US6396293B1 - Self-closing spring probe - Google Patents
Self-closing spring probe Download PDFInfo
- Publication number
- US6396293B1 US6396293B1 US09/253,320 US25332099A US6396293B1 US 6396293 B1 US6396293 B1 US 6396293B1 US 25332099 A US25332099 A US 25332099A US 6396293 B1 US6396293 B1 US 6396293B1
- Authority
- US
- United States
- Prior art keywords
- barrel
- plunger
- spring
- probe
- open end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims abstract description 124
- 230000006835 compression Effects 0.000 claims abstract description 5
- 238000007906 compression Methods 0.000 claims abstract description 5
- 238000002788 crimping Methods 0.000 claims description 38
- 238000005452 bending Methods 0.000 claims description 5
- 230000000717 retained effect Effects 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 39
- 230000003247 decreasing effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Geophysics And Detection Of Objects (AREA)
- Springs (AREA)
- Cable Accessories (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (20)
Priority Applications (18)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/253,320 US6396293B1 (en) | 1999-02-18 | 1999-02-18 | Self-closing spring probe |
GB0021622A GB2351398B (en) | 1999-02-18 | 1999-03-16 | Spring probe |
GB0021623A GB2351399B (en) | 1999-02-18 | 1999-03-16 | Spring probe assemblies |
GB9905858A GB2347023B (en) | 1999-02-18 | 1999-03-16 | Spring probe |
GB0021621A GB2356744B (en) | 1999-02-18 | 1999-03-16 | Spring probe |
TW088105387A TW528871B (en) | 1999-02-18 | 1999-04-03 | Spring probe |
EP99302847A EP1037055B1 (en) | 1999-02-18 | 1999-04-13 | Spring probe |
EP04078167A EP1510827B1 (en) | 1999-02-18 | 1999-04-13 | Spring probe |
DE69936893T DE69936893T2 (en) | 1999-02-18 | 1999-04-13 | spring sensor |
DE69930717T DE69930717T2 (en) | 1999-02-18 | 1999-04-13 | spring sensor |
AT99302847T ATE322691T1 (en) | 1999-02-18 | 1999-04-13 | SPRING SENSOR |
AT04078167T ATE370419T1 (en) | 1999-02-18 | 1999-04-13 | SPRING SENSOR |
JP15944299A JP3210645B2 (en) | 1999-02-18 | 1999-06-07 | Spring probe, spring probe assembly and method of assembling them |
US09/614,422 US6462567B1 (en) | 1999-02-18 | 2000-07-12 | Self-retained spring probe |
HK01101340A HK1030455A1 (en) | 1999-02-18 | 2001-02-23 | Spring probe |
HK01104426A HK1033977A1 (en) | 1999-02-18 | 2001-06-27 | Spring probe assemblies |
HK01104425A HK1033976A1 (en) | 1999-02-18 | 2001-06-27 | Spring probe |
HK01105237A HK1035030A1 (en) | 1999-02-18 | 2001-07-27 | Spring probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/253,320 US6396293B1 (en) | 1999-02-18 | 1999-02-18 | Self-closing spring probe |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/614,422 Continuation-In-Part US6462567B1 (en) | 1999-02-18 | 2000-07-12 | Self-retained spring probe |
Publications (1)
Publication Number | Publication Date |
---|---|
US6396293B1 true US6396293B1 (en) | 2002-05-28 |
Family
ID=22959787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/253,320 Expired - Lifetime US6396293B1 (en) | 1999-02-18 | 1999-02-18 | Self-closing spring probe |
Country Status (8)
Country | Link |
---|---|
US (1) | US6396293B1 (en) |
EP (2) | EP1510827B1 (en) |
JP (1) | JP3210645B2 (en) |
AT (2) | ATE322691T1 (en) |
DE (2) | DE69930717T2 (en) |
GB (1) | GB2347023B (en) |
HK (4) | HK1030455A1 (en) |
TW (1) | TW528871B (en) |
Cited By (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6624645B2 (en) * | 1997-11-28 | 2003-09-23 | Fujitsu Limited | Semiconductor device testing method, using a spring-biased transformable conductive member electrode connection |
