US7384688B2 - Connecting structure used in a liquid crystal display panel - Google Patents
Connecting structure used in a liquid crystal display panel Download PDFInfo
- Publication number
- US7384688B2 US7384688B2 US10/833,172 US83317204A US7384688B2 US 7384688 B2 US7384688 B2 US 7384688B2 US 83317204 A US83317204 A US 83317204A US 7384688 B2 US7384688 B2 US 7384688B2
- Authority
- US
- United States
- Prior art keywords
- conductive particles
- connecting structure
- terminals
- conductive material
- spherical conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 title description 10
- 239000002245 particle Substances 0.000 claims abstract description 126
- 239000004020 conductor Substances 0.000 claims abstract description 82
- 239000004033 plastic Substances 0.000 claims abstract description 47
- 229920000642 polymer Polymers 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000011521 glass Substances 0.000 claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 230000001788 irregular Effects 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 239000004634 thermosetting polymer Substances 0.000 claims description 4
- 239000002650 laminated plastic Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 238000005304 joining Methods 0.000 abstract description 47
- 239000011295 pitch Substances 0.000 abstract description 35
- 239000010410 layer Substances 0.000 description 58
- 238000000034 method Methods 0.000 description 10
- 230000003247 decreasing effect Effects 0.000 description 8
- 238000009826 distribution Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Definitions
- the present invention relates to a conductive material with a laminated structure, and more particularly to a conductive material with a laminated structure, where conductive particles are dispersed on the surfaces.
- Spherical conductive particles are generally used for providing electrical conductance between the terminals of the glass substrate and the driving component of a conventional liquid crystal display, as shown in FIG. 1A to FIG. 1C .
- a conductive material 3 is coated on or adhered to the surface of the glass substrate 1 , on which terminals 2 are formed.
- the surface of the driving component 4 on which terminals 5 are formed, is joined to the surface of the glass substrate 1 , on which terminals 2 are formed, in a manner of terminal-to-terminal alignment by the conductive material 3 .
- Electrical conductance occurs between the terminals 2 and 5 in Z direction; electrical insulation occurs at the direction of X-Y plane.
- the conductive material 3 is formed of a thermoplastic layer or a thermosetting layer, where spherical conductive particles 31 are evenly dispersed, as shown in FIG. 2A .
- the size of the conductive particles 31 needs to be reduced. As a result, the level of difficulty in fabricating the conductive particles 31 and the manufacturing cost are increased. Besides, the surface roughness of the terminals 2 and 5 also limits the development of small-size conductive particles 31 . When the size of the conductive particles 31 is smaller than what the surface roughness of the terminals 2 and 5 , may permit bad electrical conductance would occur. When the density of the conductive particles 31 is increased, the requirement for joining with fine pitch cannot be attained, although the junction impedance can be reduced. Owing to the above considerations, the conventional conductive material is applied for joining in case of pitches larger than 50 microns.
- One objective of the present invention is to provide a conductive material with a laminated structure, which includes at least a polymer plastic layer, where conductive particles are dispersed on surfaces, a density of the conductive particles on the unit surface area can be decreased so as to satisfy a requirement for micro-pitch joining.
- Another objective of the present invention is to provide a conductive material with a laminated structure, which includes at least a polymer plastic layer, where conductive particles are dispersed on surfaces, a density of the conductive particles dispersed on the surfaces of the polymer plastic layer is readily controlled without adding external electrical and magnetic fields. The manufacturing cost can be reduced.
- the present invention provides a conductive material with a laminated structure, which can be used to join terminals of a driving component and a glass substrate.
- the conductive material with a laminated structure under the present invention includes at least a polymer plastic layer, where conductive particles dispersed on surfaces.
- the density of the conductive particles on the unit surface area of each polymer plastic layer can be decreased due to the conductive particles dispersed on the surfaces of the polymer plastic layers.
