US7251261B2 - Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance - Google Patents
Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance Download PDFInfo
- Publication number
- US7251261B2 US7251261B2 US11/129,165 US12916505A US7251261B2 US 7251261 B2 US7251261 B2 US 7251261B2 US 12916505 A US12916505 A US 12916505A US 7251261 B2 US7251261 B2 US 7251261B2
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- US
- United States
- Prior art keywords
- heat sink
- semiconductor laser
- wavelength
- temperature
- sink portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
- H01S5/02446—Cooling being separate from the laser chip cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
- H01S5/0612—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
Definitions
- This invention relates generally to temperature control of devices by primarily passive mechanisms, for example as may be used to adjust the wavelength of a semiconductor laser by changing its temperature.
- thermoelectric coolers typically use the Peltier effect. This device can either heat or cool depending on the direction of the electrical current flowing through the Peltier elements.
- resistive heater is a resistor which converts electrical current to heat.
- thermoelectric cooler In either case, the method of temperature variation consumes considerable electrical power.
- the Peltier effect has limited efficiency and the electric power consumption required for cooling is typically several times the power consumed in the laser.
- the thermoelectric cooler When the thermoelectric cooler is used as a heater, it is approximately as efficient as a resistor. While heating can then be more power efficient than cooling, it is still necessary to supply significant electrical power. This is so because it is in general not desirable to operate the laser at high temperatures.
- the laser is generally mounted in such a way that the thermal impedance to an appropriate heat sink is small. In consequence, to obtain a significant additional temperature rise from a heater which is located in proximity to the laser, it is necessary to generate heat of an order of magnitude that is significantly greater than is generated by the laser. If the heater is located downstream of the laser with respect to the heat flow, the situation is even worse, for in that case the thermal impedance to the heat sink is even smaller and more heat must be generated to effect the same temperature rise.
- the additional power that must be provided for temperature tuning may not be acceptable in situations where power consumption is important, for example if the device is operated from a modest sized battery for a significant length of time.
- U.S. Pat. No. 5,371,753 discloses an apparatus in which the thermal impedance of a laser diode heat sink varies during the turn-on cycle of the laser.
- the variation is accomplished through use of a metal structure and an air-gap, which metal structure by virtue of its dimensions is open while the laser is warming up, and closes when the temperature has reached the range of desired values.
- the closure is accomplished by virtue of reversible deformations arising from temperature changes such as may be obtained with shape-memory alloy metals. While this approach can allow the laser to reach a specific temperature range, there is no means by which the temperature that is ultimately reached can be varied significantly or controlled precisely.
- the thermal impedance is not adjustable during device operation. It is fixed during fabrication of the device and this, in turn, fixes the temperature range.
- U.S. Pat. No. 6,243,404 discloses a laser module that can be tuned over a temperature range and different temperature ranges can be selected during fabrication.
- the temperature range is selected by inserting spacers of known thermal impedance between the laser and the ultimate heat sink such that the laser temperature can be made to rise by a fixed known amount above ambient.
- a secondary control mechanism such as a thermoelectric cooler can adjust the laser temperature over a range in the vicinity of the base laser temperature.
- the thermal impedance (and therefore the base laser temperature) is selected at the time of device fabrication and is afterwards fixed. The temperature cannot then later be further adjusted through variations in the thermal impedance and this approach depends on previously described cooling or heating schemes, with their consequent inefficiencies, to accomplish the required temperature adjustments during device operation.
- this approach is used to controllably tune the wavelength of a semiconductor laser.
- the heat generated in the laser itself that is a by-product of its emission, is used to increase the temperature of the laser by an amount which is adjustable using a variable thermal impedance.
- the wavelength of the laser is thereby adjusted to the desired value by means of the variation of wavelength with temperature.
- the overall heat sink has two portions. One portion is thermally coupled to the laser and the other portion is well coupled to the environment. The two portions may be thermally coupled or decoupled to each other and they are coupled for an average time determined by the desired heat flow. Latching type relays can be used to accomplish the required coupling/decoupling with low additional power consumption.
- the two portions of the heat sink are not coupled to each other, the temperature of the semiconductor laser will rise because of the heat generated by the laser itself.
