US6581625B1 - Liquid supply system, method for cleaning the same and vaporizer - Google Patents

Liquid supply system, method for cleaning the same and vaporizer Download PDF

Info

Publication number
US6581625B1
US6581625B1 US09/533,439 US53343900A US6581625B1 US 6581625 B1 US6581625 B1 US 6581625B1 US 53343900 A US53343900 A US 53343900A US 6581625 B1 US6581625 B1 US 6581625B1
Authority
US
United States
Prior art keywords
vaporizer
pump
liquid
supply system
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/533,439
Inventor
Mayumi Arai
Yoshiyuki Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MKS Japan Inc
Original Assignee
MKS Japan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MKS Japan Inc filed Critical MKS Japan Inc
Assigned to MKS JAPAN, INC. reassignment MKS JAPAN, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARAI, MAYUMI, YAMAZAKI, TOSHIYUKI
Priority to US10/364,357 priority Critical patent/US6715507B2/en
Application granted granted Critical
Publication of US6581625B1 publication Critical patent/US6581625B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0325—Control mechanisms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0357—For producing uniform flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0402—Cleaning, repairing, or assembling
    • Y10T137/0419—Fluid cleaning or flushing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245—Cleaning or steam sterilizing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245—Cleaning or steam sterilizing
    • Y10T137/4259—With separate material addition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/6416—With heating or cooling of the system
    • Y10T137/6606—With electric heating element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7759—Responsive to change in rate of fluid flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86131—Plural
    • Y10T137/86163—Parallel

