US8516695B2 - Method for forming a circuit board via structure for high speed signaling - Google Patents
Method for forming a circuit board via structure for high speed signaling Download PDFInfo
- Publication number
- US8516695B2 US8516695B2 US13/190,597 US201113190597A US8516695B2 US 8516695 B2 US8516695 B2 US 8516695B2 US 201113190597 A US201113190597 A US 201113190597A US 8516695 B2 US8516695 B2 US 8516695B2
- Authority
- US
- United States
- Prior art keywords
- signal
- power
- planes
- forming
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
- Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (11)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/190,597 US8516695B2 (en) | 2005-04-26 | 2011-07-26 | Method for forming a circuit board via structure for high speed signaling |
US14/010,051 US9055702B2 (en) | 2005-04-26 | 2013-08-26 | Method for forming a circuit board via structure for high speed signaling |
US14/713,836 US9622358B2 (en) | 2005-04-26 | 2015-05-15 | Method for forming a circuit board via structure for high speed signaling |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/114,420 US20060237227A1 (en) | 2005-04-26 | 2005-04-26 | Circuit board via structure for high speed signaling |
US11/533,005 US7676919B2 (en) | 2005-04-26 | 2006-09-19 | Method for forming a circuit board via structure for high speed signaling |
US12/699,428 US7992297B2 (en) | 2005-04-26 | 2010-02-03 | Method for forming a circuit board via structure for high speed signaling |
US13/190,597 US8516695B2 (en) | 2005-04-26 | 2011-07-26 | Method for forming a circuit board via structure for high speed signaling |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/699,428 Continuation US7992297B2 (en) | 2005-04-26 | 2010-02-03 | Method for forming a circuit board via structure for high speed signaling |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/010,051 Division US9055702B2 (en) | 2005-04-26 | 2013-08-26 | Method for forming a circuit board via structure for high speed signaling |
Publications (2)
Publication Number | Publication Date |
---|---|
US20110277323A1 US20110277323A1 (en) | 2011-11-17 |
US8516695B2 true US8516695B2 (en) | 2013-08-27 |
Family
ID=37185678
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/114,420 Abandoned US20060237227A1 (en) | 2005-04-26 | 2005-04-26 | Circuit board via structure for high speed signaling |
US11/533,005 Expired - Fee Related US7676919B2 (en) | 2005-04-26 | 2006-09-19 | Method for forming a circuit board via structure for high speed signaling |
US12/699,428 Active 2025-04-29 US7992297B2 (en) | 2005-04-26 | 2010-02-03 | Method for forming a circuit board via structure for high speed signaling |
US13/190,597 Expired - Fee Related US8516695B2 (en) | 2005-04-26 | 2011-07-26 | Method for forming a circuit board via structure for high speed signaling |
US14/010,051 Active US9055702B2 (en) | 2005-04-26 | 2013-08-26 | Method for forming a circuit board via structure for high speed signaling |
US14/713,836 Active US9622358B2 (en) | 2005-04-26 | 2015-05-15 | Method for forming a circuit board via structure for high speed signaling |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/114,420 Abandoned US20060237227A1 (en) | 2005-04-26 | 2005-04-26 | Circuit board via structure for high speed signaling |
US11/533,005 Expired - Fee Related US7676919B2 (en) | 2005-04-26 | 2006-09-19 | Method for forming a circuit board via structure for high speed signaling |
