US6392519B1 - Magnetic core mounting system - Google Patents
Magnetic core mounting system Download PDFInfo
- Publication number
- US6392519B1 US6392519B1 US09/706,488 US70648800A US6392519B1 US 6392519 B1 US6392519 B1 US 6392519B1 US 70648800 A US70648800 A US 70648800A US 6392519 B1 US6392519 B1 US 6392519B1
- Authority
- US
- United States
- Prior art keywords
- mounting
- core
- cavity
- mounting cup
- electromagnetic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/025—Constructional details relating to cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
Definitions
- This invention relates generally to a mounting system for an electromagnetic apparatus such as an inductor or transformer, and, more particularly, to such a mounting system which further includes a cooling function.
- the use of an electromagnetic apparatus, such as a transformer or an inductor, in electronic assemblies is common in the automotive industry.
- the electromagnetic apparatus generally includes a magnetic core and a winding disposed on the core (i.e., one for an inductor, or two windings for a transformer).
- High-frequency operation of the apparatus generates heat, both within the winding and in the magnetic core itself. As the operating frequency increases, so too does the heat component in the core. To avoid reduced performance, and/or damage, the heat generated in the core must be removed. Heat removal may occur either through transfer from the core surface by convection to the surrounding air or by direct thermal contact with an adjacent solid material (i.e., a heat sink).
- the latter mode As to the former mode, it is often undesirable to heat the surrounding air, as this can make the surrounding air too hot for neighboring electrical components. Accordingly, the latter mode of heat transfer (i.e., direct thermal conduction) is often used to remove heat from the core/windings to avoid increasing the surrounding air temperature.
- direct thermal conduction i.e., direct thermal conduction
- the heat generated in the windings is generally of higher concern than that in the core material. This is because effective heat transfer across multiple turns of insulated wire is difficult to achieve while maintaining moderate temperature gradients in the wires. That is, layers of electrical insulation and air gaps associated with the turns of wire make conduction of heat across the winding very inefficient. For this reason, it is known to apply potting material to encapsulate the winding to eliminate air gaps and thereby increase the effective thermal conductivity. Heat generated in the winding must also be removed, and is either transferred into the core material, or, into the surrounding air by way of convection. As mentioned above, however, heating of the surrounding air is generally undesirable inasmuch as it increases the surrounding air temperature, perhaps to elevated levels detrimental to surrounding electrical components. Accordingly, in view of e forgoing, there has been much investigation into systems for cooling both magnetic cores and windings.
- Khan et al. disclose an electromagnetic apparatus including a magnetic core having at least one winding disposed on a central leg of the core. Khan et al. further disclose a first, generally planar heat sink on one side of the magnetic core, and a second heat sink, also generally planar in shape, on an opposing side of the core. Both heat sinks are attached so as to engage the magnetic core in a sandwich arrangement.
- Khan et al. does not address the problem described above dealing with the removal of heat generated in the windings, and, appears to allow much of the generated heat to be transferred to the surrounding air, which is generally undesirable. Additionally, Khan et al. does not appear to protect against damage to the delicate windings/core material due to vibration or structural shock, particularly shock in the plane of the sandwiching metal sheets. The automotive environment, for example, is characterized by high vibration and/or repeated shock. These factors also require due consideration when evaluating mechanisms for mounting an electromagnetic apparatus destined for such relatively harsh environments. Finally, the system of Khan et al. may not be effective with multiple cores secured by the same metal sheet due to dimensional tolerances.
- the mounting apparatus for an electromagnetic device according to the present invention is characterized by the features specified in claim 1 .
- One advantage of the present invention is that it provides improved thermal conduction from the magnetic core to a heat sink to thereby maintain relatively cooler magnetic cores/windings.
- the present invention integrates the function of a vibration resistant mounting system with a thermal cooling system.
- a mounting apparatus in accordance with the invention is provided for mounting and cooling an electromagnetic device.
- the electromagnetic device is of the type having a first winding disposed on a core formed of magnetically-permeable material.
