US6854671B2 - Nozzle for ejecting molten metal - Google Patents
Nozzle for ejecting molten metal Download PDFInfo
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- US6854671B2 US6854671B2 US10/277,081 US27708102A US6854671B2 US 6854671 B2 US6854671 B2 US 6854671B2 US 27708102 A US27708102 A US 27708102A US 6854671 B2 US6854671 B2 US 6854671B2
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- metal
- solder
- nozzle
- philic
- ejecting direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
Definitions
- the present invention relates to a technique for ejecting molten metal, which can be applied to a technique for ejecting solder in given amounts, for example.
- Japanese Patent Application Laid-Open Nos. 62-257750 (1987) and 3-138942 (1991) disclose techniques for ejecting molten solder from a nozzle by applying pressure to the molten solder
- Japanese Patent Application Laid-Open No. 3-60036 (1991) discloses a technique for drawing out conductive paste from a nozzle with an electrostatic force.
- FIG. 23 is a cross-sectional view illustrating the structure of a nozzle 200 of a device for forming solder bumps.
- the nozzle 200 has a molten solder chamber 1 and a straight portion 5 communicating therewith.
- a molten solder 20 is stored in the molten solder chamber 1 .
- a pressure P is applied to the molten solder 20 from the side opposite to the straight portion 5 to eject a solder drop 11 from an opening 3 of the straight portion 5 at the side of the molten solder chamber 1 .
- the nozzle 200 is made of stainless steel with poor wettability with respect to solder. This technique is disclosed in Japanese Patent Application Laid-Open No. 11-274204 (1999), for example.
- FIGS. 24 to 26 are cross-sectional views showing the structure of a nozzle 201 described in Japanese Patent Application Laid-Open No. 2002-43351 by the applicant of this disclosure, where the reference characters are original to this specification.
- the nozzle 201 has a tapered portion 6 which spreads wider toward the molten solder chamber 1 and a straight portion 5 which communicates from the tapered portion 6 to a nozzle exit surface 4 .
- the tapered portion 6 has edges 6 a and 6 b which adjoin the straight portion 5 and the molten solder chamber 1 , respectively.
- the straight portion 5 has an opening 3 at the nozzle exit surface 4 .
- the nozzle 201 is made of a solder-repellent material.
- Molten solder 20 is supplied from a passage not shown and stored between the molten solder chamber 1 and a diaphragm 7 covering it.
- a force F is applied to the molten solder 20 from a stress source not shown, e.g. a piezoelectric device, through the diaphragm 7 that is variable in shape.
- the tapered portion 6 is formed at such an angle that the molten solder 20 comes into the tapered portion 6 even when the inner surface of the nozzle 201 is solder-repellent or even when the force F is absent.
- the tapered portion 6 is formed of the side of a frustum of a circular cone formed around an axis vertical to a bottom surface 1 a of the molten solder chamber 1 .
- the side of this frustum forms an angle ⁇ with respect to the above-mentioned axis. More specifically, when the contact angle that the molten solder 20 forms with respect to the inner surface of the nozzle 201 is taken as ⁇ s, the angle ⁇ is set to be ( ⁇ s ⁇ 90°) or larger.
- the inner side surface of the straight portion 5 is parallel to this axis and therefore the peripheral edge of the liquid surface of the molten solder 20 (hereinafter referred to simply as “liquid surface”) is held at the edge 6 a.
- the force F pushes the molten solder 20 toward the opening 3 and then draws it back into the molten solder chamber 1 .
- a portion of the molten solder 20 is ejected out of the nozzle 201 as a solder drop 11 through the straight portion 5 and from the opening 3 .
- the peripheral edge of the liquid surface of the molten solder 20 is held at the edge 6 a ; however, after being ejected, in reaction to the ejection of the solder drop 11 , it is drawn back past the edge 6 a into the tapered portion 6 (FIG. 26 ).
- the nozzle 201 having the shorter straight portion 5 , can be manufactured by a simpler process than the nozzle 200 having no tapered portion 5 .
- the inner surface of the molten solder chamber 1 is solder-repellent and therefore the molten solder 20 exhibits poor wettability for the molten solder chamber 1 .
- voids 40 may remain in part of the molten solder chamber 1 . Then the voids 40 will be compressed when the diaphragm 7 presses the molten solder chamber 1 , which may reduce the pressure applied to the molten solder 20 or cause a time delay, making it difficult to obtain the expected ejecting performance.
- An object of the present invention is to improve the molten metal ejecting performance.
- a nozzle for ejecting a molten metal in an ejecting direction includes: a metal-philic surface (where the molten metal forms a contact angle smaller than 90° with respect to the metal-philic surface); and a metal-repellent surface (where the molten metal forms a contact angle larger than 90° with respect to the metal-repellent surface), the metal-repellent surface being located forward of the metal-philic surface in the ejecting direction.
- the nozzle holds the peripheral edge of the liquid surface of the molten metal at a position further forward in the ejecting direction than a boundary between the metal-philic surface and the metal-repellent surface.
- the peripheral edge of the liquid surface of the molten metal is thus held so as to prevent timing delay in ejecting the molten metal and variations in the diameter, direction, and speed of the ejected molten metal drops. Furthermore, the molten metal to be ejected from the nozzle can be stored with the metal-philic surface surrounding it, which prevents formation of voids while the molten metal is stored.