US12/699,428 Active 2025-04-29 US7992297B2 (en) | 2005-04-26 | 2010-02-03 | Method for forming a circuit board via structure for high speed signaling |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/010,051 Active US9055702B2 (en) | 2005-04-26 | 2013-08-26 | Method for forming a circuit board via structure for high speed signaling |
US14/713,836 Active US9622358B2 (en) | 2005-04-26 | 2015-05-15 | Method for forming a circuit board via structure for high speed signaling |
Country Status (1)
Country | Link |
---|---|
US (6) | US20060237227A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9055702B2 (en) | 2005-04-26 | 2015-06-09 | Micron Technology, Inc. | Method for forming a circuit board via structure for high speed signaling |
US10927509B2 (en) | 2017-06-07 | 2021-02-23 | S.W.N.G., Inc. | Spike driver cab enclosure |
US11220791B2 (en) | 2019-04-11 | 2022-01-11 | S.W.N.G., Inc. | Spike puller workhead with independent control |
US11753775B2 (en) | 2020-08-31 | 2023-09-12 | S.W.N.G., Inc. | Rail threader workhead |
US11795628B2 (en) | 2019-04-12 | 2023-10-24 | S.W.N.G., Inc. | Spike tray head with replaceable wear plates |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10324477A1 (en) * | 2003-05-30 | 2004-12-30 | Carl Zeiss Smt Ag | Microlithographic projection exposure system |
US20070193775A1 (en) * | 2006-02-17 | 2007-08-23 | Micron Technology, Inc. | Impedance matching via structure for high-speed printed circuit boards and method of determining same |
US20070244684A1 (en) * | 2006-04-17 | 2007-10-18 | Dell Products L.P. | Method to model 3-D PCB PTH via |
US7781889B2 (en) * | 2006-06-29 | 2010-08-24 | Intel Corporation | Shielded via |
US8248816B2 (en) * | 2006-10-31 | 2012-08-21 | Hewlett-Packard Development Company, L.P. | Methods of designing multilayer circuitry, multilayer circuit design apparatuses, and computer-usable media |
US20080289869A1 (en) * | 2007-01-10 | 2008-11-27 | Hsu Hsiuan-Ju | Novel via structure for improving signal integrity |
US20090008139A1 (en) * | 2007-07-03 | 2009-01-08 | Sony Ericsson Mobile Communications Ab | Multilayer pwb and a method for producing the multilayer pwb |
US20090049414A1 (en) * | 2007-08-16 | 2009-02-19 | International Business Machines Corporation | Method and system for reducing via stub resonance |
TWI405314B (en) * | 2008-05-16 | 2013-08-11 | 矽品精密工業股份有限公司 | Packaging substrate having landless conductive traces disposed thereon |
CN201230402Y (en) * | 2008-07-03 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | Printed circuit board |
CN101877935B (en) * | 2009-04-29 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | Mainboard wiring method and mainboard for wiring by using same |
JP4799651B2 (en) * | 2009-08-31 | 2011-10-26 | 株式会社東芝 | Design support apparatus and design support method |
WO2012045000A1 (en) * | 2010-09-30 | 2012-04-05 | Aviat Networks, Inc. | Systems and methods for improved chip device performance |
JP5775747B2 (en) * | 2011-06-03 | 2015-09-09 | 新光電気工業株式会社 | Wiring board and manufacturing method thereof |
US8610000B2 (en) * | 2011-10-07 | 2013-12-17 | Tyco Electronics Corporation | Circuit board for an electrical connector |
US8957325B2 (en) | 2013-01-15 | 2015-02-17 | Fujitsu Limited | Optimized via cutouts with ground references |
KR102041243B1 (en) | 2013-04-26 | 2019-11-07 | 삼성전자주식회사 | Semiconductor package |
US10292259B2 (en) * | 2016-04-29 | 2019-05-14 | Stmicroelectronics (Grenoble 2) Sas | Electrical shielding using bar vias and associated methods |
JP7134803B2 (en) * | 2018-09-19 | 2022-09-12 | 株式会社東芝 | Printed board |
CN113163600A (en) * | 2020-12-30 | 2021-07-23 | 安捷利(番禺)电子实业有限公司 | Electromagnetic film edge covering method for FPC (flexible printed circuit) part |
