US7487824B2 - Liquid cooling device - Google Patents
Liquid cooling device Download PDFInfo
- Publication number
- US7487824B2 US7487824B2 US11/309,562 US30956206A US7487824B2 US 7487824 B2 US7487824 B2 US 7487824B2 US 30956206 A US30956206 A US 30956206A US 7487824 B2 US7487824 B2 US 7487824B2
- Authority
- US
- United States
- Prior art keywords
- heat sink
- receiving chamber
- outer tube
- working fluid
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates in general to a cooling device, and more particularly to a liquid cooling device used in association with electronic components.
- CPUs central processing units
- cooling devices In order to remove the heat of the CPUs and hence keep the CPUs in normal working order, cooling devices must be provided to the CPUs to dissipate heat therefrom. Conventionally, extruded heat sinks combined with electric fans are frequently used for this heat dissipation purpose. These conventional cooling devices sufficiently satisfy the heat dissipation requirements for CPUs with low frequencies, but are unsatisfactory at cooling down the current CPUs with high frequencies. Therefore, cooling devices with high heat dissipation efficiencies are needed for dissipating heat generated by high frequency CPUs.
- a liquid cooling device in accordance with an embodiment includes a base enclosing working fluid therein and absorbing heat from a heat source, a heat sink fluidically connecting with the base, and a pump driving the working fluid to circulate between the base and the heat sink.
- the heat sink has closed top and bottom ends, and includes an outer tube and an inner tube disposed in the outer tube.
- First and second receiving chambers are respectively formed in the inner tube and between an inner surface of the outer tube and an outer surface of the inner tube for receiving the working fluid therein.
- the first receiving chamber communicates with the second receiving chamber at an end thereof so that the working fluid flows from the base, the pump, the first receiving chamber, then the second receiving chamber and finally back to the base.
- FIG. 1 is an assembled, isometric view of a liquid cooling device in accordance with a preferred embodiment of the present invention
- FIG. 2 is an exploded, isometric view of a heat sink of the liquid cooling device of FIG. 1 ;
- FIG. 3 is an assembled view of the heat sink of FIG. 2 ;
- FIG. 4 is a longitudinal sectional view of the heat sink of FIG. 3 ;
- FIG. 5 is a cross sectional view of FIG. 3 , taken along line V-V thereof.
- the liquid cooling device 1 comprises a heat sink 10 , a base 2 , a pump 3 , a fan 4 , and two conduits 5 .
- the base 2 thermally contacts with a heat source, such as a CPU (not shown), for absorbing heat therefrom.
- the conduits 5 connect the base 2 with the heat sink 10 , cooperatively defining a fluid channel therebetween for passage of a working fluid.
- the pump 3 is disposed on the base 2 , driving the working fluid to circulate in the fluid channel.
- the heat absorbed from the heat source is transferred from the base 2 to the heat sink 10 by the circulation of the working fluid.
- the fan 4 is mounted on the heat sink 10 , providing an airflow flowing through the heat sink 10 to take heat thereaway.
- the heat sink 10 includes an outer tube 100 , an inner tube 30 coaxially disposed in the outer tube 100 , circular first and second covering plates 20 , 40 attached to bottom and top ends of the outer tube 100 , and a seat 50 disposed below the outer tube 100 .
- the first and second covering plates 20 , 40 , and the outer tube 100 cooperatively define a hermetical chamber (not labeled) therebetween.
- the inner tube 30 is disposed in the hermetical chamber with a bottom end thereof coplanar with the bottom end of the outer tube 100 .
- the first covering plate 20 has a top surface 23 coplanar with the bottom ends of the outer and inner tubes 100 , 30 .
- Two O-rings are disposed between the bottom ends of the outer and inner tubes 100 , 30 and the top surface 23 of the first covering plate 20 , so as to obtain a hermetical attachment therebetween.
- a first receiving chamber 34 is enclosed by the top surface of the first covering plate 20 and an inner surface of the inner tube 30 .