Definitions

  • the present invention relates to a liquid supply system which can be used in a process for manufacturing semiconductors and a method for cleaning the liquid supply system.
  • the present invention is also concerned with a vaporizer used in the liquid supply system.
  • DLI Direct Liquid Injection
  • a system conducting DLI for supply of a liquid there can be mentioned the systems disclosed in an article written by the present inventor titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD., Unexamined Japanese Patent Application Public Disclosure (Kokai) No. 5-253402 and U.S. Pat. Nos. 5,361,800 and 5,371,828.
  • the present invention has been made. It is an object of the present invention to provide a liquid supply system by use of which an appropriate time for maintenance can be estimated and the state of a supply liquid can be detected. It is another object of the present invention to provide a liquid supply system which enables appropriate maintenance and a method for cleaning the liquid supply system. It is a further object of the present invention to provide a vaporizer used in the liquid supply system.
  • a liquid supply system comprising:
  • a first pump for delivering a liquid under high pressure
  • a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber;
  • a pressure gage is provided in the passage and a monitor device is provided so as to indicate a pressure, based on an output of the pressure gage.
  • the pressure in the passage from the first pump to the vaporizer is monitored so as to estimate the amount of decomposition products accumulated in the vaporizer. Therefore, it is possible to estimate the time for cleaning or the time for maintenance.
  • the present invention also provides a liquid supply system comprising:
  • a first pump for delivering a liquid under high pressure
  • a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber;
  • a liquid flowmeter is provided in the passage and a monitor device is provided so as to indicate a flow rate, based on an output of the liquid flowmeter.
  • the flow rate of the fluid in the passage from the first pump to the vaporizer is monitored, to thereby enable detection of clogging of the vaporizer or a defect in the pump.
  • the present invention further provides a liquid supply system comprising:
  • a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber,
  • liquid supply system further comprises:
  • a solvent supply system for supplying a solvent for cleaning or a cleaning liquid, the solvent supply system including a second pump for delivering the solvent or the cleaning liquid under high pressure;
  • a gas supply system for introducing a gas into the first pump and the vaporizer, the gas supply system including a flow rate controller;
  • the system can be cleaned by filling the first pump and the vaporizer with the solvent or the cleaning liquid and introducing the gas into the first pump and the vaporizer through the flow rate controller.
  • the present invention further provides a method for cleaning a liquid supply system, the liquid supply system comprising a first pump for delivering a liquid under high pressure and a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber, the method comprising the steps of:
  • cleaning can be conducted by introducing bubbles into the solvent or the cleaning liquid.
  • the present invention further provides a vaporizer comprising:
  • a pipe having a hollow structure and having apertures for permitting radial outflow of a liquid, the pipe extending through the aperture of each disk so as to form a stack of disks;
  • a resilient member for applying a biasing force so as to bias the plurality of disks
  • the liquid in the pipe being adapted to be delivered from the apertures to spaces between the disks and vaporized in the spaces between the disks,
  • the vaporizer further comprises structure for removing the bias of the resilient member relative to the plurality of disks by applying a force against the biasing force by virtue of fluid control.
  • FIG. 1 shows an arrangement of a liquid supply system according to an embodiment of the present invention.
  • FIG. 2 shows an arrangement of a vaporizer used in the liquid supply system according to the embodiment of the present invention.
  • FIG. 3 shows a monitor display indicating a flow rate in the liquid supply system according to the embodiment of the present invention.
  • FIG. 4 shows an arrangement of a vaporizer used in a liquid supply system according to another embodiment of the present invention.
  • FIG. 1 shows an arrangement of a liquid supply system, according to an embodiment of the present invention.
  • a liquid to be vaporized and supplied to a reaction chamber is stored in a reservoir 1 .
  • Valves VM 1 to VM 3 are connected to the reservoir 1 .
  • the valves VM 1 to VM 3 are opened and closed appropriately according to the condition of the reservoir 1 .
  • valves VM 1 and VM 2 When the reservoir 1 is in a condition for use, the valves VM 1 and VM 2 are open while the valve VM 3 is closed.
  • a regulator RG 1 is connected to the inlet side of the valves VM 1 and VM 3 .
  • High-pressure air supplied from an air supply source (not shown) is adjusted to a predetermined pressure by the regulator RG 1 and is supplied through the valve VM 1 to the reservoir 1 .
  • a valve V 3 is connected to the outlet side of the valves VM 2 and VM 3 and a pump 2 is connected to the outlet of the valve V 3 .
  • the pump 2 use is made of a pump disclosed in each of the above-mentioned documents, that is, the article written by the present inventor [titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD.], Kokai No. 5-253402 and U.S. Pat. Nos. 5,361,800 and 5,371,828.
  • the pump 2 is controlled by a controller 3 and delivers the liquid under high pressure.
  • a liquid flowmeter 4 is connected to the delivery side of the pump 2 through a three-way valve V 5 .
  • a flowmeter called a flow monitor manufactured and sold by MKS, JAPAN, INC. can be used.
  • a liquid flowmeter having the same mechanism as a flow rate detector of a type having no liquid-contact portion (having no portion which makes contact with a liquid) can be used.
  • Such a liquid flowmeter is disclosed in U.S. Pat. No. 5,741,968 for an invention of the present inventor.
  • An output of the liquid flowmeter 4 is supplied to a monitor device 5 which in turn indicates a flow rate of the liquid, based on the output of the liquid flowmeter 4 .
  • a vaporizer 6 is connected through a valve V 6 to the outlet of the liquid flowmeter 4 .
  • the inlet side of the vaporizer 6 is connected to a pressure gage 7 for detecting a pressure of the liquid in a passage from the pump 2 to the vaporizer 6 .
  • a pressure gage 7 for example, a strain gage can be used.
  • An output of the pressure gage 7 is supplied to a monitor device 8 which in turn indicates the liquid pressure, based on an output of the pressure gage 7 .
  • a vaporizer disclosed in each of the above-mentioned documents [the article written by the present inventor titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD., Kokai No. 5-253402 and U.S. Pat. Nos. 5,361,800 and 5,371,828] may be used.
  • the vaporizer 6 in this embodiment has an arrangement such as shown in FIG. 2 .
  • the liquid is introduced from an inlet 21 into a casing 20 and vaporized.
  • the resultant vapor is supplied from an outlet 22 to a reaction chamber.
  • the liquid from the inlet 21 flows through a flow passage extending from a one-way valve 23 through a connecting portion 24 to a pipe 25 having a hollow structure.
  • the pipe 25 includes apertures for permitting radial outflow of the liquid.
  • the one-way valve 23 is opened by supplying air from an air supply passage 26 to a gap 28 . Under pressure of the supplied air, a cylinder 29 is moved against a biasing force of a spring 27 in a direction for opening an orifice in the one-way valve 23 .
  • the pipe 25 is provided within a fit block 31 in a vaporizing chamber 30 .
  • the pipe 25 extends through the center apertures of a plurality of disks 32 , so as to form a stack of the disks 32 .
  • the disks 32 are the same as the disks shown in FIG. 3 in the above-mentioned article written by the present inventor [titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD.].
  • the fit block 31 is biased toward the disks 32 by a spring 33 , to thereby maintain extremely narrow spaces between the disks.
  • Base blocks 34 and 35 are disposed so as to surround the vaporizing chamber 30 .
  • Heaters 37 which generate heat by receiving electric power supplied from a connector 36 are provided in the base blocks 34 and 35 . When the heaters 37 generate heat, the base blocks 34 and 35 are heated and the disks 32 are also heated. Consequently the liquid in the pipe 25 is forced through the apertures of the pipe 25 into the spaces between the disks 32 and the liquid is vaporized in the spaces between the disks 32 .
