US6811957B1 - Patterned carbon nanotube films - Google Patents
Patterned carbon nanotube films Download PDFInfo
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- US6811957B1 US6811957B1 US09/979,793 US97979302A US6811957B1 US 6811957 B1 US6811957 B1 US 6811957B1 US 97979302 A US97979302 A US 97979302A US 6811957 B1 US6811957 B1 US 6811957B1
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- 239000002238 carbon nanotube film Substances 0.000 title description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 62
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 53
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000002071 nanotube Substances 0.000 claims abstract description 33
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 12
- 230000001747 exhibiting effect Effects 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 230000000873 masking effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 50
- 230000008569 process Effects 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 16
- 238000000197 pyrolysis Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 239000002585 base Substances 0.000 claims description 8
- 229910052723 transition metal Inorganic materials 0.000 claims description 8
- 150000003624 transition metals Chemical class 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 229930003836 cresol Natural products 0.000 claims description 5
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 150000002902 organometallic compounds Chemical class 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- XJKVPKYVPCWHFO-UHFFFAOYSA-N silicon;hydrate Chemical compound O.[Si] XJKVPKYVPCWHFO-UHFFFAOYSA-N 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims description 2
- 150000001345 alkine derivatives Chemical class 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 claims description 2
- COOGPNLGKIHLSK-UHFFFAOYSA-N aluminium sulfide Chemical compound [Al+3].[Al+3].[S-2].[S-2].[S-2] COOGPNLGKIHLSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000908 ammonium hydroxide Substances 0.000 claims description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 2
- 230000000975 bioactive effect Effects 0.000 claims description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229920003243 conjugated conducting polymer Polymers 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 2
- BVSHTEBQPBBCFT-UHFFFAOYSA-N gallium(iii) sulfide Chemical compound [S-2].[S-2].[S-2].[Ga+3].[Ga+3] BVSHTEBQPBBCFT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 150000007530 organic bases Chemical class 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920000767 polyaniline Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 238000010494 dissociation reaction Methods 0.000 claims 3
- 230000005593 dissociations Effects 0.000 claims 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 claims 1
- 238000002360 preparation method Methods 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 0 *c1cccc2c1C=CC(C)C2=O.*c1cccc2c1C=CC2C=O.*c1cccc2c1C=CCC2=O.*c1cccc2c1CC=C2C(=O)O.N#N.O Chemical compound *c1cccc2c1C=CC(C)C2=O.*c1cccc2c1C=CC2C=O.*c1cccc2c1C=CCC2=O.*c1cccc2c1CC=C2C(=O)O.N#N.O 0.000 description 1
- KGWYICAEPBCRBL-UHFFFAOYSA-N 1h-indene-1-carboxylic acid Chemical class C1=CC=C2C(C(=O)O)C=CC2=C1 KGWYICAEPBCRBL-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- ZMECRNASHMRXMC-UHFFFAOYSA-N 2-methylphenol naphthalene-1,4-dione diazide Chemical compound C1(=CC=CC=C1O)C.[N-]=[N+]=[N-].[N-]=[N+]=[N-].C1(C=CC(C2=CC=CC=C12)=O)=O ZMECRNASHMRXMC-UHFFFAOYSA-N 0.000 description 1
- ADBSLEULHFGPPZ-UHFFFAOYSA-N CC.CC.CC.CCc1cccc(Cc2cccc(Cc3cccc(C)c3O)c2OS(=O)(=O)c2ccccc2)c1OS(=O)(=O)c1cccc2c1C=CC(=[N+]=[N-])C2=O Chemical compound CC.CC.CC.CCc1cccc(Cc2cccc(Cc3cccc(C)c3O)c2OS(=O)(=O)c2ccccc2)c1OS(=O)(=O)c1cccc2c1C=CC(=[N+]=[N-])C2=O ADBSLEULHFGPPZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical group 0.000 description 1
- 238000007233 catalytic pyrolysis Methods 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- LAXIOTUSRGRRNA-UHFFFAOYSA-N cyclopenta-1,3-diene nickel Chemical compound [Ni].C1C=CC=C1.C1C=CC=C1 LAXIOTUSRGRRNA-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000012983 electrochemical energy storage Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- -1 inter alia Polymers 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- UHKHUAHIAZQAED-UHFFFAOYSA-N phthalocyaninatoiron Chemical compound [Fe].N=1C2=NC(C3=CC=CC=C33)=NC3=NC(C3=CC=CC=C33)=NC3=NC(C3=CC=CC=C33)=NC3=NC=1C1=CC=CC=C12 UHKHUAHIAZQAED-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