CN115642137A (en) * | 2021-07-20 | 2023-01-24 | 长鑫存储技术有限公司 | Semiconductor structure |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421083A (en) | 1994-04-01 | 1995-06-06 | Motorola, Inc. | Method of manufacturing a circuit carrying substrate having coaxial via holes |
US5949030A (en) | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
US6479764B1 (en) | 2000-05-10 | 2002-11-12 | International Business Machines Corporation | Via structure with dual current path |
US20020179332A1 (en) | 2001-05-29 | 2002-12-05 | Mitsubishi Denki Kabushiki Kaisha | Wiring board and a method for manufacturing the wiring board |
US20030098179A1 (en) | 2001-11-29 | 2003-05-29 | Fujitsu Limited | Multi-layer wiring board and method of producing same |
US20030188889A1 (en) | 2002-04-09 | 2003-10-09 | Ppc Electronic Ag | Printed circuit board and method for producing it |
US6717059B2 (en) | 2000-10-18 | 2004-04-06 | Nitto Denko Corporation | Circuit board and connection structure of terminal portion of the same |
US6789241B2 (en) | 2002-10-31 | 2004-09-07 | Sun Microsystems, Inc. | Methodology for determining the placement of decoupling capacitors in a power distribution system |
US6796028B2 (en) | 2000-08-23 | 2004-09-28 | Micron Technology, Inc. | Method of Interconnecting substrates for electrical coupling of microelectronic components |
US6800814B2 (en) | 2001-01-17 | 2004-10-05 | Canon Kabushiki Kaisha | Multi-layered printed wiring board |
US6809267B1 (en) | 1998-08-13 | 2004-10-26 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
US20050183883A1 (en) | 2004-02-19 | 2005-08-25 | Bois Karl J. | Printed circuit board substrate and method for constructing same |
US20060065432A1 (en) | 2004-09-29 | 2006-03-30 | Hitachi Cable, Ltd. | Mounting structure for electronic components |
US20060076160A1 (en) | 2004-10-09 | 2006-04-13 | Hon Hai Precision Industry Co., Ltd. | Multilayer printed circuit board |
US20060237227A1 (en) | 2005-04-26 | 2006-10-26 | Shiyou Zhao | Circuit board via structure for high speed signaling |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2819523B2 (en) * | 1992-10-09 | 1998-10-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Printed wiring board and method of manufacturing the same |
-
2005
- 2005-04-26 US US11/114,420 patent/US20060237227A1/en not_active Abandoned
-
2006
- 2006-09-19 US US11/533,005 patent/US7676919B2/en not_active Expired - Fee Related
-
2010
- 2010-02-03 US US12/699,428 patent/US7992297B2/en active Active
-
2011
- 2011-07-26 US US13/190,597 patent/US8516695B2/en not_active Expired - Fee Related
-
2013
- 2013-08-26 US US14/010,051 patent/US9055702B2/en active Active
-
2015
- 2015-05-15 US US14/713,836 patent/US9622358B2/en active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421083A (en) | 1994-04-01 | 1995-06-06 | Motorola, Inc. | Method of manufacturing a circuit carrying substrate having coaxial via holes |
US5949030A (en) | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
US6809267B1 (en) | 1998-08-13 | 2004-10-26 | Sony Chemicals Corporation | Flexible printed wiring board and its production method |
US6479764B1 (en) | 2000-05-10 | 2002-11-12 | International Business Machines Corporation | Via structure with dual current path |
US6796028B2 (en) | 2000-08-23 | 2004-09-28 | Micron Technology, Inc. | Method of Interconnecting substrates for electrical coupling of microelectronic components |
US6717059B2 (en) | 2000-10-18 | 2004-04-06 | Nitto Denko Corporation | Circuit board and connection structure of terminal portion of the same |
US6800814B2 (en) | 2001-01-17 | 2004-10-05 | Canon Kabushiki Kaisha | Multi-layered printed wiring board |