- a second receiving chamber 14 is enclosed by the top surface of the first covering plate 20 , an inner surface of the outer tube 100 and an outer surface of the inner tube 30 .
- the second covering plate 40 spaces a distance from a top end of the inner tube 30 , so that the first receiving chamber 34 communicates with the second receiving chamber 14 at a top end of the heat sink 10 .
- the second covering plate 40 may contact with the top end of the inner tube 30 , with the first receiving chamber 34 communicating with the second receiving chamber 14 via a plurality of holes or grooves (not shown) extending through a sidewall of the inner tube 30 .
- the first covering plate 20 defines an inlet opening 21 at a center thereof communicating with the first receiving chamber 34 , and an outlet opening 22 adjacent to an edge thereof communicating with the second receiving chamber 14 .
- the working fluid enters into the heat sink 10 via the inlet opening 21 and then flows through the first and second receiving chambers 34 , 14 in that order, and finally leaves the heat sink 10 via the outlet opening 22 .
- first and second covering plates 20 , 40 each define three ears 24 , 43 evenly distributed around peripheries thereof with three screws holes 241 , 431 respectively defined therein for extension of screws 60 , 70 to mount the first and second covering plates 20 , 40 to the heat sink 10 .
- the first covering plate 20 may be integrally formed with the outer tube 100 or/and the inner tube 30 to simplify the assembly of the liquid cooling device 1 .
- the second covering plate 40 defines an aperture 41 in a center portion thereof. The aperture 41 is devised for facilitating injection of the working fluid into the liquid cooling device 1 .
- a sealing cover 42 is screwed in the aperture 41 after the working fluid has been injected into the liquid cooling device 1 with a sufficient amount.
- the second covering plate 40 is made of acrylics transparent material so as to watch the fluid level of the working fluid in the first and second receiving chambers 34 , 14 to decide whether it is need to supplement the working fluid.
- the bottom end of the inner tube 30 is coplanar with the bottom end of the outer tube 100 .
- the bottom end of the inner tube 30 may be disposed above the bottom end of the outer tube 100 .
- the outer tube 100 and the inner tube 30 are separately sealed via two covering plates, i.e., the first covering plate 20 disposed on the bottom end of the outer tube 100 , and a third covering plate (not shown) disposed on the bottom end of the inner tube 30 .
- the third covering plate is parallel to and spaces a distance from the first covering plate 20 .
- the third covering plate is located above the first covering plate 20 .
- the third covering plate also defines an outlet opening in alignment with the outlet opening 22 and in communication with the second receiving chamber 14 .
- the conduit 5 connected with the inlet opening 21 extends through the third covering plate and is fixed thereto for entering the working fluid into the heat sink 10 .
- the outer tube 100 is made of materials having good thermal conductivities, such as aluminum and copper, and formed by extrusion or die casing.
- the outer tube 100 includes a tubular heat conductive main body 11 , a plurality of inner fins 12 radially extending inwardly from the main body 11 , and a plurality of outer fins 13 radially extending outwardly from the main body 11 .
- the inner fins 12 absorb heat from the working fluid filled in the second receiving chamber 14 and transfer the heat to the main body 11 .
- the outer fins 13 absorb heat from the main body 11 and dissipate the heat to the surrounding environment.
- Each of the outer fins 13 is Y-shaped in profile and has two branches (not labeled) extending from a trunk (not labeled) thereof, whereby heat dissipating area of the outer fins 13 is increased.
- each of the outer fins 13 axially extend above and below the main body 11 , which further increases heat dissipating areas of the heat sink 10 .
- Two indents (not labeled) are formed at the top and bottom ends of the outer tube 100 .
- the first and second covering plates 20 , 40 are accommodated in the indents so as to decrease the size of the heat sink 10 and give the heat sink 10 with an aesthetic integrity.
- the inner fins 12 radially extend into the second receiving chamber 14 and contact with an outer surface of the inner tube 30 .
- the second receiving chamber 14 is therefore divided into a plurality of separated axial channels (not labeled, see FIG. 5 ).
