US8354742B2 - Method and apparatus for a package having multiple stacked die - Google Patents
Method and apparatus for a package having multiple stacked die Download PDFInfo
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- US8354742B2 US8354742B2 US12/060,115 US6011508A US8354742B2 US 8354742 B2 US8354742 B2 US 8354742B2 US 6011508 A US6011508 A US 6011508A US 8354742 B2 US8354742 B2 US 8354742B2
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Abstract
Description
Claims (30)
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Cited By (5)
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US20110266699A1 (en) * | 2010-04-26 | 2011-11-03 | Commissariat A I'energie Atomique Et Aux Energies Alternatives | Method for manufacturing a microelectronic device and a microelectronic device thus manufactured |
US8981574B2 (en) | 2012-12-20 | 2015-03-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
US9437586B2 (en) | 2013-10-22 | 2016-09-06 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
US20170077035A1 (en) * | 2011-03-22 | 2017-03-16 | Nantong Fujitsu Microelectronics Co., Ltd. | System-level packaging structures |
US10923428B2 (en) | 2018-07-13 | 2021-02-16 | Samsung Electronics Co., Ltd. | Semiconductor package having second pad electrically connected through the interposer chip to the first pad |
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US8928153B2 (en) | 2011-04-21 | 2015-01-06 | Tessera, Inc. | Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
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US10957672B2 (en) * | 2017-11-13 | 2021-03-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of manufacturing the same |
US20240006278A1 (en) * | 2022-07-01 | 2024-01-04 | Mediatek Inc. | Multi-die qfn hybrid package |
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US20110266699A1 (en) * | 2010-04-26 | 2011-11-03 | Commissariat A I'energie Atomique Et Aux Energies Alternatives | Method for manufacturing a microelectronic device and a microelectronic device thus manufactured |
US8530276B2 (en) * | 2010-04-26 | 2013-09-10 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for manufacturing a microelectronic device and a microelectronic device thus manufactured |
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US10741499B2 (en) * | 2011-03-22 | 2020-08-11 | Tongfu Microelectronics Co., Ltd. | System-level packaging structures |
US8981574B2 (en) | 2012-12-20 | 2015-03-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
US9633973B2 (en) | 2012-12-20 | 2017-04-25 | Samsung Electronics Co., Ltd. | Semiconductor package |
US9437586B2 (en) | 2013-10-22 | 2016-09-06 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
US10923428B2 (en) | 2018-07-13 | 2021-02-16 | Samsung Electronics Co., Ltd. | Semiconductor package having second pad electrically connected through the interposer chip to the first pad |
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