit for receiving light from the light emission unit.
- the end effector is inserted between the light emission unit and the light receiving unit and blocks the light from the light emission unit, thereby changing an illuminance received by the light receiving unit.
- the data on the reference position stored in the controller is a reference illuminance, and the controller compares the illuminance received by the light receiving unit with the reference illuminance, thereby detecting a deviation of the end effector, if any.
- the senor may be a planar photosensor capable of detecting a shape of a distal end of the end effector.
- the data on the reference position stored in the controller may be a reference shape of the distal end of the end effector, and the controller may compare the detected shape of the distal end of the end effector with the reference shape, thereby detecting a deviation of the end effector, if any.
- the at least one sensor may comprise at least a first sensor and a second sensor.
- the first sensor is disposed at a position to detect a vertical position of a distal end of the end effector.
- the second sensor is disposed at a position to detect a horizontal position of the distal end of the end effector.
- the data on the reference position stored in the controller include a reference illuminance for the first sensor and a reference illuminance for the second sensor.
- the controller compares an illuminance detected by the first sensor when the end effector is located inside the robot diagnostic module with the reference illuminance for the first sensor.
- the controller also compares an illuminance detected by the second sensor when the end effector is located inside the robot diagnostic module with the reference illuminance for the second sensor. The comparisons lead to detecting a deviation of the end effector.
- the wafer transfer chamber may have a polygonal shape wherein the reactor is attached to one side of the polygonal shape, and the robot diagnostic module is attached to an other side of the polygonal shape. The other side is used for maintenance of the apparatus.
- the robot diagnostic module may be detachable from the other side when the apparatus is subjected to maintenance.
- the controller may insert the end effector of the wafer transfer robot inside the robot diagnostic module and detect a deviation of the end effector of the wafer transfer robot while a wafer is being processed in the reactor.
- the wafer transfer robot would have been at a home position or a stand-by position if the controller had not inserted the end effector of the wafer transfer robot inside the robot diagnostic module.
- the controller may stop processing a wafer when a deviation of the end effector is detected in the robot diagnostic module.
- the senor may be disposed at a position to detect a position of the end effector when the end effector is extended as if the end effector loads/unloads a wafer to/from the reactor.
- an embodiment provides a method for detecting a deviation of an end effector of a wafer transfer robot for a semiconductor-processing apparatus that comprises (i) a wafer transfer chamber provided with the wafer transfer robot therein and (ii) at least one reactor connected to the wafer transfer chamber and accessible to the wafer transfer robot.
- the method includes providing a robot diagnostic module connected to the wafer transfer chamber and accessible to the wafer transfer robot, for diagnosing the transfer robot.
- the robot diagnostic module includes at least one sensor for detecting a position of the end effector when the end effector is located inside the robot diagnostic module.
- the method also includes placing the end effector of the wafer transfer robot inside the robot diagnostic module.
- the method also includes detecting a position of the end effector using the sensor and comparing the detected position with a pre-recorded reference position, thereby detecting a deviation of the end effector, if any.
- detecting the position of the end effector may comprise detecting a position of a distal end of the end effector.
- the senor may be a photosensor comprised of a paired light emission and receiving units.
- the light emission unit emits light and the light receiving unit receives light from the light emission unit.
- the end effector is inserted between the light emission unit and the light receiving unit and blocks the light from the light emission unit, thereby changing an illuminance received by the light receiving unit.
- Detecting the position of the end effector may comprise detecting an illuminance received by the light receiving unit.
- Comparing the detected position with the pre-recorded reference position may comprise comparing the detected illuminance with a reference illuminance.
- the at least one sensor may comprise at least a first sensor and a second sensor.
- the first sensor is disposed at a position to detect a vertical position of a distal end of the end effector.
- the second sensor is disposed at a position to detect a horizontal position of the distal end of the end effector.
- Detecting the position of the end effector may comprise detecting an illuminance by the first sensor and an illuminance by the second sensor.
- Comparing the detected position with the pre-recorded reference position may comprise comparing the detected illuminance by the first sensor with a reference illuminance, and comparing the detected illuminance by the second sensor with a reference illuminance.
- placing the end effector of the wafer may comprise transferring the robot end effector inside the robot diagnostic module while a wafer is being processed in the reactor.
- the wafer transfer robot would have been at a home position or a stand-by position if the end effector of the wafer transfer robot had not been inserted inside the robot diagnostic module.
- Any of the foregoing methods may further comprise stopping processing a wafer when a deviation of the end effector is detected in the robot diagnostic module in the step of comparing the detected position with the pre-recorded reference position.