- FIGS. 1 , 2 , 3 , 4 , 5 , and 6 are cross-sectional views showing structures introductory to the present invention
- FIGS. 7 , 8 , 9 , 10 , and 11 are cross-sectional views showing the present invention.
- FIGS. 12 , 13 , 14 , and 15 are cross-sectional views showing structures of nozzles according to a first preferred embodiment of the invention.
- FIG. 16 is a cross-sectional view showing the structure of a nozzle according to a second preferred embodiment of the invention.
- FIGS. 17 and 18 are cross-sectional views showing the structure of a nozzle according to a third preferred embodiment of the invention.
- FIG. 19 is a cross-sectional view showing the structure of a nozzle according to a fourth preferred embodiment of the invention.
- FIG. 20 is a cross-sectional view showing the structure of a nozzle according to a fifth preferred embodiment of the invention.
- FIG. 21 is a cross-sectional view showing the structure of a nozzle according to a sixth preferred embodiment of the invention.
- FIG. 22 is a cross-sectional view showing the structure of a nozzle according to a seventh preferred embodiment of the invention.
- FIGS. 23 , 24 , 25 , 26 and 27 are cross-sectional views illustrating conventional arts.
- Japanese Patent Application Laid-Open No. 61-141565 (1986) discloses a technique about an ink ejecting portion in an inkjet printer, where the surface of the portion corresponding to the tapered portion 6 and the straight portion 5 of the nozzle 201 is made hydrophilic and the portion corresponding to the nozzle exit surface 4 is made water-repellent.
- solder-philic surface means that the solder forms a contact angle smaller than 90° with respect to that surface.
- solder-repellent it means that the solder forms a contact angle larger than 90° with respect to that surface.
- FIG. 1 is a cross-sectional view showing the structure of a nozzle 202 according to the introductory ideal of this invention.
- the surfaces of the molten solder chamber 1 , the tapered portion 6 , and the straight portion 5 are all surface-treated to be solder-philic. More specifically, a plating layer 41 having good wettability for solder is formed, for example. On the other hand, the nozzle exit surface 4 remains solder-repellent.
- the molten solder 20 can be easily introduced from the molten solder chamber 1 to the opening 3 since the inner surface of the nozzle 202 is solder-philic. No void 40 will remain in the molten solder chamber 1 when the molten solder chamber 1 is first charged with the molten solder 20 .
- the peripheral edge of the liquid surface is held at the opening 3 , while, in the nozzle 201 , it was held at the edge 6 a of the tapered portion 6 .
- the molten solder 201 easily penetrates into the opening 3 since the surface of the straight portion 5 is solder-philic, and also because the solder-repellent nozzle exit surface 4 extends from the opening 3 at a large angle, 180° in this example.
- the solder drops 11 can be ejected in a steady manner without suffering from variations in the diameter, direction, and speed.
- the opening 3 corresponds to the boundary between the solder-philic surface of the straight portion 5 and the solder-repellent nozzle exit surface 4 . Accordingly, also when the liquid surface is drawn back into the straight portion 5 in reaction to the ejecting, the peripheral edge of the liquid surface is likely to be held at the opening 3 , possibly causing inclusion of voids.
- FIGS. 2 to 6 are cross-sectional views showing the structure of a nozzle 207 based on the introductory idea of the invention, where FIG. 2 shows the condition before ejecting, FIG. 3 shows the condition during ejecting, and FIGS. 4 to 6 show the conditions after ejecting.
- the solder-philic plating layer 41 is formed on the inner surfaces of the tapered portion 6 and the molten solder chamber 1 of the nozzle 201 described referring to FIGS. 24 to 26 .
- the nozzle 207 is not provided with the plating layer 41 in the straight portion 5 . Accordingly, as shown in FIG. 2 , as in the nozzle 201 shown in FIG. 24 , the peripheral edge of the liquid surface, before ejected, is held at the edge 6 a between the tapered portion 6 and the straight portion 5 . While the solder drop 11 is being ejected, the peripheral edge of the liquid surface is still held at the edge 6 a , as in the nozzle 201 shown in FIG. 25 .
- the solder-philic tapered portion 6 pulls the peripheral edge of the liquid surface in the direction from the edge 6 b toward the edge 6 a .
- the peripheral edge of the liquid surface is held at the edge 6 a and the liquid surface waves as shown in FIG. 4 .
- the voids 12 are included in the molten solder 20 in the vicinity of the tapered portion 6 .
- the solder drop 11 is ejected, many voids 12 are included and they join together to form a large void 13 in the molten solder chamber 1 as shown in FIG. 6 .
- the large void 13 is compressed or separated into small voids 12 , hindering steady ejecting of the solder drops 11 .
- the edge 6 a of the tapered portion 6 functions like the opening 3 of the nozzle 202 and the peripheral edge of the liquid surface is held at the edge 6 a not only before ejected but also after ejected, with the surface of the tapered portion 6 , which extends from the edge 6 a to the molten solder chamber 1 (i.e. in the direction away from the ejecting end), being solder-philic.
- the inner surface of the nozzle is made solder-repellent in the part nearer to the ejecting end and solder-philic in the part away from it. Then, before ejected, the peripheral edge of the liquid surface is held at a position further forward in the ejecting direction than the boundary between the solder-repellent surface and the solder-philic surface. It is then possible to control the pressure so that the peripheral edge of the liquid surface will not be held at the above-mentioned boundary when the molten solder is ejected and when, afterward, in reaction, it moves opposite to the ejecting direction.