- the mounting apparatus includes a first heat sink and a second heat sink, characterized in that: one of the first and second heat sinks comprises a mounting cup formed of thermally-conductive material having a cavity configured to receive the electromagnetic device, the mounting cup including a flange portion for attachment to the other one of the first and second heat sinks; and potting material disposed in the cavity of the mounting cup encapsulating portions of the electromagnetic device, wherein the flange includes a passage for routing leads of the first winding out of the cavity.
- FIG. 1 is a simplified, perspective, exploded view of a mounting apparatus for an electromagnetic device in accordance with the present invention.
- FIG. 2 is a simplified, cross-sectional view of a mounting apparatus as assembled containing the electromagnetic device of FIG. 1 .
- FIG. 1 illustrates a mounting apparatus 10 for mounting an electromagnetic device 12 , and which further performs the function of cooling electromagnetic device 12 .
- Electromagnetic device 12 includes a magnetic core 14 , a first winding 16 , and an optional second winding 18 . Electromagnetic device 12 may be an inductor wherein only first winding 16 is used. It should be appreciated, however, that core 14 may carry both windings 16 , and 18 , for example, where the electromagnetic device is a transformer. Other winding configurations are consistent with the present invention.
- Core 14 is preferably formed of a magnetically permeable material and may be formed, for example, from either steel laminations, or, insulated iron particles shaped and formed by way of a compression molding operation as known to those of ordinary skill in the art.
- Mounting apparatus 10 includes a first heat sink, such as heat sink plate 20 , and a second heat sink, such as mounting cup 22 .
- First heat sink 20 is formed of thermally-conductive material such as aluminum, or a copper alloy.
- Heat sink 20 has a main body portion, which may be generally rectangular in shape, in the illustrated embodiment. As referred to above, heat sink 20 , as illustrated, may be generally planar, at least on one side and is configured in size to be larger than mounting cup 22 for purposes of attachment thereto. Other devices like power transistors, capacitors, and resistors may also be mounted to heat sink 20 at other locations.
- Heat sink 20 may have fins on its back side for convection heat transfer or it may simply be connected to a third, remote heat sink where the heat is carried away by convection.
- Mounting cup 22 is also formed of a material having a high thermal-conductivity, such as aluminum or a copper alloy.
- Mounting cup 22 has an axis, designated “A”, associated therewith (best shown in FIG. 2 ), and includes a centrally-disposed cavity 24 , a base 26 , an annular sidewall 28 , a flange 30 , a first passage 32 , a second passage 34 , and a plurality of bore holes 36 .
- Mounting apparatus 10 may further include, in an alternate embodiment, conformal material 38 (best shown in FIG. 2 ). In either embodiment, mounting cup 22 may be attached to heat sink 20 by conventional fasteners 40 .
- Cavity 24 is configured in size and shape to receive electromagnetic device 12 .
- the height of cavity 24 is slightly greater than the height of electromagnetic device so as to allow for conformal material 38 to be inserted between an upper surface of core 14 and the inner surface of base 26 of the mounting cup 22 .
- Conformal material 38 provides for a dimensional variation of both device 12 and cup 22 while effectively transferring heat there between.
- Base 26 is substantially planar in the illustrated embodiment, and is substantially perpendicular to axis A.
- the inner surface of base 26 is configured to correspond to the opposing surface of core 14 (top in FIG. 2 ). As shown in FIG. 2, both surfaces are generally flat, but need not be.
- Annular sidewall 28 is generally axially-extending between base 26 and flange 30 .
- sidewall 28 has a generally elliptical shape in radial cross-section. Additionally, sidewall 28 exhibits a radially-increasing taper, from base 26 to flange 30 .
- shape of mounting cup 22 may be adapted with respect to size and shape to correspond to a wide variety of shapes and sizes of magnetic core 14 .
- Mounting cup 22 in a constructed embodiment, may be manufactured by deep drawing the cup shape from sheet blanks. Other manufacturing approaches, however, are possible, consistent with the spirit and scope of the present invention.
- Flange 30 is configured to provide a mounting function, whose generally flat outer surface solidly engages an upper surface of heat sink 20 .
- the flat surfaces promote a solid mechanical mounting. Additionally, the contact between flange 30 and heat sink 20 allows for an efficient transfer of heat from mounting cup 22 to heat sink 20 . Heat also flows from core 14 directly to heat sink 20 .