US20040210140A1 (en) * | 2003-04-15 | 2004-10-21 | Omnisonics Medical Technologies, Inc. | Apparatus and method for preshaped ultrasonic probe |
US20050146341A1 (en) * | 2002-03-05 | 2005-07-07 | Rika Electronics International, Inc | Apparatus for interfacing electronic packages and test equipment |
US20050280433A1 (en) * | 2004-06-16 | 2005-12-22 | Nelson Larre H | Electrical test probes, methods of making, and methods of using |
US20060073710A1 (en) * | 2004-10-06 | 2006-04-06 | Hwang Dong W | Contact for electronic devices |
US20060220666A1 (en) * | 2000-06-16 | 2006-10-05 | Nhk Spring Co. Ltd. | Microcontactor probe assembly |
US20060279301A1 (en) * | 2005-06-10 | 2006-12-14 | Valts Treibergs | Electrical contact probe with compliant internal interconnect |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
US20070128906A1 (en) * | 2004-02-04 | 2007-06-07 | Nhk Spring Co., Ltd. | Needle-like member, conductive contact, and conductive contact unit |
US20070284444A1 (en) * | 2006-06-12 | 2007-12-13 | Hellstrom Sven A | Mobile radio terminal having a multiple form factor memory card reader |
US20080143367A1 (en) * | 2006-12-14 | 2008-06-19 | Scott Chabineau-Lovgren | Compliant electrical contact having maximized the internal spring volume |
US20080278187A1 (en) * | 2007-05-07 | 2008-11-13 | Hongfei Yan | Test pin, method of manufacturing same, and system containing same |
US20090075529A1 (en) * | 2007-09-18 | 2009-03-19 | Johnston Charles J | Spring contact assembly |
US20090278699A1 (en) * | 2008-05-12 | 2009-11-12 | John Vander Horst | Recreational vehicle holding tank sensor probe |
US7677901B1 (en) | 2008-12-26 | 2010-03-16 | Yamaichi Electronics Co., Ltd. | Electric connecting apparatus for semiconductor devices and contact used therefor |
US20100120299A1 (en) * | 2008-11-07 | 2010-05-13 | Kabushiki Kaisha Nihon Micronics | Contact and electrical connecting apparatus |
US20100123476A1 (en) * | 2007-04-27 | 2010-05-20 | Nhk Spring Co., Ltd. | Conductive contact |
US20100159753A1 (en) * | 2008-09-30 | 2010-06-24 | Hon Hai Precision Industry Co., Ltd. | Electrical contact having stamped contact pins movably assembled within enclosure member thereof |
US7794414B2 (en) | 2004-02-09 | 2010-09-14 | Emigrant Bank, N.A. | Apparatus and method for an ultrasonic medical device operating in torsional and transverse modes |
US20100231251A1 (en) * | 2009-03-10 | 2010-09-16 | Nelson John E | Electrically Conductive Pins For Microcircuit Tester |
US20100271061A1 (en) * | 2009-04-27 | 2010-10-28 | Tsugio Yamamoto | Contact probe and socket |
WO2012033802A2 (en) * | 2010-09-07 | 2012-03-15 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
CN102466740A (en) * | 2010-11-12 | 2012-05-23 | 金英杰 | Kelvin test probe of semi-conductor |
TWI426274B (en) * | 2010-06-30 | 2014-02-11 | Leeno Ind Inc | Probe |
US20140091824A1 (en) * | 2012-09-28 | 2014-04-03 | Evan M. Fledell | Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths |
US8723540B2 (en) | 2011-01-17 | 2014-05-13 | Yokowo Co., Ltd. | Contact probe and socket |
US8721372B2 (en) | 2010-02-05 | 2014-05-13 | Kabushiki Kaisha Nihon Micronics | Contact and electrical connecting apparatus |
US8790359B2 (en) | 1999-10-05 | 2014-07-29 | Cybersonics, Inc. | Medical systems and related methods |
US20140340106A1 (en) * | 2013-04-18 | 2014-11-20 | Isc Co., Ltd. | Probe member for pogo pin |
TWI463141B (en) * | 2010-11-17 | 2014-12-01 | Nhk Spring Co Ltd | Contact probe and probe unit |
US9007082B2 (en) | 2010-09-07 | 2015-04-14 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
US9297832B2 (en) | 2010-03-10 | 2016-03-29 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