- FIG. 1 is a schematic drawing showing an example of a conventional semiconductor manufacturing apparatus. This apparatus comprises the following separate chambers (modules):
- IOC 1 , IOC 2 (In-Out Chambers) 5 , 6 Semiconductor wafer I/O chambers
- WHC (Wafer Handling Chamber) 7 Semiconductor wafer transfer chamber
- RC 1 , RC 2 , RC 3 , RC 4 (Reactor Chambers) 1 , 2 , 3 , 4 : Semiconductor wafer processing chambers
- a semiconductor wafer transfer equipment (vacuum robot, or VR) 8 is installed inside the semiconductor wafer transfer chamber.
- FIG. 2 shows a mechanism drawing of a semiconductor wafer damper 21 in FIG. 2 .
- the damper 21 operates in the directions of arrows shown in FIG. 3 , and is used to hold a semiconductor wafer that has been placed.
- FIG. 4 shows the semiconductor wafer transfer equipment in a condition where a semiconductor wafer is placed on it. In FIG. 4 , the direction in which the semiconductor wafer W is transferred is shown by an arrow, and two pads 23 which are used to secure the semiconductor wafer are also illustrated (locations indicated by circles).
- FIG. 1 only four semiconductor wafer processing chambers are installed, and a top side 9 of the semiconductor wafer transfer chamber in the figure is not used. This is because normally such an unused side is required for the maintenance of the semiconductor wafer processing chambers and semiconductor wafer transfer equipment of the semiconductor manufacturing apparatus.
- a diagnostic module for semiconductor wafer transfer equipment RDM 51 which is explained below, is installed on the unused side 9 of the semiconductor wafer transfer chamber, as shown in FIG. 5 .
- the same operation that inserts the semiconductor wafer transfer equipment into each semiconductor wafer processing chamber also inserts the semiconductor wafer transfer equipment into the RDM 51 , so that the relative position of the semiconductor wafer transfer equipment at each semiconductor wafer processing chamber can be recreated inside the RDM.
- the RDM 51 is removable and thus it can be removed at the time of the maintenance, thereby eliminating any maintenance problems of the module itself.
- RDM (Robot Diagnostic Module) 51 Diagnostic module for semiconductor wafer transfer equipment
- sensors are installed on this diagnostic module for semiconductor wafer transfer equipment to detect, using the sensors, the end effector of the semiconductor wafer transfer equipment when the end effector is inserted into the module, in order to diagnose the integrity of the end effector.
- linear photosensors linear sensors
- each comprising a light emission unit and a light receiving unit are installed inside the diagnostic module for semiconductor wafer transfer equipment.
- the present invention is not at all limited to these specific uses of sensors.
- FIG. 6 shows a condition where the semiconductor wafer transfer equipment in FIG. 2 is inserted into the diagnostic module for semiconductor wafer transfer equipment RDM 51 . At this time, the semiconductor wafer transfer equipment has no wafer on it.
- photosensors 71 are installed at the two positions of A and B (locations indicated by circles) in FIG. 7 , where it is assumed that the tips (tip pads 23 ) of the end effector 22 of the semiconductor wafer transfer equipment are at the correct positions.
- the photosensors used in this embodiment each comprise a pair of a light emission unit 81 and a light receiving unit 82 , where both have a certain width so that the sensor output changes according to the amount of light blocked by a light blocking object (end effector 22 ).
- the light emission unit 81 is a single light source that emits semiconductor laser light (such as laser light having a wavelength of 670 nm)
- the light receiving unit 82 comprises a CCD element arranged in a line shape.
- the photosensor has different dimensions for its width and length, and particularly the light receiving unit 52 has a longitudinal direction so as to properly detect wafer displacement
- the light receiving unit 82 and light emission unit 81 are preferably designed as a pair and have roughly the same shape.
- the light emission unit emits light through an area of 9 mm ⁇ 3 mm, while the light receiving unit has an effective receiving area of 7 mm ⁇ 0.085 mm (the aspect ratio of the effective receiving area is 10 to 100 times).
- the light emission unit 81 is positioned at the bottom, while the light receiving unit 82 is positioned at the top, in order to facilitate the position adjustment of the light receiving sensor.
- the positioning of the two is not limited to this arrangement.
- PBZ-CL007V laser line CCD manufactured by Yamatake
- the tips 23 of the end effector extend in the direction of transferring semiconductor wafers as shown in FIG. 9 (the expansion is exaggerated in the figure for the purpose of illustration).