  • the resultant vapor is supplied from the vaporizing chamber 30 through the outlet 22 to the reaction chamber.
  • the outlet 22 is connected to a valve V 9 shown in FIG. 1 . Therefore, the vapor is supplied through the valve V 9 to the reaction chamber.
  • the vaporizer 6 is adapted to receive a diluting gas.
  • the diluting gas is introduced into a cavity 38 formed in the base block 34 .
  • the diluting gas is supplied to the vaporizer 6 through a flow rate control device 9 and a valve V 7 shown in FIG. 1 . Further, the vapor can be vented through the cavity 38 formed in the base block 34 . In FIG. 1, the vapor is vented for disposal through a valve V 8 .
  • the three-way valve V 5 is connected to a pump 10 and a valve V 10 .
  • the pump 10 has the same structure as the pump 2 and is controlled by a controller 11 so as to deliver a liquid under high pressure.
  • a solvent for cleaning or a cleaning liquid, which is to be supplied to the pump 2 and the vaporizer 6 is stored in a reservoir 12 .
  • Valves VM 11 to VM 13 are connected to the reservoir 12 .
  • the valves VM 11 to VM 13 are opened and closed appropriately according to the condition of the reservoir 12 .
  • the valves VM 11 and VM 12 are open while the valve VM 13 is closed.
  • a regulator RG 2 is connected to the inlet side of the valves VM 11 and VM 13 .
  • High-pressure air from the air supply source (not shown) is adjusted to a predetermined pressure by the regulator RG 2 and supplied through the valve VM 11 to the reservoir 12 .
  • a valve V 11 is connected to the outlet side of the valves VM 12 and VM 13 .
  • the pump 10 is connected to the outlet of the valve V 11 .
  • the line from the air supply source to the inlet of the pump 10 provides a solvent supply system for supplying the solvent for cleaning or the cleaning liquid.
  • a flow rate control device 13 is connected to the valve V 10 .
  • High-pressure air from the air supply source (not shown) is adjusted to a predetermined pressure by a regulator RG 3 and supplied to the flow rate control device 13 .
  • the line from the air supply source to the flow rate control device 13 provides a gas supply system.
  • a valve V 4 and the valves V 10 and V 11 are closed, so that the solvent supply system and the gas supply system are not involved in an operation of the liquid supply system.
  • the liquid from the reservoir 1 is pressurized and delivered to the vaporizer 6 by the pump 2 .
  • the liquid is vaporized in the vaporizer 6 , and the resultant vapor is supplied to the reaction chamber.
  • the output of the liquid flowmeter 4 is supplied to the monitor device 5 .
  • the monitor device 5 indicates the flow rate of the liquid, based on the output of the liquid flowmeter 4 .
  • By monitoring the flow rate in the passage from the pump 2 to the vaporizer 6 by the monitor device 5 it is possible to detect clogging of the vaporizer 6 or a defect in the pump 2 . That is, when the flow rate lowers during normal operation of the system, it is considered that the flow rate lowers due to clogging of the vaporizer 6 or that an appropriate flow rate cannot be obtained due to a defect in the pump 2 .
  • a countermeasure can be taken by inspecting the pump 2 and the vaporizer 6 and effecting appropriate maintenance such as cleaning.
  • the monitor device 5 it is preferred to use a device capable of indicating a variation in flow rate with time, because such device enables detection of a pulsating flow due to a change in viscosity of the liquid and therefore enables detection of deterioration of the liquid.
  • a device capable of indicating a graph such as shown in FIG. 3 in which the abscissa indicates the time and the ordinate indicates the flow rate. In this arrangement, when it is observed that lowering of the flow rate occurs at certain time intervals as shown in FIG.
  • the time of lowering of the flow rate in FIG. 3 corresponds to the time between the end of a stroke for delivery of one piston in the pump 2 and the start of a stroke for delivery of the other piston in the pump 2 .
  • the monitor 5 should indicate data corresponding to a sufficient time to determine the cycle of lowering of the flow rate.
  • the amount of decomposition products accumulated in the vaporizer 6 can be estimated so as to determine an appropriate time for cleaning or maintenance. That is, when the liquid pressure becomes high during normal operation, accumulation of decomposition products in the vaporizer 6 can be expected, so that a countermeasure such as cleaning or maintenance can be taken.
  • the system For cleaning the liquid supply system, the system is stopped, and the valve V 3 is closed and the valves V 4 and V 11 are opened. Consequently, the solvent or the cleaning liquid is introduced through the pump 10 into the pump 2 and the vaporizer 6 , to thereby fill the pump 2 and the vaporizer 6 with the solvent or the cleaning liquid. Subsequently, the valve V 11 is closed and the valve V 10 is opened, so that air is introduced through the flow rate control device 13 into the pump 2 and the vaporizer 6 , to thereby conduct cleaning.
  • the liquid supply system can be cleaned by introducing bubbles into the solvent or the cleaning liquid filling the pump 2 and the vaporizer 6 . Therefore, cleaning can be conducted vigorously as compared to cleaning simply by using the solvent or the cleaning liquid, so that cleaning can be effectively conducted.
  • a vaporizer 6 A such as shown in FIG. 4 may be used.
  • the vaporizer 6 A enables more effective cleaning than the vaporizer 6 .
  • the arrangement for biasing the disks 32 differs from that in the vaporizer 6 .
  • a block 43 is biased toward the disks 32 by a spring 42 .
  • the outlet 22 faces in a radial direction relative to the disks 32 .
  • No spring is provided within a fit block 31 A in the vaporizing chamber 30 .
  • a portion protruding from a block 46 is received in a stepped portion of a base block 35 A surrounding the vaporizing chamber 30 .
  • a bellows 44 is provided in the protruding portion of the block 46 .
  • a platy portion 45 is connected to the bellows 44 .
  • the platy portion 45 is pressed by a cylinder 41 connected to the block 43 which is biased by the spring 42 , so that the fit block 31 A is biased toward the disks 32 by the spring 42 , to thereby maintain extremely narrow spaces between the disks.
  • air is supplied from an air supply passage 47 to a gap 48 .
  • the block 43 and the cylinder 41 are moved toward the spring 42 under pressure of the supplied air, against the biasing force of the spring 42 .
  • the fit block 31 A is biased toward the disks 32 by the spring 42 , to thereby maintain extremely narrow spaces between the disks.
  • the liquid is vaporized between the spaces between the disks, and the resultant vapor is supplied from the vaporizing chamber 30 through the outlet 22 to the reaction chamber.
  • the pressure in the passage extending from the first pump to the vaporizer can be monitored so as to estimate the amount of decomposition products accumulated in the vaporizer. Therefore, it is possible to estimate the time for cleaning or the time for maintenance.
  • the flow rate of the fluid in the passage extending from the first pump to the vaporizer is monitored, so that clogging of the vaporizer or a defect in the pump can be detected.
  • liquid supply system of the present invention comprising: a solvent supply system including a second pump for delivering a solvent or a cleaning liquid under high pressure; a gas supply system including a flow rate controller for introducing a gas into the first pump and the vaporizer; a passage for introducing the solvent or the cleaning liquid from the solvent supply system into the first pump and the vaporizer so that the first pump and the vaporizer fill with the solvent or the cleaning liquid; and a passage for introducing the gas from the gas supply system into the first pump and the vaporizer, the system can be cleaned by filling the first pump and the vaporizer with the solvent or the cleaning liquid and introducing the gas into the first pump and the vaporizer through the flow rate controller.
  • cleaning is conducted by introducing a solvent or a cleaning liquid into the first pump and the vaporizer so that the first pump and the vaporizer fill with the solvent or the cleaning liquid and introducing a gas into the first pump and the vaporizer through a flow rate controller. Therefore, cleaning can be conducted vigorously by introducing bubbles into the solvent or the cleaning liquid, so that cleaning can be conducted effectively.
  • the resilient member is provided to apply a biasing force so as to bias the stack of disks and maintain extremely narrow spaces between the disks.
  • the bias of the resilient member relative to the disks is removed by application of a force against the biasing force by virtue of fluid control. Therefore, it is possible to conduct cleaning of the vaporizer while expanding the spaces between the disks.