- FIG. 7 is a cross-sectional view showing the basic idea of the invention.
- the nozzle 2 ejects the molten metal 20 in the ejecting direction Z.
- the nozzle 2 has a solder-philic surface in the region P 1 and a solder-repellent surface in the region P 2 .
- the region P 2 is located forward of the region P 1 in the ejecting direction Z.
- the nozzle 2 Before ejecting, the nozzle 2 , using a technique described later, holds the peripheral edge of the liquid surface at the position A that is further forward in the ejecting direction Z by a distance ⁇ (>0) than the boundary between the solder-philic surface and the solder-repellent surface.
- ⁇ >0
- the nozzle 2 when the forward side of the ejecting direction Z is taken as a region Q 2 and the side opposite to the region Q 2 is taken as a region Q 1 , then the nozzle 2 , before ejecting, holds the peripheral edge of the liquid surface at the position A on the boundary between the regions Q 1 and Q 2 .
- the solder drops can be ejected in a steady manner with a steady diameter, in a steady direction, and at a steady speed.
- the molten solder 20 to be ejected from the nozzle 2 , can be stored in the region P 1 with the metal-philic surface surrounding it. This prevents the inclusion of voids, as shown in FIG. 27 , while the molten solder 20 is stored.
- the pressure applied to the molten solder 20 is controlled so that the peripheral edge of the liquid surface will not move more than the distance ⁇ from the position A when it moves opposite to the ejecting direction Z in ejecting the molten solder 20 or in reaction to the ejecting. Even when the peripheral edge of the liquid surface moves opposite to the ejecting direction Z within the distance ⁇ from the position A, the peripheral edge of the liquid surface is still in the region P 2 and in contact with the solder-repellent surface.
- voids may be included; however, the inclusion of voids can be prevented by controlling the position of the peripheral edge of the liquid surface as shown above.
- FIG. 8 is a cross-sectional view taken along a section parallel to the ejecting direction Z.
- a nozzle 203 has a first inner side surface 31 , a second inner side surface 32 , and a bottom surface 33 .
- the first inner side surface 31 , the second inner side surface 32 , and the bottom surface 33 are arranged symmetrically about an axis extending in the ejecting direction Z, and specifically, the side of a frustum of a circular cone, the side of a circular cylinder, and a flat plane with a circular opening can be adopted respectively for them.
- the first inner side surface 31 is tapered off at an angle ⁇ with respect to the ejecting direction Z.
- the second inner side surface 32 is parallel to the ejecting direction Z and the bottom surface 33 is perpendicular to the ejecting direction Z.
- they respectively correspond to the tapered portion 6 , the straight portion 5 and the nozzle exit surface 4 of the nozzle 201 .
- the molten solder 20 can move along the ejecting direction Z when the angle ⁇ satisfies Expression (1) which contains a contact angle ⁇ 31 (>90°) that the molten solder 20 forms with respect to the first inner side surface 31 .
- Expression (1) which contains a contact angle ⁇ 31 (>90°) that the molten solder 20 forms with respect to the first inner side surface 31 .
- ⁇ 31 ⁇ 90° (1)
- Expression (2) holds about the second inner side surface 32 , with the contact angle ⁇ 32 (>90°) that the molten solder 20 forms with respect to the second inner side surface 32 . 0 ⁇ 32 ⁇ 90° (2)
- the angle between the second inner surface 32 and the ejecting direction Z is set so that when the molten solder 20 moves along the ejecting direction Z, it is in contact with the second inner side surface 32 with poor wettability. Then, when no external pressure is applied to the molten solder 20 , the peripheral edge of the liquid surface before ejected can be held at the boundary between the first inner side surface 31 and the second inner side surface 32 .
- FIG. 8 also shows the angle ⁇ between the liquid surface and the second inner surface 32 .
- the angle ⁇ increases as the pressure P increases.
- the peripheral edge of the liquid surface is held at this boundary.
- this pressure P is the threshold pressure P 1 mentioned before
- the peripheral edge of the liquid surface is then located within the second inner surface 32 .
- the radius r is larger than the radius R of the circle formed by this boundary.
- the second inner surface 32 may be parallel to the ejecting direction Z as shown in FIG. 8 , or it may be tapered off along the ejecting direction Z.
- FIG. 9 is a cross-sectional view taken along a section parallel to the ejecting direction Z.
- a nozzle 204 has a first inner side surface 31 , a second inner side surface 32 , and a bottom surface 33 .
- the second inner side surface 32 is tapered off at an angle ⁇ with respect to the ejecting direction Z.
- the peripheral edge of the liquid surface can be held at the boundary between the first inner side surface 31 and the second inner side surface 32 when Expression (4) is satisfied.
- the second inner side surface 32 may be spread out along the ejecting direction Z.
- FIG. 10 is a cross-sectional view taken along a section parallel to the ejecting direction Z.
- a nozzle 205 has a first inner side surface 31 , a second inner side surface 32 , and a bottom surface 33 .
- the second inner side surface 32 is spread at an angle ⁇ with respect to the ejecting direction Z.
- the radius r of the spherical surface, a part of which is formed by the liquid surface is larger than the radius R of the circle formed by the boundary between the first inner side surface 31 and the second inner side surface 32 .
- Expression (5) when Expression (5) is satisfied, the angle ⁇ between the tangent of the liquid surface at the position A and the second inner surface 32 can be increased up to the contact angle ⁇ 32 .
