US6392891B1 - Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module - Google Patents
Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module Download PDFInfo
- Publication number
- US6392891B1 US6392891B1 US09/577,422 US57742200A US6392891B1 US 6392891 B1 US6392891 B1 US 6392891B1 US 57742200 A US57742200 A US 57742200A US 6392891 B1 US6392891 B1 US 6392891B1
- Authority
- US
- United States
- Prior art keywords
- card
- frame
- circuit card
- module
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- 238000003780 insertion Methods 0.000 claims abstract description 12
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- 238000000034 method Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 230000002708 enhancing effect Effects 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000003190 viscoelastic substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/76—Joints and connections having a cam, wedge, or tapered portion
Definitions
- the present invention relates generally to cooling of electronic devices and, in particular, to cooling electronic circuit cards.
- circuit cards In conventional electronic devices such as, for example, computer systems, electronic components are mounted on circuit cards, which are assembled into electronic circuit card modules.
- the circuit card modules are usually inserted into a chassis of an electronic device and, typically, plugged via a connector into an enclosure having a backplane or a motherboard.
- the circuit card modules may also include additional circuit cards, which are called mezzanine cards.
- the mezzanine card is electrically connected to the main card via a connector.
- circuit card modules There are several standards defining properties of circuit card modules. for instance, VMEbus, SEM-E, PCI, cPCI standards, etc.
- the standards encompass mechanical specifications such as card dimensions, connector specifications, etc, along with electronic specifications such as bus structures, signal functions, timing, signal voltage levels, and master/slave configurations. These specifications enable different modules of the same standard supplied from different manufacturers to plug into any enclosure of the same standard, and provide for communications between different modules.
- Convection cooled card modules are mounted within chassis of an electronic device in such a way as to allow the free flow of cooling air over electronic components to dissipate excess heat generated.
- the flow of air is usually provided by fan.
- FIG. 4 of the drawings One example of a conventional convection cooled card module of VME64 standard is shown in FIG. 4 of the drawings.
- the card module shown in FIG. 4 comprises a circuit card A having a front surface B and a rear surface C, at least the front surface bearing electronic components D.
- the card module further comprises a standard VME interface front panel E mounted to the top of the circuit card A, including extractors F. alignment pins G, and keying provisions H for the insertion of the module in a chassis of an electronic device; and two VMEbus connectors I and J mounted to the bottom of the circuit card A, for the connection thereof to an enclosure that also conforms to the VME64 standard.
- the main card shown in FIG. 4 also comprises a stiffening rib provided therealong to inhibit vibration of the card in use.
- FIG. 5 illustrates another example of a conventional convection cooled card module meeting the same VME64 standard, which in addition to the circuit card A, comprises a mezzanine card K which has electronic components L.
- Convection cooled card modules can typically not be used when there are severe requirements for protection of their cards from harsh environment such as sand, dust, humidity, etc. They also cannot be used in closed electronic devices where air ventilation is impossible.
- conduction cooled card modules are conventionally utilized.
- heat generated by electronic components of a circuit card is absorbed by an internal heat transmitting layer thereof, often made of copper, and thereby forwarded to a dissipation device, being commonly called a heat sink.
- the function of this device is usually fulfilled by the chassis in which the modules are mounted. Since a conduction cooled circuit card does not require an air exchange over its electronic components, it may be hermetically sealed within its module or rather used in a sealed electronic device, as it happens most often.
- a conduction cooled electronic card module comprising a circuit card of a convection cooled type of the same standard, having front and rear surfaces and two opposite edges adapted to be received in a chassis of an electronic device. At least the front surface of the circuit card carries electronic components, at least a part of which is capable of generating heat during operation of the module. The rear surface of the circuit card is adapted to be in thermal contact with said chassis at an area of the surface adjacent said edges, when the module is inserted therein.
- the module further includes a thermally conductive frame on which said circuit card is mounted, so as to be in thermal contact with at least said part of the electronic components and with an edge area of the front surface of the circuit card, adjacent said edges. This enables the heat generated by the electronic components of the circuit card to be transferred to the frame and therefrom, via the edge areas of the front and rear surfaces of the card, to the chassis.
- the circuit card is provided with a thermal vias at the edge areas thereof. This facilitates the hear transfer from the front surface of the card to its rear surface.
- the card module further comprises a first heat transfer pad made of thermally conductive material that is sandwiched between the circuit card and the frame.