Abstract

The liquid supply system comprises a pump for delivering a liquid under high pressure and a vaporizer for vaporizing the liquid delivered from the pump. The liquid vaporized in the vaporizer is supplied to a reaction chamber. A pressure gage is provided in a passage extending from the pump to the vaporizer. A monitor device is provided so as to indicate a pressure, based on an output of the pressure gage.

Description

BACKGROUND OF THE INVENTION
The present invention relates to a liquid supply system which can be used in a process for manufacturing semiconductors and a method for cleaning the liquid supply system. The present invention is also concerned with a vaporizer used in the liquid supply system.
In recent years, with respect to a process for manufacturing semiconductors, DLI (Direct Liquid Injection) for vaporizing a solution of a solid dissolved in a solvent and supplying the resultant vapor to a system has attracted attention. As a system conducting DLI for supply of a liquid, there can be mentioned the systems disclosed in an article written by the present inventor titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD., Unexamined Japanese Patent Application Public Disclosure (Kokai) No. 5-253402 and U.S. Pat. Nos. 5,361,800 and 5,371,828.
However, due to the supply of liquid by DLI, the above-mentioned systems have problems such as mentioned below. That is, after a certain period of time during use, a solid remains in the system or the state of a solution of the solid dissolved in a solvent changes, thereby adversely affecting the process. Further, with respect to a liquid containing no solid dissolved therein, there is a possibility that a solid component will be produced by thermal decomposition and remain in the system.
SUMMARY OF THE INVENTION
In order to solve the above-mentioned problems accompanying the conventional liquid supply systems, the present invention has been made. It is an object of the present invention to provide a liquid supply system by use of which an appropriate time for maintenance can be estimated and the state of a supply liquid can be detected. It is another object of the present invention to provide a liquid supply system which enables appropriate maintenance and a method for cleaning the liquid supply system. It is a further object of the present invention to provide a vaporizer used in the liquid supply system.
According to the present invention, there is provided a liquid supply system comprising:
a first pump for delivering a liquid under high pressure;
a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber; and
a passage extending from the first pump to the vaporizer,
wherein a pressure gage is provided in the passage and a monitor device is provided so as to indicate a pressure, based on an output of the pressure gage.
By this arrangement, the pressure in the passage from the first pump to the vaporizer is monitored so as to estimate the amount of decomposition products accumulated in the vaporizer. Therefore, it is possible to estimate the time for cleaning or the time for maintenance.
The present invention also provides a liquid supply system comprising:
a first pump for delivering a liquid under high pressure;
a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber; and
a passage extending from the first pump to the vaporizer,
wherein a liquid flowmeter is provided in the passage and a monitor device is provided so as to indicate a flow rate, based on an output of the liquid flowmeter.
By this arrangement, the flow rate of the fluid in the passage from the first pump to the vaporizer is monitored, to thereby enable detection of clogging of the vaporizer or a defect in the pump.
The present invention further provides a liquid supply system comprising:
a first pump for delivering a liquid under high pressure; and
a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber,
wherein the liquid supply system further comprises:
a solvent supply system for supplying a solvent for cleaning or a cleaning liquid, the solvent supply system including a second pump for delivering the solvent or the cleaning liquid under high pressure;
a gas supply system for introducing a gas into the first pump and the vaporizer, the gas supply system including a flow rate controller;
a passage for introducing the solvent or the cleaning liquid from the solvent supply system into the first pump and the vaporizer so that the first pump and the vaporizer fill with the solvent or the cleaning liquid; and
a passage for introducing the gas from the gas supply system into the first pump and the vaporizer.
By this arrangement, the system can be cleaned by filling the first pump and the vaporizer with the solvent or the cleaning liquid and introducing the gas into the first pump and the vaporizer through the flow rate controller.
The present invention further provides a method for cleaning a liquid supply system, the liquid supply system comprising a first pump for delivering a liquid under high pressure and a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, the vapor being adapted to be introduced into a reaction chamber, the method comprising the steps of:
introducing a solvent or a cleaning liquid into the first pump and the vaporizer so that the first pump and the vaporizer fill with the solvent or the cleaning liquid; and
introducing a gas into the first pump and the vaporizer through a flow rate controller.
By this arrangement, cleaning can be conducted by introducing bubbles into the solvent or the cleaning liquid.
The present invention further provides a vaporizer comprising:
a plurality of disks each including an aperture at an central portion thereof;
a pipe having a hollow structure and having apertures for permitting radial outflow of a liquid, the pipe extending through the aperture of each disk so as to form a stack of disks; and
a resilient member for applying a biasing force so as to bias the plurality of disks,
the liquid in the pipe being adapted to be delivered from the apertures to spaces between the disks and vaporized in the spaces between the disks,
wherein the vaporizer further comprises structure for removing the bias of the resilient member relative to the plurality of disks by applying a force against the biasing force by virtue of fluid control.
By this arrangement, the space between the disks can be increased, so that cleaning can be effectively conducted.
The foregoing and other objects, features and advantages of the present invention will be apparent from the following detailed description and appended claims taken in connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows an arrangement of a liquid supply system according to an embodiment of the present invention.
FIG. 2 shows an arrangement of a vaporizer used in the liquid supply system according to the embodiment of the present invention.
FIG. 3 shows a monitor display indicating a flow rate in the liquid supply system according to the embodiment of the present invention.
FIG. 4 shows an arrangement of a vaporizer used in a liquid supply system according to another embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Hereinbelow, referring to the drawings, explanation is made of a liquid supply system, a method for cleaning the liquid supply system and a vaporizer used in the liquid supply system, according to the present invention. In the drawings, the same elements are designated by the same reference numerals and characters, and overlapping explanation is omitted. FIG. 1 shows an arrangement of a liquid supply system, according to an embodiment of the present invention. In this system, a liquid to be vaporized and supplied to a reaction chamber is stored in a reservoir 1. Valves VM1 to VM3 are connected to the reservoir 1. The valves VM1 to VM3 are opened and closed appropriately according to the condition of the reservoir 1. When the reservoir 1 is in a condition for use, the valves VM1 and VM2 are open while the valve VM3 is closed. A regulator RG1 is connected to the inlet side of the valves VM1 and VM3. High-pressure air supplied from an air supply source (not shown) is adjusted to a predetermined pressure by the regulator RG1 and is supplied through the valve VM1 to the reservoir 1.
A valve V3 is connected to the outlet side of the valves VM2 and VM3 and a pump 2 is connected to the outlet of the valve V3. As the pump 2, use is made of a pump disclosed in each of the above-mentioned documents, that is, the article written by the present inventor [titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD.], Kokai No. 5-253402 and U.S. Pat. Nos. 5,361,800 and 5,371,828. The pump 2 is controlled by a controller 3 and delivers the liquid under high pressure.
A liquid flowmeter 4 is connected to the delivery side of the pump 2 through a three-way valve V5. As the liquid flowmeter 4, a flowmeter called a flow monitor manufactured and sold by MKS, JAPAN, INC. can be used. As the liquid flowmeter 4, a liquid flowmeter having the same mechanism as a flow rate detector of a type having no liquid-contact portion (having no portion which makes contact with a liquid) can be used. Such a liquid flowmeter is disclosed in U.S. Pat. No. 5,741,968 for an invention of the present inventor. An output of the liquid flowmeter 4 is supplied to a monitor device 5 which in turn indicates a flow rate of the liquid, based on the output of the liquid flowmeter 4.
A vaporizer 6 is connected through a valve V6 to the outlet of the liquid flowmeter 4. The inlet side of the vaporizer 6 is connected to a pressure gage 7 for detecting a pressure of the liquid in a passage from the pump 2 to the vaporizer 6. As the pressure gage 7, for example, a strain gage can be used. An output of the pressure gage 7 is supplied to a monitor device 8 which in turn indicates the liquid pressure, based on an output of the pressure gage 7.
As the vaporizer 6, a vaporizer disclosed in each of the above-mentioned documents [the article written by the present inventor titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD., Kokai No. 5-253402 and U.S. Pat. Nos. 5,361,800 and 5,371,828] may be used. However, the vaporizer 6 in this embodiment has an arrangement such as shown in FIG. 2.
In the vaporizer 6 in FIG. 2, the liquid is introduced from an inlet 21 into a casing 20 and vaporized. The resultant vapor is supplied from an outlet 22 to a reaction chamber. The liquid from the inlet 21 flows through a flow passage extending from a one-way valve 23 through a connecting portion 24 to a pipe 25 having a hollow structure. The pipe 25 includes apertures for permitting radial outflow of the liquid.
The one-way valve 23 is opened by supplying air from an air supply passage 26 to a gap 28. Under pressure of the supplied air, a cylinder 29 is moved against a biasing force of a spring 27 in a direction for opening an orifice in the one-way valve 23.
The pipe 25 is provided within a fit block 31 in a vaporizing chamber 30. The pipe 25 extends through the center apertures of a plurality of disks 32, so as to form a stack of the disks 32. The disks 32 are the same as the disks shown in FIG. 3 in the above-mentioned article written by the present inventor [titled “Direct Liquid Injection System” in “Keisoku Gijyutsu (Measurement Technology)” Vol. 25, No. 12 (January, 1997) published by JAPAN INDUSTRIAL PUBLISHING CO., LTD.].