- the two heat sink portions will couple to each other for that fraction of time which is appropriate to yield an average thermal impedance, which in conjunction with the laser heat, stabilizes the temperature at the desired point.
- the two heat sink portions are in thermal contact with each other but the contact area is adjustable, thus changing the overall thermal impedance.
- the contact area may be determined by a deformable material or liquid, which can then be adjusted to change the contact area.
- a secondary heater e.g., a resistive heater
- a resistive heater can be deployed on the laser assembly to shorten the time required to reach a higher temperature. This can be done with little energy penalty because the heater is only on during warm-up (or when other significant rises in temperature are desired) and can thereafter be turned off.
- a temperature sensor is deployed on the laser assembly such that the system can be operated in a closed control loop, a controller is coupled to the temperature sensor and adjusts the thermal impedance of the heat sink to maintain a given temperature.
- a wavelength sensor is used to provide direct feedback from the output of the laser. A controller adjusts the thermal impedance of the heat sink to maintain a given wavelength. Controllers can also operate the heat sink in an open loop manner.
- the temperature control is primarily passive (i.e., not primarily by use of active external heaters or coolers). Therefore, less power is consumed.
- the device can be tuned over a range of temperatures or, in the semiconductor laser example, the semiconductor laser can be tuned over a range of wavelengths.
- FIG. 1 is a diagram of an apparatus where adjustable thermal impedance is achieved by intermittent contact between different parts of the heat sink.
- FIG. 2 is a diagram of an apparatus which allows the thermal impedance to be continuously varied through use of a deformable material.
- FIG. 1 is a diagram of an apparatus where adjustable thermal impedance is achieved by intermittent contact between different parts of a heat sink.
- the heat sink is implemented in two parts, which will be referred to as the laser heat sink 110 and the second heat sink 120 .
- the semiconductor laser 150 is contacted by the laser heat sink 110 , but insulated from the housing 160 such that the heat flow is predominantly through the heat sink.
- the heat sink 110 can be thermally coupled to the second heat sink 120 by virtue of an actuator 170 which drives the two parts together.
- the actuator 170 is a solenoid.
- FIG. 1 shows a case where the laser heat sink 110 is deflected onto the second heat sink 120 when the actuator 170 is extended
- the position of the laser heat sink 110 is fixed and the actuator 170 is used to move the second heat sink 120 into contacting position.
- the laser heat sink portion 110 is part of an integrated assembly which also contains conductive traces 115 for the purpose of establishing useful circuits.
- these circuits 115 preferentially include connections to a temperature sensor 130 that senses the temperature of the semiconductor laser 150 . Using the temperature which is obtained from the sensor 170 , the control circuits 180 can perform operations appropriate to arriving quickly at a desired temperature and stabilizing the temperature at that point.
- the control circuits 180 perform the operation of deciding when the heat sink portions 110 , 120 are in contact and for how long.
- Z C is the thermal impedance from the laser 150 to the second heat sink portion 120 when the actuator 170 connects the two portions 110 , 120 .
- the time t t preferably should be selected on the basis of restricting the variation of the temperature of the laser assembly from the desired temperature, during both the connected time t l and the time not connected (t t ⁇ t l ). Variations arise because the thermal impedance is adjusting from the average impedance during these times.
- the laser assembly is composed of an ensemble of materials with different masses and heat capacities. However, it can be considered to have a thermal mass which is the sum of the products of each mass with the heat capacity appropriate for that material.
- the assembly will rise in temperature in a given time by an amount which is proportional to the laser heating, H, and inversely proportional to the thermal mass of the whole assembly. If temperature variations are desired to be less than a set value, T v , the time when the heat sinks are not connected (t t ⁇ t l ) should be less than the time required for the assembly to rise in temperature by T v .
- a second criterion for setting the time t t could emerge from the observation that the thermal impedance is less than the desired average during the interval t l , and, hence, the temperature will be lower than the average near the end of the connection interval.
- the temperature variations during intervals of disconnection will be larger than the temperature variations during periods of connection. That is because the thermal impedance in disconnection is assumed to be very large by virtue of proper insulation. Accordingly, the criterion based on variations during disconnection will typically be more stringent.
- the actuator 170 can be chosen to be a relay type electrical device wherein a suitable current is supplied to effect connection and a second suitable current is supplied to effect disconnection.