- Passages 32 and 34 are configured to allow routing of the leads of first and second windings 16 , 18 out of cavity 24 . It should be understood, however, where only one winding, for example, first winding 16 , is employed in electromagnetic device 12 , that only one passage may be required. Additionally, both passages may be implemented in embodiments where only one winding is used, without any detriment to the operation of mounting apparatus 10 . Other routing orientations for windings may result in a greater or fewer number of passages, all consistent with the present invention.
- Each bore hole 36 is configured to receive a corresponding fastener 40 for attaching mounting cup 22 to heat sink 20 (as illustrated in exploded form in FIG. 1 ).
- core 14 includes, in the illustrated embodiment, a central leg 42 , and a pair of opposing outer legs 44 , and 46 .
- mounting apparatus 10 further includes potting material 48 disposed in cavity 24 of mounting cup 22 .
- Material 48 encapsulates, at least in part, portions of electromagnetic device 12 .
- potting material 48 comprises a polyurethane resin material. Suitable potting materials for use in the present invention are commercially available, such as, for example, a resin sold under the trade name UR-312, by Thermoset, Lord Chemical Products, Indianapolis, Ind., USA.
- the UR-312 resin is characterized by a shore 00 hardness of 50, a clear color, and which cures to a soft, low modulus gel and remains in that state down to ⁇ 80° C. Potting material 48 , as described above, exhibits excellent thermal-shock properties and a has a 50 PSI tensile strength.
- Conformal material 38 is a relatively thermally-conductive material, and which may exhibit some level of plastic deformation properties.
- suitable conformal materials 38 may be either electrically isolative (i.e., dielectric), or non-electrically isolative.
- the higher conductivity conformal materials that are presently available comprise the non-electrically isolative type. Inasmuch as electrical isolation for magnetic core 14 is not required in the present invention, such conformal materials are preferred.
- Conformal materials 38 are commercially available, such as, for example, materials sold under the tradename THERM-A-GAP, by Chomerics, a division of Parker Hannifin Corp., Woburn, Mass., USA.
- the exemplary product described above consists of an extremely soft silicone elastomer loaded with ceramic particles laminated onto either an aluminum foil carrier (e.g., 0.050 millimeters thick) for electrically non-isolative uses, or a thin, thermally conductive fiberglass carrier for electrically isolative uses.
- the total thickness of conformal material 38 , the height of core 14 (taken along axis “A”), and the depth of cavity 24 is coordinated as follows, in one embodiment.
- the thickness of conformal material 38 is selected to be at least four (4) times the value of maximum tolerance variation between the core 14 and cavity 24 .
- the core 14 when encapsulated in cup 22 with potting material 48 , extends slightly beyond the plane shared by mounting flange 30 by about 1 ⁇ 4 the thickness of conformal material 38 .
- This dimensional relationship allows slight compression of material 38 on tightening of fasteners 40 , thus ensuring a positive pressure contact with heat sink 20 by taking up dimensional variation in the parts.
- the foregoing arrangement promotes good heat transfer at the interface between core 14 and heat sink 20 .
- Grease loaded with zinc oxide may be applied to the surface of core 14 to bridge any small air gaps at the core 14 /heat sink 20 interface. Heat thus easily transfers through this interface.
- no potting material 48 should be between core 14 and heat sink 20 .
- mounting apparatus 10 integrates thermal cooling with a shock-resistant mounting structure.
- Mounting cup 22 allows the use of potting material 48 for better thermal paths for cooling electromagnetic device 12 via the walls e.g., base, sidewall, flange) of cup 22 as well as providing a thermally conductive path for core 14 /winding 16 , 18 to reach heat sink 20 .
- Heat transfer occurs without exposing high temperature components (e.g., like hot wires) directly to the surrounding air, due to the closed-end configuration of mounting cup 22 .
- Cavity 24 of mounting cup 22 functions as a mounting system as well as a thermal cooling structure.
- the flat surface of flange 30 engages the flat surface of heat sink 20 and the flat surface of core 14 engages the flat surface of heat sink 20 , to provide a solid mechanical mounting to heat sink 20 , as well as providing an efficient mechanism for transferring heat from cup 22 and core 14 to heat sink 20 .