The fit block 31 is biased toward the disks 32 by a spring 33, to thereby maintain extremely narrow spaces between the disks. Base blocks 34 and 35 are disposed so as to surround the vaporizing chamber 30. Heaters 37 which generate heat by receiving electric power supplied from a connector 36 are provided in the base blocks 34 and 35. When the heaters 37 generate heat, the base blocks 34 and 35 are heated and the disks 32 are also heated. Consequently the liquid in the pipe 25 is forced through the apertures of the pipe 25 into the spaces between the disks 32 and the liquid is vaporized in the spaces between the disks 32. The resultant vapor is supplied from the vaporizing chamber 30 through the outlet 22 to the reaction chamber. The outlet 22 is connected to a valve V9 shown in FIG. 1. Therefore, the vapor is supplied through the valve V9 to the reaction chamber.
The vaporizer 6 is adapted to receive a diluting gas. The diluting gas is introduced into a cavity 38 formed in the base block 34. The diluting gas is supplied to the vaporizer 6 through a flow rate control device 9 and a valve V7 shown in FIG. 1. Further, the vapor can be vented through the cavity 38 formed in the base block 34. In FIG. 1, the vapor is vented for disposal through a valve V8.
The three-way valve V5 is connected to a pump 10 and a valve V10. The pump 10 has the same structure as the pump 2 and is controlled by a controller 11 so as to deliver a liquid under high pressure. A solvent for cleaning or a cleaning liquid, which is to be supplied to the pump 2 and the vaporizer 6, is stored in a reservoir 12.
Valves VM11 to VM13 are connected to the reservoir 12. The valves VM11 to VM13 are opened and closed appropriately according to the condition of the reservoir 12. When the reservoir 12 is in a condition for use, the valves VM11 and VM12 are open while the valve VM13 is closed. A regulator RG2 is connected to the inlet side of the valves VM11 and VM13. High-pressure air from the air supply source (not shown) is adjusted to a predetermined pressure by the regulator RG2 and supplied through the valve VM11 to the reservoir 12. A valve V11 is connected to the outlet side of the valves VM12 and VM13. The pump 10 is connected to the outlet of the valve V11. The line from the air supply source to the inlet of the pump 10 provides a solvent supply system for supplying the solvent for cleaning or the cleaning liquid.
A flow rate control device 13 is connected to the valve V10. High-pressure air from the air supply source (not shown) is adjusted to a predetermined pressure by a regulator RG3 and supplied to the flow rate control device 13. The line from the air supply source to the flow rate control device 13 provides a gas supply system.
In the liquid supply system arranged as mentioned above, in a normal operative state, a valve V4 and the valves V10 and V11 are closed, so that the solvent supply system and the gas supply system are not involved in an operation of the liquid supply system. In this state, the liquid from the reservoir 1 is pressurized and delivered to the vaporizer 6 by the pump 2. The liquid is vaporized in the vaporizer 6, and the resultant vapor is supplied to the reaction chamber.
The output of the liquid flowmeter 4 is supplied to the monitor device 5. The monitor device 5 indicates the flow rate of the liquid, based on the output of the liquid flowmeter 4. By monitoring the flow rate in the passage from the pump 2 to the vaporizer 6 by the monitor device 5, it is possible to detect clogging of the vaporizer 6 or a defect in the pump 2. That is, when the flow rate lowers during normal operation of the system, it is considered that the flow rate lowers due to clogging of the vaporizer 6 or that an appropriate flow rate cannot be obtained due to a defect in the pump 2. In this case, a countermeasure can be taken by inspecting the pump 2 and the vaporizer 6 and effecting appropriate maintenance such as cleaning.
As the monitor device 5, it is preferred to use a device capable of indicating a variation in flow rate with time, because such device enables detection of a pulsating flow due to a change in viscosity of the liquid and therefore enables detection of deterioration of the liquid. For example, as the monitor device 5, use is made of a device capable of indicating a graph such as shown in FIG. 3 in which the abscissa indicates the time and the ordinate indicates the flow rate. In this arrangement, when it is observed that lowering of the flow rate occurs at certain time intervals as shown in FIG. 3, it is considered that the viscosity of the liquid is high due to evaporation of a solvent in the liquid, dissociation of a solute in the liquid or deterioration of the liquid itself. In this case, a countermeasure can be taken by stopping the operation of the system and conducting, for example, replacement of the liquid in the reservoir 1. The time of lowering of the flow rate in FIG. 3 corresponds to the time between the end of a stroke for delivery of one piston in the pump 2 and the start of a stroke for delivery of the other piston in the pump 2. The monitor 5 should indicate data corresponding to a sufficient time to determine the cycle of lowering of the flow rate.
Further, by monitoring the liquid pressure in the passage from the pump 2 to the vaporizer 6 by the monitor device 8, the amount of decomposition products accumulated in the vaporizer 6 can be estimated so as to determine an appropriate time for cleaning or maintenance. That is, when the liquid pressure becomes high during normal operation, accumulation of decomposition products in the vaporizer 6 can be expected, so that a countermeasure such as cleaning or maintenance can be taken.
For cleaning the liquid supply system, the system is stopped, and the valve V3 is closed and the valves V4 and V11 are opened. Consequently, the solvent or the cleaning liquid is introduced through the pump 10 into the pump 2 and the vaporizer 6, to thereby fill the pump 2 and the vaporizer 6 with the solvent or the cleaning liquid. Subsequently, the valve V11 is closed and the valve V10 is opened, so that air is introduced through the flow rate control device 13 into the pump 2 and the vaporizer 6, to thereby conduct cleaning. By this arrangement, the liquid supply system can be cleaned by introducing bubbles into the solvent or the cleaning liquid filling the pump 2 and the vaporizer 6. Therefore, cleaning can be conducted vigorously as compared to cleaning simply by using the solvent or the cleaning liquid, so that cleaning can be effectively conducted.
In the present invention, a vaporizer 6A such as shown in FIG. 4 may be used. The vaporizer 6A enables more effective cleaning than the vaporizer 6. In the vaporizer 6A, the arrangement for biasing the disks 32 differs from that in the vaporizer 6. In a bias portion 40, a block 43 is biased toward the disks 32 by a spring 42. The outlet 22 faces in a radial direction relative to the disks 32.
No spring is provided within a fit block 31A in the vaporizing chamber 30. A portion protruding from a block 46 is received in a stepped portion of a base block 35A surrounding the vaporizing chamber 30. A bellows 44 is provided in the protruding portion of the block 46. A platy portion 45 is connected to the bellows 44. The platy portion 45 is pressed by a cylinder 41 connected to the block 43 which is biased by the spring 42, so that the fit block 31A is biased toward the disks 32 by the spring 42, to thereby maintain extremely narrow spaces between the disks.
For removing the bias of the spring 42, air is supplied from an air supply passage 47 to a gap 48. The block 43 and the cylinder 41 are moved toward the spring 42 under pressure of the supplied air, against the biasing force of the spring 42.
In the vaporizer 6A arranged as mentioned above, normally, the fit block 31A is biased toward the disks 32 by the spring 42, to thereby maintain extremely narrow spaces between the disks. In this state, as in the case of the vaporizer 6, the liquid is vaporized between the spaces between the disks, and the resultant vapor is supplied from the vaporizing chamber 30 through the outlet 22 to the reaction chamber.
For cleaning the liquid supply system, before the above-mentioned operation for cleaning, air is supplied from the air supply passage 47 into the vaporizer 6A. The air is supplied to the gap 48 and the gap 48 is expanded under pressure of the supplied air. Consequently, the block 43 and the cylinder 41 move against the biasing force of the spring 42, to thereby expand the spaces between the disks. In this state, the vaporizer 6A is filled with the solvent or the cleaning liquid and air is introduced into the solvent or the cleaning liquid in a manner such as mentioned above, to thereby conduct cleaning.
Thus, in the vaporizer 6A, cleaning is conducted by introducing bubbles into the solvent or the cleaning liquid while the spaces between the disks 32 are expanded. Therefore, cleaning of the disks 32 can be effectively conducted.
As has been described above, in the liquid supply system of the present invention, the pressure in the passage extending from the first pump to the vaporizer can be monitored so as to estimate the amount of decomposition products accumulated in the vaporizer. Therefore, it is possible to estimate the time for cleaning or the time for maintenance.
Further, in the liquid supply system of the present invention, the flow rate of the fluid in the passage extending from the first pump to the vaporizer is monitored, so that clogging of the vaporizer or a defect in the pump can be detected.
In the liquid supply system of the present invention comprising: a solvent supply system including a second pump for delivering a solvent or a cleaning liquid under high pressure; a gas supply system including a flow rate controller for introducing a gas into the first pump and the vaporizer; a passage for introducing the solvent or the cleaning liquid from the solvent supply system into the first pump and the vaporizer so that the first pump and the vaporizer fill with the solvent or the cleaning liquid; and a passage for introducing the gas from the gas supply system into the first pump and the vaporizer, the system can be cleaned by filling the first pump and the vaporizer with the solvent or the cleaning liquid and introducing the gas into the first pump and the vaporizer through the flow rate controller.
In the method for cleaning the liquid supply system according to the present invention, cleaning is conducted by introducing a solvent or a cleaning liquid into the first pump and the vaporizer so that the first pump and the vaporizer fill with the solvent or the cleaning liquid and introducing a gas into the first pump and the vaporizer through a flow rate controller. Therefore, cleaning can be conducted vigorously by introducing bubbles into the solvent or the cleaning liquid, so that cleaning can be conducted effectively.
In the vaporizer of the present invention, the resilient member is provided to apply a biasing force so as to bias the stack of disks and maintain extremely narrow spaces between the disks. The bias of the resilient member relative to the disks is removed by application of a force against the biasing force by virtue of fluid control. Therefore, it is possible to conduct cleaning of the vaporizer while expanding the spaces between the disks.

