US7149109B2 - Single transistor vertical memory gain cell - Google Patents
Single transistor vertical memory gain cell Download PDFInfo
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- US7149109B2 US7149109B2 US10/929,307 US92930704A US7149109B2 US 7149109 B2 US7149109 B2 US 7149109B2 US 92930704 A US92930704 A US 92930704A US 7149109 B2 US7149109 B2 US 7149109B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7841—Field effect transistors with field effect produced by an insulated gate with floating body, e.g. programmable transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/482—Bit lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/488—Word lines
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dram (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (27)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/929,307 US7149109B2 (en) | 2002-08-29 | 2004-08-30 | Single transistor vertical memory gain cell |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/231,397 US7224024B2 (en) | 2002-08-29 | 2002-08-29 | Single transistor vertical memory gain cell |
US10/929,307 US7149109B2 (en) | 2002-08-29 | 2004-08-30 | Single transistor vertical memory gain cell |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/231,397 Division US7224024B2 (en) | 2002-08-29 | 2002-08-29 | Single transistor vertical memory gain cell |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050041457A1 US20050041457A1 (en) | 2005-02-24 |
US7149109B2 true US7149109B2 (en) | 2006-12-12 |
Family
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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US10/231,397 Expired - Lifetime US7224024B2 (en) | 2002-08-29 | 2002-08-29 | Single transistor vertical memory gain cell |
US10/929,307 Expired - Lifetime US7149109B2 (en) | 2002-08-29 | 2004-08-30 | Single transistor vertical memory gain cell |
US11/485,019 Expired - Lifetime US7323380B2 (en) | 2002-08-29 | 2006-07-12 | Single transistor vertical memory gain cell |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/231,397 Expired - Lifetime US7224024B2 (en) | 2002-08-29 | 2002-08-29 | Single transistor vertical memory gain cell |
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Application Number | Title | Priority Date | Filing Date |
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US11/485,019 Expired - Lifetime US7323380B2 (en) | 2002-08-29 | 2006-07-12 | Single transistor vertical memory gain cell |
Country Status (1)
Country | Link |
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US (3) | US7224024B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060181919A1 (en) * | 2002-12-04 | 2006-08-17 | Micron Technology, Inc. | Embedded DRAM gain memory cell |
US20060227601A1 (en) * | 2004-08-24 | 2006-10-12 | Micron Technology, Inc. | Memory cell with trenched gated thyristor |
US20060252206A1 (en) * | 2002-08-29 | 2006-11-09 | Micron Technology, Inc. | Single transistor vertical memory gain cell |
US7241658B2 (en) | 2003-03-04 | 2007-07-10 | Micron Technology, Inc. | Vertical gain cell |
US20090129145A1 (en) * | 2007-11-19 | 2009-05-21 | Qimonda Ag | Memory Cell Array Comprising Floating Body Memory Cells |
US20100176451A1 (en) * | 2009-01-09 | 2010-07-15 | Hoon Jeong | Semiconductor |
US20120012915A1 (en) * | 2007-11-29 | 2012-01-19 | Yuniarto Widjaja | Semiconductor memory having electrically floating body transistor |
US8194471B2 (en) | 2010-10-04 | 2012-06-05 | Zeno Semiconductor, Inc. | Semiconductor memory device having an electrically floating body transistor |
US8264875B2 (en) | 2010-10-04 | 2012-09-11 | Zeno Semiconducor, Inc. | Semiconductor memory device having an electrically floating body transistor |
US11251186B2 (en) | 2020-03-23 | 2022-02-15 | Intel Corporation | Compute near memory with backend memory |
Families Citing this family (43)
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US6531727B2 (en) * | 2001-02-09 | 2003-03-11 | Micron Technology, Inc. | Open bit line DRAM with ultra thin body transistors |
US6496034B2 (en) * | 2001-02-09 | 2002-12-17 | Micron Technology, Inc. | Programmable logic arrays with ultra thin body transistors |
US6559491B2 (en) * | 2001-02-09 | 2003-05-06 | Micron Technology, Inc. | Folded bit line DRAM with ultra thin body transistors |
US6424001B1 (en) * | 2001-02-09 | 2002-07-23 | Micron Technology, Inc. | Flash memory with ultra thin vertical body transistors |
TWI230392B (en) * | 2001-06-18 | 2005-04-01 | Innovative Silicon Sa | Semiconductor device |
US7160577B2 (en) | 2002-05-02 | 2007-01-09 | Micron Technology, Inc. | Methods for atomic-layer deposition of aluminum oxides in integrated circuits |