- Mounting apparatus 10 is further capable of supporting electromagnetic device 12 under harsh shock loads. Potting material 48 is pliable, cushioning electromagnetic device 12 from vibration and/or shocks.
- an outside surface of mounting cup 22 i.e., the surface not abutting cavity 24
- This example describes the thermal transfer improvements of mounting apparatus 10 relative to a conventional heat sink arrangement.
Abstract
Description
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US09/706,488 US6392519B1 (en) | 2000-11-03 | 2000-11-03 | Magnetic core mounting system |
DE10153887A DE10153887A1 (en) | 2000-11-03 | 2001-11-02 | Magnetic core mounting system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/706,488 US6392519B1 (en) | 2000-11-03 | 2000-11-03 | Magnetic core mounting system |
Publications (1)
Publication Number | Publication Date |
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US6392519B1 true US6392519B1 (en) | 2002-05-21 |
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Family Applications (1)
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US09/706,488 Expired - Lifetime US6392519B1 (en) | 2000-11-03 | 2000-11-03 | Magnetic core mounting system |
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US (1) | US6392519B1 (en) |
DE (1) | DE10153887A1 (en) |
Cited By (38)
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US6611186B2 (en) * | 2001-02-26 | 2003-08-26 | Woodward Governor Company | Solenoid having an elastomeric retaining device and method of manufacturing same without potting |
US20030184423A1 (en) * | 2002-03-27 | 2003-10-02 | Holdahl Jimmy D. | Low profile high current multiple gap inductor assembly |
US20040189430A1 (en) * | 2003-03-26 | 2004-09-30 | Matsushita Elec. Ind. Co. Ltd. | Choke coil and electronic device using the same |
US20040239466A1 (en) * | 2003-05-27 | 2004-12-02 | Rouser Richard F. | Magnetic core device and assembly method |
US20050068147A1 (en) * | 2003-09-30 | 2005-03-31 | Skibinski Gary Leonard | Modular inductor for use in power electronic circuits |
US20050068141A1 (en) * | 2003-09-30 | 2005-03-31 | Skibinski Gary Leonard | Method of making an electric inductor and inductor made by same |
US7002074B2 (en) | 2002-03-27 | 2006-02-21 | Tyco Electronics Corporation | Self-leaded surface mount component holder |
WO2006069571A1 (en) * | 2004-12-29 | 2006-07-06 | Danfoss Drives A/S | An electromagnetic module for a frequency converter |
US20060250205A1 (en) * | 2005-05-04 | 2006-11-09 | Honeywell International Inc. | Thermally conductive element for cooling an air gap inductor, air gap inductor including same and method of cooling an air gap inductor |
US7164337B1 (en) * | 2004-12-11 | 2007-01-16 | Rsg/Aames Security, Inc. | Splash proof electromagnetic door holder |
US20070279171A1 (en) * | 2006-06-05 | 2007-12-06 | Hon Hai Precision Ind. Co., Ltd. | Inductor with insluative housing and method for making the same |
US20090189723A1 (en) * | 2008-01-25 | 2009-07-30 | Irgens O Stephan | Transformer with isolated cells |
US20100253461A1 (en) * | 2007-04-26 | 2010-10-07 | Koninklijke Philips Electronics N.V. | Planar transformer with boards |
US8427269B1 (en) * | 2009-06-29 | 2013-04-23 | VI Chip, Inc. | Encapsulation method and apparatus for electronic modules |
CN103189942A (en) * | 2010-11-19 | 2013-07-03 | 住友电气工业株式会社 | Reactor |
CN103366926A (en) * | 2012-04-05 | 2013-10-23 | 李尔公司 | Heat dissipating electromagnetic device arrangement |
JP2013239496A (en) * | 2012-05-11 | 2013-11-28 | Sanyo Denki Co Ltd | Container for cooling heating unit |
JP2014036194A (en) * | 2012-08-10 | 2014-02-24 | Panasonic Corp | Reactor device |
US20140132379A1 (en) * | 2012-11-09 | 2014-05-15 | Ford Global Technologies, Llc | Integrated inductor assembly |
US8836459B1 (en) * | 2013-07-05 | 2014-09-16 | Chicony Power Technology Co., Ltd. | Power module |