- the pad is designed for enhancing the thermal contact between the frame and the electronic components. Therefore, the kind of material of which its pad is made and its thickness are to be chosen so as to ensure the provision of a thermal contact between the pad and the electronic components having various heights.
- the pad material is a soft viscoelastic material and it may even be in the form of a gel.
- the card module may further comprise at least one mezzanine card as the circuit card.
- the mezzanine card is attached to said frame so that the frame is sandwiched between the main card and the mezzanine card, the latter being electrically connected to said main card via at least one connector arranged in said frame.
- the frame is thus adapted to be in thermal contact with electronic components of the mezzanine card to withdraw therefrom heat generated by these components.
- the module further includes a second pad made of thermally conductive elastic material, to be sandwiched between the mezzanine circuit and the frame.
- the frame has a base surface adapted to be in thermal contact with said electronic components on the front surface of the circuit card and at least two peripheral side walls adapted to be in thermal contact with the edge areas of the front surface of the circuit card.
- the frame has side walls all along the circumference of the base surface so that, if the main card does not have electronic components on its rear surface, its sealing may be achieved by simple attaching said card to the frame.
- a rear cover should be attached to the frame.
- a front cover should be used when the mezzanine card has such components on its rear surface.
- the front and rear covers may serve to transfer heat generated thereby to said frame.
- the main card and, optionally, the mezzanine card in the module should comprise both rear and front covers attached to said frame. with appropriate gasket sandwiched therebetween.
- the module When the module is hermetically sealed, it is protected from humidity and it may be used when there are severe requirements for protection from any harsh environment.
- both the main card and the mezzanine card of the module meet requirements of a specific standard, and said thermally conductive frame meets corresponding requirements of mechanical specifications of said standard.
- a kit comprising a convection cooled circuit card and parts to be assembled therewith for producing a conduction cooled card module according to the present invention and a convection cooled card module, both adapted for insertion into a corresponding chassis of an electronic device.
- the present invention provides for a conduction cooled card module, which is based on a convection cooled card and is, therefore, much simpler in production and cheaper than the conduction cooled card modules.
- the significance of the present invention goes beyond the preparation of highly reliable, stable, and cost-effective conduction cooled card modules meeting standard requirements. Since the card modules may be sealed, the modules retain superior performance in harsh environments. The products are better suited for applications needed for ruggedization (for example, the ability to withstand shock and vibration). Additionally, the modules are better suited in systems needed for extended temperature operation and in life-critical and quality-sensitive applications.
- FIG. 1 is an exploded isomeric view of a conduction cooled card module constructed in accordance with one embodiment of the present invention
- FIG. 2 is an exploded isomeric view of a conduction cooled card module including a mezzanine card and constructed in accordance with another embodiment of the present invention
- FIG. 3 a is an isomeric front view of the assembled conduction cooled card module shown in FIG. 1 or FIG. 2;
- FIG. 3 b is an isomeric rear view of the assembled conduction cooled card module shown in FIG. 1 or FIG. 2;
- FIG. 4 is an isomeric view of a conventional convection cooled module
- FIG. 5 is an exploded isomeric view of another conventional convection cooled card module including a mezzanine card.
- FIGS. 1 and 2 illustrate conduction cooled modules 10 and 20 , respectively, which in accordance with the present invention are designed to meet requirements of the VMEbus standard (Versa Module Eurocard) and are produced based on a convection cooled circuit card A of the same VMEbus standard, shown in respective FIGS. 4 and 5.
- the modules 10 and 20 are adapted for insertion into a chassis of an electronic device (not shown), designed for conduction cooled card modules.
- the circuit card A has front and rear surfaces B and C, at least the former bearing electronic components D.
- the rear surface C of the circuit card A is adapted for thermal contact with the chassis, at edge areas 11 and 12 of the rear surface C.
- the rear surface C is provided, at the edge areas 11 and 12 , with edge guides (not seen) extending along the left and right edges thereof.
- the circuit card A is further provided with a thermal vias in the form of a plurality of thermally conductive microbores 15 formed between the front and rear surfaces B and C and localized at the edge areas 11 and 12 thereof to be associated with the edge guides.
- the conduction cooled module 10 shown in FIG. 1, further includes a thermally conductive frame 13 mating in format with the circuit card A.
