US7114237B2 - Manufacturing method for precise multi-pole magnetic components - Google Patents
Manufacturing method for precise multi-pole magnetic components Download PDFInfo
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- US7114237B2 US7114237B2 US10/718,626 US71862603A US7114237B2 US 7114237 B2 US7114237 B2 US 7114237B2 US 71862603 A US71862603 A US 71862603A US 7114237 B2 US7114237 B2 US 7114237B2
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 230000005405 multipole Effects 0.000 title claims abstract description 31
- 238000005516 engineering process Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000009826 distribution Methods 0.000 claims description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 239000011295 pitch Substances 0.000 description 25
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- 238000003754 machining Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
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- 238000005520 cutting process Methods 0.000 description 2
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- 238000004804 winding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
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- 230000005404 monopole Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/142—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices
- G01D5/145—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices influenced by the relative movement between the Hall device and magnetic fields
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D2205/00—Indexing scheme relating to details of means for transferring or converting the output of a sensing member
- G01D2205/80—Manufacturing details of magnetic targets for magnetic encoders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
Definitions
- the invention relates to a precise multi-pole magnetic component and the manufacturing method thereof.
- the invention pertains to a precise multi-pole magnetic component that formed by using the printed circuit board (PCB) technology and the corresponding manufacturing method.
- PCB printed circuit board
- Magnetic encoders are widely used to detect the rotation speed, angle and position in many precise control systems. They are quite rigid with simple structures, offering reliable operation in adverse environments where high vibration, temperature, moisture or dust may exist. Since the motor size is getting smaller, a strict condition is required for magnetic encoders with high resolution. Therefore, conventional magnetic encoders with wide magnetic pole pitch are not enough for using in precise control systems anymore.
- a precise magnetic encoder consists of a magnetic reading device and a multi-pole magnetic component with fine magnetic pole pitch. Its resolution is determined by the size of the magnetic pole pitch. The dimension of a monopole means the magnetic pole pitch. A smaller of the magnetic pole pitch provides a higher resolution in detection.
- the signals in the multi-pole magnetic component can be detected using a magnetic reading device like Hall element or MR (magneto-resistance) element.
- the position and speed of a moving object can be obtained from detecting the rotation angle and direction of magnetic encoder.
- the multi-pole magnetic component with fine magnetic pole pitch in the magnetic encoder is achieved by magnetization.
- An unmagnetized magnetic component is placed onto the surface of a magnetizing head.
- the magnetizing coil is wound on the magnetizing head and the winding pattern is depended upon the design of the magnetizing head. Connecting the terminals of magnetizing coil to a magnetization machine which can provide the magnetizing current. After releasing a magnetizing current, the strong magnetic field is induced to magnetize the magnetic component.
- the multi-pole magnetizing head is obtained from the line-cutting process and the smallest magnetic pole pitch can be acquired about 1 mm by magnetization using the magnetizing head.
- the magnetic pole pitch of less than 1 mm is very difficult to achieve because it is limited by the precision of the machining tools and the bending angle of the magnetizing coils.
- the surface of the magnetizing head is divided into eight equal parts (16, 16′, 18, 18′, 20, 20′. . . 30 and 30′) by line-cutting process and the magnetizing coil ( 34 ) is wound into the groove as shown in FIG. 1 .
- the grooves are located between any two parts.
- An alternate multi-pole magnetic field distribution is formed with an appropriate arrangement of the magnetizing coil.
- Both terminals ( 36 and 38 ) of the magnetizing coil are connected to a magnetization machine which can provide the magnetizing current.
- a strong magnetic field is induced instantaneously after the magnetization machine releases a magnetizing current.
- the magnetic component ( 40 ) is magnetized with a multi-pole structure.
- the distance between the magnetic poles is limited by the machining technique and the minimum is about 1 mm.
- the insulating layer of the magnetizing coil can not withstand the stress and then breaks. It is caused by the large bending angle of the magnetizing coil being used in a magnetizing head with fine magnetic pole pitch. Therefore, a short circuit is happened on the bases ( 12 and 12 ′) of the magnetizing head. Since the bases are made of a ferromagnetic material with high permeability, the magnetizing coil and head are exploded frequently during the magnetization. Thus this way is very dangerous.