- the relay is latching in the actuator 170 position that is reached as a result of application of current. In that case, the current can be discontinued and no further power is required to retain the actuator 170 position.
- a second current is applied which releases the latch
- Relays can be based on conventional solenoids, but are not restricted to be so. It is also possible to use other types of actuators 170 which have essentially the same mechanical function. These can include MEM actuators, piezoelectric actuators, motor driven actuators, and other actuators which produce the necessary deflections and forces. Preferably, the average power consumption is less than or of the order of that of the laser. As this invention is applicable to lasers of many different powers, the choice of actuator depends in part on the laser. Conventional solenoid type relays, however, generally work well over a broad range of laser choices and can be inexpensive.
- a secondary heater 155 may also be advantageously employed.
- the secondary heater 155 may also be usefully connected via the conductive traces 115 to electrical power which can be applied to more rapidly heat the semiconductor laser 150 to the desired temperature
- the heater 155 consist of a resistor through which current flows.
- Such a resistive heater 155 can be used to rapidly heat the laser assembly to the desired temperature in a time short compared to the time required for the laser heat alone to perform this function. After the required temperature is obtained, the secondary heater 155 may be turned off. If the thermal mass of the laser assembly is not too large, the energy penalty incurred in using the secondary heater is small.
- the heater 155 is secondary in the sense that temperature control is primarily achieved by the heat sink with adjustable thermal impedance.
- the secondary heater 155 is used, for example, in initial heating (e.g., during startup) or as a supplement to heating caused by the laser (e.g., if the laser is moved from one operating temperature to another operating temperature).
- the control circuits 180 can also perform the operation of applying electrical current to any secondary heaters 155 .
- the laser heat sink 110 may be advantageously chosen to be a flex circuit with a copper ground plane.
- the heat is conducted through a copper layer of sufficient width and thickness to have low thermal impedance over the designed length, and electrical circuits may be established using the conductive traces 115 on the insulating layers that are part of the flex circuit. That permits straightforward connection of the temperatures sensor, any secondary heater, laser bias current connections, and any monitor photodiode within the laser assembly.
- connection between the control circuits 180 and the laser heat sink 110 should be chosen such that the thermal impedance of these connections is large. This is facilitated if the traces used for establishing circuits are the minimum width and thickness required to carry the necessary currents. Wires of a gauge as small as possible are advantageously used to make the electrical connections between the traces 115 and the control circuits 180 .
- the laser heat sink 110 itself preferably is not attached to the control circuits 180 .
- a temperature sensor 130 is advantageously mounted on the laser assembly.
- the sensor can be thermistor, or a semiconductor device that produces a voltage from which the temperature can be determined.
- the wavelength of the laser can be directly measured by some sort of wavelength sensor and used as feedback for the control circuits 180 , such that the wavelength of the laser can be set at a previously established target value.
- Thermal insulators may be advantageously chosen to be glass, or in a more preferred embodiment glass which is substantially filled with air bubbles.
- the insulator can be selected using conventional heat flow calculations in order to obtain a thermal impedance of at least 120° C./W, but preferentially at least 200° C./W.
- the 200 mW laser heating can cause the laser assembly to rise by at least 20° C. above the temperature that would be reached if the heat sinks are always connected. Therefore, in this example, the laser wavelength can be expected to change by at least 5 nm between the cases when the heat sinks are always connected and never connected.
- An adequate contact area between the two heat sink portions 110 , 120 is desirable when the actuator 170 forces connection such that excessive thermal impedance is not added by a limited contact area.
- a contact area of 1 mm 2 will suffice if the second heat sink 120 is also copper.
- a secondary resistive heater is deployed on the assembly, it is usually preferable to design the device to provide at least as much heat as the laser in order to affect the warm up time appreciably.
- a suitable choice would be a 500 mW heater.
- the resistor would be 50 Ohms.
- the heat sink portion 110 is desired to elastically deflect when contacted by the actuator 170 and return to its nominal position when contact is withdrawn.
- a deflection of about 1 mm is sufficient, and the actuator 170 could be chosen to have approximately a deflection of 2 mm.
- the actuator 170 need not be in contact with the heat sink other than when desired, and no heat will flow between the two heat sink portions 110 , 120 when the actuator 170 is not extended.