- a central area (not seen) of a front surface of the frame 13 , facing the circuit card A, is adapted to be in thermal contact with the electronic components D of the circuit card A.
- a peripheral area 14 of the front surface of the frame 13 is adapted to be in thermal contact with the front surface B of the card in the area of the microbores 15 .
- the frame 13 comprises a pair of wedge locks 16 mounted on a rear surface of the frame 13 at side edge areas thereof, and a pair of extractors 29 mounted at an upper edge area of the rear surface of the frame 13 , which are designed for facilitating the insertion/extraction of the module 10 in/from the chassis of an electronic device.
- the conduction cooled module 10 further includes a heat transfer pad 17 made of a thermally conductive viscoelastic material, to be sandwiched between the circuit card A and the frame B so as to enhance thermal contact between the frame 13 and the electronic components D mounted on the front surface B of the circuit card A.
- the kind of the pad material and its thickness are to be chosen so as to ensure the provision of a thermal contact between the pad and the electronic components having various heights. It is therefore preferable that the pad material is a soft viscoelastic material and, when the difference in heights between the electronic components D is essential, this material may even be in the form of a gel.
- the conduction cooled module 10 further includes front and rear covers 18 and 19 , respectively. adapted to seal the circuit card A within the module 10 .
- the module may further comprise gaskets to be sandwiched between the covers 18 and 19 and the frame 16 .
- the rear cover 19 is used also to transfer the heat generated by these components to the frame.
- the card module 10 shown in FIG. 1 is assembled by mounting the circuit card A to the frame 13 with the pad 17 sandwiched therebetween so as to provide a thermal contact between the central area of the frame 13 and the electrical components D mounted on the front surface C. In addition. a thermal contact is provided between the peripheral area 14 of the front surface of the frame 13 and the front surface B of the card A in the area of the microbores 15 .
- the front and rear covers 18 and 19 are attached to the frame 13 , optionally with the gaskets sandwiched therebetween.
- the conduction cooled card module 20 shown in FIG. 2 differs from the card module 10 shown in FIG. 1, in that, in addition to the standard circuit card A which constitutes its main card, it comprises a mezzanine card K of the same standard, which is shown in FIG. 5 .
- the mezzanine card K is to be attached to a frame 23 so that this frame is sandwiched between the main circuit card A and the mezzanine card K.
- the mezzanine card K which carries electronic components L at least at its front surface facing the frame 23 , is adapted to be electrically connected to the main circuit card A via a connector 24 that is arranged in the frame 23 .
- the card module 20 may further comprise a heat transfer pad 25 made of a thermally conductive elastic material, similar to the pad 17 described above, to be sandwiched between the mezzanine card K and the frame 23 for enhancing the thermal contact between the frame 23 and the electronic components of the mezzanine card K.
- a heat transfer pad 25 made of a thermally conductive elastic material, similar to the pad 17 described above, to be sandwiched between the mezzanine card K and the frame 23 for enhancing the thermal contact between the frame 23 and the electronic components of the mezzanine card K.
- the conduction cooled model 20 further includes front and rear covers 27 and 28 , respectively, to be attached to the frame 23 for sealing the circuit card A and the mezzanine card K within the module 20 .
- the mezzanine card K carries electronic components L also on its rear surface facing the front cover 27 and a thermal contact is provided between the front cover 27 and the electronic components L.
- FIGS. 3 a and 3 b show, respectively, front and rear views of the assembled conduction cooled card module 10 or 20 .
- the module is hermetically sealed and it may be used when there are severe requirements for protection from any harsh environment.
- the heat generated by the electronic components D mounted on the front surface B of the circuit card A is transferred through the first heat transfer pad 17 and the frame 13 to the front surface B of the card A at the area of the thermal vias 15 and, therethrough, to the rear surface C of the card which transfers the heat to the chassis of an electronic device. If the electronic components are mounted also on the rear surface C of the circuit card A, the heat generated thereby is transferred via the rear cover 19 to the frame 13 and therefrom to the rear surface C of the circuit card A and to the chassis.
- the card module 20 operates similarly to the card module 10 .
- heat generated by the electronic elements L of the mezzanine card K is transferred to the frame 23 via the second heat transfer pad 25 , and then to the rear surface 14 of the main circuit card A.
