US7352312B2 - Variable passive components with high resolution value selection and control - Google Patents

Variable passive components with high resolution value selection and control Download PDF

Info

Publication number
US7352312B2
US7352312B2 US11/557,425 US55742506A US7352312B2 US 7352312 B2 US7352312 B2 US 7352312B2 US 55742506 A US55742506 A US 55742506A US 7352312 B2 US7352312 B2 US 7352312B2
Authority
US
United States
Prior art keywords
circuit
current
dac
node
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US11/557,425
Other versions
US20070194813A1 (en
Inventor
Robert D. Washburn
Robert F. McClanahan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mashhoon Hamid R
Dorothy LLC
Original Assignee
Washburn Robert D
Mcclanahan Robert F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Washburn Robert D, Mcclanahan Robert F filed Critical Washburn Robert D
Priority to US11/557,425 priority Critical patent/US7352312B2/en
Publication of US20070194813A1 publication Critical patent/US20070194813A1/en
Priority to US12/060,044 priority patent/US7525468B2/en
Publication of US7352312B2 publication Critical patent/US7352312B2/en
Application granted granted Critical
Priority to US12/431,581 priority patent/US7907073B2/en
Assigned to DOROTHY, LLC reassignment DOROTHY, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCCLANAHAN, ROBERT F., WASHBURN, ROBERT D.
Assigned to CMW TECHNOLOGY reassignment CMW TECHNOLOGY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCCLANAHAN, ROBERT F., WASHBURN, ROBERT D.
Assigned to CMW TECHNOLOGY reassignment CMW TECHNOLOGY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCCLANAHAN, ROBERT F., WASHBURN, ROBERT D.
Assigned to MASHHOON, HAMID R reassignment MASHHOON, HAMID R ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CMW TECHNOLOGY, LLC
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/24—Frequency- independent attenuators
    • H03H7/25—Frequency- independent attenuators comprising an element controlled by an electric or magnetic variable
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/66—Digital/analogue converters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/08—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/32—Modifications of amplifiers to reduce non-linear distortion
    • H03F1/3211—Modifications of amplifiers to reduce non-linear distortion in differential amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56—Modifications of input or output impedances, not otherwise provided for
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/34—Dc amplifiers in which all stages are dc-coupled
    • H03F3/343—Dc amplifiers in which all stages are dc-coupled with semiconductor devices only
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/4508—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using bipolar transistors as the active amplifying circuit
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/02—Multiple-port networks
    • H03H11/28—Impedance matching networks
    • H03H11/30—Automatic matching of source impedance to load impedance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/46—One-port networks
    • H03H11/48—One-port networks simulating reactances
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/46—One-port networks
    • H03H11/48—One-port networks simulating reactances
    • H03H11/481—Simulating capacitances
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/46—One-port networks
    • H03H11/53—One-port networks simulating resistances; simulating resistance multipliers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H03H7/40—Automatic matching of load impedance to source impedance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/222—A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/321—Use of a microprocessor in an amplifier circuit or its control circuit
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/387—A circuit being added at the output of an amplifier to adapt the output impedance of the amplifier
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/91—Indexing scheme relating to amplifiers the amplifier has a current mode topology
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45—Indexing scheme relating to differential amplifiers
    • H03F2203/45031—Indexing scheme relating to differential amplifiers the differential amplifier amplifying transistors are compositions of multiple transistors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45—Indexing scheme relating to differential amplifiers
    • H03F2203/45136—One differential amplifier in IC-block form being shown
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45—Indexing scheme relating to differential amplifiers
    • H03F2203/45352—Indexing scheme relating to differential amplifiers the AAC comprising a combination of a plurality of transistors, e.g. Darlington coupled transistors