US6838723B2 (en) * | 2002-08-29 | 2005-01-04 | Micron Technology, Inc. | Merged MOS-bipolar capacitor memory cell |
US7002842B2 (en) * | 2003-11-26 | 2006-02-21 | Intel Corporation | Floating-body dynamic random access memory with purge line |
US7158410B2 (en) * | 2004-08-27 | 2007-01-02 | Micron Technology, Inc. | Integrated DRAM-NVRAM multi-level memory |
US7271433B1 (en) | 2004-09-02 | 2007-09-18 | Micron Technology, Inc. | High-density single transistor vertical memory gain cell |
US7259415B1 (en) | 2004-09-02 | 2007-08-21 | Micron Technology, Inc. | Long retention time single transistor vertical memory gain cell |
US7271052B1 (en) | 2004-09-02 | 2007-09-18 | Micron Technology, Inc. | Long retention time single transistor vertical memory gain cell |
US7301803B2 (en) * | 2004-12-22 | 2007-11-27 | Innovative Silicon S.A. | Bipolar reading technique for a memory cell having an electrically floating body transistor |
US7538389B2 (en) | 2005-06-08 | 2009-05-26 | Micron Technology, Inc. | Capacitorless DRAM on bulk silicon |
US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
KR100663368B1 (en) * | 2005-12-07 | 2007-01-02 | 삼성전자주식회사 | Semiconductor memory device, and data write and read method of the same |
KR100675297B1 (en) * | 2005-12-19 | 2007-01-29 | 삼성전자주식회사 | Semiconductor memory device comprising capacitorless dynamic memory cells and layout method of the same |
KR100675300B1 (en) * | 2006-01-06 | 2007-01-29 | 삼성전자주식회사 | Semiconductor memory device comprising capacitor-less dynamic memory cell and data write and read method of the same |
US8501581B2 (en) * | 2006-03-29 | 2013-08-06 | Micron Technology, Inc. | Methods of forming semiconductor constructions |
TWI300251B (en) * | 2006-07-14 | 2008-08-21 | Ind Tech Res Inst | Manufacturing method of vertical thin film transistor |
US7589995B2 (en) * | 2006-09-07 | 2009-09-15 | Micron Technology, Inc. | One-transistor memory cell with bias gate |
KR100890641B1 (en) * | 2007-05-01 | 2009-03-27 | 삼성전자주식회사 | Nonvolatile memory device using variable resistive element |
US20080277738A1 (en) * | 2007-05-08 | 2008-11-13 | Venkat Ananthan | Memory cells, memory banks, memory arrays, and electronic systems |
US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
JP2009093708A (en) * | 2007-10-04 | 2009-04-30 | Toshiba Corp | Semiconductor memory device and driving method thereof |
US7948008B2 (en) | 2007-10-26 | 2011-05-24 | Micron Technology, Inc. | Floating body field-effect transistors, and methods of forming floating body field-effect transistors |
US8067803B2 (en) * | 2008-10-16 | 2011-11-29 | Micron Technology, Inc. | Memory devices, transistor devices and related methods |
TWI455291B (en) * | 2009-10-30 | 2014-10-01 | Inotera Memories Inc | Vertical transistor and manufacture thereof |
US9608119B2 (en) | 2010-03-02 | 2017-03-28 | Micron Technology, Inc. | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures |
US8288795B2 (en) | 2010-03-02 | 2012-10-16 | Micron Technology, Inc. | Thyristor based memory cells, devices and systems including the same and methods for forming the same |
US9646869B2 (en) | 2010-03-02 | 2017-05-09 | Micron Technology, Inc. | Semiconductor devices including a diode structure over a conductive strap and methods of forming such semiconductor devices |
US8513722B2 (en) * | 2010-03-02 | 2013-08-20 | Micron Technology, Inc. | Floating body cell structures, devices including same, and methods for forming same |
US8507966B2 (en) | 2010-03-02 | 2013-08-13 | Micron Technology, Inc. | Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same |
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US8519462B2 (en) * | 2011-06-27 | 2013-08-27 | Intel Corporation | 6F2 DRAM cell |
US8772848B2 (en) | 2011-07-26 | 2014-07-08 | Micron Technology, Inc. | Circuit structures, memory circuitry, and methods |
US11843054B2 (en) * | 2018-06-22 | 2023-12-12 | Intel Corporation | Vertical architecture of thin film transistors |
US11646372B2 (en) | 2020-09-19 | 2023-05-09 | International Business Machines Corporation | Vertical transistor floating body one transistor DRAM memory cell |
US20230005915A1 (en) * | 2021-07-05 | 2023-01-05 | Changxin Memory Technologies, Inc. | Memory and method for manufacturing same |
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US11812599B2 (en) | 2020-03-23 | 2023-11-07 | Intel Corporation | Compute near memory with backend memory |
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US20040042256A1 (en) | 2004-03-04 |
US20060252206A1 (en) | 2006-11-09 |
US7323380B2 (en) | 2008-01-29 |
US7224024B2 (en) | 2007-05-29 |
US20050041457A1 (en) | 2005-02-24 |
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