- C01B32/162—Preparation characterised by catalysts
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F9/00—Artificial filaments or the like of other substances; Manufacture thereof; Apparatus specially adapted for the manufacture of carbon filaments
- D01F9/08—Artificial filaments or the like of other substances; Manufacture thereof; Apparatus specially adapted for the manufacture of carbon filaments of inorganic material
- D01F9/12—Carbon filaments; Apparatus specially adapted for the manufacture thereof
- D01F9/127—Carbon filaments; Apparatus specially adapted for the manufacture thereof by thermal decomposition of hydrocarbon gases or vapours or other carbon-containing compounds in the form of gas or vapour, e.g. carbon monoxide, alcohols
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/08—Aligned nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30446—Field emission cathodes characterised by the emitter material
- H01J2201/30453—Carbon types
- H01J2201/30469—Carbon nanotubes (CNTs)
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/842—Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
- Y10S977/843—Gas phase catalytic growth, i.e. chemical vapor deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/887—Nanoimprint lithography, i.e. nanostamp
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/895—Manufacture, treatment, or detection of nanostructure having step or means utilizing chemical property
- Y10S977/896—Chemical synthesis, e.g. chemical bonding or breaking
Definitions
- This invention relates to carbon nanotube materials and processes for their preparation.
- the invention relates to patterned aligned carbon nanotube films and to processes for their preparation which involve the use of photoresist materials.
- the invention also relates to the construction of devices from such materials for practical applications in many areas including as electron field emitters, artificial actuators, chemical sensors, gas storages, molecular-filtration membranes, energy-absorbing materials, molecular transistors and other optoelectronic devices.
- Carbon nanotubes usually have a diameter in the order of tens of angstroms and the length of up to several micrometers. These elongated nanotubes consist of carbon hexagons arranged in a concentric manner with both ends of the tubes normally capped by pentagon-containing, fullerene-like structures. They can behave as a semiconductor or metal depending on their diameter and helicity of the arrangement of graphitic rings in the walls, and dissimilar carbon nanotubes may be joined together allowing the formation of molecular wires with interesting electrical, magnetic, nonlinear optical, thermal and mechanical properties. These unusual properties have led to diverse potential applications for carbon nanotubes in material science and nanotechnology.
- carbon nanotubes have been proposed as new materials for electron field emitters in panel displays, single-molecular transistors, scanning probe microscope tips, gas and electrochemical energy storages, catalyst and proteins/DNA supports, molecular-filtration membranes, and energy-absorbing materials (see, for example: M. Dresselhaus, et al., Phys. World, January, 33, 1998; P. M. Ajayan, and T. W. Ebbesen, Rep. Prog. Phys., 60, 1027, 1997; R. Dagani, C & E News, January 11, 31, 1999).
- Carbon nanotubes synthesised by most of the common techniques, such as arc discharge (Iijima, S. Nature 354, 56-58, 1991; Ebbesen, T. W. & Ajayan, P. M. Nature 358, 220-222, 1992) and catalytic pyrolysis (See, for example: Endo. M et al. J. Phys. Chem. Solids 54, 1841-1848, 1994; Ivanov. V. et al., Chem. Phys. Let.
- arc discharge Iijima, S. Nature 354, 56-58, 1991
- Ebbesen T. W. & Ajayan, P. M. Nature 358, 220-222, 1992
- catalytic pyrolysis See, for example: Endo. M et al. J. Phys. Chem. Solids 54, 1841-1848, 1994; Ivanov. V. et al., Chem. Phys. Let.
- aligned carbon nanotubes have recently been prepared either by post-synthesis manipulation (see, for example: Aegean, P. M., et al., Science 265, 1212-1214, 1994; De Heer, W. A. et al. Science 268, 845-847, 1995) or by synthesis-induced alignment (see, for example: W. Z. Li, Science, 274, 1701, 1996; Che, G., Nature, 393, 346, 1998; Z. G. Ren, et al., Science, 282, 1105, 1998; C. N., Rao, et al., J. C. S., Chem. Commun, 1525, 1998).