Claims (2)

What is claimed is:
1. A liquid supply system comprising:
a first pump for delivering a liquid under high pressure;
a vaporizer for vaporizing the liquid delivered from said first pump to thereby obtain vapor, with the vapor being adapted to be introduced into a reaction chamber;
a solvent supply system for supplying a solvent for cleaning or a cleaning liquid, with said solvent supply system including a second pump for delivering the solvent or the cleaning liquid under high pressure,
a gas supply system for supplying a gas, with said gas supply system including a flow rate controller for controlling the flow rate of the gas;
a passage for introducing the solvent or the cleaning liquid from said second pump into said first pump and said vaporizer so that said first pump and said vaporizer become filled with the solvent or the cleaning liquid; and
a passage for introducing the gas from said flow rate controller into said first pump and said vaporizer such that the gas mixes with the solvent or the cleaning liquid to form gas bubbles, whereby said first pump and said vaporizer are cleaned in response to vibrations resulting from impulses due to the gas bubbles.
2. A method for cleaning a liquid supply system, the liquid supply system including a first pump for delivering a liquid under high pressure and a vaporizer for vaporizing the liquid delivered from the first pump to thereby obtain vapor, with the vapor being adapted to be introduced into a reaction chamber, said method comprising:
introducing a solvent or a cleaning liquid into said first pump and said vaporizer so that said first pump and said vaporizer become filled with said solvent or said cleaning liquid; and
introducing a gas into said first pump and said vaporizer through a flow rate controller such that the gas mixes with the solvent or the cleaning liquid to form gas bubbles, whereby said first pump and said vaporizer are cleaned in response to vibrations resulting from impulses due to the gas bubbles.
US09/533,439 1999-03-24 2000-03-23 Liquid supply system, method for cleaning the same and vaporizer Expired - Fee Related US6581625B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/364,357 US6715507B2 (en) 1999-03-24 2003-02-12 Vaporizer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/079380 1999-03-24
JP11079380A JP2000271471A (en) 1999-03-24 1999-03-24 Liquid source supplying system and its washing method and vaporizer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/364,357 Division US6715507B2 (en) 1999-03-24 2003-02-12 Vaporizer

Publications (1)

Publication Number Publication Date
US6581625B1 true US6581625B1 (en) 2003-06-24

Family

ID=13688277

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/533,439 Expired - Fee Related US6581625B1 (en) 1999-03-24 2000-03-23 Liquid supply system, method for cleaning the same and vaporizer
US10/364,357 Expired - Fee Related US6715507B2 (en) 1999-03-24 2003-02-12 Vaporizer