Definitions

  • the present system relates to the field of variable, passive, electronic components.
  • the characteristics include component tolerances, tolerance build-up, the relatively high cost of using high precision components, added circuitry required to provide precision control or precisely set component values or performance characteristics, and changes in component value or performance produced by component aging, operating history, and changes in environmental conditions.
  • FIG. 1 illustrates an idealized solution in the form of variable resistor R 100 , varaiable capacitor C 100 and variable inductor L 100 . These components would be comparable in nature to the present passive devices they would replace, but whose value could be adjusted to provide nearly nominal performance over widely varying operating conditions. Variability would either be part of the manufacturing processes, or dynamically available during actual operation, as determined on a case-by-case basis.
  • One useful application illustrated is directed toward providing a matched, complex termination (Z 100 ) for a transmission line structure (TL 100 ).
  • FIG. 2A One example of a digitally controlled, variable resistor of the present art is shown in FIG. 2A .
  • a switched resistor network is used with control FETs such that turning one or more FETs “on” places resistors in parallel, reducing the effective resistive value of the combination.
  • Resistor networks are more frequently implemented as series structures with one or more FETs used to short out unwanted resistors in the chain. For resistors, value selection controls are far simpler with series connection. Switched capacitor structures are typically configured as parallel networks, again simplifying value selection controls.
  • FIG. 2B illustrates the use of the channel resistance of a FET as a variable resistor (note resistor R 206 is variable implying some form of gate voltage control).
  • resistor R 206 is variable implying some form of gate voltage control.
  • the undesirable characteristics of this approach are the large number of unused components and the characteristics of the FET switches. When a value has been selected, there are typically many unused components. This is typically not a major issue for an integrated resistor network but switched capacitor networks can require discrete capacitors to realize large values, adding cost and using circuit board area that could be used for functioning circuitry.
  • the switch FETs also can present significant problems. If kept small to minimize chip area utilization, they tend to have significant resistance that is aggravated by their rapid resistance increase with temperature (a sensitivity experienced to an even greater degree by the circuit for FIG. 2B ). If the FETs are enlarged to reduce resistance, they consume greater area. Either way, there is an incentive to minimize the number of switched devices (4-bit is most common with 8-bit the maximum generally encountered), thereby limiting resolution of the component value.
  • FIG. 2C illustrates a varactor diode, which provides the function of a controlled variable capacitor. Implementation requires a DC control voltage and DC isolation. Use is generally limited to RF applications where the small diode capacitance under reverse junction bias yields appropriate values for circuit operation.
  • Inductors are particularly difficult components in which to implement variability because they frequently are wound around a magnetic core material. Modification of the geometric relationship between the core material and the winding provides inductance adjustment capacity. However, the adjustment capacity is typically a mechanical setting with real time adjustment being largely impractical, particularly at high frequencies.
  • a significant issue associated with realization of component value variability is energy storage, which is a function of the component value (whether primary or parasitic in nature). Alteration of a component value typically involves movement of energy into or out of the storage mechanisms associated with the specific type of passive component, thereby significantly limiting the speed of circuit operation. For many applications, it would be highly beneficial to be able to change the apparent component value without requiring significant energy transfer.
  • the present system is an electronic, digital-to-analog converter (DAC) circuit that provides means to detect current flowing through a passive component and source or sink additional current such that the value of the passive component appears to vary from its actual or fixed value.
  • DAC digital-to-analog converter
  • the term “fixed value” is not intended to imply that the passive component value does not vary with environmental or circuit application conditions, or include initial tolerance variation. Rather than unchanging, the term “fixed value” means the instantaneous actual value of the component (or component characteristic) in the specific circuit and under the actual environmental conditions in which it is operating.
  • the present system employs feedback such that the additional current tracks current flowing through the passive component.
  • the DAC functions as a source for the additional current and either supplies it directly or functions as a reference for external current drive circuits.
  • the digital inputs to the DAC function to set the gain of the DAC and thereby provide high-resolution adjustment of the equivalent variable component value. Resolutions equal to or greater than 24-bits may be realized, where the resolution is primarily limited by the combined DAC operating frequency and resolution in each specific application.
  • the present system is coupled to a fixed value passive component within an electronic circuit, whereby operation of the present system produces operation by the electronic circuit substantially equivalent to that which would be produced by an altered value of the fixed value passive component.
  • the value of the fixed value passive component is a linear component.
  • the value of the fixed value passive component is a non-linear component.
  • the fixed value passive component is a characteristic of an active component such as a semiconductor junction capacitance.
  • a transimpedance amplifier senses the current through the fixed value passive component.
  • the output of the transimpedance amplifier is coupled to a DAC voltage reference input.
  • the present system includes a current sense resistor in series with the fixed value passive component.
  • the feedback signal from the current sense resistor coupled to a DAC voltage reference input.
  • the present system includes a DAC that directly sources or sinks current from the circuit nodes terminating the series combination of the fixed value passive component and the current sense resistor.
  • the present system includes a DAC that provides reference current for external drive circuitry that sources or sinks current from circuit nodes terminating the series combination of the fixed value passive component and the current sense resistor.
  • the present system includes external drive circuitry with single sided current sense and single output for driving a shunt passive component with current sense resistor connected to ground.
  • the present system includes external drive circuitry with differential current sense and differential outputs for driving a series passive component with floating current sense resistor.
  • the present system includes external drive circuitry for high current applications, including one or more output current amplifiers having both differential inputs and differential outputs.
  • the fixed value passive component is a distributed structure such as a transmission line, resonant cavity, slotted line, stub tuner, waveguide or antenna.
  • more than one DAC controls current injection or removal from a single pair of nodes.
  • current sense feedback is taken from a passive component connected between nodes into which current is neither injected nor removed in response to the current sense feedback.
  • the present system provides signals that are coupled between two or more fixed value passive components.
  • one or more variable components of the present system are varied as a function of frequency such that the circuit functions as a tracking filter.
  • FIG. 1 is an illustration of a number of variable passive components realizable by various embodiments of the present system.
  • FIG. 2A is a circuit diagram of a switched resistor network.
  • FIG. 2B is a circuit diagram of a FET realization of a variable resistor.
  • FIG. 2C is a circuit diagram of a varactor diode realization of a variable capacitor.
  • FIG. 3A is a circuit diagram of a fixed value, series resistor.
  • FIG. 3B is a circuit diagram of a fixed value, shunt resistor to ground.
  • FIG. 3C is a circuit diagram of the resistor of FIG. 3A incorporating a resistive embodiment of the current sense function of the present system.
  • FIG. 3D is a circuit diagram of the resistor of FIG. 3B incorporating a resistive embodiment of the current sense function of the present system.
  • FIG. 3E is a circuit diagram of the circuit of FIG. 3C with the fixed value resistor replaced by a fixed value capacitor.
  • FIG. 3F is a circuit diagram of the circuit of FIG. 3D with the fixed value resistor replaced by a fixed value capacitor.
  • FIG. 3G is a functional block diagram of one embodiment of the present system.
  • FIG. 3H is a functional block diagram of one embodiment of the present system with floating current sense resistor.
  • FIG. 3I is a functional block diagram of the preferred embodiment of the present system incorporating zero impedance current sense.
  • FIG. 3J is a simplified circuit diagram of the transimpedance amplifier function shown in FIG. 3I .
  • FIG. 4A is a circuit diagram illustrating use of variable component value to control output signal amplitude.
  • FIG. 4B is a circuit diagram illustrating means for realization of the component variability as illustrated in FIG. 4A .
  • FIG. 4C is a circuit diagram illustrating alternate means for realization of component variability as illustrated in FIG. 4B .
  • FIG. 5A is a circuit diagram of a single output embodiment of the present system.
  • FIG. 5C is a circuit diagram of a differential output embodiment of the present system.
  • FIG. 6 is a functional block diagram of a variable resistor embodiment of the present system.
  • FIG. 7 is a functional block diagram of a variable resistor embodiment of the present system with alternate current feed polarity.
  • FIG. 8 is a functional block diagram of a variable resistor embodiment of the present system with fine adjustment capability.
  • FIG. 9 is a functional block diagram of a high current, variable resistor embodiment of the present system.
  • FIG. 11 is a functional block diagram of the present system illustrating open loop signal coupling from a second passive component to a first, variable passive component.
  • FIG. 12 is an illustration of the RF frequency characteristics of a tracking filter embodiment of the present system.
  • FIG. 13 is an illustration of the IF frequency characteristics of a tracking filter embodiment of the present system.
  • FIG. 14 is a functional block diagram of a generic receiver system employing conventional filters.
  • FIG. 15 is a functional block diagram of the generic receiver system of FIG. 14 implemented with multiple tracking filter embodiments of the present system.
  • the present system is directed to variable passive components with high-resolution, digital value selection and control.
  • numerous specific details are set forth to provide a more thorough description of embodiments of the system. It is apparent, however, to one skilled in the art, that the system may be practiced without these specific details. In other instances, well known features have not been described in detail so as not to obscure the system. Except as noted herein, common components and connections, identified by common reference designators function in like manner in each circuit.
  • the present system is a digital-to-analog converter circuit that provides the capability to dynamically vary the apparent value of passive components to the circuitry to which they are coupled in a wide range in analog and mixed signal electronic circuits.
  • the term “fixed value” refers to does not imply that the value of the component does not vary with operating or environmental conditions, but rather represents the component value while operating in the circuitry without operation of the present system to alter its apparent value.