WO2016128226A1 (en) * | 2015-02-12 | 2016-08-18 | Ptr Messtechnik Gmbh & Co. Kommanditgesellschaft | Method for assembling a component which has a sleeve, a piston with a piston head, and a spring, and component |
US9726693B2 (en) | 2013-04-18 | 2017-08-08 | Isc Co., Ltd. | Probe member for pogo pin |
US10411386B2 (en) | 2014-08-08 | 2019-09-10 | Nhk Spring Co., Ltd. | Connection terminal |
KR20210029667A (en) * | 2019-09-06 | 2021-03-16 | 야마이치 일렉트로닉스 컴퍼니 리미티드 | Contact probe and inspecting socket including the same |
US10976346B2 (en) | 2016-02-29 | 2021-04-13 | Yokowo Co., Ltd. | Socket |
CN112740049A (en) * | 2018-09-26 | 2021-04-30 | 恩普乐股份有限公司 | Contact pin and socket |
US20220137093A1 (en) * | 2018-12-03 | 2022-05-05 | Enplas Corporation | Contact pin and socket |
WO2023049433A1 (en) * | 2021-09-27 | 2023-03-30 | Smiths Interconnect Americas, Inc. | Test socket and probe with stepped collar for semiconductor integrated circuits |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4450397B2 (en) * | 1999-06-03 | 2010-04-14 | 有限会社清田製作所 | Double-end sliding contact probe |
JP4521106B2 (en) * | 2000-09-28 | 2010-08-11 | 日本発條株式会社 | Conductive contact with movable guide plate |
JP2002159913A (en) * | 2000-11-22 | 2002-06-04 | Shin Etsu Polymer Co Ltd | Vibrator with connector and its connecting structure |
JP3767810B2 (en) * | 2001-04-27 | 2006-04-19 | 株式会社ヨコオ | Spring connector |
JP2002350463A (en) * | 2001-05-23 | 2002-12-04 | Sanyu Kogyo Kk | Contact probe |
KR100840834B1 (en) * | 2002-06-05 | 2008-06-23 | 이노우에 쇼지 가부시키가이샤 | Printed wiring board inspection jig |
KR100608232B1 (en) * | 2004-05-17 | 2006-08-03 | 리노공업주식회사 | a probe for electric current of a large quantity |
KR100769891B1 (en) * | 2007-01-25 | 2007-10-24 | 리노공업주식회사 | Contact probe and socket |
WO2010016608A1 (en) * | 2008-08-08 | 2010-02-11 | 日本発條株式会社 | Electric contact member and contact probe |
JP2012112709A (en) * | 2010-11-22 | 2012-06-14 | Unitechno Inc | Kelvin contact probe and kelvin inspection jig having the same |
JP5097968B1 (en) * | 2011-08-02 | 2012-12-12 | 株式会社クローバーテクノロジー | Anisotropic conductive member |
WO2013157033A1 (en) * | 2012-04-17 | 2013-10-24 | ユニテクノ株式会社 | Kelvin contact probe and a kelvin inspection fixture provided with same |
JP2015004614A (en) * | 2013-06-21 | 2015-01-08 | 株式会社ミタカ | Contact probe |
KR101591013B1 (en) * | 2014-09-29 | 2016-02-03 | (주) 네스텍코리아 | Self-Combined Prove Pin |
KR101785605B1 (en) * | 2015-09-24 | 2017-10-17 | (주)엠투엔 | Interconnect structure and probe card having the same |
KR101785591B1 (en) * | 2015-09-24 | 2017-10-17 | (주)엠투엔 | Interconnect structure and probe card having the same |
JP6556612B2 (en) * | 2015-12-04 | 2019-08-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
HUP1700051A2 (en) | 2017-02-02 | 2018-08-28 | Equip Test Kft | Contact device and headunit, and method of contact device and headunit production |
JP6892277B2 (en) * | 2017-02-10 | 2021-06-23 | 株式会社日本マイクロニクス | Probes and electrical connections |
JP6969929B2 (en) * | 2017-08-24 | 2021-11-24 | 株式会社日本マイクロニクス | Probe and its manufacturing method |
JP6889067B2 (en) * | 2017-08-24 | 2021-06-18 | 株式会社日本マイクロニクス | Electrical connection device |
JP6837513B2 (en) * | 2019-05-07 | 2021-03-03 | 株式会社ヨコオ | socket |
CN114223098B (en) * | 2019-10-04 | 2024-04-12 | 株式会社村田制作所 | Probe head |
DE102021120146A1 (en) | 2021-08-03 | 2023-02-09 | F I X T E S T Prüfmittelbau GmbH | contact pin |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1324053A (en) | 1971-09-09 | 1973-07-18 | Carr V | Electrical contact probe |
US3754731A (en) * | 1972-01-18 | 1973-08-28 | Halkey Roberts Corp | Inflation manifold valve and flange assembly |