- FIG. 11 is a cross-sectional view taken along a section parallel to the ejecting direction Z.
- the nozzle 206 has the molten solder chamber 1 , an inner side surface 34 , and the bottom surface 33 .
- the inner side surface 34 connects with the bottom surface 1 a of the molten solder chamber 1 and the bottom surface 33 .
- the angle between said ejecting direction Z and the tangent of the curve formed by the inner side surface 34 in this section continuously varies from 90° to 0° along the ejecting direction Z.
- bottom surfaces 1 a and 33 are perpendicular to the ejecting direction Z, and therefore the bottom surface 1 a and the inner side surface 34 meet at an angle of 0° in this section and the bottom surface 33 and the inner side surface 34 meet at 90° in this section.
- FIGS. 12 to 14 are cross-sectional views of a nozzle 101 according to a first preferred embodiment of the present invention, which shows the structure appearing in a section parallel to the ejecting direction Z.
- the nozzle 101 has a molten solder chamber 1 , a tapered portion 6 communicating therewith, and a straight portion 5 communicating with the tapered portion 6 .
- the tapered portion 6 has edges 6 a and 6 b which adjoin the straight portion 5 and the molten solder chamber 1 , respectively.
- the straight portion 5 has an opening 3 in the nozzle exit surface 4 .
- the nozzle 101 may be made by adopting a solder-repellent material, such as ceramics (e.g. zirconia), stainless steel, quartz glass, or ruby.
- the molten solder chamber 1 , the straight portion 5 , and the tapered portion 6 can be formed by machining. Ceramics have good solder-repellent property but are difficult to process, while stainless steel is superior in strength and processibility but inferior to ceramics in solder-repellent property.
- the molten solder chamber 1 is covered with a diaphragm 7 , which faces to the bottom surface 1 a of the chamber 1 .
- the molten solder 20 is stored with the molten solder chamber 1 and the diaphragm 7 enclosing it.
- a solder-philic layer 42 is formed on the surface of the diaphragm 7 that lies opposite the bottom surface 1 a .
- a solder-philic layer 43 is formed on the bottom surface 1 a of the molten solder chamber 1 and on its side surface extending from the bottom surface 1 a to the diaphragm 7 . Accordingly the molten solder 20 is stored in the molten solder chamber 1 with good wettability and voids 40 (see FIG. 27 ) will not remain in the molten solder chamber 1 when the molten solder chamber 1 is first charged with the molten solder 20 .
- the solder-philic layers 42 and 43 may be formed by plating, coating, sputtering, or vapor deposition. Plating is the easiest method among them. Plating materials having good wettability with respect to the molten solder 20 include gold, copper, tin, nickel, platinum, and palladium. While gold, copper, and tin have good wettability with respect to the molten solder 20 , they are susceptible to erosion by the molten solder 20 . When erosion occurs, the solder-philic layers 42 and 43 will be removed and then it is difficult to ensure steady solder-phile for a long time. Gold and palladium, noble metals, are expensive.
- nickel is insusceptible to erosion by the molten solder 20 , lower in price, and has good wettability with respect to the molten solder 20 . Furthermore, when stainless steel is adopted as the material of the nozzle 101 , nickel plating can be directly applied without the need for underlayer.
- plating layer materials for the solder-philic layers 42 and 43 include: Ni—P which contains nickel (Ni) and a small amount of phosphorus (P); Ni—B which contains boron (B); Ni—P—W which contains phosphorus and tungsten (W); and Ni—B—W which contains boron and tungsten.
- Ni—P which contains nickel
- B which contains boron
- W phosphorus and tungsten
- Ni—B—W which contains boron and tungsten.
- the plating layers provide as good wettability as a plating layer of nickel with respect to the molten solder 20 and still less susceptibility to erosion by the molten solder 20 .
- the nozzle 101 is made of ceramic and the solder-philic layers 42 and 43 are formed by plating using nickel or a material mainly containing nickel as shown above, it is desired, before plating, to sputter chromium (Cr) or titanium (Ti) and then sputter copper (Cu), so as to enhance the adhesion of the solder-philic layers 42 and 43 .
- Cr chromium
- Ti titanium
- Cu sputter copper
- solder-philic layer 42 does not have to be formed when the diaphragm 7 is made of a solder-philic member.
- the tapered portion 6 is tapered off at an angle ⁇ with respect to the ejecting direction Z and the straight portion 5 is parallel to the ejecting direction Z.
- the tapered portion 6 forms the side of a frustum of a circular cone having its axis parallel to the ejecting direction Z and the straight portion 5 forms the side of a circular cylinder having the same axis.
- the straight portion 5 and the tapered portion 6 do not necessarily have to be axisymmetric. They are just required to satisfy conditions necessary for the angles ⁇ and ⁇ as will be described later in this and following preferred embodiments.
- the tapered portion 6 and the straight portion 5 are made of the same material.
- the contact angle that the molten solder 20 forms with respect to this material is taken as ⁇ s, then the angle ⁇ shall satisfy Expression (7).
- the peripheral edge of the liquid surface of the molten solder 20 is held at the edge 6 a as shown in FIG. 12 , unless a pressure exceeding the threshold pressure P 1 occurs at the boundary between the tapered portion 6 and the straight portion 5 , i.e. at the edge 6 a.
- FIG. 13 shows the condition in which the molten solder 20 is being ejected.