  • the term “passive components” represents either individual discrete passive parts or passive characteristics of other components such as diodes, bipolar junction transistors, FETs, etc.
  • the passive components may be linear or non-linear.
  • a consideration in implementation of the present system is whether or not the passive component has one of its terminals connected to ground (or either a floating reference or return node). Ground connected components are typically easier to vary with a wider choice of implementations than for an arbitrarily connected passive component.
  • One element of the present system is a means for sensing the current flowing through the fixed value passive component whose apparent value is to be varied.
  • One example means of current sensing is by the addition of a small value, current sense resistor placed in series with the passive component.
  • FIGS. 3A through 3F illustrate some of the various configurations of passive components, each with current sense resistors added in series.
  • DAC 310 is a current output DAC with a voltage reference input VREF.
  • Current sense resistor 320 is placed in series with a fixed value passive component 330 .
  • the voltage across resistor 320 is a representation of the current through passive component 320 and is applied to the reference input of DAC 310 .
  • the output current maintains the same characteristic shape as a function of time, as that through the fixed value passive component.
  • the output of the DAC is equivalent to a fixed value passive component of the same type as passive component 330 placed in parallel with passive component 330 .
  • the value of the “added parallel component” is determined by scaling of the DAC output current by the DAC digital input setting. For some applications, the apparent value of the fixed value component can be altered intra-cycle up to some frequency.
  • the DAC outputs are cross coupled such that positive DAC output current flows in the same direction as a positive current through the sense resistor.
  • the passive component is a capacitor
  • the configuration shown would make the capacitor appear larger in value.
  • the passive component is a resistor or inductor, the apparent parallel combination would be a smaller value.
  • the positive and negative outputs of the DAC are swapped, as shown in FIG. 8 , the capacitor value would apparently decrease and that of a resistor or inductor increase.
  • the present system can readily produce negative component values.
  • the value change is of course dynamic in nature and does not provide energy storage.
  • FIG. 3H illustrates an alternate embodiment with floating current sense resistor.
  • FIG. 3G has 3 is typically used for components that are coupled to ground.
  • An embodiment for use with non-grounded components is discussed below. Note that the addition of any resistance in series with passive component 330 can impact circuit performance for some applications.
  • One alternative is discussed in the Transimpedance Amplifier Current Sense Embodiment below.
  • DACs are typically not designed for this type of application and operate using a DC voltage reference. As a result, the bandwidth of the reference input amplifier may be limited (around 500 KHz). However, in some of the newer DACs, this bandwidth is 10s of MHz.
  • the embodiment for floating components provides a direct means for avoiding the reference amplifier bandwidth limitation and implementing the present system at RF frequencies.
  • FIGS. 3I and 3J illustrate a method for sensing the current in shunt components to ground when feasible.
  • the current is sensed while the passive component terminal is held at virtual ground.
  • Use of the transimpedance amplifier avoids performance degradation caused by the presence of a current sense resistor or any offset voltage associated with the DAC reference amplifier that may or may not be easily correctable.
  • FIG. 3J illustrates an embodiment of a transimpedance amplifier 350 .
  • FIG. 4A is a schematic that illustrates one of the methods for the use and implementation of a variable component.
  • VSOURCE 1 is a voltage source generating an arbitrary output waveform at node N 401 .
  • Output voltage V 0 at node N 402 is a reduced amplitude representation of the voltage at node N 401 .
  • the amplitude reduction is produced by a resistor divider network comprised of resistor R 401 coupling node N 401 to node N 402 and a resistor equivalent comprised of the parallel combination of resistors R 402 and R 403 , which couple node N 402 to ground.
  • Resistor R 402 is variable and is used to compensate for variations in the values of resistors R 401 and R 403 , thereby providing the desired ratio of the voltages at nodes N 401 and N 402 .
  • the current flowing through resistor R 402 is IR 402 .
  • FIG. 4B An equivalent circuit for maintenance of the ratio of voltages at nodes N 401 and N 402 is shown in FIG. 4B .
  • a second voltage source VSOURCE 2 couples node N 403 to ground and is connected in series with resistor R 404 , which couples node N 403 to node N 402 .
  • Voltage source VSOURCE 2 and resistor R 404 operate together such that the current through resistor R 404 is IR 402 , the same as the current flowing through resistor R 402 of FIG. 4A .
  • the combination of voltage source VSOURCE 2 and resistor R 404 is the functional equivalent of the variable resistor R 402 .
  • the output of voltage source VSOURCE 2 will be variable and the value of resistor R 404 will be fixed.
  • FIG. 4C is an alternate representation to the circuit shown in FIG. 4B .
  • Current source ISOURCE 2 couples node N 402 to ground and replaces the series combination of voltage source VSOURCE 2 and resistor R 404 .
  • the current supplied is IR 402 so that the current source is the functional equivalent of variable resistor R 403 in FIG. 4A .
  • current source ISOURCE 2 is provided directly by the output from a current output DAC.
  • current source ISOURCE 2 is provided by the combination of current output DAC DAC 310 and current amplifier 900 A.
  • DACs are often of limited use for the embodiment illustrated in FIG. 3G and the transimpedance amplifier embodiment illustrated in FIG. 3I . This can be due to the limited bandwidth of the analog reference input. While some devices have a reference bandwidth of several MHz, most are limited to approximately 500 KHz. For the present system, this would limit their utilization to audio applications or equivalent.
  • FIGS. 5A and 5C represent embodiments for realization of the highest level of speed and performance while avoiding the DAC reference limitations. These embodiments use the DAC in a configuration to set the gain of a differential amplifier.
  • the differential amplifier functions as the input or sense element.
  • FIG. 5A shows a single-ended version for use with components in shunt to ground.
  • FIG. 5C shows the more general double-ended circuit to be used with components between 2 arbitrary circuit nodes.
  • the circuit of FIG. 5C can also be used with ground reference in place of that shown in FIG. 5A . Both of these configurations have the additional advantage of avoiding the problem with limited bandwidth for the reference input.
  • Each has a high speed, differential amplifier input circuit that allow standard DACs to be used with a DC reference level, typically ground.
  • the configuration shown in FIG. 5A is a single output version of the configuration of FIG. 5C .
  • variable component values can be as valuable in high current power circuits as in low power digital processing and communications applications.
  • a general solution involves the addition of a differential current amplifier to the output of the control DAC as shown in FIG. 9 .
  • the positive output of DAC DAC 310 is coupled to the positive input of differential current amplifier 900 A.
  • the negative output of DAC DAC 310 is coupled to the negative input of differential current amplifier 900 A.
  • the positive output of current amplifier 900 A is coupled to resistor R 602 at node N 301 .
  • the negative output of current amplifier 900 A is coupled to ground at node N 200 .
  • the outputs of current amplifier 900 A can be swapped with the negative output coupled to node N 301 and the positive output coupled to ground at node N 200 , as long as the corresponding change is made to the digital input to DAC DAC 310 .
  • FIGS. 5A and 5C Two forms of such alternate embodiment are illustrated in FIGS. 5A and 5C implemented with single high current or multiple lower current output circuits, formed by the push-pull current mirrors. Use of the alternate embodiments of FIGS. 5A and 5C to resolve the problem of limited DAC current capability has the added advantage of simultaneously avoiding the problem of the limited bandwidth of the reference input previously described.
  • FIG. 11 illustrates a configuration wherein two separate DACs are used to vary a single component. Strictly speaking, this configuration alters the wave shape of the current flowing through the passive component 330 A being varied such that it may no longer look like the same type of passive component. This may be mitigated if passive component 330 B is the same type as 330 A.
  • a wide variety of electronic circuits either generate or are selectively responsive to different frequency signals. Examples are variable frequency oscillators or filters. Virtually any channelized system uses one or more tunable filters. Tuning requires either mechanical movement of a tuning element or use of a dynamically tracking device. Examples of the dynamically tracking devices include phase locked loops or devices that are able to affect the value of the reactance in a network. An example of the latter type of the device can include a varactor diode that functions to tune the effective resonant frequency of a transmission line or cavity.
  • FIG. 12 illustrates a signal within a passband. Under this condition, the signal to noise ratio is good and standard processing approaches are adequate.
  • FIG. 13 illustrates a more typical situation, simplified to three ac signals. The signal at a frequency below F 1 is typically attenuated sufficiently such that it is not a problem unless it has an exceptionally large relative power. Of the two remaining signals inside the passband where the desired signal is the smaller of the two, a selection process should occur or the larger would dominate the detection process.
  • Selection is accomplished by mixing the broadband, amplified and filtered received signal with the output of local oscillator LO 1400 to generate the sum and difference frequencies.
  • Filter F 1402 follows the mixer and is typically designed to both pass the difference frequency and attenuate the sum frequency.
  • FIG. 15 illustrates the embodiment of dynamically tunable filters in three different locations.
  • the use of a tracking/adjustable filter following the mixer allows for a much narrower band pass because the component variations associated with manufacturing processes can be reduced to insignificance.
  • both the L and C components should be independently controlled. In general, this requires the use of two DACs and two feedback networks. By sensing and controlling both types of reactive components it is possible to control both the center frequency and the impedance of the network at the same time thereby allowing adjustable frequency and impedance control at any given frequency within the band. In special cases, two sense control currents maybe fed back by way of a single current buffer into a common node.
  • Another embodiment uses a single DAC and feedback circuit that affects the performance of a network of components rather than an individual L or C.
  • the series LC tank circuit one node is AC grounded and a signal is applied to the other.
  • This circuit would function as a simple notch filter. It is well known that all components have parasitic resistance associated with them and this example has two. Applying the DAC and feedback system to the entire filter permits a reduction in the effective parasitic resistance of the network rather than varying the individual element values and without affecting the resonant frequency of the network. The result is a very high-unloaded Q, and a lower insertion loss for the network system.
  • the lower loss and higher Q permit use of narrower filter bandwidths and can also provide some of the benefits associated with super cooled circuits, lower thermal noise and greater frequency selectivity.
  • This structure can be applied to more complicated network structures, to allowing them to more closely approach the functionality of ideal components than with present circuit structures.
  • variable passive components with high resolution, digital value selection and control have been described.

