US7224075B2 - Methods and systems for attaching die in stacked-die packages - Google Patents
Methods and systems for attaching die in stacked-die packages Download PDFInfo
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- US7224075B2 US7224075B2 US10/918,585 US91858504A US7224075B2 US 7224075 B2 US7224075 B2 US 7224075B2 US 91858504 A US91858504 A US 91858504A US 7224075 B2 US7224075 B2 US 7224075B2
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Definitions
- Embodiments of the invention relate generally to the field of integrated circuit devices and more specifically to methods for stacking die to create a stacked-die device.
- chips can be packaged more densely on the surface of a circuit board, the dimensions and cost of the module can be reduced and system performance improved.
- One possible method of maximizing packaging densities involves placing chips atop one another to form three-dimensional stacks referred to as stacked-chip devices or stacked-die devices. Over the past several years there has been great interest in stacking chips where possible.
- Such chip-stacking schemes include stacking a number of decreasing sized chips in order to facilitate the wire-bonds or stacking a number of same-sized chips using spacers or employing a beveling technique.
- the lower-most die of the stacked-die device is attached to the substrate using a die-attach material such as a paste-based adhesive.
- the same die-attach material is used to attach subsequent die in the stacked-die device one to another.
- the paste-based adhesive is applied as a liquid, the die is placed on the substrate (or upon another die), and the adhesive is then cured. During curing, the adhesive is raised to a relatively high temperature.
- the process is repeated. As the trend moves toward stacking more die, from 2–4 stacked die, in typical devices today, to 6–8 stacked die in the near future, and more, problems arise with the die-attach material. Repeatedly raising the temperature to cure each subsequent adhesive layer causes degradation of the previously applied adhesive layers.
- the use of a paste-based adhesive as a die-attach material is not optimal, and is being replaced by a film die-attach material.
- an extremely thin die may be desired.
- a typical die may be 725 microns thick, but for a given application (e.g., wireless communications), a die 25 microns thick may be desired.
- the imbalance in metal density from one side of the die to the other causes the die to warp.
- warping renders the use of a paste-based adhesive as a die-attach material problematic as the warped die does not maintain contact with the paste-based adhesive throughout the curing process.
- a paste-based adhesive for a die attach material may lead to bleedout of the paste, which may interfere with a subsequent wire-bonding process.
- the die In a typical lamination process using a thermoplastic film for the die-attach material, the die is laminated to the substrate (or to another die) under high temperature and pressure. The film has enough adhesive strength to hold the die flat (prevent warping) during the lamination process. To attach a subsequent die in order to form a stacked-die device, the process is repeated. This means that the die-attach film of a previously attached die is subjected to the heat and pressure of repeated laminations processes.
- the repeated thermal processing can cause voids and stress in the die attach film causing delamination and warping.
- extreme care must be taken during successive lamination processes to prevent previous die attach film layers from delaminating or experiencing excessive deformation. This limits the ability to achieve void-free bond lines across the several dies of a stacked-die device.
- the voids, cracks, and other defects caused by repeated high-temperature/high-pressure processes leads to a reduction in performance reliability.
- FIG. 1 illustrates a process for creating a stacked-die device in accordance with one embodiment of the invention
- FIG. 2 illustrates a stacked-die device in accordance with one embodiment of the invention
- FIG. 3A illustrates a modulus/temperature graph for a typical thermoplastic film
- FIG. 3B illustrates a modulus/temperature graph for each of three thermoplastic films in accordance with one embodiment of the invention.
- FIG. 1 illustrates a process for creating a stacked-die device in accordance with one embodiment of the invention.
- Process 100 begins at operation 105 in which a first die-attach material is selected.
- the first die-attach material has a processing temperature associated with it.
- the processing temperature may be the curing temperature of the paste-based adhesive for one embodiment.
- the processing temperature is above the glass transition temperature (Tg) of the thermoplastic film.
- a first die is attached to a substrate using the first die-attach material.
- the associated processing temperature of the first die-attach material is no higher than the temperature tolerance of the die and substrate.
- a second die-attach material is selected.
- the second die-attach material has a processing temperature associated with it that is less than the temperature associated with the first die-attach material.
- a second die-attach material is selected having an associated processing temperature that is sufficiently lower than the temperature associated with the first die-attach material such that the processing (e.g., curing or laminating) of the second die-attach material will not significantly degrade the previously processed first die-attach material to within a specified degree. That is, the processing of the second die-attach material will not cause delamination, warping, or other defects to such an extent as to render the stacked-die device inoperable for its intended purpose.
- a second die is stacked atop, and attached to, the first die using the second die-attach material.