- the bottom ends of the inner fins 12 spaces distances from the top surface 23 of the first covering plate 20 so that the axial channels communicate with each other at a bottom end of the second receiving chamber 14 .
- the working fluid filled in the axial channels influxes together at the bottom end of the second receiving chamber 14 and leaves the heat sink 10 via the outlet opening 22 .
- the bottom ends of the inner fins 12 may contact with the top surface 23 of the first covering plate 20 , with the axial channels communicating with each other via holes or grooves (not shown) extending through the inner fins 12 .
- the inner fins 12 and the outer fins 13 are evenly distributed around and parallel to an axis of the outer tube 100 .
- the inner fins 12 and the outer fins 13 may be spirally extended on inner and outer surfaces of the main body 11 of the outer tube 100 from the bottom end to the top end thereof to increase turbulence of the working fluid.
- the inner tube 30 is made of materials having good thermal conductivities, such as aluminum and copper, and formed by extrusion or die casing.
- the inner tube 30 includes a tubular heat conductive main body 31 , a plurality of inner fins 32 radially extending inwardly from the main body 31 , and a plurality of outer fins 33 radially extending outwardly from the main body 31 .
- the inner fins 32 radially and inwardly extend into the first receiving chamber 34 , absorbing heat from the working fluid filled therein and transferring the heat to the main body 31 .
- the outer fins 33 radially and outwardly extend into the second receiving chamber 14 , absorbing heat from the main body 31 and dissipating the heat to the working fluid filled in the second receiving chamber 14 .
- the outer fins 33 of the inner tube 30 are alternately arranged with the inner fins 32 of the outer tube 100 so as to increase turbulence of the working fluid flowing through the second receiving chamber 14 .
- the heat exchange efficiency between the outer and the inner tubes 10 , 30 are therefore increased.
- the seat 50 is disposed below the heat sink 10 , mounting the heat sink 10 inside or outside of an electronic apparatus (not shown) such as a desktop, or a notebook, depending on whether an inner space of the electronic apparatus is large enough to receive the heat sink 10 .
- the seat 50 is cone-shaped in profile, and made of metal or plastics. Preferably it is made of plastics.
- the seat 50 includes a ring-like platform 51 at a top end thereof. Three through holes 510 are evenly distributed around the platform 51 for extension of three screws (not shown) to mount the heat sink 10 on the seat 50 .
- the base 2 In operation of the liquid cooling device 1 , the base 2 is attached to the heat source and absorbs heat therefrom.
- the working fluid filled in the base 2 absorbs heat from the base 2 and is pumped to the heat sink 10 via the drive of the pump 3 .
- the working fluid enters into the heat sink 10 via the inlet opening 21 and flows through the first receiving chamber 34 of the heat sink 10 .
- One part of the heat carried by the working fluid is transferred to the inner fins 32 of the inner tube 30 and then to the main body 31 and the outer fins 33 thereof.
- the other part of the heat is carried by the working fluid and enters into the second receiving chamber 14 . This part of the heat is transferred to the inner fins 12 of the outer tube 100 and then to the main body 11 and the outer fins 13 thereof.
- the one part of the heat transferred to the main body 31 and the outer fins 33 of the inner tube 30 is transferred to the working fluid in the second receiving chamber 14 and then to the main body 11 and the outer fins 13 of the outer tube 100 .
- the heat is finally dissipated to the surrounding environment via heat exchanges between the main body 11 and outer fins 13 of the outer tube 100 and the airflow provided by the fan 4 .
- the working fluid in the heat sink 10 after being cooled leaves the heat sink 10 via the outlet opening 22 of the heat sink 10 and arrives at the base 2 to proceed with a next circulation of thermal exchange.