- the control circuits 180 in a preferred embodiment enable closed loop control of the temperature.
- the circuits include a device for reading the output of the temperature sensor 130 , and appropriate electronics for ascertaining the time required for connecting the heat sink portions 110 , 120 .
- a microprocessor or an application specific IC with computational capability can be used to perform the function of establishing connection times.
- There are many possible control algorithms to achieve the desired temperature. One satisfactory way to do this is to estimate the fraction of time the heat sinks should be connected on the basis of the typical variation of temperature as a function of connection time for an adequate sample of assemblies. Individual variability of the assemblies can then be compensated by a microprocessor which will make adjustments to the fraction of time connected, depending on whether the measured temperature from the sensor is either high or low. It is preferred that the heat sinks 110 , 120 be disconnected until the laser gets near to the set-point in order to minimize the time required.
- control circuits 180 also contain a device to drive the actuator 170 .
- a secondary heater is employed, another device to supply current to the heater is added to the control circuits.
- FIG. 2 shows an example where this is accomplished by adjusting the contact area between the laser heat sink 110 and the second heat sink 120 , by applying a adjustable force between the two.
- a deformable material 210 is advantageously placed between the two portions 110 , 120 of the heat sink such that significant changes in contact area are possible with realistic forces.
- the material may be advantageously chosen to be a liquid or a solid of low modulus of elasticity. In the case of a liquid, it is necessary to control the spacing between the laser heat sink 110 and second heat sink 120 rather than the force.
- Liquids can advantageously be chosen to be oil or mercury.
- Suitable deformable solids can be obtained in the form of spheres. Suitable material choices would include aluminum or copper.
- laser assembly wavelengths and wavelength ranges, form factors, type of heat sink, etc.
- One class of possible applications is Raman spectroscopy. In these applications, differential wavelength measurements can be useful in accurately extracting fluorescence backgrounds and measurement artifacts.
- One specific implementation uses the 830 nm laser wavelength from a semiconductor laser.
- the laser is advantageously mounted in a TO-header type package.
- the laser may be stabilized advantageously to a precision of ⁇ 0.2 nm and/or it can be deliberately tuned by approximately 1 nm and spectra may taken before and subsequent to the tuning, for purposes of subtraction.
- a semiconductor laser could have a wavelength in the vicinity of 1550 nm and may also be advantageously mounted in a TO-header type package.
- a typical spacing between channels is about 0.8 nm.
- the approach described above could be used to control the laser to a precision that is finer than the channel spacing, potentially with major savings in power consumption. In the more compact packaging schemes that are becoming prevalent, this is usually highly advantageous.
Abstract
Description
ΔT=Z H (1)
where ΔT is the temperature rise of the
Z=t t /t l Z C (2)
where ZC is the thermal impedance from the
Claims (24)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/129,165 US7251261B2 (en) | 2004-05-14 | 2005-05-12 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
PCT/US2005/016925 WO2005112590A2 (en) | 2004-05-14 | 2005-05-13 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
CN2005800147861A CN101015100B (en) | 2004-05-14 | 2005-05-13 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
KR1020067026369A KR101122858B1 (en) | 2004-05-14 | 2005-05-13 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
EP05750682A EP1751830A4 (en) | 2004-05-14 | 2005-05-13 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57056204P | 2004-05-14 | 2004-05-14 | |
US57076204P | 2004-05-14 | 2004-05-14 | |
US11/129,165 US7251261B2 (en) | 2004-05-14 | 2005-05-12 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060083273A1 US20060083273A1 (en) | 2006-04-20 |
US7251261B2 true US7251261B2 (en) | 2007-07-31 |
Family