FR2224757A1 (en) | 1973-04-03 | 1974-10-31 | Cit Alcatel | Probe for printed circuit boards - mounted on subsidiary board in desired spatial arrangement for testing |
US4438397A (en) * | 1979-12-26 | 1984-03-20 | Teradyne, Inc. | Test pin |
JPS6212875A (en) | 1985-07-10 | 1987-01-21 | Mitsubishi Electric Corp | Testing device for digital protecting relay device |
US4701700A (en) | 1985-12-02 | 1987-10-20 | Jenkins Jack E | Captivated, pre-loaded spring means for vacuum displaced circuit board testing |
US4740746A (en) | 1984-11-13 | 1988-04-26 | Tektronix, Inc. | Controlled impedance microcircuit probe |
US4897043A (en) * | 1986-06-23 | 1990-01-30 | Feinmetall Gmbh | Resilient contact pin |
US4904213A (en) | 1989-04-06 | 1990-02-27 | Motorola, Inc. | Low impedance electric connector |
US4935695A (en) | 1988-07-13 | 1990-06-19 | Hewlett-Packard Company | Board alignment system |
JPH04270967A (en) | 1990-06-11 | 1992-09-28 | Internatl Standard Electric Corp | Contact device |
US5174763A (en) | 1990-06-11 | 1992-12-29 | Itt Corporation | Contact assembly |
EP0616394A1 (en) | 1993-03-16 | 1994-09-21 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
US5410260A (en) | 1992-11-09 | 1995-04-25 | Nhk Spring Co., Ltd. | Coil spring-pressed needle contact probe |
US5746606A (en) * | 1996-09-30 | 1998-05-05 | Hughes Electronics | Spring loaded contact device and rotary connector |
US6104205A (en) * | 1998-02-26 | 2000-08-15 | Interconnect Devices, Inc. | Probe with tab retainer |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227718A (en) * | 1992-03-10 | 1993-07-13 | Virginia Panel Corporation | Double-headed spring contact probe assembly |
ATE176966T1 (en) * | 1997-02-04 | 1999-03-15 | Durtal Sa | SPRING CONTACT ELEMENT |
-
1999
- 1999-02-18 US US09/253,320 patent/US6396293B1/en not_active Expired - Lifetime
- 1999-03-16 GB GB9905858A patent/GB2347023B/en not_active Expired - Lifetime
- 1999-04-03 TW TW088105387A patent/TW528871B/en not_active IP Right Cessation
- 1999-04-13 AT AT99302847T patent/ATE322691T1/en not_active IP Right Cessation
- 1999-04-13 EP EP04078167A patent/EP1510827B1/en not_active Expired - Lifetime
- 1999-04-13 EP EP99302847A patent/EP1037055B1/en not_active Expired - Lifetime
- 1999-04-13 AT AT04078167T patent/ATE370419T1/en not_active IP Right Cessation
- 1999-04-13 DE DE69930717T patent/DE69930717T2/en not_active Expired - Lifetime
- 1999-04-13 DE DE69936893T patent/DE69936893T2/en not_active Expired - Lifetime
- 1999-06-07 JP JP15944299A patent/JP3210645B2/en not_active Expired - Lifetime
-
2001
- 2001-02-23 HK HK01101340A patent/HK1030455A1/en not_active IP Right Cessation
- 2001-06-27 HK HK01104426A patent/HK1033977A1/en not_active IP Right Cessation
- 2001-06-27 HK HK01104425A patent/HK1033976A1/en not_active IP Right Cessation
- 2001-07-27 HK HK01105237A patent/HK1035030A1/en not_active IP Right Cessation
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1324053A (en) | 1971-09-09 | 1973-07-18 | Carr V | Electrical contact probe |
US3754731A (en) * | 1972-01-18 | 1973-08-28 | Halkey Roberts Corp | Inflation manifold valve and flange assembly |
FR2224757A1 (en) | 1973-04-03 | 1974-10-31 | Cit Alcatel | Probe for printed circuit boards - mounted on subsidiary board in desired spatial arrangement for testing |
US4438397A (en) * | 1979-12-26 | 1984-03-20 | Teradyne, Inc. | Test pin |
US4740746A (en) | 1984-11-13 | 1988-04-26 | Tektronix, Inc. | Controlled impedance microcircuit probe |
JPS6212875A (en) | 1985-07-10 | 1987-01-21 | Mitsubishi Electric Corp | Testing device for digital protecting relay device |
US4701700A (en) | 1985-12-02 | 1987-10-20 | Jenkins Jack E | Captivated, pre-loaded spring means for vacuum displaced circuit board testing |