Abstract

The present system provides a method for varying the value of passive components in electronic circuits. Passive components can range from basic resistors, capacitors, and inductors to complex, structures such as transmission lines and resonant cavities. Value selection and variation can either be dynamically performed during circuit operation or as a one-time part of the manufacturing process as determined by the requirements of the specific application. A digital-to-analog converter (DAC) circuit is used to input value selection data digitally, and control value selection with value resolution dependent on the resolution of the DAC. An alternate embodiment is provided for high frequency operation.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims the benefit of U.S. provisional patent application No. 60/734,516, filed Nov. 7, 2005, which is herein incorporated by reference in its entirety.
BACKGROUND
A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all copyright rights whatsoever.
1. Field
The present system relates to the field of variable, passive, electronic components.
2. Background Art
Throughout the history of electronics, the inherent characteristics and consequences associated with the presence of fixed value passive components have impacted circuit performance. The characteristics include component tolerances, tolerance build-up, the relatively high cost of using high precision components, added circuitry required to provide precision control or precisely set component values or performance characteristics, and changes in component value or performance produced by component aging, operating history, and changes in environmental conditions.
FIG. 1 illustrates an idealized solution in the form of variable resistor R100, varaiable capacitor C100 and variable inductor L100. These components would be comparable in nature to the present passive devices they would replace, but whose value could be adjusted to provide nearly nominal performance over widely varying operating conditions. Variability would either be part of the manufacturing processes, or dynamically available during actual operation, as determined on a case-by-case basis. One useful application illustrated is directed toward providing a matched, complex termination (Z100) for a transmission line structure (TL100).
As a result of the long-recognized benefits associated with use of variable passive components, techniques have been made developed to provide this capability using the present art. The effectiveness of the techniques is generally limited to specific types of components over a limited range of operating conditions, such as frequency or power level. One example of a digitally controlled, variable resistor of the present art is shown in FIG. 2A. A switched resistor network is used with control FETs such that turning one or more FETs “on” places resistors in parallel, reducing the effective resistive value of the combination. Resistor networks are more frequently implemented as series structures with one or more FETs used to short out unwanted resistors in the chain. For resistors, value selection controls are far simpler with series connection. Switched capacitor structures are typically configured as parallel networks, again simplifying value selection controls.
Other implementations of variable value components generally realize the function but can have significant impact on the circuit or limited performance. FIG. 2B illustrates the use of the channel resistance of a FET as a variable resistor (note resistor R206 is variable implying some form of gate voltage control). Among the undesirable characteristics of this approach are the large number of unused components and the characteristics of the FET switches. When a value has been selected, there are typically many unused components. This is typically not a major issue for an integrated resistor network but switched capacitor networks can require discrete capacitors to realize large values, adding cost and using circuit board area that could be used for functioning circuitry.
The switch FETs also can present significant problems. If kept small to minimize chip area utilization, they tend to have significant resistance that is aggravated by their rapid resistance increase with temperature (a sensitivity experienced to an even greater degree by the circuit for FIG. 2B). If the FETs are enlarged to reduce resistance, they consume greater area. Either way, there is an incentive to minimize the number of switched devices (4-bit is most common with 8-bit the maximum generally encountered), thereby limiting resolution of the component value.
FIG. 2C illustrates a varactor diode, which provides the function of a controlled variable capacitor. Implementation requires a DC control voltage and DC isolation. Use is generally limited to RF applications where the small diode capacitance under reverse junction bias yields appropriate values for circuit operation.
Inductors are particularly difficult components in which to implement variability because they frequently are wound around a magnetic core material. Modification of the geometric relationship between the core material and the winding provides inductance adjustment capacity. However, the adjustment capacity is typically a mechanical setting with real time adjustment being largely impractical, particularly at high frequencies.
A significant issue associated with realization of component value variability is energy storage, which is a function of the component value (whether primary or parasitic in nature). Alteration of a component value typically involves movement of energy into or out of the storage mechanisms associated with the specific type of passive component, thereby significantly limiting the speed of circuit operation. For many applications, it would be highly beneficial to be able to change the apparent component value without requiring significant energy transfer.
It would therefore be highly desirable to implement low cost, high-resolution value variation for common passive components.
SUMMARY
The present system is an electronic, digital-to-analog converter (DAC) circuit that provides means to detect current flowing through a passive component and source or sink additional current such that the value of the passive component appears to vary from its actual or fixed value. The term “fixed value” is not intended to imply that the passive component value does not vary with environmental or circuit application conditions, or include initial tolerance variation. Rather than unchanging, the term “fixed value” means the instantaneous actual value of the component (or component characteristic) in the specific circuit and under the actual environmental conditions in which it is operating.
The present system employs feedback such that the additional current tracks current flowing through the passive component. The DAC functions as a source for the additional current and either supplies it directly or functions as a reference for external current drive circuits. The digital inputs to the DAC function to set the gain of the DAC and thereby provide high-resolution adjustment of the equivalent variable component value. Resolutions equal to or greater than 24-bits may be realized, where the resolution is primarily limited by the combined DAC operating frequency and resolution in each specific application.
In one or more embodiments, the present system is coupled to a fixed value passive component within an electronic circuit, whereby operation of the present system produces operation by the electronic circuit substantially equivalent to that which would be produced by an altered value of the fixed value passive component.
In one or more embodiments of the present system, the value of the fixed value passive component is a linear component.
In one or more embodiments of the present system, the value of the fixed value passive component is a non-linear component.
In one or more embodiments of the present system, the fixed value passive component is a characteristic of an active component such as a semiconductor junction capacitance.
In one or more embodiments of the present system, a transimpedance amplifier senses the current through the fixed value passive component.
In one or more embodiments of the present system, the output of the transimpedance amplifier is coupled to a DAC voltage reference input.
In one or more embodiments, the present system includes a current sense resistor in series with the fixed value passive component.
In one or more embodiments of the present system, the feedback signal from the current sense resistor coupled to a DAC voltage reference input.
In one or more embodiments, the present system includes a DAC that directly sources or sinks current from the circuit nodes terminating the series combination of the fixed value passive component and the current sense resistor.
In one or more embodiments, the present system includes a DAC that provides reference current for external drive circuitry that sources or sinks current from circuit nodes terminating the series combination of the fixed value passive component and the current sense resistor.
In one or more embodiments, the present system includes external drive circuitry with single sided current sense and single output for driving a shunt passive component with current sense resistor connected to ground.
In one or more embodiments, the present system includes external drive circuitry with differential current sense and differential outputs for driving a series passive component with floating current sense resistor.
In one or more embodiments, the present system includes external drive circuitry for high current applications, including one or more output current amplifiers having both differential inputs and differential outputs.
In one or more embodiments of the present system, the fixed value passive component is a distributed structure such as a transmission line, resonant cavity, slotted line, stub tuner, waveguide or antenna.
In one or more embodiments of the present system, more than one DAC controls current injection or removal from a single pair of nodes.
In one or more embodiments of the present system, current sense feedback is taken from a passive component connected between nodes into which current is neither injected nor removed in response to the current sense feedback.
In one or more embodiments of the present system, the present system provides signals that are coupled between two or more fixed value passive components.