- FIG. 2 The disclosed in the proceeding of Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference (Chicago '93 EEIC/ICWA Exposition, P.237–242, 1993) is shown in FIG. 2 .
- the magnetizing coils ( 200 ) are wound on the magnetizing head ( 201 ).
- the leakage of the magnetic filed from the magnetizing head is used to write the magnetic pole pairs (i.e. N and S pole) onto the surface of the magnetic component ( 202 ).
- the magnetic pole pitch of less than 1 mm is accomplished successfully.
- the magnetic component Before magnetization, the magnetic component is mounted on a base which is usually supported and rotated by a high precision spindle motor. Then, the magnetic component is magnetized with magnetic pole pairs intermittently controlling by using a magnetization machine.
- the precise position control of the spindle motor is highly required; otherwise, an asymmetric magnetic file distribution will happen in the multi-pole magnetic component after magnetization and it is not good for subsequent processing of signals.
- the dimension of the magnetic component must be controlled uniformly. During the magnetization, the magnetic component will often collide with the magnetizing head if its radial run-out is too large and thus result in damages both of them. Moreover, the leaking gap in the magnetizing head and the air gap between the magnetizing head and the magnetic component have to be properly controlled.
- the waveform of the magnetizing current from the magnetization machine is required to modify in order to magnetize the magnetic component with different magnetic properties using the single-pulse magnetizing technique. Because the waveform of the magnetizing current highly depends upon the magnetic material property and this can be achieved only through a precise magnetization machine. In addition to controlling the tiny radial run-out and the material homogeneity on the magnetic component, it has to be mounted on a spindle motor under a precision position control. The desired magnetic pole pitch can be accomplished by tuning an appropriate leaking gap and the magnetizing air gap during the magnetization. Despite the fact that this technique can narrow the magnetic pole pitch to around 200 ⁇ m, the process is very complicated and difficult. The high precision machining, the techniques for making the precise magnetizing head and the magnetization machine are essential, and therefore the single-pulse magnetizing technique is costly and not economical at all.
- the invention provides a precise multi-pole magnetic component and the corresponding manufacturing method.
- an appropriate circuit pattern is designed and formed on the printed circuit board (PCB).
- An alternate and regular magnetic pole distribution is induced after a current is supplied to the circuit and then a multi-pole magnetic component is formed.
- the fine magnetic pole pitch in the multi-pole magnetic component is obtained from making the high-density wire circuit on the substrate using PCB manufacturing technology.
- the invention designs a special circuit pattern and then it is formed on the PCB. After supplying a current to the circuit, the magnetic field is generated and its distribution is determined by the circuit pattern. Using this property and designing a special circuit pattern possessing with a meander structure, let the current flow in opposite directions on the circuit to generate an alternate magnetic pole distribution. At present, the minimum wire width on the circuit can be achieved is about 75 ⁇ m using PCB manufacturing technology. Thus the multi-pole magnetic component with fine magnetic pole pitch can be accomplished by forming the special circuit pattern on the PCB.
- This disclosed precise multi-pole magnetic component can have both single-layer and multi-layer structures.
- the single-layer structure contains a substrate and a circuit built on the surface of the substrate.
- the multi-layer structure has more than one layer of circuit built on the surface of the substrate.
- An insulating layer is inserted between any two layers of circuits. All circuits on different layers are connected into a single circuit by drilling holes and filling them with soldering tin.
- the current input and output (I/O) terminals are reserved for connecting to a current source. After supplying a current, the multi-layer structure can enhance the magnetic field and it is good for signal detection.
- the above-mentioned precise multi-pole magnetic component can be accomplished using the PCB manufacturing technology.
- the size of the magnetic pole pitch is closely related to the manufacturing technology and the minimum value of 150 ⁇ m can be easily achieved at present.
- the PCB manufacturing technology greatly improves the resolution of magnetic encoders for high precision requirements.
- the multi-pole magnetic field distribution of the disclosed precise multi-pole magnetic component is not formed by actually magnetizing a magnetic component. It is generated from supplying a current into the circuit on the PCB.
- One can readily obtain a desired precise multi-pole magnetic field distribution by designing an appropriate circuit pattern on a substrate using PCB manufacturing technology.