- a force F is applied to the diaphragm 7 from a pressure source not shown, e.g. a piezoelectric device.
- the force F presses down the molten solder 20 into the opening 3 and then draws it back into the molten solder chamber 1 .
- a portion of the molten solder 20 is ejected out of the nozzle 101 as a solder drop 11 , through the straight portion 5 and from the opening 3 .
- the position of the peripheral edge of the liquid surface can thus be held before the molten solder 20 is ejected, and therefore the pressure required for ejecting can rise sharply, thus avoiding timing delay in ejecting the solder drop 11 and variations in the diameter, direction, and speed of the ejected solder drops 11 .
- FIG. 14 shows the condition after the solder drop 11 has been ejected.
- the force F is not applied to the diaphragm 7 and the diaphragm 7 has returned to its original position. While the angle ⁇ formed by the tapered portion 6 satisfies Expression (7), the liquid surface is pulled into the tapered portion 6 in reaction to the ejecting and the peripheral edge of the liquid surface once rises to the position B nearer to the edge 6 b than the edge 6 a is. After that, the peripheral edge of the liquid surface returns to the condition shown in FIG. 12 to be held at the edge 6 a until the force F is next applied to the diaphragm 7 to eject the solder drop 11 .
- the edge 6 a corresponds to the boundary between the regions Q 1 and Q 2 shown in FIG. 7
- the edge 6 b corresponds to the boundary between the regions P 1 and P 2 of FIG. 7
- the tapered portion 6 corresponds to the distance 6 . Accordingly the liquid surface can be prevented from waving, as shown in FIG. 4 , by controlling the force F so that the position B, to which the peripheral edge of the liquid surface is drawn back, stays within the tapered portion 6 , and then voids 12 and 13 (see FIGS. 5 and 6 ) will not be formed and the solder can be steadily ejected thereafter.
- the straight portion 5 may be tapered off at an angle ⁇ satisfying Expression (9) with respect to the ejecting direction Z, or it may be spread with respect to the ejecting direction Z, more preferably spread at an angle ⁇ which satisfies Expression (10).
- FIG. 13 shows an example in which the peripheral edge of the liquid surface is held at the edge 6 a not only before ejected but also while being ejected.
- the liquid surface is held at the edge 6 a before the solder drop 11 is ejected
- the liquid surface does not necessarily have to be held while being ejected.
- the peripheral edge of the liquid surface is held at the edge 6 a before ejected, it may be held, while being ejected, at a position still closer to the forward end of the ejecting direction Z, e.g. at the opening 3 . That is to say, the pressure P occurring at the edge 6 a may exceed the threshold pressure P 1 .
- FIG. 15 is a cross-sectional view showing the peripheral edge of the liquid surface held at the position C on the boundary between the second inner side surface 32 and the bottom surface 33 in the nozzle 203 .
- the position C corresponds to the opening 3 of the nozzle 101 .
- the bottom surface 33 extends at 90° with respect to the ejecting direction Z.
- the pressure P that is applied when the peripheral edge of the liquid surface is held at the position C can reach up to the maximum pressure P max .
- the liquid surface P in this case forms a semi-spherical surface S 1 with the radius R.
- this liquid surface forms a part S 2 of a spherical surface with a radius larger than R.
- the angle ⁇ between the tangent of the liquid surface at the position C and the bottom surface 33 becomes equal to the contact angle ⁇ 33 or larger, the liquid surface can no longer be held and the molten solder 20 overflows from the position C onto the bottom surface 33 .
- the position C shown in FIG. 15 corresponds to the opening 3 of the nozzle 101 .
- FIG. 16 is a cross-sectional view of a nozzle 102 according to a second preferred embodiment of the invention, which shows the structure appearing in a section parallel to the ejecting direction Z.
- the nozzle 102 is a modification of the nozzle 101 , where the solder-philic layer 43 is extended not only on the bottom surface 1 a of the molten solder chamber 1 but also onto the tapered portion 6 past the edge 6 b .
- the tapered portion 6 satisfies Expression (7) as in the nozzle 101 .
- the straight portion 5 may be tapered off at an angle ⁇ satisfying Expression (9) with respect to the ejecting direction Z, or it may be spread out with respect to the ejecting direction Z, more preferably spread at an angle ⁇ which satisfies Expression (10).
- the effects shown in the first preferred embodiment can be obtained as long as the position B, at which the peripheral edge of the liquid surface is located when drawn back in reaction to the ejecting, is located further forward than the solder-philic layer 43 in the ejecting direction Z.
- the solder-philic layer 43 might be eroded by the molten solder 20 since the molten solder 20 intensively flows on the tapered portion 6 when the solder drop 11 is ejected. However, in the tapered portion 6 , the molten solder 20 does not flow so intensively in the vicinity of the edge 6 b as it does in the vicinity of the edge 6 a . Accordingly, even when, as shown in the nozzle 102 , the solder-philic layer 43 on the bottom surface 1 a of the molten solder chamber 1 extends onto the tapered portion 6 past the edge 6 b , it will not be easily eroded by the molten solder 20 .
- the nozzle 102 has a manufacturing advantage.
- the solder-philic layer 43 is allowed to extend past the edge 6 b onto the tapered portion 6 , so that a mask smaller than the size of the edge 6 b can be used and it can be positioned easily.