- the semiconductor wafer is pushed in the extending direction of the end effector 22 by the semiconductor wafer clamping mechanism 21 of the semiconductor wafer transferring equipment, and the wafer is consequently displaced toward the outer periphery from its specified position.
- the two photosensors 71 installed at the positions shown in FIG. 7 can be used to detect any extension of the end effector 22 due to heat expansion. If FIG. 8 is used, this specifically means that when the end effector extends, light for the photosensor is blocked more than when the end effector 22 is at the correct position. Since the photosensor output drops as a result, it is recognized that an extension corresponding to the drop in output has occurred.
- the photosensors 71 in the diagnostic module for semiconductor wafer transfer equipment allow for detection of change in the shape of the end effector of the semiconductor wafer transfer equipment. Note that if the end effector of the semiconductor wafer transfer equipment drops out for some reason, which is different from the situation explained above, the resulting shape change can still be detected by a method similar to the above (in this case, the photosensor output will increase).
- FIG. 10 provides a longitudinal section view of a diagnostic module for semiconductor wafer transfer equipment according to an embodiment of the present invention, as well as a schematic drawing showing a plan view of the end effector 22 .
- the photosensors A, A′, B, B′ are the same as those shown in FIG. 7 , and are installed on the top and bottom opposing surfaces of the RDM.
- photosensors C, C′ are added in the horizontal positions near the opposing side walls of the RDM. In this case, light for the photosensors is completely blocked when the semiconductor wafer transfer equipment is positioned at the correct height. If something happens and the stopped position of the semiconductor wafer transfer equipment becomes lower or higher, however, light for one or more photosensors is not blocked and thus the photosensor output increases. This way, the height (position in the Z direction) of the semiconductor wafer transfer equipment can be detected.
- J and K in FIG. 11 indicate positions corresponding to wafer pads 24 near the center of the semiconductor wafer transfer equipment. However, these locations undergo wear and tear after a long period of use. Since these locations are normally given a mirror surface finish, reflection-type photosensors can be used to detect such wear and tear that results in lower reflection. Accordingly, reflection-type photosensors are used at the positions of J and K in FIG. 11 . While FIG. 8 illustrates the operating principle of a transmission-type photosensor, FIG. 12 illustrates the operating principle of a reflection-type photosensor.
- an photosensor is further installed at the position of F (proximal inner end of the end effector) in FIG. 11 , it is possible to detect a possible displacement caused by factors other than heat expansion, because this location receives little impact from heat expansion of the end effector.
- a light emission unit 121 and light receiving unit 122 are both positioned above the end effector 22 .
- Light emitted by the light emission unit 122 reflects on the surface of the end effector 22 , and is received by the light receiving unit 122 , to permit evaluation of the condition of wear according to the intensity of reflected light.
- the light emission unit 121 and light receiving unit 122 used here can be the same as the light emission unit 81 and light receiving unit 82 shown in FIG. 8 .
- FIG. 13 is a schematic drawing showing a side view of a diagnostic module for semiconductor wafer transfer equipment.
- the photosensor C shown in FIG. 10 is positioned at the tip 23 of the semiconductor wafer transfer equipment in FIG. 13 .
- installing an photosensor at the position of L in FIG. 13 allows for detection of the condition of warping and deflection of the end effector 22 of the semiconductor wafer transfer equipment.
- FIG. 14 gives a top view of FIG. 13 , showing the position relationships of photosensors C, C′, L, L′.
- the example shown in FIG. 15 has a planar sensor (CCD) 151 installed above the module 51 .
- CCD planar sensor
- a two-dimensional image storage area is allocated to store and register an image of the end effector 22 of the semiconductor wafer transfer equipment at the correct position, which means that any change in the shape of the end effector of the semiconductor wafer transfer equipment can be detected by comparing the two-dimensional image taken when the semiconductor wafer transfer equipment is inserted into the diagnostic module, against the pre-registered two-dimensional image.
- the semiconductor wafer transfer equipment in a normal lot processing of semiconductor wafers some type of semiconductor process is performed in the semiconductor wafer processing chamber after the semiconductor wafer transfer equipment has transferred a semiconductor wafer into the semiconductor wafer processing chamber or transferred a semiconductor wafer out of the semiconductor wafer processing chamber, and accordingly the semiconductor wafer transfer equipment remains on standby during this process. Normally, therefore, the semiconductor wafer transfer equipment can be diagnosed without affecting the throughput of the semiconductor manufacturing apparatus, by inserting the semiconductor wafer transfer equipment into the module for diagnosis at these timings where the semiconductor wafer transfer equipment is on standby.
- the semiconductor wafer transfer equipment may stand by with a semiconductor wafer placed on it.