- the present invention enables utilizing a standard convection cooled circuit card used for producing a standard convection cooled module, in the production of a conduction cooled module meeting all standard requirements. Consequently, such a circuit card, together with parts of these modules that are necessary for their assembling, may be combined in a kit.
- the kit may comprise the circuit card A, the mezzanine card K, a frame, first and second pads, front and rear covers and two gaskets. for the assembly of conduction cooled card modules such as 10 in FIG. 1 or 20 in FIG. 2; and an interface front panel E with all appropriate appliances for the assembly of convection cooled card modules such as shown in FIG. 4 or FIG. 5 .
- circuit cards of VMEbus standard used in the description of the preferred embodiment were used as a non-limiting example of implementation of the present invention.
- the present invention should not be considered as being limited to the use of any particular standard.
- a similar solution can be implemented on the circuit cards of any other conventional design or appropriate standard, for example, SEM-E, PCI or cPCI circuit card standards and their modifications. It may also be designed in a non-standard format.
- the thermal vias providing a convection heat transfer between the front and rear surfaces of the circuit card A, are desirable for improving the heat transfer between these surfaces, they can be omitted.
- they may be converted into thermal conductive channels by filling the microbores with a conductive material.
- the module may be designed without the heat transfer pad or rather this pad need not be of elastic only, but may be of metal, for example, aluminium, copper, or another good thermal conductor.
- the frame may be not only in the form of a continues solid body, but it may be of hollow design.
- the frame can be cooled by passing therethrough an air or a coolant fluid.
Abstract
Description
Claims (29)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/145,385 US6621706B2 (en) | 1999-07-02 | 2002-05-14 | Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL130775A IL130775A (en) | 1999-07-02 | 1999-07-02 | Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling |
IL130775 | 1999-07-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/145,385 Continuation US6621706B2 (en) | 1999-07-02 | 2002-05-14 | Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module |
Publications (1)
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US6392891B1 true US6392891B1 (en) | 2002-05-21 |
Family
ID=11072983
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Application Number | Title | Priority Date | Filing Date |
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US09/577,422 Expired - Lifetime US6392891B1 (en) | 1999-07-02 | 2000-05-22 | Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module |
US10/145,385 Expired - Lifetime US6621706B2 (en) | 1999-07-02 | 2002-05-14 | Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module |
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Application Number | Title | Priority Date | Filing Date |
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US10/145,385 Expired - Lifetime US6621706B2 (en) | 1999-07-02 | 2002-05-14 | Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module |
Country Status (9)
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US (2) | US6392891B1 (en) |
EP (1) | EP1198978B1 (en) |
AT (1) | ATE258367T1 (en) |
AU (1) | AU5561300A (en) |
DE (1) | DE60007872T2 (en) |
DK (1) | DK1198978T3 (en) |
ES (1) | ES2215054T3 (en) |
IL (1) | IL130775A (en) |
WO (1) | WO2001003486A1 (en) |
Cited By (32)
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US20030072153A1 (en) * | 2001-09-18 | 2003-04-17 | Nobuyuki Matsui | Lighting apparatus with enhanced capability of heat dissipation |
US6600427B2 (en) * | 2000-06-16 | 2003-07-29 | Mannesmann Vdo Ag | Combination instrument for displaying measured values and/or other information, in particular for use in a motor vehicle |
US6639801B2 (en) * | 2001-08-10 | 2003-10-28 | Agilent Technologies, Inc. | Mechanical packaging architecture for heat dissipation |
US6721182B1 (en) | 2002-10-10 | 2004-04-13 | Harris Corporation | Circuit card module including mezzanine card heat sink and related methods |
US20040100767A1 (en) * | 2002-11-25 | 2004-05-27 | Lockheed Martin Corporation | Rugged modular pc 104 chassis with blind mate connector and forced convection cooling capabilities |
US20040114331A1 (en) * | 2002-12-16 | 2004-06-17 | Hines Douglas J. | Vme circuit host card with triple mezzanine configuration |