- the present invention provides a process for preparing a patterned layer of aligned carbon nanotubes on a substrate including:
- this photolithographic patterning method together with a novel contact printing transfer technique, allows the pattern formation of aligned carbon nanotubes on various substrates at a micrometer/submicrometer resolution.
- the technique provides a route to patterned formations of aligned carbon nanotubes which have not been achievable according to methods described in the prior art.
- the process according to the present invention is easy to perform and provides a convenient route to patterned aligned carbon nanotubes with controllable geometries.
- photoresist is used herein in its broadest sense to refer to any organic material capable of polymerising or otherwise transforming upon exposure to electromagnetic radiation such that, upon exposure, its solubility characteristics are changed relative to unexposed material.
- photoresponsive materials include, but are not limited to, diazonaphthoquinone (DNQ)-based photoresists, such as cresol novolac resin (from Shipley), Ozatec PK 14 (from Hoechst), as well as other possible polymers including, inter alia, epoxy resins, polyanilines, polymethyl methacrylate, polystyrenes, and polydienes.
- DNQ diazonaphthoquinone
- cresol novolac resin from Shipley
- Ozatec PK 14 from Hoechst
- other possible polymers including, inter alia, epoxy resins, polyanilines, polymethyl methacrylate, polystyrenes, and polydienes.
- the base insoluble resin is transformed into a base soluble entity following exposure to light.
- the substrate to which the photoresist layer is applied can be any substrate which is capable of withstanding the pyrolysis or CVD (chemical vapour deposition) conditions employed, for nanotube growth and which is capable of supporting aligned carbon nanotube growth.
- suitable substrates include all types of glass that provide sufficient thermal stability according to the synthesis temperature applied, such as quartz glass, as well as alumina, graphite, mica, mesaporous silica, silicon water, nanoporous alumina or ceramic plates.
- the substrate is glass, in particular, quartz glass or silicon water.
- the substrate may also include a coating of a material which is capable of supporting carbon nanotube growth under the conditions employed.
- the coating may be of any metal, metaloxide, metal alloy or compound thereof, which may have conducting or semiconducting properties.
- suitable metals include Au, Pt, Cu, Cr, Ni, Fe, Co and Pd.
- suitable compounds are metal oxides, metal carbides, metal nitrides, metal sulfides and metal borides.
- suitable metal oxides include indium tin oxide (ITO), Al 2 O 3 , TiO 2 and MgO.
- Examples of semiconducting materials include gallium arsenide, aluminium arsenide, aluminium sulphide and gallium sulphide.
- the patterning of the aligned carbon nanotubes is achieved by creating a region on the substrate which is incapable of supporting nanotube growth.
- the pattern is created on the substrate by applying an appropriate mask to the photoresist layer such that part of the photoresist layer is capable of being exposed to electromagnetic radiation, while the remaining photoresist layer is substantially shielded from such electromagnetic radiation.
- the patterning of the subsequently synthesised aligned carbon nanotube layer will be defined by the positive or negative of the mask.
- One suitable mask is a quartz plate coated with a thin layer of metal micropatterns, where the regions covered by the thin metal layer are opaque while the uncovered areas are transparent to a photo-irradiation beam.
- the photomask may be applied to the photoresist layer by physical pressing.
- the photoresist coated substrate is subjected to electromagnetic radiation to transform the exposed region of the photoresist.
- the transformation which is undergone by the photoresist will depend on the nature and properties of the photoresist. Accordingly the transformation may represent a polymerisation, an oxidation, or other chemical transformation of the photoresist material.
- the transformation should be specific to the exposed region, should result in a change in solubility characteristics relative to the unexposed photoresist, and should be sufficiently permanent to enable selective solubilisation of the exposed or the unexposed photoresist.
- the electromagnetic radiation used to irradiate the exposed photoresist will depend on the nature of the photoresist material used, however for most applications the electromagnetic radiation will be UV radiation.
- the photoresist layer is then developed by contact with a solvent which is capable of dissolving the portion of the photoresist layer which is to later support growth of aligned carbon nanotubes into the desired pattern. This will be either the exposed (transformed) region or the unexposed (untransformed) region.
- the contact with the solvent should be such that the non-dissolved region of the photoresist remains attached to the substrate.