- the conductive particles are isolated from each other by the polymer plastic layers in a portion of the conductive material outside the joining region of the terminals. Hence, a phenomenon of short circuit between the conductive particles in the portion of the conductive material outside the joining region of the terminals is prevented.
- the laminated conductive material of the present invention provides three mechanisms to attain the purpose of fine pitch bonding: (1) Increasing the lamination layers of the conductive material while keeping the conductive particles per unit volume constant. The number of the conductive particles per unit surface area thus can be decreased, and the probability for occurring short circuit of the conductive particles outside the joining region is reduced. The space between the terminals can be shrunk, and therefore the fine pitch bonding can be obtained; (2) the conductive material of the present invention utilizes non-spherical (such as elliptical, flat, sheet, fibered or irregular)conductive particles. The junction impedance between the terminals can be lowered.
- the pitch between the terminals can be shrunk to attain the purpose of fine-pitch joining;
- the conductive material of the present invention utilizes non-spherical conductive particles.
- the non-spherical conductive particles do not easily flow away compared to the conventional spherical particles when joining the terminals. Therefore, the non-spherical conductive particles provide the advantage of clustering, which is advantageous for shrinking the pitch between the terminals. And thus, the purpose of fine-pitch joining can be obtained.
- the conductive material of the present invention is suitable for an application in a liquid crystal display with super-fine pitches.
- FIG. 1A to FIG. 1C are various cross-sectional views of a flow process of joining terminals of a glass substrate and a driving component by a conventional conductive material;
- FIG. 2A to FIG. 2B are various cross-sectional views of a flow process of joining terminals of the glass substrate and the driving component by a known conductive material, where conductive particles are dispersed;
- FIG. 3A to FIG. 3C are various cross-sectional views corresponding to respective stages of a flow process for joining the terminals of the glass substrate and the driving component by a conductive material in accordance with the first embodiment of the present invention.
- FIG. 4A to FIG. 4C are various cross-sectional views corresponding to respective stages of a flow process for joining the terminals of the glass substrate and the driving component by a conductive material in accordance with the second embodiment of the present invention.
- the present invention provides a conductive material with a laminated structure, which includes at least a polymer plastic layer, where conductive particles are dispersed on surfaces.
- the polymer plastic layer can be formed of thermoplastic polymer or thermosetting polymer.
- the conductive material with a laminated structure of the present invention is formed of laminated thermoplastic polymer layers or laminated thermosetting polymer layers, where conductive particles are dispersed on the surfaces of the thermoplastic polymer layers or the thermosetting polymer layers.
- the density and uniformity of distribution of the conductive particles on the surfaces of the polymer plastic layers can be readily controlled.
- the number of the conductive particles per unit surface area (the density of the conductive particles) of a single surface of the polymer plastic layer can be smaller, compared with the conventional conductive material with the conductive particles dispersed therein.
- the number of the conductive particles within the joining region between the terminals is equal to a sum of the numbers of conductive particles on all the surface portions of the laminated polymer plastic layers in the joining region.
- the present conductive material with a laminated structure thus can provide electrical conductance between the terminals as the conventional conductive material.
- the density of the conductive particles on unit surface area of a single surface of the laminated polymer plastic layers is decreased, and the conductive particles are isolated from each other by the polymer plastic layer in a portion of the conductive material outside the joining region of the terminals.
- a phenomenon of short circuit between the conductive particles in the portion of the conductive material outside the joining region of the terminals can be prevented.
- the conductive material with a laminated structure of the present invention can be a single-layer structure or a multi-layer structure.
- the conductive particles can be dispersed on the surfaces of each polymer plastic layer so as to decrease the number of the conductive particles per unit surface area of a single polymer plastic layer (i.e. the density of the conductive particles).
- a pitch between the terminals of the driving component and the glass substrate can be made smaller.
- the laminated layers are increased and in case that the number of the conductive particles per unit volume is constant, the number of the conductive particles per unit surface area of each single polymer plastic layer would be decreased.
- the pitch between the terminals thus can further be made smaller.