- FIG. 2 illustrates a stacked-die device in accordance with one embodiment of the invention.
- Stacked-die device 200 shown in FIG. 2 , includes a substrate 210 with conductive balls 220 formed on the lower surface 211 of the substrate 210 .
- the conductive balls 220 are for electrically connecting the substrate 210 to a motherboard (not shown).
- a die 230 a is disposed upon the upper surface 212 of the substrate 210 .
- a die-attach material DA 1 is disposed between substrate 210 and die 230 a and attaches the die 230 a to the substrate 210 .
- DA 1 has an associated processing temperature, T DA1 .
- Die 230 b is stacked atop die 230 a and is attached to die 230 a with die-attach material DA 2 .
- DA 2 has an associated processing temperature, T DA2 , which is lower than T DA1 .
- Die 230 c is stacked atop die 230 b and is attached to die 230 b with die-attach material DA 3 .
- DA 3 has an associated processing temperature, T DA3 , which is lower than T DA2 .
- the stacked dies 230 a – 230 c are wire-bonded to the substrate 210 and or one to another with wire-bonds 231 .
- Each of the stacked dies 230 a – 230 c may be a memory chip or a logic processor chip.
- die 230 a is a logic processor chip while dies 230 b and 230 c are memory chips (e.g., flash memory devices).
- the number of dies forming the stacked-die device is exemplary, more or less dies may comprise the device in accordance with various alternative embodiments of the invention.
- each of multiple die attach materials may be a thermoplastic film.
- the film is applied to the substrate and heated to a specified temperature for the lamination process, which is above the Tg of the thermoplastic film. That is, in order to provide a reliable lamination, the film should be soft and flexible.
- the Tg is the temperature above which the thermoplastic film is soft and pliable, and below which it is hard and brittle.
- the die is then laminated to the substrate under pressure to prevent warping.
- FIG. 3A illustrates a modulus/temperature graph for a typical thermoplastic film. As shown in FIG. 3A , the Tg for the film is approximately 60° C.
- a typical laminating process is effected with a modulus that is approximately 100 MPa and below, and ideally closer to 0 MPa. Therefore, for such a film, the laminating temperature is above the Tg and is approximately 120° C.
- a thermoplastic film is used to attach a die to a substrate (e.g., DA 1 of FIG. 2 ).
- the thermoplastic film may be commercially available polyamide-based materials or epoxies.
- a subsequent die may be attached to form a stacked-die device using a second film as described above.
- the second film may be another commercially available die-attach material having a lower Tg.
- the second film can be a reformulation of the thermoplastic film having a lower Tg. The Tg of a polymer can be lowered by introducing a plasticizer.
- a plasticizer is a small molecule introduced to increase the free volume of the polymer, rendering the polymer more pliant at lower temperatures.
- Some typical plasticizers that may be used to lower the Tg of a thermoplastic film include low molecular weight polyimides, amine terminated rubbers and low molecular weight epoxies.
- FIG. 3B illustrates a modulus/temperature graph for each of three thermoplastic films in accordance with one embodiment of the invention.
- the modulus/temperature graph for the first die-attach film DA 1 is that illustrated in FIG. 3A and requires a processing temperature of approximately 120° C. to achieve the desired modulus below 100 MPa.
- DA 1 has a Tg, Tg 1 , of approximately 60° C.
- the second die-attach material DA 2 which may be a reformulation of DA 1 , has a lower Tg, Tg 2 , and therefore requires a processing temperature of only approximately 90° C. to achieve the desired modulus below 100 MPa.
- Tg 2 is approximately 45° C.
- the third die-attach material DA 3 which may be a reformulation of DA 1 , has a still lower Tg, Tg 3 , and therefore requires a processing temperature of only approximately 90° C. to achieve the desired modulus below 100 MPa.
- Tg 3 is approximately 30° C. Therefore, during a lamination process using DA 3 , DA 2 will transition to some degree, and DA 1 will transition even less, both will remain rigid enough to reduce degradation and warping.
- Embodiments of the invention describe using a first die-attach material to attach a die to a substrate and using different die-attach materials (having successively lower processing temperatures) to iteratively attach one or more additional die to the first die to form a stacked-die device.
- each of the die-attach materials employed may be used to successively attach multiple dies.
- the number of dies that may be successively attached with each die-attach material varies, and will depend upon the die-attach material and its associated processing temperature. For example, a die-attach film having a relatively high Tg, may exhibit significant degradation after more than one transition and it may therefore be desirable to attach only one die using that particular film.