US4897043A (en) * | 1986-06-23 | 1990-01-30 | Feinmetall Gmbh | Resilient contact pin |
US4935695A (en) | 1988-07-13 | 1990-06-19 | Hewlett-Packard Company | Board alignment system |
US4904213A (en) | 1989-04-06 | 1990-02-27 | Motorola, Inc. | Low impedance electric connector |
JPH04270967A (en) | 1990-06-11 | 1992-09-28 | Internatl Standard Electric Corp | Contact device |
US5174763A (en) | 1990-06-11 | 1992-12-29 | Itt Corporation | Contact assembly |
US5410260A (en) | 1992-11-09 | 1995-04-25 | Nhk Spring Co., Ltd. | Coil spring-pressed needle contact probe |
EP0616394A1 (en) | 1993-03-16 | 1994-09-21 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
US5746606A (en) * | 1996-09-30 | 1998-05-05 | Hughes Electronics | Spring loaded contact device and rotary connector |
US6104205A (en) * | 1998-02-26 | 2000-08-15 | Interconnect Devices, Inc. | Probe with tab retainer |
Non-Patent Citations (2)
Title |
---|
Udall, Gordon F., Specifying test fixtures for Automated Test Equipment, Instruments & Control Systems, pp. 63-66, vol. 55 (1982) Oct., No. 10, Radnor, Pennsylvania, USA. |
Visual Inspection of Oztek .5mm Probe, Everett Charles Technologies Contact Products Division, Jun. 21, 2000 (1 page). |
Cited By (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6624645B2 (en) * | 1997-11-28 | 2003-09-23 | Fujitsu Limited | Semiconductor device testing method, using a spring-biased transformable conductive member electrode connection |
US8790359B2 (en) | 1999-10-05 | 2014-07-29 | Cybersonics, Inc. | Medical systems and related methods |
US7459922B2 (en) | 2000-06-16 | 2008-12-02 | Nhk Spring Co. Ltd. | Microcontactor probe assembly having a plunger and electric probe unit using the same |
US20060220666A1 (en) * | 2000-06-16 | 2006-10-05 | Nhk Spring Co. Ltd. | Microcontactor probe assembly |
US20050146341A1 (en) * | 2002-03-05 | 2005-07-07 | Rika Electronics International, Inc | Apparatus for interfacing electronic packages and test equipment |
US20040210140A1 (en) * | 2003-04-15 | 2004-10-21 | Omnisonics Medical Technologies, Inc. | Apparatus and method for preshaped ultrasonic probe |
CN100492020C (en) * | 2004-02-04 | 2009-05-27 | 日本发条株式会社 | Needle-like member, conductive contact, and conductive contact unit |
US20070128906A1 (en) * | 2004-02-04 | 2007-06-07 | Nhk Spring Co., Ltd. | Needle-like member, conductive contact, and conductive contact unit |
US7815438B2 (en) * | 2004-02-04 | 2010-10-19 | Nhk Spring Co., Ltd. | Needle-like member, conductive contact, and conductive contact unit |
US7794414B2 (en) | 2004-02-09 | 2010-09-14 | Emigrant Bank, N.A. | Apparatus and method for an ultrasonic medical device operating in torsional and transverse modes |
US7315176B2 (en) | 2004-06-16 | 2008-01-01 | Rika Denshi America, Inc. | Electrical test probes, methods of making, and methods of using |
WO2006007440A1 (en) * | 2004-06-16 | 2006-01-19 | Rika Denshi America, Inc. | Electrical test probes, methods of making, and methods of using |
US20050280433A1 (en) * | 2004-06-16 | 2005-12-22 | Nelson Larre H | Electrical test probes, methods of making, and methods of using |
US7025602B1 (en) | 2004-10-06 | 2006-04-11 | Plastronics Socket Partners, L.P. | Contact for electronic devices |
US20060073710A1 (en) * | 2004-10-06 | 2006-04-06 | Hwang Dong W | Contact for electronic devices |
US7256593B2 (en) * | 2005-06-10 | 2007-08-14 | Delaware Capital Formation, Inc. | Electrical contact probe with compliant internal interconnect |
US20060279301A1 (en) * | 2005-06-10 | 2006-12-14 | Valts Treibergs | Electrical contact probe with compliant internal interconnect |
CN101501509B (en) * | 2005-06-10 | 2013-08-14 | 特拉华资本组成公司 | Electrical contact probe with compliant internal interconnect |