- the pitch between the terminals can be made smaller as the lamination layers of the present conductive material increases.
- the distance between the glass substrate and the driving component is constant, the more the lamination layers are, the less the thickness of each layer is. As a result, insulating impedance between the laminated layers is insufficient. The possibility of a short circuit is increased. It is proper that the lamination layers of the present conductive material is between 1 and 20, more preferably between 1 and 10, and most preferably between 1 and 5.
- the conductive particles can be dispersed on the surface of at least one of the two laminated polymer plastic layers between an interface.
- the conductive particles can be randomly dispersed on the surfaces of the polymer plastic layers of the present conductive material. It is unnecessary to define the orientation distribution of the conductive particles. The random distribution of the conductive particles on the surfaces of the polymer plastic layers would further make fine-pitch joining possible.
- the density of the conductive particles per unit surface area of the present conductive material can be reduced.
- the present conductive material can be used in a liquid crystal display with super-fine pitch, which is even less than 25 microns.
- the conductive particles of the present conductive material can be a kind of low-resistant metal material, for example, selected from a group consisting of gold, silver, copper, aluminum, nickel, stainless steel or carbon or a combination thereof.
- the shape of the conductive particles can be spherical, circular, elliptical, flat, sheet, rod, fibred or even irregular.
- the shape of the conductive particles is fibred or rod, a linear contact between the conductive particles and terminals is established upon press joining the terminals with the present conductive material.
- the junction impedance is thus lower than that of the conductive particles in other shapes.
- the fibred conductive particles When a metal is to be molded to the fibred conductive particles, firstly, the metal is molded to a foil shape, and then finished to a fibred shape by a cutting technique.
- the fibred conductive particles also can be fabricated by a fiber process with a high-pressure steam jet, a molten fiber spinning process or a metal fiber molding method proposed by U.S. Pat. No. 6,074,752, entitled “METAL FIBRE AGGLOMERATE AND PROCESS FOR MANUFACTURING THE SAME”, metal fiber fabrication provided by a Taiwan Patent Publication No. 511406, or a nanometer fiber technology.
- the dimension of the conductive particles can be in micrometers or even in nanometers.
- a height-to-width ratio of the conductive particles can be in a range of between about 0.2 and 1. When the height-to-width ratio is less than 0.2, the diameters of the conductive particles would be smaller than what the surface roughness of the terminals may permit, and this would cause bad joining. The signals cannot be effectively transferred. When the height-to-width ratio is equal to 1, the spherical conductive particles dispersed on the surfaces of the polymer plastic layer may be shifted as the polymer plastic layer as softened flows. As a result, the distribution of the conductive particles on the terminals would become uneven. However, the above problem can be avoided by the polymer plastic layer that has some adhesiveness.
- non-spherical conductive particles having the height-to-width ratio not equal to 1 in the conductive material of the present invention it is preferable to use fibred conductive particles in the conductive material of the present invention. This is because the polymer plastic layer as softened flows, the fibred conductive particles dispersed on the surfaces of the polymer plastic layer are merely distorted and would not flow away, and this would not result in insufficiency of the conductive particles on the terminals.
- the present conductive material When the present conductive material is used to join the terminals of the glass substrate and the liquid crystal display, after press joining, the electrical joining is established by a kind of linear-type adhesion so as to reduce junction impedance. Moreover, the relationship between the pitch and the density of the conductive particles is linear.
- the number of the conductive particles per unit surface area of the present conductive material can be 1 ⁇ 5 to 1 ⁇ 2 times the number of the conductive particles of the conventional conductive material. Therefore, it is possible to satisfy the requirement of joining with fine pitch.
- FIG. 3A to FIG. 3C are various cross-sectional views corresponding to respective stages of a flow process for joining the terminals of the glass substrate and the liquid crystal display by the conductive material in accordance with the first embodiment of the present invention.