- the nature of the solvent used will depend on the type of photoresist utilised and the nature of the transformation which it undergoes on exposure to electromagnetic radiation.
- cresol novolac resin which is base insoluble
- exposure to UV radiation produces a carboxylic acid moiety which is soluble in base.
- a suitable base such as an alkali metal hydroxide, ammonium hydroxide, tetramethylammonium hydroxide or other organic bases.
- a solvent can be selected which dissolves the unexposed region of the photoresist, such as ethylene glycol, butanediol, dimethyl ether, diethyl ether, methyl ethyl ether, acetone, methyl ethyl ketone, and similar solvents.
- polar solvents such as water, ethanol, methanol, acetone and the like on the one hand
- non-polar solvents such as benzene, toluene and the like on the other hand.
- a person skilled in the art would be readily able to select a suitable solvent to dissolve the desired region of the photoresist.
- the next step in the process involves the synthesis of a layer of aligned carbon nanotubes on the region of the substrate from which the photoresist has been dissolved. This may be achieved using a suitable technique for the synthesis of perpendicularly aligned carbon nanotubes.
- the aligned carbon nanotubes are prepared by pyrolysis of a carbon-containing material in the presence of a suitable catalyst for nanotube formation.
- the carbon-containing material may be any compound or substance which includes carbon and which is capable for forming carbon nanotubes when subjected to pyrolysis in the presence of a suitable catalyst.
- suitable carbon-containing materials include alkanes, alkenes, alkynes or aromatic hydrocarbons and their derivatives, for example methane, acetylene, benzene, organometallic compounds of transition metals, for example transition metal phthalocyanines, such as Fe(II) phthalocyanine, and metallocenes such as ferocene and nickel dicyclopentadiene and any other suitable evaporable metal complex.
- the catalyst may be any compound, element or substance suitable for catalysing the conversion of a carbon-containing material to aligned carbon nanotubes under pyrolytic conditions.
- the catalyst may be a transition metal, such as Fe, Co, Al, Ni, Mn, Pd, Cr or alloys thereof in any suitable oxidation state.
- the catalyst may be incorporated into the substrate or may be included in the carbon-containing material.
- carbon-containing materials which include a transition metal catalyst are Fe(II) phthalocyanine, Ni(II) phthalocyanine and ferrocene.
- the pyrolysis condition employed will depend on the type of carbon-containing material employed and the type of catalyst, as well as the length and density of the nanotubes required. In this regard it is possible to vary the pyrolysis conditions, such as the temperature, time, pressure or flow rate through the pyrolysis reactor, to obtain nanotubes having different characteristics.
- performing the pyrolysis at a higher temperature may produce nanotubes having different base-end structures relative to those prepared at a lower temperature.
- the pyrolysis will generally be performed with a temperature range of 500° C. to 1100° C.
- lowering the flow rate through a flow-type pyrolysis reactor may result in a smaller packing density of the nanotubes and vice versa.
- a person skilled in the art would be able to select and control the conditions of pyrolysis to obtain nanotubes having the desired characteristics.
- the photoresist material remaining on the substrate may be dissociated from the carbon nanotubes. This may be achieved using a solvent capable of dissolving the remaining photoresist layer. Alternatively it is possible to disassociate the carbon nanotubes from the substrate by transferring the patterned carbon nanotube layer to another substrate.
- This other substrate may be another substrate capable of supporting carbon nanotube growth, or may be a metal, metal oxide, semi-conductor material or a polymer.
- suitable polymers include adhesive coated polymers such as cellulose tape, conjugated (conducting) polymers, temperature/pressure responsive polymers, bioactive polymers and engineering resins.
- the patterned layer of aligned carbon nanotubes is transferred to another substrate which is capable of supporting carbon nanotube growth
- it is possible to form a hetero-structured nanotube film by subjecting the nanotube coated substrate to conditions for promoting aligned carbon nanotube growth.
- the conditions of nanotube formation may be controlled or adjusted such that the length of the further nanotubes is different to the length of the nanotubes making up the original patterned layer.
- This second layer of nanotubes will tend to grow in the spaces defined by the original patterned layer. It may also be possible to adjust conditions such that there is some further nanotube growth on top of the original patterned layer.