- another die-attach film may be used having a relatively low Tg. It may be possible to attach 2 or more dies using this film, as repeated transitioning at the lower temperature is not as detrimental to the film.
- process 100 may include additional operations in which successive die-attach materials are determined and used to attach successive dies to form a stacked-die device.
Abstract
Description
Claims (12)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/918,585 US7224075B2 (en) | 2004-08-13 | 2004-08-13 | Methods and systems for attaching die in stacked-die packages |
TW094125492A TWI318448B (en) | 2004-08-13 | 2005-07-27 | Methods and systems for attaching die in stacked-die packages |
DE112005001962.4T DE112005001962B4 (en) | 2004-08-13 | 2005-07-29 | Systems and methods for mounting chips in stacked chip packages |
PCT/US2005/026940 WO2006020428A1 (en) | 2004-08-13 | 2005-07-29 | Methods and systems for attaching die in stacked-die packages |
KR1020077003448A KR20070032817A (en) | 2004-08-13 | 2005-07-29 | Die attach method and system in stacked-die packages |
CN200580027379A CN100594609C (en) | 2004-08-13 | 2005-07-29 | Methods and systems for attaching die in stacked-die packages |
JP2007525649A JP4732456B2 (en) | 2004-08-13 | 2005-07-29 | Method and apparatus for attaching a die in a stacked die package |
US11/254,309 US20060038276A1 (en) | 2004-08-13 | 2005-10-19 | Methods and systems for attaching die in stacked-die packages |
HK08100683.4A HK1110437A1 (en) | 2004-08-13 | 2008-01-18 | Methods and systems for attaching die in stacked-die packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/918,585 US7224075B2 (en) | 2004-08-13 | 2004-08-13 | Methods and systems for attaching die in stacked-die packages |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/254,309 Division US20060038276A1 (en) | 2004-08-13 | 2005-10-19 | Methods and systems for attaching die in stacked-die packages |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060033192A1 US20060033192A1 (en) | 2006-02-16 |
US7224075B2 true US7224075B2 (en) | 2007-05-29 |
Family
ID=35447545
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/918,585 Active US7224075B2 (en) | 2004-08-13 | 2004-08-13 | Methods and systems for attaching die in stacked-die packages |
US11/254,309 Abandoned US20060038276A1 (en) | 2004-08-13 | 2005-10-19 | Methods and systems for attaching die in stacked-die packages |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/254,309 Abandoned US20060038276A1 (en) | 2004-08-13 | 2005-10-19 | Methods and systems for attaching die in stacked-die packages |
Country Status (8)
Country | Link |
---|---|
US (2) | US7224075B2 (en) |
JP (1) | JP4732456B2 (en) |
KR (1) | KR20070032817A (en) |
CN (1) | CN100594609C (en) |
DE (1) | DE112005001962B4 (en) |
HK (1) | HK1110437A1 (en) |
TW (1) | TWI318448B (en) |
WO (1) | WO2006020428A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070158807A1 (en) * | 2005-12-29 | 2007-07-12 | Daoqiang Lu | Edge interconnects for die stacking |
US20070241442A1 (en) * | 2006-04-18 | 2007-10-18 | Stats Chippac Ltd. | Stacked integrated circuit package-in-package system |
US20100246152A1 (en) * | 2009-03-30 | 2010-09-30 | Megica Corporation | Integrated circuit chip using top post-passivation technology and bottom structure technology |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070152314A1 (en) * | 2005-12-30 | 2007-07-05 | Intel Corporation | Low stress stacked die packages |
TWI335654B (en) * | 2007-05-04 | 2011-01-01 | Advanced Semiconductor Eng | Package for reducing stress |
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- 2005-07-29 CN CN200580027379A patent/CN100594609C/en active Active
- 2005-07-29 DE DE112005001962.4T patent/DE112005001962B4/en not_active Expired - Fee Related
- 2005-07-29 WO PCT/US2005/026940 patent/WO2006020428A1/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
CN100594609C (en) | 2010-03-17 |
KR20070032817A (en) | 2007-03-22 |
HK1110437A1 (en) | 2008-07-11 |
WO2006020428A1 (en) | 2006-02-23 |
JP2008509572A (en) | 2008-03-27 |
JP4732456B2 (en) | 2011-07-27 |
DE112005001962B4 (en) | 2014-08-21 |
US20060038276A1 (en) | 2006-02-23 |
CN101002321A (en) | 2007-07-18 |
TWI318448B (en) | 2009-12-11 |
US20060033192A1 (en) | 2006-02-16 |
DE112005001962T5 (en) | 2007-10-18 |
TW200620611A (en) | 2006-06-16 |
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