US20140300438A1 (en) * | 2011-09-02 | 2014-10-09 | Schmidhauser Ag | Transformer and Associated Production Method |
US8860542B2 (en) | 2011-02-14 | 2014-10-14 | Sumitomo Electric Industries, Ltd. | Reactor, reactor manufacturing method, and reactor component |
WO2014173960A1 (en) * | 2013-04-25 | 2014-10-30 | Magcomp Ab | Thermal management system for smc inductors |
WO2014200459A1 (en) * | 2013-06-10 | 2014-12-18 | Schneider Electric Solar Inverters Usa, Inc. | An electronics system and method of forming same |
US20160005523A1 (en) * | 2014-07-07 | 2016-01-07 | Louw D. Jacobs | Potted heat transfer media transformer system |
US20160064134A1 (en) * | 2014-08-26 | 2016-03-03 | Hyundai Motor Company | Cooling device for transformer |
US9543069B2 (en) | 2012-11-09 | 2017-01-10 | Ford Global Technologies, Llc | Temperature regulation of an inductor assembly |
US9581234B2 (en) | 2012-11-09 | 2017-02-28 | Ford Global Technologies, Llc | Liquid cooled power inductor |
US20170092416A1 (en) * | 2014-06-19 | 2017-03-30 | Sma Solar Technology Ag | Inductor assembly comprising at least one inductor coil thermally coupled to a metallic inductor housing |
WO2017103078A1 (en) * | 2015-12-17 | 2017-06-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Electronic device including at least one inductor comprising passive heat management means |
US20170243688A1 (en) * | 2014-10-03 | 2017-08-24 | Fdk Corporation | Coil device |
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US9892842B2 (en) | 2013-03-15 | 2018-02-13 | Ford Global Technologies, Llc | Inductor assembly support structure |
US20180130589A1 (en) * | 2016-11-04 | 2018-05-10 | Ford Global Technologies, Llc | Inductor cooling systems and methods |
US10460865B2 (en) | 2012-11-09 | 2019-10-29 | Ford Global Technologies, Llc | Inductor assembly |
US20200286667A1 (en) * | 2019-03-10 | 2020-09-10 | Cyntec Co., Ltd. | Magnetic component structure with thermal conductive filler and method of fabricating the same |
US20200402696A1 (en) * | 2019-06-21 | 2020-12-24 | Panasonic Intellectual Property Management Co., Ltd. | Core |
GB2608392A (en) * | 2021-06-29 | 2023-01-04 | Murata Manufacturing Co | Electrical device |
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US7002074B2 (en) | 2002-03-27 | 2006-02-21 | Tyco Electronics Corporation | Self-leaded surface mount component holder |
US20030184423A1 (en) * | 2002-03-27 | 2003-10-02 | Holdahl Jimmy D. | Low profile high current multiple gap inductor assembly |
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US20040239466A1 (en) * | 2003-05-27 | 2004-12-02 | Rouser Richard F. | Magnetic core device and assembly method |
US6980078B2 (en) | 2003-05-27 | 2005-12-27 | Delphi Technologies, Inc. | Magnetic core device and assembly method |
US7113065B2 (en) * | 2003-09-30 | 2006-09-26 | Rockwell Automation Technologies, Inc. | Modular inductor for use in power electronic circuits |
US6998950B2 (en) * | 2003-09-30 | 2006-02-14 | Rockwell Automation Technologies, Inc. | Method of making an electric inductor and inductor made by same |
US20050068141A1 (en) * | 2003-09-30 | 2005-03-31 | Skibinski Gary Leonard | Method of making an electric inductor and inductor made by same |
US20050068147A1 (en) * | 2003-09-30 | 2005-03-31 | Skibinski Gary Leonard | Modular inductor for use in power electronic circuits |
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US20060250205A1 (en) * | 2005-05-04 | 2006-11-09 | Honeywell International Inc. | Thermally conductive element for cooling an air gap inductor, air gap inductor including same and method of cooling an air gap inductor |
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US7786832B2 (en) * | 2006-06-05 | 2010-08-31 | Hon Hai Precision Ind. Co., Ltd. | Inductor with insulative housing and method for making the same |
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