- the conductive material 3 with a laminated structure of the first embodiment includes a polymer plastic layer 32 , where fibred conductive particles 33 are dispersed on the surfaces. The fibred conductive particles 33 are evenly distributed on the two surfaces of the polymer plastic layer 32 .
- the conductive material 3 is applied on a surface of the glass substrate 1 , on which terminals 2 are formed. Then, the driving component 4 is press joined to the glass substrate 1 in a manner of terminal to terminal alignment.
- the conductive particles 33 After press joining, the conductive particles 33 would touch the terminals 2 and 5 , thus producing electrical connection between the terminals 2 and 5 (a Z-axis electrical connection). While the conductive particles 33 outside the joining region of the terminals 2 and 5 are isolated from each other by the polymer plastic layer 32 , and there is not any electrical connection established (i.e. there is not any electrical connection in X and Y directions), as shown in FIG. 3B .
- FIG. 3C is a schematic top view of FIG. 3B .
- the distribution of the conductive particles 33 of the conductive material 3 can be seen from FIG. 3C .
- the total number of the conductive particles 33 of the conductive material 3 is equal to the sum of the numbers of the conductive particles 33 dispersed on the two surfaces of the polymer plastic layer 32 . Therefore, under the situation of obtaining a density of the conductive particles 33 the same as that of the conventional conductive material, the conductive material 3 can be provided with a lower density of the conductive particles 33 per unit surface area on the two surfaces of the polymer plastic layer 32 .
- the surface portions of the conductive material 3 outside the joining region of the terminals 2 and 5 can be provided with the conductive particles 33 having a lower density per unit surface area.
- the particle density per unit surface area is low, the probability of the electrical short outside the joining region is low, too. It means the joining with fine pitch can be achieved. Besides, the fibred conductive particles 33 become linearly joining with the terminals 2 and 5 after press joining. Low junction impedance can be obtained.
- FIG. 4A to FIG. 4C are various cross-sectional views corresponding to respective stages of a flow process for joining the is terminals of the glass substrate and the liquid crystal display by a conductive material in accordance with the second embodiment.
- the conductive material 3 with a laminated structure of the second embodiment includes three laminated polymer plastic layers 32 , where fibred conductive particles 33 are dispersed on the surfaces.
- the conductive particles 33 are evenly distributed on the surfaces of the three polymer plastic layers 32 , while the conductive particles 33 are merely dispersed on the surface of one of the two laminated polymer plastic layers 32 between an interface.
- the conductive material 3 is applied on a surface of the glass substrate 1 , where the terminals 2 are formed.
- the driving component 4 is press joined to the glass substrate 1 in a manner of terminal to terminal alignment.
- the conductive particles 33 would touch the terminals 2 and 5 , thus producing electrical connection between the terminals 2 and 5 (a Z-axis electrical connection). While the conductive particles 33 outside the joining region of the terminals 2 and 5 are isolated from each other by the laminated polymer plastic layers 32 , there is not any electrical connection established (i.e. there is not any electrical connection in X and Y directions), as shown in FIG. 4B .
- FIG. 4C is a schematic top view of FIG. 4B .
- the distribution of the conductive particles 33 of the conductive material 3 can be seen from FIG. 4C .
- the total number of the conductive particles 33 of the conductive material 3 is equal to the sum of the numbers of the conductive particles 33 dispersed on the surfaces of each of the polymer plastic layers 32 .
- the conductive material 3 Owing to the three laminated structure of the conductive material 3 of the second embodiment and under the situation of obtaining a density of the conductive particles 33 the same as that of the conventional conductive material, the conductive material 3 can be provided with the conductive particles 33 , which has a lower density per unit surface area than that of the first embodiment.
- there is not any electrical connection established outside the joining region of the terminals 2 and 5 When the particle density per unit surface area is lowered, the joining with finer pitch is thus achieved.
- the conductive material with a laminated structure of the present invention is provided with the conductive particles distributed in a form of laminated distribution.
- the conductive particles 33 are distributed on the two surfaces of the polymer plastic layer 32 of FIG. 3 .