US20070001695A1 (en) * | 2005-06-30 | 2007-01-04 | Marx Donald A | Dual tapered spring probe |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
US20070284444A1 (en) * | 2006-06-12 | 2007-12-13 | Hellstrom Sven A | Mobile radio terminal having a multiple form factor memory card reader |
US7392946B2 (en) | 2006-06-12 | 2008-07-01 | Sony Ericsson Mobile Communications Ab | Mobile radio terminal having a multiple form factor memory card reader |
US20080143367A1 (en) * | 2006-12-14 | 2008-06-19 | Scott Chabineau-Lovgren | Compliant electrical contact having maximized the internal spring volume |
US20100123476A1 (en) * | 2007-04-27 | 2010-05-20 | Nhk Spring Co., Ltd. | Conductive contact |
US20080278187A1 (en) * | 2007-05-07 | 2008-11-13 | Hongfei Yan | Test pin, method of manufacturing same, and system containing same |
US7521949B2 (en) * | 2007-05-07 | 2009-04-21 | Intel Corporation | Test pin, method of manufacturing same, and system containing same |
KR101145283B1 (en) * | 2007-09-18 | 2012-05-14 | 델라웨어 캐피탈 포메이션, 인코포레이티드 | Spring contact assembly |
US20110039457A1 (en) * | 2007-09-18 | 2011-02-17 | Delaware Capital Formation, Inc. | Spring contact assembly |
US8231416B2 (en) * | 2007-09-18 | 2012-07-31 | Delaware Capital Formation, Inc. | Spring contact assembly |
US8523579B2 (en) | 2007-09-18 | 2013-09-03 | Delaware Capital Formation, Inc. | Spring contact assembly |
US20090075529A1 (en) * | 2007-09-18 | 2009-03-19 | Johnston Charles J | Spring contact assembly |
US7862391B2 (en) * | 2007-09-18 | 2011-01-04 | Delaware Capital Formation, Inc. | Spring contact assembly |
US20090278699A1 (en) * | 2008-05-12 | 2009-11-12 | John Vander Horst | Recreational vehicle holding tank sensor probe |
US8410948B2 (en) * | 2008-05-12 | 2013-04-02 | John Vander Horst | Recreational vehicle holding tank sensor probe |
US7841866B2 (en) * | 2008-09-30 | 2010-11-30 | Hon Hai Precision Ind. Co. Ltd. | Electrical contact having stamped contact pins movably assembled within enclosure member thereof |
US20100159753A1 (en) * | 2008-09-30 | 2010-06-24 | Hon Hai Precision Industry Co., Ltd. | Electrical contact having stamped contact pins movably assembled within enclosure member thereof |
US7946855B2 (en) * | 2008-11-07 | 2011-05-24 | Kabushiki Kaisha Nihon Micronics | Contact and electrical connecting apparatus |
US20100120299A1 (en) * | 2008-11-07 | 2010-05-13 | Kabushiki Kaisha Nihon Micronics | Contact and electrical connecting apparatus |
US7677901B1 (en) | 2008-12-26 | 2010-03-16 | Yamaichi Electronics Co., Ltd. | Electric connecting apparatus for semiconductor devices and contact used therefor |
US8536889B2 (en) | 2009-03-10 | 2013-09-17 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
US20100231251A1 (en) * | 2009-03-10 | 2010-09-16 | Nelson John E | Electrically Conductive Pins For Microcircuit Tester |
US8519727B2 (en) * | 2009-04-27 | 2013-08-27 | Yokowo Co., Ltd. | Contact probe and socket |
US20100271061A1 (en) * | 2009-04-27 | 2010-10-28 | Tsugio Yamamoto | Contact probe and socket |
US8721372B2 (en) | 2010-02-05 | 2014-05-13 | Kabushiki Kaisha Nihon Micronics | Contact and electrical connecting apparatus |
US9678106B2 (en) | 2010-03-10 | 2017-06-13 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
US10073117B2 (en) | 2010-03-10 | 2018-09-11 | Johnstech International Corporation | Resilient interposer with electrically conductive slide-by pins as part of a microcircuit tester |
US9297832B2 (en) | 2010-03-10 | 2016-03-29 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
US10302675B2 (en) | 2010-03-10 | 2019-05-28 | Johnstech International Corporation | Electrically conductive pins microcircuit tester |