In one or more embodiments, one or more variable components of the present system are varied as a function of frequency such that the circuit functions as a tracking filter.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an illustration of a number of variable passive components realizable by various embodiments of the present system.
FIG. 2A is a circuit diagram of a switched resistor network.
FIG. 2B is a circuit diagram of a FET realization of a variable resistor.
FIG. 2C is a circuit diagram of a varactor diode realization of a variable capacitor.
FIG. 3A is a circuit diagram of a fixed value, series resistor.
FIG. 3B is a circuit diagram of a fixed value, shunt resistor to ground.
FIG. 3C is a circuit diagram of the resistor of FIG. 3A incorporating a resistive embodiment of the current sense function of the present system.
FIG. 3D is a circuit diagram of the resistor of FIG. 3B incorporating a resistive embodiment of the current sense function of the present system.
FIG. 3E is a circuit diagram of the circuit of FIG. 3C with the fixed value resistor replaced by a fixed value capacitor.
FIG. 3F is a circuit diagram of the circuit of FIG. 3D with the fixed value resistor replaced by a fixed value capacitor.
FIG. 3G is a functional block diagram of one embodiment of the present system.
FIG. 3H is a functional block diagram of one embodiment of the present system with floating current sense resistor.
FIG. 3I is a functional block diagram of the preferred embodiment of the present system incorporating zero impedance current sense.
FIG. 3J is a simplified circuit diagram of the transimpedance amplifier function shown in FIG. 3I.
FIG. 4A is a circuit diagram illustrating use of variable component value to control output signal amplitude.
FIG. 4B is a circuit diagram illustrating means for realization of the component variability as illustrated in FIG. 4A.
FIG. 4C is a circuit diagram illustrating alternate means for realization of component variability as illustrated in FIG. 4B.
FIG. 5A is a circuit diagram of a single output embodiment of the present system.
FIG. 5C is a circuit diagram of a differential output embodiment of the present system.
FIG. 6 is a functional block diagram of a variable resistor embodiment of the present system.
FIG. 7 is a functional block diagram of a variable resistor embodiment of the present system with alternate current feed polarity.
FIG. 8 is a functional block diagram of a variable resistor embodiment of the present system with fine adjustment capability.
FIG. 9 is a functional block diagram of a high current, variable resistor embodiment of the present system.
FIG. 11 is a functional block diagram of the present system illustrating open loop signal coupling from a second passive component to a first, variable passive component.
FIG. 12 is an illustration of the RF frequency characteristics of a tracking filter embodiment of the present system.
FIG. 13 is an illustration of the IF frequency characteristics of a tracking filter embodiment of the present system.
FIG. 14 is a functional block diagram of a generic receiver system employing conventional filters.
FIG. 15 is a functional block diagram of the generic receiver system of FIG. 14 implemented with multiple tracking filter embodiments of the present system.
 DETAILED DESCRIPTION OF THE SYSTEM
The present system is directed to variable passive components with high-resolution, digital value selection and control. In the following description, numerous specific details are set forth to provide a more thorough description of embodiments of the system. It is apparent, however, to one skilled in the art, that the system may be practiced without these specific details. In other instances, well known features have not been described in detail so as not to obscure the system. Except as noted herein, common components and connections, identified by common reference designators function in like manner in each circuit.
The present system is a digital-to-analog converter circuit that provides the capability to dynamically vary the apparent value of passive components to the circuitry to which they are coupled in a wide range in analog and mixed signal electronic circuits. The term “fixed value” refers to does not imply that the value of the component does not vary with operating or environmental conditions, but rather represents the component value while operating in the circuitry without operation of the present system to alter its apparent value. The term “passive components” represents either individual discrete passive parts or passive characteristics of other components such as diodes, bipolar junction transistors, FETs, etc. The passive components may be linear or non-linear.
A consideration in implementation of the present system is whether or not the passive component has one of its terminals connected to ground (or either a floating reference or return node). Ground connected components are typically easier to vary with a wider choice of implementations than for an arbitrarily connected passive component.
One element of the present system is a means for sensing the current flowing through the fixed value passive component whose apparent value is to be varied. One example means of current sensing is by the addition of a small value, current sense resistor placed in series with the passive component. FIGS. 3A through 3F illustrate some of the various configurations of passive components, each with current sense resistors added in series.
One embodiment of the present system is illustrated in FIG. 3G. DAC310 is a current output DAC with a voltage reference input VREF. Current sense resistor 320 is placed in series with a fixed value passive component 330. The voltage across resistor 320 is a representation of the current through passive component 320 and is applied to the reference input of DAC 310. Within the bandwidth of the DAC reference amplifier, the output current maintains the same characteristic shape as a function of time, as that through the fixed value passive component. Thus the output of the DAC is equivalent to a fixed value passive component of the same type as passive component 330 placed in parallel with passive component 330. The value of the “added parallel component” is determined by scaling of the DAC output current by the DAC digital input setting. For some applications, the apparent value of the fixed value component can be altered intra-cycle up to some frequency.
As shown in FIG. 3G, the DAC outputs are cross coupled such that positive DAC output current flows in the same direction as a positive current through the sense resistor. If the passive component is a capacitor, the configuration shown would make the capacitor appear larger in value. If the passive component is a resistor or inductor, the apparent parallel combination would be a smaller value. If the positive and negative outputs of the DAC are swapped, as shown in FIG. 8, the capacitor value would apparently decrease and that of a resistor or inductor increase. Thus, the present system can readily produce negative component values. The value change is of course dynamic in nature and does not provide energy storage.
FIG. 3H illustrates an alternate embodiment with floating current sense resistor.
The embodiment of FIG. 3G has 3 is typically used for components that are coupled to ground. An embodiment for use with non-grounded components is discussed below. Note that the addition of any resistance in series with passive component 330 can impact circuit performance for some applications. One alternative is discussed in the Transimpedance Amplifier Current Sense Embodiment below. Further, DACs are typically not designed for this type of application and operate using a DC voltage reference. As a result, the bandwidth of the reference input amplifier may be limited (around 500 KHz). However, in some of the newer DACs, this bandwidth is 10s of MHz. The embodiment for floating components provides a direct means for avoiding the reference amplifier bandwidth limitation and implementing the present system at RF frequencies.
Transimpedance Amplifier Current Sense Embodiment
FIGS. 3I and 3J illustrate a method for sensing the current in shunt components to ground when feasible. Within the bandwidth of the transimpedance amplifier, the current is sensed while the passive component terminal is held at virtual ground. Use of the transimpedance amplifier avoids performance degradation caused by the presence of a current sense resistor or any offset voltage associated with the DAC reference amplifier that may or may not be easily correctable.
Wideband transimpedance amplifiers are realizable with appropriately designed feedback. It is desirable to have the transimpedance amplifier circuitry integrated into the DAC integrated circuit with external feedback selection by the user. FIG. 3J illustrates an embodiment of a transimpedance amplifier 350.
Variable Component Equivalent Circuit
FIG. 4A is a schematic that illustrates one of the methods for the use and implementation of a variable component. VSOURCE1 is a voltage source generating an arbitrary output waveform at node N401. Output voltage V0 at node N402 is a reduced amplitude representation of the voltage at node N401. The amplitude reduction is produced by a resistor divider network comprised of resistor R401 coupling node N401 to node N402 and a resistor equivalent comprised of the parallel combination of resistors R402 and R403, which couple node N402 to ground. Resistor R402 is variable and is used to compensate for variations in the values of resistors R401 and R403, thereby providing the desired ratio of the voltages at nodes N401 and N402. The current flowing through resistor R402 is IR402.
An equivalent circuit for maintenance of the ratio of voltages at nodes N401 and N402 is shown in FIG. 4B. A second voltage source VSOURCE2 couples node N403 to ground and is connected in series with resistor R404, which couples node N403 to node N402. Voltage source VSOURCE2 and resistor R404 operate together such that the current through resistor R404 is IR402, the same as the current flowing through resistor R402 of FIG. 4A. Thus the combination of voltage source VSOURCE2 and resistor R404 is the functional equivalent of the variable resistor R402. Typically, the output of voltage source VSOURCE2 will be variable and the value of resistor R404 will be fixed.