- FIG. 1 is the embodiment of the magnetizing head in the prior art
- FIG. 2 is the embodiment of the single-pulse magnetizing method in the prior art
- FIG. 3 is the first embodiment of the invention
- FIG. 4 is a schematic view of the magnetic field distribution in the first embodiment
- FIG. 5 is a schematic view of the circuit structure in the second embodiment of the invention.
- FIG. 6 is a schematic view of the magnetic field distribution in the second embodiment
- FIG. 7 shows the measured result of a partial magnetic field distribution produced by the disclosed linear 9-pole magnetic component
- FIG. 8 shows the manufacturing procedure of the first embodiment of the invention.
- the invention fabricates a special circuit pattern on the surface of a substrate.
- the multi-pole magnetic field distribution is generated after a current supplying to the circuit for producing the precise multi-pole magnetic component.
- Different magnetic pole pitches can be achieved easily by modifying the circuit patterns on PCB.
- the multi-layer structure of circuits is formed using PCB manufacturing process repeatedly. It can enhance the strength of the magnetic field and this is good for the signal detection.
- a special circuit pattern which has a meander structure for providing the current to flow in opposite directions, is designed and formed on the PCB.
- the magnetic field is induced in different directions among the circuits to generate an alternate magnetic pole distribution. Then the multi-pole magnetic component is accomplished.
- FIG. 3 shows the first embodiment of the invention.
- a circuit pattern which is a linear type extending along one-dimensional direction and has a meander structure for providing the current to flow in opposite directions. Therefore, magnetic fields pointing in different directions can be induced among the circuit, thereby producing an alternate magnetic pole distribution.
- FIG. 4 is the schematic view of the magnetic field distribution in the first embodiment and the magnetic field has an alternate magnetic pole distribution extending along one-dimensional direction.
- the magnetic flux density produced by the circuit pattern on the substrate can be detected using a Hall sensor, or a magneto-resistance (MR) sensor/giant magneto-resistance (GMR) sensor.
- MR magneto-resistance
- GMR giant magneto-resistance
- the magnetic field distribution can be easily extended from the one-dimensional structure to a two-dimensional one.
- An annular meander structure which provides the current to flow in opposite directions for producing the magnetic field in different directions among the circuit, can be obtained from modifying the circuit pattern on the PCB.
- FIG. 5 this is the schematic view of circuit structure in the second embodiment of the invention.
- An annular meander circuit pattern ( 110 ) is formed on the surface of a substrate ( 100 ).
- the current input terminal ( 111 ) and output terminal ( 112 ) are connected to a current source. Once a current is supplied, an alternate magnetic field distribution is induced among the circuit ( 110 ).
- the magnetic field distribution is an annular type in radial direction as shown in FIG. 6 .
- FIG. 7 It is the measured results of a partial magnetic filed distribution of the disclosed linear 9-pole magnetic component.
- Three consecutive magnetic poles of the magnetic flux density distributions are measured at a detection spacing of 200 ⁇ m and 300 ⁇ m above the surface by using a precise Hall probe with a high sensitivity of 0.1 gauss.
- the width of the circuit wires on the substrate is designed and formed with 200 ⁇ m and the gap between two adjacent circuit wires is also 200 ⁇ m. Therefore, the size of the magnetic pole pitch is 400 ⁇ m.
- the measured magnetic field distribution is not only uniform but also the obvious boundaries existing between the magnetic poles.
- the signals of the magnetic field distributions are enough to be as the signals for detection.
- FIG. 8 shows the manufacturing procedure of the disclosed first embodiment of the invention.
- a substrate is prepared (step 10 ).
- the first layer of the circuit pattern is formed on the surface of the substrate using the PCB manufacturing technology (step 20 ).
- An insulating layer is then added on the circuit layer using the PCB manufacturing technology (step 30 ).
- the second layer of the circuit pattern is formed on the insulating layer using the PCB manufacturing technology (step 40 ). Steps 30 and 40 are repeated until the desired circuit layers are completed. All circuits on different layers have to be connected into a single circuit by drilling holes and filling them with soldering tin.
- Each layer of the circuit has a meander structure for providing a current to flow in opposite directions and then an alternate magnetic pole distribution is generated.
- the magnetic field distribution of each layer of the circuit on the substrate is arranged appropriately to stack with an enhancing configuration.