- the nanotube patterns on quartz plates may also be separated from the substrate, while retaining the integrity of the pattern by immersing the sample in an aqueous hydrofluoric acid solution (10-40% w/w) for an appropriate period.
- the patterned carbon nanotube film may be incorporated into a multilayer structure including layers of other materials, such as metals, metal oxides, semiconductor materials or polymers.
- the patterned carbon nanotube film prepared in accordance with the present invention and the devices including these patterned films represent further aspects of the present invention.
- the patterned film prepared in accordance with any one of the processes of the present invention and devices, materials coated with or including these multilayer films represent further aspects of the present invention.
- the invention allows the preparation of a large variety of patterned films and structures.
- the processes of the present invention and the patterned structures formed may have use in the following applications:
- FIG. 1 is a diagrammatic representation of a pyrolysis flow reactor suitable for preparing aligned carbon nanotubes.
- FIG. 2 a is a scanning electron microscopic image of aligned carbon nanotubes on a quartz glass substrate.
- FIG. 2 b is a high resolution transmission electron microscopic image of an individual carbon nanotube.
- FIG. 3 is a schematic diagram showing the stages involved in the preparation of a patterned layer of aligned carbon nanotubes according to the embodiment of the invention.
- FIG. 4 is a scanning electron microscopic image of a patterned layer of aligned carbon nanotubes.
- FIG. 2 a represents a typical scanning electron microscopic (SEM, XL-30 FEG SEM, Philips, at 5 KV) image of the carbon nanotubes, showing that the as-synthesised nanotubes align almost normal to the substrate surface.
- the aligned nanotubes are densely packed with a fairly uniform tubular length of ca. 25 ⁇ m.
- the length of the aligned nanotubes can be varied over a wide range (from a few to several tens of micrometers) in a controllable fashion by changing the experimental conditions (e.g. the pyrolysis time, flow rate).
- a well-graphitised structure with ca. 40 concentric carbon shells and an outer diameter of ca. 40 nm is illustrated in the high resolution transmission electron microscopic HR-TEM, CM30, Philips, at 300 KV) image of an individual nanotube (FIG. 2 b ).
- cresol novolac resin was used as a positive photoresist.
- the indene carboxylic acid derivative of the photoresist formed in regions exposed to UV is base soluble while the unexposed photoresist remains to be insoluble under the same conditions.
- the steps involved in forming the pattern are shown schematically in FIG. 3.
- a photoresist solution was prepared by dissolving 30 g of naphthoquinone diazid-cresol novolac resin in 100 mL ethoxy ethyl acetate. Spin-casting of the photoresist solution onto a quartz glass plate resulted in the formation of a photoresist coating, which was baked in an oven at 80° C. for 10 min.
- the resultant dry photoresist layer (0.2 ⁇ m thick) was then exposed through a photomask to EIMAC, VARIAN R150-8 at a lamp-sample distance of 111 cm for 30 sec.
- the photoresist was then developed in a 1% sodium hydroxide solution for 8 sec. After rinsing with distilled water, the photoresist patterned quartz plate was further baked at 80° C. for 10 min.
- the photoresist prepatterned quartz plate prepared in Example 2 was used for growing the aligned nanotubes in accordance with the process described in Example 1.
- the aligned nanotube pattern thus prepared is shown in FIG. 4, the nanotube pattern showing a close replication of the photomask structure.
- aligned nanotube bundles at a submicrometer scale are clearly evident.
Abstract
Description
Claims (35)
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AUPQ0649A AUPQ064999A0 (en) | 1999-05-28 | 1999-05-28 | Patterned carbon nanotube films |
AUPQ0649 | 1999-05-28 | ||
PCT/AU2000/000549 WO2000073203A1 (en) | 1999-05-28 | 2000-05-25 | Patterned carbon nanotube films |
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US6811957B1 true US6811957B1 (en) | 2004-11-02 |
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US09/979,793 Expired - Lifetime US6811957B1 (en) | 1999-05-28 | 2000-05-25 | Patterned carbon nanotube films |
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US (1) | US6811957B1 (en) |
EP (1) | EP1200341B1 (en) |
JP (1) | JP2003500324A (en) |
AU (1) | AUPQ064999A0 (en) |
WO (1) | WO2000073203A1 (en) |
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EP1200341A1 (en) | 2002-05-02 |
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