FIG. 4C is an alternate representation to the circuit shown in FIG. 4B. Current source ISOURCE2 couples node N402 to ground and replaces the series combination of voltage source VSOURCE2 and resistor R404. The current supplied is IR402 so that the current source is the functional equivalent of variable resistor R403 in FIG. 4A. For the embodiments illustrated in FIGS. 3G, 3H, 31, 6, 7, 8, 10, and 11, current source ISOURCE2 is provided directly by the output from a current output DAC. For the embodiment illustrated in FIG. 9, current source ISOURCE2 is provided by the combination of current output DAC DAC310 and current amplifier 900A.
Embodiment for Generic Passive Component Value Selection
As previously discussed, presently available DACs are often of limited use for the embodiment illustrated in FIG. 3G and the transimpedance amplifier embodiment illustrated in FIG. 3I. This can be due to the limited bandwidth of the analog reference input. While some devices have a reference bandwidth of several MHz, most are limited to approximately 500 KHz. For the present system, this would limit their utilization to audio applications or equivalent.
The embodiments illustrated in FIGS. 5A and 5C represent embodiments for realization of the highest level of speed and performance while avoiding the DAC reference limitations. These embodiments use the DAC in a configuration to set the gain of a differential amplifier. The differential amplifier functions as the input or sense element.
FIG. 5A shows a single-ended version for use with components in shunt to ground. FIG. 5C shows the more general double-ended circuit to be used with components between 2 arbitrary circuit nodes. The circuit of FIG. 5C can also be used with ground reference in place of that shown in FIG. 5A. Both of these configurations have the additional advantage of avoiding the problem with limited bandwidth for the reference input. Each has a high speed, differential amplifier input circuit that allow standard DACs to be used with a DC reference level, typically ground. The configuration shown in FIG. 5A is a single output version of the configuration of FIG. 5C.
High Current Embodiment
In addition to limited bandwidth of the reference input, another problem in using DACs of the present art is their limited output current capability. Many variable component applications simply require higher current levels than the 20 milliamperes that is the typical maximum output for most DACs. One solution to the current capacity problem would be to simply increase the current output capability of the DAC. However, this approach can only be used to achieve a limited increased before it would affect the nature and realization of the DAC integrated circuit and its functionality. Nevertheless, variable component values can be as valuable in high current power circuits as in low power digital processing and communications applications.
A general solution involves the addition of a differential current amplifier to the output of the control DAC as shown in FIG. 9. The positive output of DAC DAC310 is coupled to the positive input of differential current amplifier 900A. The negative output of DAC DAC310 is coupled to the negative input of differential current amplifier 900A. The positive output of current amplifier 900A is coupled to resistor R602 at node N301. The negative output of current amplifier 900A is coupled to ground at node N200. As with previous configurations, the outputs of current amplifier 900A can be swapped with the negative output coupled to node N301 and the positive output coupled to ground at node N200, as long as the corresponding change is made to the digital input to DAC DAC310.
For high current applications, use of current amplifier 900A may be required. For moderately higher current applications up to a few amperes, the need for separate current amplifier 900A can be avoided by of an alternate embodiment. Two forms of such alternate embodiment are illustrated in FIGS. 5A and 5C implemented with single high current or multiple lower current output circuits, formed by the push-pull current mirrors. Use of the alternate embodiments of FIGS. 5A and 5C to resolve the problem of limited DAC current capability has the added advantage of simultaneously avoiding the problem of the limited bandwidth of the reference input previously described.
Component Value Selection Using Multiple Controls
FIG. 11 illustrates a configuration wherein two separate DACs are used to vary a single component. Strictly speaking, this configuration alters the wave shape of the current flowing through the passive component 330A being varied such that it may no longer look like the same type of passive component. This may be mitigated if passive component 330B is the same type as 330A.
Use of this configuration is not likely to be a common occurrence since typically calibration routines controlled by Digital Controller 300 can accomplish the same results as an added mixed-signal circuit. The use of multiple controls has much greater potential for coupling signals into a single circuit.
Real Time Frequency Tracking Circuit Embodiments
A wide variety of electronic circuits either generate or are selectively responsive to different frequency signals. Examples are variable frequency oscillators or filters. Virtually any channelized system uses one or more tunable filters. Tuning requires either mechanical movement of a tuning element or use of a dynamically tracking device. Examples of the dynamically tracking devices include phase locked loops or devices that are able to affect the value of the reactance in a network. An example of the latter type of the device can include a varactor diode that functions to tune the effective resonant frequency of a transmission line or cavity.
Historically, there have been a number of approaches to deal with the basic problem of differentiating a desired signal from the adjacent signals and noise sources. FIG. 12 illustrates a signal within a passband. Under this condition, the signal to noise ratio is good and standard processing approaches are adequate. FIG. 13 illustrates a more typical situation, simplified to three ac signals. The signal at a frequency below F1 is typically attenuated sufficiently such that it is not a problem unless it has an exceptionally large relative power. Of the two remaining signals inside the passband where the desired signal is the smaller of the two, a selection process should occur or the larger would dominate the detection process.
The typical selection process is illustrated in FIG. 14. Selection is accomplished by mixing the broadband, amplified and filtered received signal with the output of local oscillator LO1400 to generate the sum and difference frequencies. Filter F1402 follows the mixer and is typically designed to both pass the difference frequency and attenuate the sum frequency.
One problem associated with this approach results from the fact that mixers are non-linear devices. If an interfering signal is sufficiently large, the mixer is placed into compression and the output amplitude of the smaller, desired signal is badly attenuated. The result is the need for very high IP3 performance in the mixer with a resulting reduced ability to handle very small signals.
FIG. 15 illustrates the embodiment of dynamically tunable filters in three different locations. The ability to make input filters F1500 and F1501 narrow-band compared to those that typically transmit the entire system passband, substantially reduces the interference from other signal/noise sources. For example, if the tracking filters have a bandwidth of 10% of the usual passband, the power of the “noise” compared to the desired signal power inside the passband of the tracking filter is typically reduce by a factor of 10, assuming a typical congested cell phone band as an example. This significantly reduces the IP3 requirements, reduces intermodulation products, and allows for better sensitivity of low amplitude signals. The use of a tracking/adjustable filter following the mixer allows for a much narrower band pass because the component variations associated with manufacturing processes can be reduced to insignificance.
A cascaded, double conversion process using two, offset IF frequencies is commonly used to increase selectivity. Dynamically adjustable filters used with the cascaded selection improves the signal to noise ratio substantially beyond a basic approach as illustrated in FIG. 15. Clearly these are a multitude of reactive networks used to filter or otherwise manipulate the frequency characteristics of such systems. The following discussion will be focused on the most simple, and easily implemented form of adjustable filter, the ground referenced parallel L-C network.
In order to maintain specific impedance for a filter, both the L and C components should be independently controlled. In general, this requires the use of two DACs and two feedback networks. By sensing and controlling both types of reactive components it is possible to control both the center frequency and the impedance of the network at the same time thereby allowing adjustable frequency and impedance control at any given frequency within the band. In special cases, two sense control currents maybe fed back by way of a single current buffer into a common node.
Another embodiment uses a single DAC and feedback circuit that affects the performance of a network of components rather than an individual L or C. For the series LC tank circuit, one node is AC grounded and a signal is applied to the other. This circuit would function as a simple notch filter. It is well known that all components have parasitic resistance associated with them and this example has two. Applying the DAC and feedback system to the entire filter permits a reduction in the effective parasitic resistance of the network rather than varying the individual element values and without affecting the resonant frequency of the network. The result is a very high-unloaded Q, and a lower insertion loss for the network system. The lower loss and higher Q permit use of narrower filter bandwidths and can also provide some of the benefits associated with super cooled circuits, lower thermal noise and greater frequency selectivity. This structure can be applied to more complicated network structures, to allowing them to more closely approach the functionality of ideal components than with present circuit structures.
Thus, variable passive components with high resolution, digital value selection and control have been described.