Abstract
Description
TABLE 1 | |||||
Basic | Magneti- | Mag- | Minimum | ||
Requirements | zation | netizing | Precision | Pole | |
Technology | Machine | Head | Machining | Pitch | Price |
Conventional | Yes | Yes | Yes | ~1 mm | High |
Magnetization | |||||
Single-Pulse | Yes | Yes | Yes | ~200 μm | Very High |
Magnetization | |||||
PCB | No | No | No | ~150 μm | Cheap |
Manufacturing | |||||
Technology | |||||
Claims (6)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/197,428 US7656259B2 (en) | 2003-09-02 | 2005-08-05 | Precise multi-pole magnetic component |
US12/580,073 US7884690B2 (en) | 2003-09-02 | 2009-10-15 | Precise multi-pole magnetic component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092124245 | 2003-09-02 | ||
TW092124245A TWI227502B (en) | 2003-09-02 | 2003-09-02 | Precise multi-pole magnetic components and manufacturing method thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/197,428 Division US7656259B2 (en) | 2003-09-02 | 2005-08-05 | Precise multi-pole magnetic component |
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US20050046535A1 US20050046535A1 (en) | 2005-03-03 |
US7114237B2 true US7114237B2 (en) | 2006-10-03 |
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US10/718,626 Expired - Fee Related US7114237B2 (en) | 2003-09-02 | 2003-11-24 | Manufacturing method for precise multi-pole magnetic components |
US11/197,428 Expired - Fee Related US7656259B2 (en) | 2003-09-02 | 2005-08-05 | Precise multi-pole magnetic component |
US12/580,073 Expired - Fee Related US7884690B2 (en) | 2003-09-02 | 2009-10-15 | Precise multi-pole magnetic component |
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Application Number | Title | Priority Date | Filing Date |
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US11/197,428 Expired - Fee Related US7656259B2 (en) | 2003-09-02 | 2005-08-05 | Precise multi-pole magnetic component |
US12/580,073 Expired - Fee Related US7884690B2 (en) | 2003-09-02 | 2009-10-15 | Precise multi-pole magnetic component |
Country Status (3)
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US (3) | US7114237B2 (en) |
JP (1) | JP2005077404A (en) |
TW (1) | TWI227502B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060038646A1 (en) * | 2003-09-02 | 2006-02-23 | Industrial Technology Research Institute | Precise multi-pole magnetic component and manufacturing method thereof |
US20080068007A1 (en) * | 2006-09-19 | 2008-03-20 | Hiroyuki Hoshiya | Magnetic encoder apparatus |
US20100035785A1 (en) * | 1997-01-09 | 2010-02-11 | Advanced Technology Materials Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7352270B1 (en) | 2006-10-27 | 2008-04-01 | Itt Manufacturing Enterprises, Inc. | Printed circuit board with magnetic assembly |
US9870861B2 (en) | 2015-09-21 | 2018-01-16 | Apple Inc. | Multiple step shifted-magnetizing method to improve performance of multi-pole array magnet |
CN108925038A (en) * | 2018-07-25 | 2018-11-30 | 深圳市华星光电技术有限公司 | Inductance, circuit board and inductance measurement method |
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US4920326A (en) | 1989-01-26 | 1990-04-24 | Eastman Kodak Company | Method of magnetizing high energy rare earth alloy magnets |
US5949321A (en) * | 1996-08-05 | 1999-09-07 | International Power Devices, Inc. | Planar transformer |
US6150915A (en) * | 1997-12-18 | 2000-11-21 | National University Of Ireland, Cork | Magnetic components and their production |
US6831544B2 (en) * | 2000-02-01 | 2004-12-14 | Hewlett-Packard Development Company, L.P. | Apparatus and method for PCB winding planar magnetic devices |
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Also Published As
Publication number | Publication date |
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TW200511332A (en) | 2005-03-16 |
JP2005077404A (en) | 2005-03-24 |
US7656259B2 (en) | 2010-02-02 |
US20050046535A1 (en) | 2005-03-03 |
US20100033281A1 (en) | 2010-02-11 |
TWI227502B (en) | 2005-02-01 |
US7884690B2 (en) | 2011-02-08 |
US20060038646A1 (en) | 2006-02-23 |
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