US20040120116A1 (en) * | 2002-12-19 | 2004-06-24 | Chad St. Louis | Embedded heat pipe for a conduction cooled circuit card assembly |
US6762939B2 (en) * | 2002-02-20 | 2004-07-13 | Intel Corporation | Thermal solution for a mezzanine card |
US20050138833A1 (en) * | 2003-08-25 | 2005-06-30 | Knight Paul A. | Dry-wet thermal management system |
US20060036793A1 (en) * | 2004-08-12 | 2006-02-16 | Sandy Douglas L | Stacked 3U payload module unit |
US7043933B1 (en) | 2003-08-26 | 2006-05-16 | Isothermal Systems Research, Inc. | Spray coolant reservoir system |
US20060139892A1 (en) * | 2003-01-29 | 2006-06-29 | Koninklijke Phillips Electronics N.V. | Heat dissipating arrangement for an electronic appliance |
US7180741B1 (en) | 2003-08-26 | 2007-02-20 | Isothermal Systems Research, Inc. | Spray cool system with a dry access chamber |
US20080074839A1 (en) * | 2006-09-21 | 2008-03-27 | Sony Computer Entertainment Inc. | Information processing device |
US20090080163A1 (en) * | 2007-05-17 | 2009-03-26 | Lockheed Martin Corporation | Printed wiring board assembly |
US20090147472A1 (en) * | 2007-12-11 | 2009-06-11 | Honeywell International Inc. | Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System |
US20100103614A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US20100101759A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
US20100103620A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Open Flow Cold Plate For Liquid Cooled Electronic Packages |
US20100103618A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
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US7970006B1 (en) * | 2003-03-10 | 2011-06-28 | Ciena Corporation | Dynamic configuration for a modular interconnect |
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US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
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US11259445B2 (en) | 2020-03-05 | 2022-02-22 | Hamilton Sundstrand Corporation | Cooling mechanism for electrionic component mounted on a printed wiring board |
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US7291783B2 (en) * | 2004-02-19 | 2007-11-06 | International Business Machines Corporation | Mounting components to a hardware casing |
US7113401B2 (en) * | 2004-10-25 | 2006-09-26 | International Business Machines Corporation | System for airflow management in electronic enclosures |
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US7324336B2 (en) * | 2005-09-27 | 2008-01-29 | Lockheed Martin Corporation | Flow through cooling assemblies for conduction-cooled circuit modules |
US7796384B2 (en) * | 2008-08-27 | 2010-09-14 | Honeywell International Inc. | Hybrid chassis cooling system |
US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
US8233279B2 (en) * | 2010-11-04 | 2012-07-31 | Ge Intelligent Platforms, Inc. | Wedge lock for use with a single board computer and method of assembling a computer system |
US8861213B2 (en) * | 2012-06-29 | 2014-10-14 | Violin Memory, Inc. | Circuit card and cage arrangement with improved cooling |
US9426931B2 (en) | 2014-02-07 | 2016-08-23 | Lockheed Martin Corporation | Fluid-flow-through cooling of circuit boards |
US9357670B2 (en) | 2014-02-18 | 2016-05-31 | Lockheed Martin Corporation | Efficient heat transfer from conduction-cooled circuit cards |
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- 2000-05-22 US US09/577,422 patent/US6392891B1/en not_active Expired - Lifetime
- 2000-06-30 DE DE60007872T patent/DE60007872T2/en not_active Expired - Lifetime
- 2000-06-30 AU AU55613/00A patent/AU5561300A/en not_active Abandoned
- 2000-06-30 ES ES00940715T patent/ES2215054T3/en not_active Expired - Lifetime
- 2000-06-30 DK DK00940715T patent/DK1198978T3/en active
- 2000-06-30 AT AT00940715T patent/ATE258367T1/en not_active IP Right Cessation
- 2000-06-30 EP EP00940715A patent/EP1198978B1/en not_active Expired - Lifetime
- 2000-06-30 WO PCT/IL2000/000379 patent/WO2001003486A1/en active IP Right Grant
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- 2002-05-14 US US10/145,385 patent/US6621706B2/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
EP1198978A1 (en) | 2002-04-24 |
ATE258367T1 (en) | 2004-02-15 |
DK1198978T3 (en) | 2004-06-28 |
IL130775A (en) | 2007-03-08 |
ES2215054T3 (en) | 2004-10-01 |
EP1198978B1 (en) | 2004-01-21 |
US20020186544A1 (en) | 2002-12-12 |
IL130775A0 (en) | 2001-01-28 |
DE60007872D1 (en) | 2004-02-26 |
AU5561300A (en) | 2001-01-22 |
DE60007872T2 (en) | 2004-11-11 |
US6621706B2 (en) | 2003-09-16 |
WO2001003486A1 (en) | 2001-01-11 |
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