Claims (14)

1. A circuit comprising:
a passive component coupled between a first node and a second node;
a digital-to-analog converter having a first output coupled to the first node and a second output coupled to a third node, and having a reference input coupled to the second node;
a controller coupled to the digital-to-analog converter;
a sense resistor coupled between the second node and the third node.
2. The circuit of claim 1 wherein the third node is ground.
3. The circuit of claim 1 wherein the passive component is a resistor.
4. The circuit of claim 1 wherein the passive component is a capacitor.
5. The circuit of claim 1 wherein the passive component is an inductor.
6. The circuit of claim 1 wherein the reference input is a voltage reference.
7. The circuit of claim 1 wherein the controller is a digital controller for controlling the digital-to-analog converter.
8. A circuit comprising:
a sense resistor coupled between a first node and a second node;
a digital-to-analog converter having a first output coupled to the first node and a second output coupled to a third node, and having a reference input coupled to the second node;
a controller coupled to the digital-to-analog converter;
a passive component coupled between the second node and the third node.
9. The circuit of claim 8 wherein the third node is ground.
10. The circuit of claim 8 wherein the passive component is a resistor.
11. The circuit of claim 8 wherein the passive component is a capacitor.
12. The circuit of claim 8 wherein the passive component is an inductor.
13. The circuit of claim 8 wherein the reference input is a voltage reference.
14. The circuit of claim 8 wherein the controller is a digital controller for controlling the digital-to-analog converter.
US11/557,425 2005-11-07 2006-11-07 Variable passive components with high resolution value selection and control Expired - Fee Related US7352312B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/557,425 US7352312B2 (en) 2005-11-07 2006-11-07 Variable passive components with high resolution value selection and control
US12/060,044 US7525468B2 (en) 2005-11-07 2008-03-31 Variable passive components with high resolution value selection and control
US12/431,581 US7907073B2 (en) 2005-11-07 2009-04-28 Variable passive components with high resolution value selection and control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73451605P 2005-11-07 2005-11-07
US11/557,425 US7352312B2 (en) 2005-11-07 2006-11-07 Variable passive components with high resolution value selection and control

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/060,044 Continuation US7525468B2 (en) 2005-11-07 2008-03-31 Variable passive components with high resolution value selection and control

Publications (2)

Publication Number Publication Date
US20070194813A1 US20070194813A1 (en) 2007-08-23
US7352312B2 true US7352312B2 (en) 2008-04-01

Family

ID=38024069

Family Applications (3)

Application Number Title Priority Date Filing Date
US11/557,425 Expired - Fee Related US7352312B2 (en) 2005-11-07 2006-11-07 Variable passive components with high resolution value selection and control
US12/060,044 Expired - Fee Related US7525468B2 (en) 2005-11-07 2008-03-31 Variable passive components with high resolution value selection and control
US12/431,581 Expired - Fee Related US7907073B2 (en) 2005-11-07 2009-04-28 Variable passive components with high resolution value selection and control

Family Applications After (2)

Application Number Title Priority Date Filing Date
US12/060,044 Expired - Fee Related US7525468B2 (en) 2005-11-07 2008-03-31 Variable passive components with high resolution value selection and control
US12/431,581 Expired - Fee Related US7907073B2 (en) 2005-11-07 2009-04-28 Variable passive components with high resolution value selection and control

Country Status (9)

Country Link
US (3) US7352312B2 (en)
EP (1) EP1958331A4 (en)
KR (1) KR101052531B1 (en)
CN (1) CN101356736B (en)
AU (1) AU2006311295A1 (en)
CA (1) CA2632645A1 (en)
MX (1) MX2008007417A (en)
RU (1) RU2408134C2 (en)
WO (1) WO2007056730A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080180294A1 (en) * 2005-11-07 2008-07-31 Washburn Robert D Variable passive components with high resolution value selection and control

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2472273A (en) 2009-07-31 2011-02-02 Cambridge Silicon Radio Ltd Fine gain adjustment of tuned circuit for UWB receiver
WO2014042118A1 (en) * 2012-09-13 2014-03-20 独立行政法人産業技術総合研究所 Multilevel power conversion circuit and device
US9385741B2 (en) * 2014-10-27 2016-07-05 Mediatek Inc. Digital-to-analog conversion apparatus for generating combined analog output by combining analog outputs derived from using different sampling clocks and related method thereof
CN108736855B (en) * 2017-04-21 2021-12-21 展讯通信（上海）有限公司 Passive filter circuit and transmitting circuit
US10110175B1 (en) * 2017-05-19 2018-10-23 Qualcomm Incorporated Preventing distortion in a differential power amplifier
US11272854B1 (en) * 2020-09-02 2022-03-15 Analog Devices International Unlimited Company Noise cancellation in impedance measurement circuits

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121995A1 (en) * 2000-12-29 2002-09-05 Summit Microelectronics, Inc Apparatus and method for digital to analog conversion
US20040080441A1 (en) * 2002-10-29 2004-04-29 Motorola, Inc. Method and apparatus for increasing a dynamic range of a digital to analog converter
US20050062629A1 (en) * 2001-10-29 2005-03-24 Frederic Roger High-resolution digital-to-analog convertor
US6917316B2 (en) * 2003-05-19 2005-07-12 Semtech Corporation Digital adjustment of gain and offset for digital to analog converters
US6940440B1 (en) * 2003-10-24 2005-09-06 National Semiconductor Corporation System and method for detecting when an external load is coupled to a video digital-to-analog converter
US6977602B1 (en) * 2004-07-13 2005-12-20 Maxim Integrated Products, Inc. Wide band digital to analog converters and methods, including converters with selectable impulse response
US7030793B2 (en) * 2004-02-18 2006-04-18 Standard Microsystems Corporation Accurate testing of temperature measurement unit
US20060092065A1 (en) * 2004-10-29 2006-05-04 Broadcom Corporation Delay equalized z/2z ladder for digital to analog conversion
US20060092062A1 (en) * 2004-10-29 2006-05-04 Broadcom Corporation Method and system for a glitch-free differential current steering switch circuit for high speed, high resolution digital-to-analog conversion
US7098830B2 (en) * 2004-04-09 2006-08-29 Texas Instruments Incorporated Current switching arrangement for D.A.C. reconstruction filtering
US20070085719A1 (en) * 2003-02-28 2007-04-19 Silicon Laboratories, Inc. Mixing dac architectures for a radio frequency receiver