ID=36180715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/129,165 Expired - Fee Related US7251261B2 (en) | 2004-05-14 | 2005-05-12 | Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance |
Country Status (3)
Country | Link |
---|---|
US (1) | US7251261B2 (en) |
EP (1) | EP1751830A4 (en) |
WO (1) | WO2005112590A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090277608A1 (en) * | 2008-05-07 | 2009-11-12 | Kamins Theodore I | Thermal Control Via Adjustable Thermal Links |
US20100220755A1 (en) * | 2007-08-20 | 2010-09-02 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Spectrally tunabler laser module |
US10775563B2 (en) * | 2017-03-08 | 2020-09-15 | Chengdu Superxon Communication Technology Co., Ltd. | TWDM ONU wavelength control method, system thereof and shut- off depth control circuit |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201000179D0 (en) | 2010-01-07 | 2010-02-24 | Rsp Systems As | Apparatus for non-invasive in vivo measurement by raman spectroscopy |
EP3471222A4 (en) * | 2016-06-08 | 2019-06-26 | Mitsubishi Electric Corporation | Laser light source device |
DE102019216924A1 (en) * | 2019-11-04 | 2021-05-06 | Robert Bosch Gmbh | Laser emitter arrangement and LiDAR system |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5181214A (en) * | 1991-11-18 | 1993-01-19 | Harmonic Lightwaves, Inc. | Temperature stable solid-state laser package |
US5265115A (en) * | 1991-08-30 | 1993-11-23 | Hoya Corporation | Solid-state laser device having a feedback loop |
US5267252A (en) * | 1991-08-30 | 1993-11-30 | Hoya Corporation | Solid-state laser device comprising a temperature-controlled thermal conductive support |
US5392303A (en) * | 1993-03-30 | 1995-02-21 | Nec Corporation | Frequency stabilization method of semiconductor laser, frequency-stabilized light source and laser module |
US6724791B1 (en) * | 2002-07-02 | 2004-04-20 | C-Cor.Net Corp. | Method and apparatus for controlling the temperature of a laser module in fiber optic transmissions |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5107330A (en) * | 1990-10-19 | 1992-04-21 | At&T Bell Laboratories | Self-adjusting heat sink design for vlsi packages |
US5371753A (en) | 1993-08-26 | 1994-12-06 | Litton Systems, Inc. | Laser diode mount |
US6243404B1 (en) | 1999-01-25 | 2001-06-05 | Lucent Technologies, Inc. | Laser module with adjustable operating temperature range |
US6181717B1 (en) * | 1999-06-04 | 2001-01-30 | Bandwidth 9 | Tunable semiconductor laser system |
US6647035B1 (en) * | 2000-10-17 | 2003-11-11 | The Regents Of The University Of California | Ruggedized microchannel-cooled laser diode array with self-aligned microlens |
-
2005
- 2005-05-12 US US11/129,165 patent/US7251261B2/en not_active Expired - Fee Related
- 2005-05-13 EP EP05750682A patent/EP1751830A4/en not_active Withdrawn
- 2005-05-13 WO PCT/US2005/016925 patent/WO2005112590A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5265115A (en) * | 1991-08-30 | 1993-11-23 | Hoya Corporation | Solid-state laser device having a feedback loop |
US5267252A (en) * | 1991-08-30 | 1993-11-30 | Hoya Corporation | Solid-state laser device comprising a temperature-controlled thermal conductive support |
US5181214A (en) * | 1991-11-18 | 1993-01-19 | Harmonic Lightwaves, Inc. | Temperature stable solid-state laser package |
US5392303A (en) * | 1993-03-30 | 1995-02-21 | Nec Corporation | Frequency stabilization method of semiconductor laser, frequency-stabilized light source and laser module |
US6724791B1 (en) * | 2002-07-02 | 2004-04-20 | C-Cor.Net Corp. | Method and apparatus for controlling the temperature of a laser module in fiber optic transmissions |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100220755A1 (en) * | 2007-08-20 | 2010-09-02 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Spectrally tunabler laser module |
US20090277608A1 (en) * | 2008-05-07 | 2009-11-12 | Kamins Theodore I | Thermal Control Via Adjustable Thermal Links |
US10775563B2 (en) * | 2017-03-08 | 2020-09-15 | Chengdu Superxon Communication Technology Co., Ltd. | TWDM ONU wavelength control method, system thereof and shut- off depth control circuit |
Also Published As
Publication number | Publication date |
---|---|
US20060083273A1 (en) | 2006-04-20 |
WO2005112590A2 (en) | 2005-12-01 |
EP1751830A2 (en) | 2007-02-14 |
WO2005112590A3 (en) | 2006-12-14 |
EP1751830A4 (en) | 2009-11-25 |
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