US9128120B2 (en) | 2010-06-30 | 2015-09-08 | Leeno Industrial Inc. | Probe |
TWI426274B (en) * | 2010-06-30 | 2014-02-11 | Leeno Ind Inc | Probe |
US10877090B2 (en) | 2010-09-07 | 2020-12-29 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
US9007082B2 (en) | 2010-09-07 | 2015-04-14 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
WO2012033802A2 (en) * | 2010-09-07 | 2012-03-15 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
WO2012033802A3 (en) * | 2010-09-07 | 2012-05-18 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
CN102466740A (en) * | 2010-11-12 | 2012-05-23 | 金英杰 | Kelvin test probe of semi-conductor |
TWI463141B (en) * | 2010-11-17 | 2014-12-01 | Nhk Spring Co Ltd | Contact probe and probe unit |
US8723540B2 (en) | 2011-01-17 | 2014-05-13 | Yokowo Co., Ltd. | Contact probe and socket |
US20140091824A1 (en) * | 2012-09-28 | 2014-04-03 | Evan M. Fledell | Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths |
US9128121B2 (en) * | 2012-09-28 | 2015-09-08 | Intel Corporation | Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths |
US9726693B2 (en) | 2013-04-18 | 2017-08-08 | Isc Co., Ltd. | Probe member for pogo pin |
US9310395B2 (en) * | 2013-04-18 | 2016-04-12 | Isc Co., Ltd. | Probe member for pogo pin |
US20140340106A1 (en) * | 2013-04-18 | 2014-11-20 | Isc Co., Ltd. | Probe member for pogo pin |
US10411386B2 (en) | 2014-08-08 | 2019-09-10 | Nhk Spring Co., Ltd. | Connection terminal |
WO2016128226A1 (en) * | 2015-02-12 | 2016-08-18 | Ptr Messtechnik Gmbh & Co. Kommanditgesellschaft | Method for assembling a component which has a sleeve, a piston with a piston head, and a spring, and component |
US10976346B2 (en) | 2016-02-29 | 2021-04-13 | Yokowo Co., Ltd. | Socket |
CN112740049A (en) * | 2018-09-26 | 2021-04-30 | 恩普乐股份有限公司 | Contact pin and socket |
US11506684B2 (en) | 2018-09-26 | 2022-11-22 | Enplas Corporation | Contact pin and socket |
CN112740049B (en) * | 2018-09-26 | 2023-12-08 | 恩普乐股份有限公司 | Contact pin and socket |
US20220137093A1 (en) * | 2018-12-03 | 2022-05-05 | Enplas Corporation | Contact pin and socket |
US11821917B2 (en) * | 2018-12-03 | 2023-11-21 | Enplas Corporation | Contact pin and socket |
KR20210029667A (en) * | 2019-09-06 | 2021-03-16 | 야마이치 일렉트로닉스 컴퍼니 리미티드 | Contact probe and inspecting socket including the same |
WO2023049433A1 (en) * | 2021-09-27 | 2023-03-30 | Smiths Interconnect Americas, Inc. | Test socket and probe with stepped collar for semiconductor integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
ATE322691T1 (en) | 2006-04-15 |
EP1037055B1 (en) | 2006-04-05 |
DE69936893T2 (en) | 2008-05-15 |
JP2000241447A (en) | 2000-09-08 |
EP1510827A1 (en) | 2005-03-02 |
JP3210645B2 (en) | 2001-09-17 |
HK1033976A1 (en) | 2001-10-05 |
HK1033977A1 (en) | 2001-10-05 |
DE69936893D1 (en) | 2007-09-27 |
DE69930717D1 (en) | 2006-05-18 |
GB2347023B (en) | 2001-07-25 |
EP1037055A3 (en) | 2001-03-28 |
GB9905858D0 (en) | 1999-05-05 |
EP1037055A2 (en) | 2000-09-20 |
GB2347023A (en) | 2000-08-23 |
DE69930717T2 (en) | 2007-01-25 |
ATE370419T1 (en) | 2007-09-15 |
TW528871B (en) | 2003-04-21 |
HK1030455A1 (en) | 2001-05-04 |
HK1035030A1 (en) | 2001-11-09 |
EP1510827B1 (en) | 2007-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6396293B1 (en) | Self-closing spring probe | |
US6462567B1 (en) | Self-retained spring probe | |
US10547135B2 (en) | Spring connector | |
US8523579B2 (en) | Spring contact assembly | |
US20060279301A1 (en) | Electrical contact probe with compliant internal interconnect | |
US20100267291A1 (en) | Swaging process for improved compliant contact electrical test performance | |