- the density of the conductive particles per unit surface area thus can be decreased.
- the conductive particles are dispersed on the surfaces of the polymer plastic layers, the density of the conductive particles is readily controlled without the necessity of adding electrical and magnetic fields to control the even of distribution of the conductive particles. The manufacturing cost can be reduced.
- the density of the conductive particles per unit surface area of the conductive material of the present invention is decreased, and the conductive particles are isolated from each other by the laminated polymer plastic layers outside the joining region of the terminals. A phenomenon of short circuit between the conductive particles in the portion of the conductive material outside the joining region of the terminals can be prevented.
- the pitch also can be made smaller due to the lower density of the conductive particles per unit surface area.
- the laminated conductive material of the present invention provides three mechanisms to attain the purpose of fine pitch bonding: (1) Increasing the lamination layers of the conductive material while keeping the conductive particles per unit volume constant. The number of the conductive particles per unit surface area thus can be decreased, and the probability for occurring short circuit of the conductive particles outside the joining region is reduced. The space between the terminals can be shrunk, and therefore the fine pitch bonding can be obtained; (2) the conductive material of the present invention utilizes non-spherical conductive particles. The junction impedance between the terminals can be lowered. As a consequence, the pitch between the terminals can be shrunk to attain the purpose of fine-pitch joining; (3) the conductive material of the present invention utilizes non-spherical conductive particles.
- the non-spherical conductive particles do not easily flow away compared to the conventional spherical particles when joining the terminals. Therefore, the non-spherical conductive particles provide the advantage of clustering, which is advantageous for shrinking the pitch between the terminals. And thus, the purpose of fine-pitch joining can be obtained.
Abstract
Description
P=T+S
A=T+S/(n+1)
n=Th/(2*B)
A<P
wherein P=pitch;
-
- T=terminal width (lead width);
- S=space between terminals;
- A=Expected pitch of the conductive material with laminated structure;
- n=number of lamination layers;
- Th=thickness of conductive material; and
- B=diameter of the conductive particle.
Claims (17)
P=T+S
A=T+S/(n+1)
n=Th/(2*B)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093100181A TWI299502B (en) | 2004-01-05 | 2004-01-05 | Conductive material with a laminated structure |
TW93100181 | 2004-01-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050147808A1 US20050147808A1 (en) | 2005-07-07 |
US7384688B2 true US7384688B2 (en) | 2008-06-10 |
Family
ID=34709557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/833,172 Expired - Lifetime US7384688B2 (en) | 2004-01-05 | 2004-04-28 | Connecting structure used in a liquid crystal display panel |
Country Status (2)
Country | Link |
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US (1) | US7384688B2 (en) |
TW (1) | TWI299502B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI419953B (en) * | 2007-12-04 | 2013-12-21 | Innolux Corp | Liquid crystal display |
CN102001210B (en) * | 2010-09-17 | 2013-04-24 | 友达光电股份有限公司 | Compression device and operating method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US6180226B1 (en) * | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
US6194492B1 (en) * | 1997-06-06 | 2001-02-27 | Bridgestone Corporation | Anisotropic conductive film |
US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
US6592783B2 (en) * | 2000-02-25 | 2003-07-15 | Sony Chemicals Corp. | Anisotropic conductive adhesive film |
-
2004
- 2004-01-05 TW TW093100181A patent/TWI299502B/en active
- 2004-04-28 US US10/833,172 patent/US7384688B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US6180226B1 (en) * | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
US6194492B1 (en) * | 1997-06-06 | 2001-02-27 | Bridgestone Corporation | Anisotropic conductive film |
US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
US6592783B2 (en) * | 2000-02-25 | 2003-07-15 | Sony Chemicals Corp. | Anisotropic conductive adhesive film |
Also Published As
Publication number | Publication date |
---|---|
US20050147808A1 (en) | 2005-07-07 |
TWI299502B (en) | 2008-08-01 |
TW200523950A (en) | 2005-07-16 |
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