- three points (W 1 , W 2 and W 3 ) on the outer periphery of the semiconductor wafer W at the correct position are detected by photosensors, as shown in FIG. 16 .
- photosensors By installing photosensors this way, any displacement of the semiconductor wafer placed on the semiconductor wafer transfer equipment can also be detected.
- the apparatus controller stops the semiconductor wafer processing of the apparatus to prevent defective semiconductor wafers from being manufactured.
- a signal can be sent to a controller 52 that controls the entire apparatus shown in FIG. 5 in order to implement a desired control through this controller.
- This controller can have a memory function to store information regarding the correct position of the end effector beforehand.
- this diagnostic module for semiconductor wafer transfer equipment preferably has a structure that can be easily removed at the time of maintenance. This way, diagnosis of the semiconductor wafer transfer equipment can be performed without affecting the maintainability.
- the diagnostic module for semiconductor wafer transfer equipment does not perform any processing of semiconductor wafers, and thus it can have any sensors installed inside.
- any sensors installed inside.
- a semiconductor manufacturing apparatus provided with a diagnostic module for semiconductor wafer transfer equipment according to at least one embodiment of the present invention allows for diagnosis of the end effector of the semiconductor wafer transfer equipment without lowering the lot processing throughput of semiconductor wafers.
- the module has a structure that can be easily removed at the time of maintenance, which enables diagnosis without lowering the maintainability.
- a semiconductor manufacturing apparatus comprising: a semiconductor wafer transfer chamber, a semiconductor wafer processing chamber, a semiconductor wafer transfer equipment, and a diagnostic module for semiconductor wafer transfer equipment; said semiconductor manufacturing apparatus characterized in that the diagnostic module for semiconductor wafer transfer equipment has at least one sensor at a specified position and when the semiconductor wafer transfer equipment inserts an end effector into the diagnostic module for semiconductor wafer transfer equipment, the sensor detects the end effector of the semiconductor wafer transfer equipment, after which the detected information is compared against a record of a normal condition of the end effector of the semiconductor wafer transfer equipment, in order to detect a change in the end effector of the semiconductor wafer transfer equipment.
- the sensor represents a pair of photosensors comprising a light emission unit and a light receiving unit so that when the end effector of the semiconductor wafer transfer equipment blocks light for the photosensor, the amount of blocked light for the photosensor is compared against a pre-registered amount of light blocked at the correct position of the end effector of the semiconductor wafer transfer equipment, in order to detect a change in the end effector of the semiconductor wafer transfer equipment.
- a semiconductor manufacturing apparatus characterized in that the sensor is a planar photosensor, where the shape of the end effector of the semiconductor wafer transfer equipment is recognized and compared against a pre-registered correct shape of the end effector of the semiconductor wafer transfer equipment, in order to detect a change in the end effector of the semiconductor wafer transfer equipment.
- a semiconductor manufacturing apparatus characterized in that there are at least two units of the photosensor, where a photosensor 1 is arranged in the top/bottom vertical direction of the end effector of the semiconductor wafer transfer equipment, while a photosensor 2 is arranged in the left/right horizontal direction of the end effector of the semiconductor wafer transfer equipment, to compare the amount of blocked light for each photosensor against a pre-registered amount of light blocked at the correct position of the end effector of the semiconductor wafer transfer equipment, in order to detect a change in the end effector of the semiconductor wafer transfer equipment.
- a semiconductor manufacturing apparatus characterized in that the diagnostic module for semiconductor wafer transfer equipment is installed on one side of the semiconductor wafer transfer chamber where no semiconductor wafer processing chamber is originally installed for the purpose of maintenance.
- a semiconductor manufacturing apparatus characterized in that the diagnostic module for semiconductor wafer transfer equipment can be removed and reinstalled at the time of maintenance.
- a semiconductor manufacturing apparatus characterized in that while a semiconductor wafer is being processed in the semiconductor wafer processing chamber and therefore the semiconductor wafer transfer equipment is not operating, the semiconductor wafer transfer equipment inserts the end effector into the diagnostic module for semiconductor wafer transfer equipment, in order to detect a change in the end effector of the semiconductor wafer transfer equipment.
- a semiconductor manufacturing apparatus characterized in that the manufacturing process of semiconductor wafers is stopped upon detection of any change in the end effector of the semiconductor wafer transfer equipment in the diagnostic module for semiconductor wafer transfer equipment.
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US8758514B2 (en) * | 2007-03-02 | 2014-06-24 | Asm Japan K.K. | Cluster type semiconductor processing apparatus |
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