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/364,357 Expired - Fee Related US6715507B2 (en) 1999-03-24 2003-02-12 Vaporizer

Country Status (2)

Country Link
US (2) US6581625B1 (en)
JP (1) JP2000271471A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050183771A1 (en) * 2004-02-20 2005-08-25 Christoph Scholz Apparatus and process for refilling a bubbler
US20070251585A1 (en) * 2006-04-28 2007-11-01 David Paul Edwards Fluid distribution system
US20080302302A1 (en) * 2006-01-24 2008-12-11 Hitachi Kokusai Electric Inc. Substrate Processing System
US20100043276A1 (en) * 2008-08-19 2010-02-25 Eger Jr Joseph Edward Bait materials, pest monitoring devices and other pest control devices that include polyurethane foam
US20110124201A1 (en) * 2007-07-30 2011-05-26 Micron Technology, Inc. Chemical vaporizer for material deposition systems and associated methods
US20120012188A1 (en) * 2010-07-13 2012-01-19 Timothy Frank Matheis Slurry feed system and method
US20120160172A1 (en) * 2010-12-28 2012-06-28 Tokyo Electron Limited Raw material supplying device and film forming apparatus
US20140150890A1 (en) * 2010-10-07 2014-06-05 Boehringer Ingelheim Microparts Gmbh Method For Washing a Microfluidic Cavity
US9289803B1 (en) * 2013-05-24 2016-03-22 Steve A. Parks Dispenser apparatus and method
US10006656B1 (en) 2013-05-24 2018-06-26 Steve A. Parks Dispenser apparatus and method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6953047B2 (en) * 2002-01-14 2005-10-11 Air Products And Chemicals, Inc. Cabinet for chemical delivery with solvent purging
JP4256884B2 (en) * 2006-06-23 2009-04-22 東京エレクトロン株式会社 Raw material liquid supply unit to vaporizer
US8122903B2 (en) 2007-07-26 2012-02-28 Parker-Hannifin Corporation Close-coupled purgeable vaporizer valve

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869301A (en) * 1988-03-05 1989-09-26 Tadahiro Ohmi Cylinder cabinet piping system
US5014727A (en) * 1989-02-27 1991-05-14 Seiichiro Aigo Bubbler device for washing semiconductor materials
US5137047A (en) * 1990-08-24 1992-08-11 Mark George Delivery of reactive gas from gas pad to process tool
US5313982A (en) * 1988-07-08 1994-05-24 Tadahiro Ohmi Gas supply piping device for a process apparatus
US5336356A (en) * 1992-05-22 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Apparatus for treating the surface of a semiconductor substrate
US5361800A (en) 1991-08-28 1994-11-08 Mks Instruments, Inc. Liquid pump and vaporizer
US5440887A (en) * 1991-02-05 1995-08-15 Applied Materials, Inc. Liquid vaporizer-feeder
US5455014A (en) * 1993-07-20 1995-10-03 Hughes Aircraft Company Liquid deposition source gas delivery system
US5488967A (en) * 1993-10-27 1996-02-06 Masako Kiyohara Method and apparatus for feeding gas into a chamber
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US5553188A (en) 1995-02-24 1996-09-03 Mks Instruments, Inc. Vaporizer and liquid delivery system using same
US5660207A (en) * 1994-12-29 1997-08-26 Tylan General, Inc. Flow controller, parts of flow controller, and related method
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5819782A (en) * 1996-01-05 1998-10-13 Ckd Corporation Gas supply unit
US5826607A (en) * 1996-11-25 1998-10-27 Sony Corporation Dual exhaust controller
US5835677A (en) * 1996-10-03 1998-11-10 Emcore Corporation Liquid vaporizer system and method
US5849091A (en) * 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US5868159A (en) * 1996-07-12 1999-02-09 Mks Instruments, Inc. Pressure-based mass flow controller
US5966499A (en) * 1997-07-28 1999-10-12 Mks Instruments, Inc. System for delivering a substantially constant vapor flow to a chemical process reactor
US6019114A (en) * 1997-02-12 2000-02-01 Icon Dynaamics, Llc Self-metering reservoir
US6065481A (en) * 1997-03-26 2000-05-23 Fsi International, Inc. Direct vapor delivery of enabling chemical for enhanced HF etch process performance
US6068016A (en) * 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
US6132515A (en) * 1998-03-12 2000-10-17 Cosmos Factory, Inc. Liquid precursor delivery system
US6216708B1 (en) * 1998-07-23 2001-04-17 Micron Technology, Inc. On-line cleaning method for CVD vaporizers
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5249624A (en) * 1992-11-17 1993-10-05 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of National Defence Load-following vaporizer apparatus and method

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869301A (en) * 1988-03-05 1989-09-26 Tadahiro Ohmi Cylinder cabinet piping system
US5313982A (en) * 1988-07-08 1994-05-24 Tadahiro Ohmi Gas supply piping device for a process apparatus
US5014727A (en) * 1989-02-27 1991-05-14 Seiichiro Aigo Bubbler device for washing semiconductor materials
US5137047A (en) * 1990-08-24 1992-08-11 Mark George Delivery of reactive gas from gas pad to process tool
US5440887A (en) * 1991-02-05 1995-08-15 Applied Materials, Inc. Liquid vaporizer-feeder
US5361800A (en) 1991-08-28 1994-11-08 Mks Instruments, Inc. Liquid pump and vaporizer
US5371828A (en) 1991-08-28 1994-12-06 Mks Instruments, Inc. System for delivering and vaporizing liquid at a continuous and constant volumetric rate and pressure
US5437542A (en) 1991-08-28 1995-08-01 Mks Instruments, Inc. Positive displacement pump system
US5336356A (en) * 1992-05-22 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Apparatus for treating the surface of a semiconductor substrate
US5455014A (en) * 1993-07-20 1995-10-03 Hughes Aircraft Company Liquid deposition source gas delivery system
US5488967A (en) * 1993-10-27 1996-02-06 Masako Kiyohara Method and apparatus for feeding gas into a chamber
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US5660207A (en) * 1994-12-29 1997-08-26 Tylan General, Inc. Flow controller, parts of flow controller, and related method
US5553188A (en) 1995-02-24 1996-09-03 Mks Instruments, Inc. Vaporizer and liquid delivery system using same
US5819782A (en) * 1996-01-05 1998-10-13 Ckd Corporation Gas supply unit
US5868159A (en) * 1996-07-12 1999-02-09 Mks Instruments, Inc. Pressure-based mass flow controller
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
US5835677A (en) * 1996-10-03 1998-11-10 Emcore Corporation Liquid vaporizer system and method
US5826607A (en) * 1996-11-25 1998-10-27 Sony Corporation Dual exhaust controller
US6019114A (en) * 1997-02-12 2000-02-01 Icon Dynaamics, Llc Self-metering reservoir
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US6065481A (en) * 1997-03-26 2000-05-23 Fsi International, Inc. Direct vapor delivery of enabling chemical for enhanced HF etch process performance
US6006765A (en) * 1997-06-02 1999-12-28 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US5849091A (en) * 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US5966499A (en) * 1997-07-28 1999-10-12 Mks Instruments, Inc. System for delivering a substantially constant vapor flow to a chemical process reactor
US6068016A (en) * 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
US6132515A (en) * 1998-03-12 2000-10-17 Cosmos Factory, Inc. Liquid precursor delivery system
US6216708B1 (en) * 1998-07-23 2001-04-17 Micron Technology, Inc. On-line cleaning method for CVD vaporizers