- solder-philic layer 43 presenting a solder-philic surface and the solder-repellent surface part of the tapered portion 6 is located within the tapered portion 6 , the process of forming the solder-philic layer 43 can be easier than when the tapered portion 6 is made entirely solder-repellent with no solder-philic layer 43 thereon. Also, since the solder-philic surface extends halfway in the tapered portion 6 , voids are less likely to remain in the tapered portion 6 when the molten solder 20 is first supplied.
- FIGS. 17 and 18 are cross-sectional views of a nozzle 103 according to a third preferred embodiment of the invention, which show the structure appearing in a section parallel to the ejecting direction Z.
- the nozzle 103 does not have the straight portion 5 .
- the edge 6 a of the tapered portion 6 is regarded as the boundary between the tapered portion 6 and the nozzle exit surface 4 , which can also be regarded as the opening 3 .
- this structure corresponds to an example in which the angle ⁇ is 90° and the second inner side surface 32 coincides with the bottom surface 33 .
- the solder-philic layer 43 may be extended from the bottom surface 1 a onto the tapered portion 6 past the edge 6 b , as in the nozzle 102 .
- the tapered portion 6 satisfies Expression (7), as in the nozzle 101 .
- FIG. 17 shows the condition before the solder drop 11 is ejected
- FIG. 18 shows the condition where the solder drop 11 is being ejected.
- the peripheral edge of the liquid surface is held at the opening 3 (i.e. at the edge 6 a ).
- the force F is controlled so that the peripheral edge of the liquid surface, when drawn back in reaction to the ejecting of the solder drop 11 , does not reach the solder-philic layer 43 .
- this structure offers the same effects as the nozzles 101 and 102 .
- the nozzle 103 does not have the straight portion 5 , and therefore the liquid surface, which protrudes when the solder drop 11 is ejected, does not come into contact with the straight portion 5 . Therefore the solder drops 11 will not be ejected in skewed direction and can be ejected in a steady manner.
- FIGS. 17 and 18 show an example in which ⁇ is 90° in FIG. 10 ; as has been described referring to FIG. 10 and as shown by Expression (5), as long as Expression (5) is satisfied, the angle ⁇ between the tangent of the liquid surface at the position A and the second inner surface 32 can increase up to the contact angle ⁇ 32 .
- the liquid surface protruding when ejected does not come into contact with the second inner surface 32 as long as the angle ⁇ satisfies Expression (5).
- FIG. 19 is a cross-sectional view of a nozzle 104 according to a fourth preferred embodiment of the invention, which shows the structure appearing in a section parallel to the ejecting direction Z.
- the molten solder chamber 1 has not yet been charged with molten solder.
- a solder plating layer 14 is formed on the solder-philic layer 43 of the nozzle 101 .
- the tapered portion 6 satisfies Expression (7) as in the nozzle 101 .
- the straight portion 5 may be tapered off at an angle ⁇ which satisfies Expression (9) with respect to the ejecting direction Z, or it may be spread out with respect to the ejecting direction Z, more preferably spread at an angle ⁇ which satisfies Expression (10).
- the solder plating layer 14 may be provided on the solder-philic layer 43 also in the nozzles 102 and 103 .
- solder When molten solder is supplied into the molten solder chamber 1 through a passage not shown, it can be smoothly introduced into the molten solder chamber 1 since the molten solder exhibits very large wettability with respect to the solder plating layer 14 . Further, the solder plating layer 14 covering the solder-philic layer 43 prevents oxidation of the solder-philic layer 43 . This prevents deterioration of the wettability of the molten solder due to oxide film.
- the solder plating layer 14 readily dissolves into the molten solder supplied, leaving no residue. Therefore, after the molten solder has been contained in the molten solder chamber 1 , the nozzle 104 exhibits the same structure as the nozzle 101 containing molten solder in the molten solder chamber 1 . Thus the nozzle 104 provides the same effects as those of the first preferred embodiment after the molten solder has been contained.
- solder plating layer 14 when the solder plating layer 14 once comes in contact with the molten solder, it dissolves into the molten solder with no residue. Therefore the straight portion 5 and the tapered portion 6 , too, may be plated with the solder plating 14 .
- the effect of preventing oxidation of the solder-philic layer 43 and the effect of allowing the molten solder to be smoothly supplied into the nozzle 102 at the first time can be obtained also by providing a gold plating layer instead of the solder plating layer 14 .
- gold (Au) reacts with tin (Sn) in the molten solder to produce Au—Sn alloy.
- the Au—Sn alloy has stronger viscosity than solder. Therefore, when the gold plating layer is provided, Au—Sn alloy is likely to adhere to the tapered portion 6 , the straight portion 5 , or the nozzle exit surface 4 around the opening 3 , which may adversely affect the ejecting operation.
- Adopting the solder plating layer 14 thus prevents oxidation of the solder-philic layer 43 and allows the molten solder to be smoothly introduced into the nozzle 102 at the first time without producing unwanted impurities.
- FIG. 20 is a cross-sectional view of a nozzle 105 according to a fifth preferred embodiment of the invention, which shows the structure appearing in a section parallel to the ejecting direction Z.
- the nozzle 105 has the molten solder chamber 1 , the tapered portion 6 , and the straight portion 5 .
- the tapered portion 6 satisfies Expression (7).
- the straight portion 5 may be tapered with respect to the ejecting direction Z at an angle ⁇ which satisfies Expression (9), or it may be spread out with respect to the ejecting direction, more preferably spread at an angle ⁇ which satisfies Expression (10).