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3516005A1 (en) * 1985-05-03 1986-11-06 Zdzislaw Medford Mass. Gulczynski DIGITAL-ANALOG CONVERTER
DE3901314A1 (en) * 1989-01-18 1990-07-26 Knick Elekt Messgeraete Gmbh Circuit arrangement for simulating a variable impedance, particularly an ohmic resistance
US4990916A (en) * 1990-01-30 1991-02-05 Analog Devices, Bv Single-supply digital-to-analog converter for control function generation
US5130565A (en) * 1991-09-06 1992-07-14 Xerox Corporation Self calibrating PWM utilizing feedback loop for adjusting duty cycles of output signal
GB2270595B (en) * 1992-09-09 1995-12-06 Guy De Warrenne Bruce Adams An audio system
US5606318A (en) * 1994-09-30 1997-02-25 Honeywell Inc. Apparatus for conversion of scaled binary data
KR0118873B1 (en) * 1995-06-29 1999-03-30 김태구 Indicator for fuel remainder using variable resistor
KR19980039340A (en) * 1996-11-27 1998-08-17 김광호 Complex variable resistor
US6067327A (en) * 1997-09-18 2000-05-23 International Business Machines Corporation Data transmitter and method therefor
US6509796B2 (en) * 2000-02-15 2003-01-21 Broadcom Corporation Variable transconductance variable gain amplifier utilizing a degenerated differential pair
GB0108656D0 (en) * 2001-04-06 2001-05-30 Koninkl Philips Electronics Nv Digital to analogue converter
US6897704B2 (en) * 2001-05-25 2005-05-24 Thunder Creative Technologies, Inc. Electronic isolator
EP1445678A1 (en) * 2003-02-05 2004-08-11 Agilent Technologies, Inc. - a Delaware corporation - Voltage to current converter
US7126288B2 (en) * 2003-05-05 2006-10-24 International Rectifier Corporation Digital electronic ballast control apparatus and method
ITMI20031924A1 (en) * 2003-10-07 2005-04-08 Atmel Corp HIGH PRECISION DIGITAL TO ANALOGUE CONVERTER WITH OPTIMIZED ENERGY CONSUMPTION.
US7154308B2 (en) * 2004-09-30 2006-12-26 Via Technologies, Inc. Driver circuit with gradual voltage ramp up and ramp down
EP1958331A4 (en) * 2005-11-07 2013-01-02 Dorothy Llc Variable passive components with high resolution value selection and control
US7652445B2 (en) * 2006-04-10 2010-01-26 Texas Instruments Incorporated On-chip compensation for a fully differential voice coil motor control
US7403041B2 (en) * 2006-05-11 2008-07-22 Broadcom Corporation Techniques for enabling a 10BT active output impedance line driver using a low power supply
US7439810B2 (en) * 2006-06-08 2008-10-21 Harris Corporation Fast bias for power amplifier gating in a TDMA application
US7764210B2 (en) * 2006-12-20 2010-07-27 Texas Instruments Incorporated System and method for converting an input signal

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121995A1 (en) * 2000-12-29 2002-09-05 Summit Microelectronics, Inc Apparatus and method for digital to analog conversion
US20050062629A1 (en) * 2001-10-29 2005-03-24 Frederic Roger High-resolution digital-to-analog convertor
US6995700B2 (en) * 2001-10-29 2006-02-07 Infineon Technologies Ag High-resolution digital-to-analog converter
US20040080441A1 (en) * 2002-10-29 2004-04-29 Motorola, Inc. Method and apparatus for increasing a dynamic range of a digital to analog converter
US20070085719A1 (en) * 2003-02-28 2007-04-19 Silicon Laboratories, Inc. Mixing dac architectures for a radio frequency receiver
US6917316B2 (en) * 2003-05-19 2005-07-12 Semtech Corporation Digital adjustment of gain and offset for digital to analog converters
US6940440B1 (en) * 2003-10-24 2005-09-06 National Semiconductor Corporation System and method for detecting when an external load is coupled to a video digital-to-analog converter
US7030793B2 (en) * 2004-02-18 2006-04-18 Standard Microsystems Corporation Accurate testing of temperature measurement unit
US7098830B2 (en) * 2004-04-09 2006-08-29 Texas Instruments Incorporated Current switching arrangement for D.A.C. reconstruction filtering
US6977602B1 (en) * 2004-07-13 2005-12-20 Maxim Integrated Products, Inc. Wide band digital to analog converters and methods, including converters with selectable impulse response
US20060092065A1 (en) * 2004-10-29 2006-05-04 Broadcom Corporation Delay equalized z/2z ladder for digital to analog conversion
US20060092062A1 (en) * 2004-10-29 2006-05-04 Broadcom Corporation Method and system for a glitch-free differential current steering switch circuit for high speed, high resolution digital-to-analog conversion

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080180294A1 (en) * 2005-11-07 2008-07-31 Washburn Robert D Variable passive components with high resolution value selection and control
US7525468B2 (en) * 2005-11-07 2009-04-28 Washburn Robert D Variable passive components with high resolution value selection and control
US20090207063A1 (en) * 2005-11-07 2009-08-20 Washburn Robert D Variable passive components with high resolution value selection and control
US7907073B2 (en) * 2005-11-07 2011-03-15 Dorothy, Llc Variable passive components with high resolution value selection and control

Also Published As

Publication number Publication date
CN101356736A (en) 2009-01-28
EP1958331A4 (en) 2013-01-02
US20080180294A1 (en) 2008-07-31
KR20080091095A (en) 2008-10-09
RU2008122881A (en) 2009-12-20
WO2007056730A2 (en) 2007-05-18
US7525468B2 (en) 2009-04-28
CA2632645A1 (en) 2007-05-18
EP1958331A2 (en) 2008-08-20
KR101052531B1 (en) 2011-07-29
RU2408134C2 (en) 2010-12-27
US20090207063A1 (en) 2009-08-20
CN101356736B (en) 2012-05-30
US20070194813A1 (en) 2007-08-23
MX2008007417A (en) 2008-10-24
AU2006311295A1 (en) 2007-05-18
WO2007056730A3 (en) 2008-07-17
US7907073B2 (en) 2011-03-15

Similar Documents

Publication Publication Date Title
US7907073B2 (en) Variable passive components with high resolution value selection and control
US4048598A (en) Uhf tuning circuit utilizing a varactor diode
US5563545A (en) Low cost monolithic GaAs upconverter chip
US5548248A (en) RF amplifier circuit
US6862437B1 (en) Dual band tuning
US8190115B2 (en) Transmission line coupled to circuits and Q-enhancement cell
US6028496A (en) Active inductor
WO2002047251A2 (en) Low noise amplifier having bypass circuitry
US5339048A (en) Radio frequency amplifier
US7129801B2 (en) Interpolative varactor voltage controlled oscillator with constant modulation sensitivity
US5345123A (en) Attenuator circuit operating with single point control
US7509111B2 (en) Integrated circuit having a mixer circuit
GB2393866A (en) A class F Doherty amplifier using PHEMTs
US7432767B2 (en) Tunable low noise amplifier
KR100343681B1 (en) Digital television tuner and method of operating the same
JPH05175761A (en) Controllable amplifier circuit
JP3886642B2 (en) High frequency gain variable amplifier circuit
JPH01173908A (en) Oscillation device and oscillation circuit used therein
US5089791A (en) MMIC-compatible power amplifier
US20050195541A1 (en) Load and matching circuit having electrically controllable frequency range
JPH0653761A (en) High frequency amplifier
JPH08162857A (en) Impedance matching circuit
JP2677178B2 (en) Phase control circuit
JPH05291842A (en) Power circuit
CN111371416A (en) Bias network capable of switching output impedance, control method and power amplifier system

Legal Events

Date Code Title Description
AS Assignment

Owner name: DOROTHY, LLC, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WASHBURN, ROBERT D.;MCCLANAHAN, ROBERT F.;REEL/FRAME:023085/0729

Effective date: 20090803

AS Assignment

Owner name: CMW TECHNOLOGY, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WASHBURN, ROBERT D.;MCCLANAHAN, ROBERT F.;REEL/FRAME:025940/0502

Effective date: 20080505

Owner name: CMW TECHNOLOGY, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WASHBURN, ROBERT D.;MCCLANAHAN, ROBERT F.;REEL/FRAME:025962/0921

Effective date: 20080505

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20120401

AS Assignment

Owner name: MASHHOON, HAMID R, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CMW TECHNOLOGY, LLC;REEL/FRAME:039617/0915

Effective date: 20160831