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7278438B2 (en) * 2004-02-20 2007-10-09 Cs Clean Systems Ag Apparatus and process for refilling a bubbler
US20050183771A1 (en) * 2004-02-20 2005-08-25 Christoph Scholz Apparatus and process for refilling a bubbler
US8506714B2 (en) * 2006-01-24 2013-08-13 Hitachi Kokusai Electric Inc. Substrate processing system
US20080302302A1 (en) * 2006-01-24 2008-12-11 Hitachi Kokusai Electric Inc. Substrate Processing System
US8641829B2 (en) * 2006-01-24 2014-02-04 Hitachi Kokusai Electric Inc. Substrate processing system
US20070251585A1 (en) * 2006-04-28 2007-11-01 David Paul Edwards Fluid distribution system
US20110124201A1 (en) * 2007-07-30 2011-05-26 Micron Technology, Inc. Chemical vaporizer for material deposition systems and associated methods
US8225745B2 (en) * 2007-07-30 2012-07-24 Micron Technology, Inc. Chemical vaporizer for material deposition systems and associated methods
US8551564B2 (en) 2007-07-30 2013-10-08 Micron Technology, Inc. Chemical vaporizer for material deposition systems and associated methods
US9833001B2 (en) 2008-08-19 2017-12-05 Dow Argosciences Llc Bait materials, pest monitoring devices and other pest control devices that include polyurethane foam
US20100043276A1 (en) * 2008-08-19 2010-02-25 Eger Jr Joseph Edward Bait materials, pest monitoring devices and other pest control devices that include polyurethane foam
US9848605B2 (en) 2008-08-19 2017-12-26 Dow Agrosciences Llc Bait materials, pest monitoring devices and other pest control devices that include polyurethane foam
US8753658B2 (en) 2008-08-19 2014-06-17 Dow Agrosciences, Llc. Bait materials, pest monitoring devices and other pest control devices that include polyurethane foam
US8430112B2 (en) * 2010-07-13 2013-04-30 Siemens Industry, Inc. Slurry feed system and method
US20120012188A1 (en) * 2010-07-13 2012-01-19 Timothy Frank Matheis Slurry feed system and method
US20140150890A1 (en) * 2010-10-07 2014-06-05 Boehringer Ingelheim Microparts Gmbh Method For Washing a Microfluidic Cavity
US9089883B2 (en) * 2010-10-07 2015-07-28 Boehringer Ingelheim International Gmbh Method for washing a microfluidic cavity
TWI506151B (en) * 2010-12-28 2015-11-01 Tokyo Electron Ltd Raw material supplying device and film forming apparatus
US9080238B2 (en) * 2010-12-28 2015-07-14 Tokyo Electron Limited Raw material supplying device and film forming apparatus
US20120160172A1 (en) * 2010-12-28 2012-06-28 Tokyo Electron Limited Raw material supplying device and film forming apparatus
US9289803B1 (en) * 2013-05-24 2016-03-22 Steve A. Parks Dispenser apparatus and method
US10006656B1 (en) 2013-05-24 2018-06-26 Steve A. Parks Dispenser apparatus and method

Also Published As

Publication number Publication date
JP2000271471A (en) 2000-10-03
US20030140965A1 (en) 2003-07-31
US6715507B2 (en) 2004-04-06

Similar Documents

Publication Publication Date Title
US6581625B1 (en) Liquid supply system, method for cleaning the same and vaporizer
US5393434A (en) Liquid chromatography method
KR20010022301A (en) System for delivering a substantially constant vapor flow to a chemical process reactor
US20110313639A1 (en) Service bay high pressure common rail injector performance test
US7921702B2 (en) Method for identifying anomalous behaviour of a dynamic system
WO2010077386A1 (en) Hot-melt inkjet printing system
US8047817B2 (en) Cleaning method of a rotary piston vacuum pump
US6205853B1 (en) Method for testing functions of painting apparatus and apparatus for the same
US9097245B2 (en) Method and device for refilling and checking the leak-tightness of a fuel injector
US20030010091A1 (en) System and method for detecting occlusions in a semiconductor manufacturing device
JP4966365B2 (en) Apparatus and method associated with a fuel injection system
JPH1082351A (en) Controlling method and controller for internal combustion engine
JP2009031113A (en) Liquid chromatograph mass spectrometer
CN104990816A (en) Pulse test device
KR200156805Y1 (en) Refrigeration apparatus for semiconductor wafer
KR100478854B1 (en) Apparatus to test pressure for a tube
JP3362302B2 (en) Chemical solution supply device
KR200266364Y1 (en) The real-time gas monitoring device of gas supply system
JP2005052717A (en) Coating solution supply device
JP2002206733A (en) Method and equipment for supplying liquid fuel
KR100625323B1 (en) Semiconductor manufacturing equipment and control method for interlock in hunting
US20080145237A1 (en) Injection pump apparatus
US20030013212A1 (en) System and method for removing deposited material from within a semiconductor fabrication device
US20220363230A1 (en) Electronic brake system and control method therefor
JP2000208005A (en) Hydraulic operation device for power circuit breaker

Legal Events

Date Code Title Description
AS Assignment

Owner name: MKS JAPAN, INC., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ARAI, MAYUMI;YAMAZAKI, TOSHIYUKI;REEL/FRAME:010641/0857

Effective date: 20000307

CC Certificate of correction
FPAY Fee payment

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20110624