- the nozzle 105 is formed of a solder-philic first plate 16 and a second plate 15 bonded together.
- the second plate 15 is located on the side of the nozzle exit surface 4 , while the first plate 16 is located away from the nozzle exit surface 4 .
- the boundary between the first plate 16 and the second plate 15 is located, at least on the surface on which the molten solder 20 contacts, between the bottom surface 1 a of the molten solder chamber 1 and the position Bmax to which the peripheral edge of the liquid surface is drawn back closest to the molten solder chamber 1 in reaction to the ejecting.
- the molten solder chamber 1 is covered by the diaphragm 7 and the solder-philic layer 42 is formed on the side of the diaphragm 7 that lies opposite the bottom surface 1 a .
- the solder-philic layer 42 does not have to be formed when the diaphragm 7 is formed of a solder-philic member.
- the solder-philic surface needed in the nozzle 105 is presented by the first plate 16 without the need to adopt the solder-philic layer 43 adopted in the nozzles 101 to 104 .
- FIG. 21 is a cross-sectional view of a nozzle 106 according to a sixth preferred embodiment of the invention, which shows the structure appearing in a section parallel to the ejecting direction Z.
- the nozzle 106 is formed of a solder-philic first plate 16 and a second plate 15 bonded together.
- the nozzle 106 differs from the nozzle 105 in the position of the first plate 16 and the second plate 15 . That is to say, the first plate 16 surrounds the second plate 15 , with the second plate 15 forming the straight portion 5 and the opening 3 .
- the nozzle exit surface 4 is formed by the second plate 15 in the vicinity of the opening 3 and by the first plate 16 in the part around it.
- the boundary between the first plate 16 and the second plate 15 is located, on the surface with which the molten solder 20 contacts, between the position Bmax and the bottom surface 1 a of the molten solder chamber 1 .
- the molten solder chamber 1 and the tapered portion 6 and straight portion 5 may be processed after the second plate 15 has been incorporated in the first plate 16 , or the first plate 16 and the second plate 15 may be individually processed before put together.
- FIG. 22 is a cross-sectional view of a nozzle 107 according to a seventh preferred embodiment of the invention, which shows the structure appearing in a section parallel to the ejecting direction Z.
- the nozzle 107 has the molten solder chamber 1 , the tapered portion 6 communicating therewith, and the straight portion 5 communicating with the tapered portion 6 .
- the tapered portion 6 has the edges 6 a and 6 b which adjoin the straight portion 5 and the molten solder chamber 1 , respectively.
- the straight portion 5 has the opening 3 in the nozzle exit surface 4 .
- the tapered portion 6 satisfies Expression (7).
- the straight portion 5 may be tapered off with respect to the ejecting direction Z at an angle ⁇ which satisfies Expression (9), or it may be spread out with respect to the ejecting direction Z, more preferably spread at an angle ⁇ which satisfies Expression (10).
- the nozzle 107 is made of a solder-philic material, e.g. nickel.
- the molten solder chamber 1 , the straight portion 5 , and the tapered portion 6 can be formed by machining.
- the molten solder chamber 1 is covered by the diaphragm 7 lying opposite the bottom surface 1 a , where the molten solder 20 is stored with the molten solder chamber 1 and the diaphragm 7 enclosing it. While the solder-philic layer 42 is provided on the surface of the diaphragm 7 that faces to the bottom surface 1 a , the solder-philic layer 42 can be removed when the diaphragm 7 is made of a solder-philic member. The molten solder 20 can thus be stored in the molten solder chamber 1 with good wettability and voids 40 (see FIG. 27 ) will not remain in the molten solder chamber 1 when the molten solder chamber 1 is first charged with the molten solder 20 .
- a solder-repellent layer 17 is formed on the nozzle exit surface 4 , the straight portion 5 , and the tapered portion 6 .
- the solder-repellent layer 17 can be formed by coating using ceramics or diamond-like-carbon, or by chromium plating.
- solder-repellent surface and the solder-philic surface are thus positioned like those in the nozzle 101 and the nozzle 107 provides the same effects as the first preferred embodiment.
- the solder-repellent layer 17 may be formed to partially cover the tapered portion 6 , as long as it extends from the opening 3 , through the straight portion 5 and the edge 6 a , and past the position B.
- the straight portion 5 may be removed, as in the nozzle 103 .
- the solder-repellent layer 17 has poor wettability with respect to the molten solder 20 and therefore it ensures steady ejecting operation for a long time, without being eroded by the molten solder 20 .
- solder-repellent body presents the solder-repellent surface and the solder-philic layer 43 , provided thereon, presents the solder-philic surface, as shown in the nozzles 101 to 104 of the first to fourth preferred embodiments, is more desirable.
- the solder-repellent layer 17 might be damaged by cleaning to the nozzle exit surface 4 .
- the molten solder 20 when ejected, will overflow onto the nozzle exit surface 4 to make the ejecting operation unsteady.
- the nozzles 101 to 104 will provide more steady ejecting operation because the part where the peripheral edge of the liquid surface is located is not surface-treated and therefore the solder repellent property will not be deteriorated in that part.