EP2836847B1 (en) | Test probe assembly and related methods | |
US20080143367A1 (en) | Compliant electrical contact having maximized the internal spring volume | |
US5801544A (en) | Spring probe and method for biasing | |
US8710856B2 (en) | Terminal for flat test probe | |
US20100007365A1 (en) | Socket for double ended probe, double ended probe, and probe unit | |
EP2411820B1 (en) | Scrub inducing compliant electrical contact | |
JP2015507198A (en) | Electrical connector having an insulating member | |
GB2351398A (en) | Spring probe for testing | |
US6271672B1 (en) | Biased BGA contactor probe tip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: DELAWARE CAPITAL FORMATION, INC., DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:VINTHER, GORDON, A.;CHABINEAU, SCOTT D.;JOHNSTON, CHARLES J.;REEL/FRAME:009797/0211;SIGNING DATES FROM 19990215 TO 19990216 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT, CALI Free format text: SECURITY AGREEMENT;ASSIGNORS:LTX-CREDENCE CORPORATION;EVERETT CHARLES TECHNOLOGIES LLC;REEL/FRAME:032086/0476 Effective date: 20131127 |
|
AS | Assignment |
Owner name: XCERRA CORPORATION, MASSACHUSETTS Free format text: CHANGE OF NAME;ASSIGNOR:LTX-CREDENCE CORPORATION;REEL/FRAME:033032/0768 Effective date: 20140520 |
|
AS | Assignment |
Owner name: LTX-CREDENCE CORPORATION, MASSACHUSETTS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DELAWARE CAPITAL FORMATION, INC.;REEL/FRAME:033091/0639 Effective date: 20131122 |
|
AS | Assignment |
Owner name: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT, CALI Free format text: SECURITY AGREEMENT;ASSIGNORS:XCERRA CORPORATION;EVERETT CHARLES TECHNOLOGIES LLC;REEL/FRAME:034660/0188 Effective date: 20141215 Owner name: EVERETT CHARLES TECHNOLOGIES LLC, MASSACHUSETTS Free format text: RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS;ASSIGNOR:SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT;REEL/FRAME:034660/0394 Effective date: 20141215 Owner name: XCERRA CORPORATION, MASSACHUSETTS Free format text: RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS;ASSIGNOR:SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT;REEL/FRAME:034660/0394 Effective date: 20141215 |
|
AS | Assignment |
Owner name: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT, CALI Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 7261561 AND REPLACE WITH PATENT NUMBER 7231561 PREVIOUSLY RECORDED ON REEL 034660 FRAME 0188. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT;ASSIGNORS:XCERRA CORPORATION;EVERETT CHARLES TECHNOLOGIES LLC;REEL/FRAME:037824/0372 Effective date: 20141215 |
|
AS | Assignment |
Owner name: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT, NEW YORK Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:XCERRA CORPORATION;REEL/FRAME:047185/0624 Effective date: 20181001 Owner name: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AG Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:XCERRA CORPORATION;REEL/FRAME:047185/0624 Effective date: 20181001 |
|
AS | Assignment |
Owner name: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT, NEW YORK Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT;ASSIGNOR:XCERRA CORPORATION;REEL/FRAME:047675/0354 Effective date: 20181001 Owner name: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AG Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT;ASSIGNOR:XCERRA CORPORATION;REEL/FRAME:047675/0354 Effective date: 20181001 |
|
AS | Assignment |
Owner name: XCERRA CORPORATION, MASSACHUSETTS Free format text: TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624;ASSIGNOR:DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT;REEL/FRAME:066762/0811 Effective date: 20240209 |