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610060290.4 | 2006-04-14 | ||
CN2006100602904A CN101056522B (en) | 2006-04-14 | 2006-04-14 | Liquid-cooled radiator and liquid-cooled heat radiator applying the same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070240849A1 US20070240849A1 (en) | 2007-10-18 |
US7487824B2 true US7487824B2 (en) | 2009-02-10 |
Family
ID=38603726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/309,562 Expired - Fee Related US7487824B2 (en) | 2006-04-14 | 2006-08-23 | Liquid cooling device |
Country Status (2)
Country | Link |
---|---|
US (1) | US7487824B2 (en) |
CN (1) | CN101056522B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080236794A1 (en) * | 2007-03-27 | 2008-10-02 | Dk Innovations Inc. | Heat-removal device |
US20130135865A1 (en) * | 2011-11-29 | 2013-05-30 | Foxsemicon Integrated Technology, Inc. | Heat sink and led lamp using the same |
US20140360706A1 (en) * | 2012-04-05 | 2014-12-11 | R.B. Radley & Company Limited | Laboratory Condensers With Passive Heat Exchange |
US20180003444A1 (en) * | 2015-01-15 | 2018-01-04 | A Markussen Holding As | Heat exchanger |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7475718B2 (en) * | 2006-11-15 | 2009-01-13 | Delphi Technologies, Inc. | Orientation insensitive multi chamber thermosiphon |
US20110030920A1 (en) * | 2009-08-04 | 2011-02-10 | Asia Vital Components (Shen Zhen) Co., Ltd. | Heat Sink Structure |
CN102235652B (en) * | 2010-05-06 | 2014-06-18 | 浙江思朗照明有限公司 | Air-cooled liquid-cooled combined radiating device |
US20140104858A1 (en) * | 2012-10-17 | 2014-04-17 | Lighting Science Group Corporation | Lighting device with integrally molded base and associated methods |
US9717137B2 (en) | 2013-11-19 | 2017-07-25 | Varex Imaging Corporation | X-ray housing having integrated oil-to-air heat exchanger |
CN104900794B (en) * | 2015-06-18 | 2018-04-20 | 东莞市闻誉实业有限公司 | LED light radiator structure |
CN105530800B (en) * | 2015-12-04 | 2018-02-09 | 太仓陶氏电气有限公司 | A kind of oil cooling frequency converter cooling device |
CN105377002B (en) * | 2015-12-04 | 2018-07-06 | 太仓陶氏电气有限公司 | A kind of snowflake shape liquid radiator |
CN205726818U (en) * | 2016-03-29 | 2016-11-23 | 深圳市光峰光电技术有限公司 | Projector equipment and liquid cooling heat radiation system thereof |
FR3064878B1 (en) * | 2017-03-31 | 2020-01-24 | Aptiv Technologies Limited | DEVICE FOR HEAT DISSIPATION OF AN ELECTRONIC DEVICE |
CN109084616A (en) * | 2018-08-27 | 2018-12-25 | 珠海格力电器股份有限公司 | weapon cooling device |
CN109742058B (en) * | 2018-12-21 | 2020-07-28 | 西安理工大学 | Heat radiator |
CN111103958B (en) * | 2020-02-26 | 2021-06-01 | 邢台职业技术学院 | Circulation cooling device for improving heat dissipation efficiency of computer |
CN112259672B (en) * | 2020-10-22 | 2021-06-08 | 深圳市宇亮光电技术有限公司 | Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US2235669A (en) * | 1938-11-30 | 1941-03-18 | Rca Corp | Electron discharge apparatus |
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4778002A (en) * | 1985-09-14 | 1988-10-18 | Norsk Hydro A.S | Fluid cooler |
US5542467A (en) * | 1993-07-06 | 1996-08-06 | Societe E'etudes Et De Constructions Aero-Navales | Safety annular heat exchanger for incompatible fluids |
US5735342A (en) * | 1996-05-17 | 1998-04-07 | Nitta; Minoru | Heat exchanger |
US5749413A (en) * | 1991-09-23 | 1998-05-12 | Sundstrand Corporation | Heat exchanger for high power electrical component and package incorporating same |
US6145584A (en) * | 1996-09-26 | 2000-11-14 | Alstom Uk Ltd. | Power equipment for use underwater |