Abstract
Description
α≧θ31−90° (1)
0<θ32−90° (2)
0<β<θ32−90° (4)
γ≦180°−θ32 (5)
P max=2σ/R (6)
α≧θs−90° (7)
0<β<θs−90° (9)
γ≧180°−θs (10)
90°>180°−θ33 (11)
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002129757A JP3643089B2 (en) | 2002-05-01 | 2002-05-01 | nozzle |
JP2002-129757 | 2002-05-01 |
Publications (2)
Publication Number | Publication Date |
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US20030205628A1 US20030205628A1 (en) | 2003-11-06 |
US6854671B2 true US6854671B2 (en) | 2005-02-15 |
Family
ID=29267696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/277,081 Expired - Fee Related US6854671B2 (en) | 2002-05-01 | 2002-10-22 | Nozzle for ejecting molten metal |
Country Status (2)
Country | Link |
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US (1) | US6854671B2 (en) |
JP (1) | JP3643089B2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100605315B1 (en) | 2004-07-30 | 2006-07-28 | 삼성전자주식회사 | Input/output pad structure of integrated circuit chip |
JP5101844B2 (en) * | 2006-08-08 | 2012-12-19 | 矢崎総業株式会社 | Coloring nozzle |
JP4997926B2 (en) * | 2006-11-09 | 2012-08-15 | 三菱電機株式会社 | Nozzle for molten metal discharge apparatus and method for manufacturing the same |
KR100986760B1 (en) * | 2008-06-09 | 2010-10-08 | 포항공과대학교 산학협력단 | Pneumatic Dispenser |
JP5884058B2 (en) * | 2010-02-26 | 2016-03-15 | パナソニックIpマネジメント株式会社 | Soldering device |
JP5511705B2 (en) * | 2011-02-10 | 2014-06-04 | ギガフォトン株式会社 | Target supply device and extreme ultraviolet light generation device |
JP2013028101A (en) * | 2011-07-29 | 2013-02-07 | Seiko Epson Corp | Liquid ejecting head and liquid ejecting device |
JP6068044B2 (en) * | 2012-08-09 | 2017-01-25 | ギガフォトン株式会社 | Target supply device control method and target supply device |
DE102018216930A1 (en) * | 2018-10-02 | 2020-04-02 | Robert Bosch Gmbh | Method and device for the additive manufacturing of a three-dimensional workpiece from a liquid material |
DE102018221738A1 (en) * | 2018-12-14 | 2020-06-18 | Robert Bosch Gmbh | Device for the additive manufacturing of a three-dimensional workpiece from an aluminum-containing molten metal |
CN113000974A (en) * | 2021-03-09 | 2021-06-22 | 沈倩友 | Nozzle of laser tin ball welding machine |
US20240058870A1 (en) * | 2022-08-17 | 2024-02-22 | Xerox Corporation | High-throughput liquid metal inkjet nozzle with porous layer for meniscus damping |
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US4719963A (en) * | 1985-06-19 | 1988-01-19 | Sundwiger Eisenhutte Maschinenfabrik Grah & Co. | Process for the production of a metal strand, more particularly in the form of a strip or section, by casting and apparatus for the performance of the process |
JPH0360036A (en) | 1989-07-27 | 1991-03-15 | Oki Electric Ind Co Ltd | Formation of bump |
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US5063988A (en) * | 1990-06-22 | 1991-11-12 | Armco Inc. | Method and apparatus for strip casting |
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JP2002043351A (en) | 2000-07-25 | 2002-02-08 | Mitsubishi Electric Corp | Solder bump formation device, solder bump formation method and method for manufacturing semiconductor thereby |
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2002
- 2002-05-01 JP JP2002129757A patent/JP3643089B2/en not_active Expired - Fee Related
- 2002-10-22 US US10/277,081 patent/US6854671B2/en not_active Expired - Fee Related
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US4475583A (en) * | 1980-05-09 | 1984-10-09 | Allegheny Ludlum Steel Corporation | Strip casting nozzle |
JPS61141565A (en) | 1984-12-14 | 1986-06-28 | Ricoh Co Ltd | Surface treatment of ink jet head |
US4719963A (en) * | 1985-06-19 | 1988-01-19 | Sundwiger Eisenhutte Maschinenfabrik Grah & Co. | Process for the production of a metal strand, more particularly in the form of a strip or section, by casting and apparatus for the performance of the process |
JPS62257750A (en) | 1986-04-30 | 1987-11-10 | Fujitsu Ltd | Forming method for bump electrode |
JPH0360036A (en) | 1989-07-27 | 1991-03-15 | Oki Electric Ind Co Ltd | Formation of bump |
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US5063988A (en) * | 1990-06-22 | 1991-11-12 | Armco Inc. | Method and apparatus for strip casting |
US5171360A (en) * | 1990-08-30 | 1992-12-15 | University Of Southern California | Method for droplet stream manufacturing |
JPH11274204A (en) | 1998-03-26 | 1999-10-08 | Toshiba Corp | Formation of solder bump |
US6213356B1 (en) | 1999-04-07 | 2001-04-10 | Mitsubishi Denki Kabushiki Kaisha | Bump forming apparatus and bump forming method |
US6306467B1 (en) * | 1999-06-14 | 2001-10-23 | Ford Global Technologies, Inc. | Method of solid free form fabrication of objects |
JP2002043351A (en) | 2000-07-25 | 2002-02-08 | Mitsubishi Electric Corp | Solder bump formation device, solder bump formation method and method for manufacturing semiconductor thereby |
Also Published As
Publication number | Publication date |
---|---|
US20030205628A1 (en) | 2003-11-06 |
JP3643089B2 (en) | 2005-04-27 |
JP2003324121A (en) | 2003-11-14 |
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