US20020179332A1 (en) | 2001-05-29 | 2002-12-05 | Mitsubishi Denki Kabushiki Kaisha | Wiring board and a method for manufacturing the wiring board |
US6787710B2 (en) | 2001-05-29 | 2004-09-07 | Mitsubishi Denki Kabushiki Kaisha | Wiring board and a method for manufacturing the wiring board |
US20030098179A1 (en) | 2001-11-29 | 2003-05-29 | Fujitsu Limited | Multi-layer wiring board and method of producing same |
US6812412B2 (en) | 2001-11-29 | 2004-11-02 | Fujitsu Limited | Multi-layer wiring board and method of producing same |
US20030188889A1 (en) | 2002-04-09 | 2003-10-09 | Ppc Electronic Ag | Printed circuit board and method for producing it |
US6789241B2 (en) | 2002-10-31 | 2004-09-07 | Sun Microsystems, Inc. | Methodology for determining the placement of decoupling capacitors in a power distribution system |
US20050183883A1 (en) | 2004-02-19 | 2005-08-25 | Bois Karl J. | Printed circuit board substrate and method for constructing same |
US20060065432A1 (en) | 2004-09-29 | 2006-03-30 | Hitachi Cable, Ltd. | Mounting structure for electronic components |
US20060076160A1 (en) | 2004-10-09 | 2006-04-13 | Hon Hai Precision Industry Co., Ltd. | Multilayer printed circuit board |
US20060237227A1 (en) | 2005-04-26 | 2006-10-26 | Shiyou Zhao | Circuit board via structure for high speed signaling |
US20070007031A1 (en) | 2005-04-26 | 2007-01-11 | Micron Technology, Inc. | Method for Forming a Circuit Board Via Structure for High Speed Signaling |
US20100132191A1 (en) | 2005-04-26 | 2010-06-03 | Micron Technology, Inc. | Method for Forming a Circuit Board Via Structure for High Speed Signaling |
US7992297B2 (en) | 2005-04-26 | 2011-08-09 | Micron Technology, Inc. | Method for forming a circuit board via structure for high speed signaling |
Non-Patent Citations (4)
Title |
---|
"PCB/Overview," published at www.ul.ie/~rinne/ee6471/ee6471%20wk11.pdf (Apr. 11, 2004). |
"PCB/Overview," published at www.ul.ie/˜rinne/ee6471/ee6471%20wk11.pdf (Apr. 11, 2004). |
Houfei Chen et al., "Coupling of Large Numbers of Vias in Electronic Packaging Structures and Differential Signaling," IEEE MTT-S International Microwave Symposium, Seattle, WA, Jun. 2-7 (2002). |
Thomas Neu, "Designing Controlled Impedance Vias," at 67-72, EDN (Oct. 2, 2003). |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9055702B2 (en) | 2005-04-26 | 2015-06-09 | Micron Technology, Inc. | Method for forming a circuit board via structure for high speed signaling |
US9622358B2 (en) | 2005-04-26 | 2017-04-11 | Micron Technology, Inc. | Method for forming a circuit board via structure for high speed signaling |
US10927509B2 (en) | 2017-06-07 | 2021-02-23 | S.W.N.G., Inc. | Spike driver cab enclosure |
US11746474B2 (en) | 2017-06-07 | 2023-09-05 | S.W.N.G., Inc. | Spike driver cab enclosure |
US11220791B2 (en) | 2019-04-11 | 2022-01-11 | S.W.N.G., Inc. | Spike puller workhead with independent control |
US11624158B2 (en) | 2019-04-11 | 2023-04-11 | S.W.N.G., Inc. | Spike puller workhead with independent control |
US11795628B2 (en) | 2019-04-12 | 2023-10-24 | S.W.N.G., Inc. | Spike tray head with replaceable wear plates |
US11753775B2 (en) | 2020-08-31 | 2023-09-12 | S.W.N.G., Inc. | Rail threader workhead |
Also Published As
Publication number | Publication date |
---|---|
US20110277323A1 (en) | 2011-11-17 |
US20060237227A1 (en) | 2006-10-26 |
US20150250060A1 (en) | 2015-09-03 |
US20130340250A1 (en) | 2013-12-26 |
US7676919B2 (en) | 2010-03-16 |
US7992297B2 (en) | 2011-08-09 |
US20070007031A1 (en) | 2007-01-11 |
US9622358B2 (en) | 2017-04-11 |
US9055702B2 (en) | 2015-06-09 |
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