US6173760B1 (en) * | 1998-08-04 | 2001-01-16 | International Business Machines Corporation | Co-axial bellows liquid heatsink for high power module test |
US6666261B2 (en) * | 2001-06-15 | 2003-12-23 | Foxconn Precision Components Co., Ltd. | Liquid circulation cooler |
US20050019234A1 (en) * | 2003-07-21 | 2005-01-27 | Chin-Kuang Luo | Vapor-liquid separating type heat pipe device |
US7117931B2 (en) * | 2004-12-31 | 2006-10-10 | Intel Corporation | Systems for low cost liquid cooling |
US20070000648A1 (en) * | 2005-06-29 | 2007-01-04 | Crocker Michael T | Systems for low cost coaxial liquid cooling |
-
2006
- 2006-04-14 CN CN2006100602904A patent/CN101056522B/en not_active Expired - Fee Related
- 2006-08-23 US US11/309,562 patent/US7487824B2/en not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2235669A (en) * | 1938-11-30 | 1941-03-18 | Rca Corp | Electron discharge apparatus |
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4778002A (en) * | 1985-09-14 | 1988-10-18 | Norsk Hydro A.S | Fluid cooler |
US5749413A (en) * | 1991-09-23 | 1998-05-12 | Sundstrand Corporation | Heat exchanger for high power electrical component and package incorporating same |
US5542467A (en) * | 1993-07-06 | 1996-08-06 | Societe E'etudes Et De Constructions Aero-Navales | Safety annular heat exchanger for incompatible fluids |
US5735342A (en) * | 1996-05-17 | 1998-04-07 | Nitta; Minoru | Heat exchanger |
US6145584A (en) * | 1996-09-26 | 2000-11-14 | Alstom Uk Ltd. | Power equipment for use underwater |
US6173760B1 (en) * | 1998-08-04 | 2001-01-16 | International Business Machines Corporation | Co-axial bellows liquid heatsink for high power module test |
US6666261B2 (en) * | 2001-06-15 | 2003-12-23 | Foxconn Precision Components Co., Ltd. | Liquid circulation cooler |
US20050019234A1 (en) * | 2003-07-21 | 2005-01-27 | Chin-Kuang Luo | Vapor-liquid separating type heat pipe device |
US7117931B2 (en) * | 2004-12-31 | 2006-10-10 | Intel Corporation | Systems for low cost liquid cooling |
US20070000648A1 (en) * | 2005-06-29 | 2007-01-04 | Crocker Michael T | Systems for low cost coaxial liquid cooling |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080236794A1 (en) * | 2007-03-27 | 2008-10-02 | Dk Innovations Inc. | Heat-removal device |
US20130135865A1 (en) * | 2011-11-29 | 2013-05-30 | Foxsemicon Integrated Technology, Inc. | Heat sink and led lamp using the same |
US20140360706A1 (en) * | 2012-04-05 | 2014-12-11 | R.B. Radley & Company Limited | Laboratory Condensers With Passive Heat Exchange |
US10704837B2 (en) * | 2012-04-05 | 2020-07-07 | R.B. Radley & Company Limited | Laboratory condensers with passive heat exchange |
US20180003444A1 (en) * | 2015-01-15 | 2018-01-04 | A Markussen Holding As | Heat exchanger |
US10739078B2 (en) * | 2015-01-15 | 2020-08-11 | A Markussen Holding As | Heat exchanger |
Also Published As
Publication number | Publication date |
---|---|
CN101056522A (en) | 2007-10-17 |
CN101056522B (en) | 2010-08-04 |
US20070240849A1 (en) | 2007-10-18 |
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Legal Events
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AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, YU-CHEN;XU, HONG-BO;REEL/FRAME:018162/0448 Effective date: 20060811 |
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AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:021907/0690 Effective date: 20081117 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:021907/0690 Effective date: 20081117 |
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Year of fee payment: 4 |
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LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20170210 |