US8014991B2 - System and method for using first-principles simulation to characterize a semiconductor manufacturing process - Google Patents
System and method for using first-principles simulation to characterize a semiconductor manufacturing process Download PDFInfo
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- US8014991B2 US8014991B2 US10/673,501 US67350103A US8014991B2 US 8014991 B2 US8014991 B2 US 8014991B2 US 67350103 A US67350103 A US 67350103A US 8014991 B2 US8014991 B2 US 8014991B2
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- semiconductor processing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/44—Arrangements for executing specific programs
- G06F9/455—Emulation; Interpretation; Software simulation, e.g. virtualisation or emulation of application or operating system execution engines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/08—Probabilistic or stochastic CAD
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Evolutionary Computation (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Drying Of Semiconductors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
where
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where
Claims (39)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/673,501 US8014991B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to characterize a semiconductor manufacturing process |
US10/673,583 US8050900B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
JP2006533881A JP5032118B2 (en) | 2003-09-30 | 2004-09-30 | A system and method using a first principle simulation in a semiconductor manufacturing process. |
PCT/US2004/028819 WO2005034185A2 (en) | 2003-09-30 | 2004-09-30 | System and method for on-tool semiconductor simulation |
CNB2004800285180A CN100476733C (en) | 2003-09-30 | 2004-09-30 | System and method for semiconductor simulation on tool |
KR1020067006632A KR101094620B1 (en) | 2003-09-30 | 2004-09-30 | Method and system of facilitating a process performed by a semiconductor processing tool, system, and computer readable medium |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/673,501 US8014991B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to characterize a semiconductor manufacturing process |
US10/673,583 US8050900B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050071036A1 US20050071036A1 (en) | 2005-03-31 |
US8014991B2 true US8014991B2 (en) | 2011-09-06 |
Family
ID=34426369
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/673,583 Expired - Fee Related US8050900B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
US10/673,501 Expired - Fee Related US8014991B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to characterize a semiconductor manufacturing process |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/673,583 Expired - Fee Related US8050900B2 (en) | 2003-09-30 | 2003-09-30 | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
Country Status (5)
Country | Link |
---|---|
US (2) | US8050900B2 (en) |
JP (1) | JP5032118B2 (en) |
KR (1) | KR101094620B1 (en) |
CN (1) | CN100476733C (en) |
WO (1) | WO2005034185A2 (en) |
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US20100082138A1 (en) * | 2008-09-27 | 2010-04-01 | Hayes Timothy R | System and Method for a Demand Driven Lean Production Control System |
US20100083160A1 (en) * | 2008-09-27 | 2010-04-01 | Hayes Timothy R | System and Method for a Demand Driven Lean Production Control System |
US20100330710A1 (en) * | 2009-06-30 | 2010-12-30 | Jiangxin Wang | Methods for constructing an optimal endpoint algorithm |
US20100332014A1 (en) * | 2009-06-30 | 2010-12-30 | Luc Albarede | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
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US20100332012A1 (en) * | 2009-06-30 | 2010-12-30 | Chung-Ho Huang | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
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US8296687B2 (en) * | 2003-09-30 | 2012-10-23 | Tokyo Electron Limited | System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool |
US8036869B2 (en) | 2003-09-30 | 2011-10-11 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model |
US8073667B2 (en) | 2003-09-30 | 2011-12-06 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process |
US8032348B2 (en) * | 2003-09-30 | 2011-10-04 | Tokyo Electron Limited | System and method for using first-principles simulation to facilitate a semiconductor manufacturing process |
US8050900B2 (en) * | 2003-09-30 | 2011-11-01 | Tokyo Electron Limited | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
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CN100476733C (en) | 2009-04-08 |
KR20070001872A (en) | 2007-01-04 |
JP2007507890A (en) | 2007-03-29 |
WO2005034185A3 (en) | 2005-10-20 |
US20050071036A1 (en) | 2005-03-31 |
CN1860440A (en) | 2006-11-08 |
US20050071039A1 (en) | 2005-03-31 |
KR101094620B1 (en) | 2011-12-15 |
US8050900B2 (en) | 2011-11-01 |
JP5032118B2 (en) | 2012-09-26 |
WO2005034185A2 (en) | 2005-04-14 |
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