US6162381A - Method for producing a molded unit with electrodes embedded therein - Google Patents

Method for producing a molded unit with electrodes embedded therein Download PDF

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Publication number
US6162381A
US6162381A US08/205,821 US20582194A US6162381A US 6162381 A US6162381 A US 6162381A US 20582194 A US20582194 A US 20582194A US 6162381 A US6162381 A US 6162381A
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Prior art keywords
electrodes
molded unit
molded
mold
resin
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Expired - Lifetime
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US08/205,821
Inventor
Takashi Onishi
Toshiaki Hata
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/84—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks by moulding material on preformed parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0056—Apparatus or processes specially adapted for the manufacture of electric switches comprising a successive blank-stamping, insert-moulding and severing operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Definitions

  • the present invention relates to a method for producing a molded unit having a plurality of electrodes embedded therein.
  • FIGS. 4 through 6 are a plan view, a bottom view and a cross section along line VI--VI of FIG. 5, respectively.
  • the molded unit includes a plurality of first through fifth electrodes 1, 2, 3, 4 and 5, as illustrated in FIG. 7, which are embedded in a circular-shaped molded body 6 formed of a resin.
  • the molded body 6 has a plurality of through-holes 7 formed therethrough at the backside thereof which is opposite to that surface of the molded body 6 at which a plurality of recesses are formed for mounting electric elements 8.
  • the above-described molded unit is produced as follows. First, a plurality of electrodes 1-5, which are electrically and mechanically disconnected from each other, are respectively or individually placed in a mold at predetermined locations therein and exactly positioned or supported in place by a plurality of support pins. Then, a molten resin is poured into the mold and cooled to provide a molded body 6 having the electrodes 1-5 embedded therein. After cooling of the molten resin, the support pins are removed from the molded body 6, forming a plurality of through-holes 7 at the backside thereof, as shown in FIGS. 5 and 6.
  • the through-holes 7 thus formed are then closed by filling therein a sealing material such as a silicone-based adhesive.
  • a sealing material such as a silicone-based adhesive.
  • the present invention is intended to overcome the above-mentioned problems encountered with the known method for producing a molded unit with electrodes therein.
  • An object of the invention is provide a novel and improved method for producing a molded unit with a plurality of electrodes embedded therein which can prevent the embedded electrodes from being exposed to the outside of a molded body, and which is simple, efficient and has low manufacturing costs.
  • a method for producing a molded unit with a plurality of electrodes comprising the steps of:
  • the step of molding the primary product into a molded unit comprises:
  • the primary product is supported in the mold at the predetermined location by a plurality of support pins which abut against the resin moldings.
  • the support pins are removed from the molded unit after the molten resin poured into the mold is cooled.
  • FIG. 1 is a bottom view of a molded unit with electrodes produced in accordance with the method of invention
  • FIG. 2 is a plan view of a primary molded product to be incorporated in the molded unit of FIG. 1;
  • FIG. 3 is a plan view of the electrodes of FIG. 1, but showing their state before being formed into the primary molded product of FIG. 2;
  • FIG. 4 is a plan view of a molded unit with electrodes produced in accordance with a known method
  • FIG. 5 is a bottom view of the molded unit of FIG. 4;
  • FIG. 6 is a cross section taken along line VI--VI in FIG. 5;
  • FIG. 7 is a plan view of the electrodes to be embedded in the molded unit of FIG. 4.
  • FIGS. 1 through 3 of the drawings A preferred embodiment of the present invention will now be described in detail while referring to FIGS. 1 through 3 of the drawings.
  • FIG. 1 shows, in a bottom view, a molded unit with electrodes produced in accordance with the method of the invention.
  • the molded unit of FIG. 1 is produced as follows. First, as shown in FIG. 3, a plurality of electrodes 101-104, which are supported by a support frame 110 of a metallic thin film through a plurality of support members 110a, are integrally pre-molded by an electrically insulating resin into an electrode assembly 111, in which the electrodes 101-104 are integrally and mechanically connected with each other through resin moldings 112. Then, the electrode assembly 111 thus formed is cut off from the support frame 110 at the support members 110a into a primary or intermediate molded product 113, as shown in FIG. 2.
  • the primary molded product 113 thus formed is finally molded into a molded unit with the electrodes embedded therein, as shown in FIG. 1.
  • the primary molded product 113 which has the electrodes 101-104 mechanically connected with each other through the electrically insulating resin moldings 112, is placed into a mold at a predetermined location therein and supported by a plurality of support pins (not shown) at appropriate locations of the resin moldings 112. In this state, the support pins abut against the resin moldings 112 to support the primary molded product 113.
  • a molten resin of an electrically insulating property is then poured into the mold and cooled to provide a molded body 106 of a generally cylindrical shape.
  • the support pins are removed from the molded body 106, leaving through-holes 114 at the backside of the cylindrical molded body 106.
  • the support pins abut against the resin moldings 112 but not the electrodes 101-104 at all, so there is no possibility of the electrodes 101-104 being exposed to the outside of the molded body 106 via the through-holes 114.
  • there is no need to take an additional measure such as closing the through-holes 114 with a sealing material as would by required with the aforementioned known method, thus resulting in a substantial improvement in productivity.
  • the primary molded product 113 comprising the electrode assembly 111, in which the electrodes 101-104 are mechanically and integrally connected with each other through the electrically insulating resin moldings 112, can be exactly positioned in the mold at a predetermined location with utmost ease. This serves to greatly simplify and facilitate the exact positioning of the electrodes in the mold as well as greatly increase the production efficiency. Thus, it becomes much easier to automate the entire process.

Abstract

A plurality of mutually separate electrodes supported by a support frame are pre-molded into an integral electrode assembly in which the electrodes are connected with each other through resin moldings. The electrode assembly thus formed is cut off from the support frame to provide a primary product in which the electrodes are electrically disconnected from each other. The primary product is then molded into a molded unit having the electrodes embedded therein. Preferably, the primary product is placed in a mold and supported at a predetermined location by a plurality of support pins which abut against the resin moldings. The support pins are removed from the molded unit while leaving corresponding through-holes after a molten resin is poured into the mold and cooled. The electrodes embedded in the molded unit are prevented from being exposed to the outside of the molded unit via through-holes.

Description

This is a Continuation of application Ser. No. 07/699,110 filed May 13, 1991, now abandoned.
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing a molded unit having a plurality of electrodes embedded therein.
An example of a known molded unit with electrodes embedded therein, which forms a rotational angle sensor for sensing the crank angle or position of an internal combustion engine, is shown in FIGS. 4 through 6 which are a plan view, a bottom view and a cross section along line VI--VI of FIG. 5, respectively. The molded unit includes a plurality of first through fifth electrodes 1, 2, 3, 4 and 5, as illustrated in FIG. 7, which are embedded in a circular-shaped molded body 6 formed of a resin. The molded body 6 has a plurality of through-holes 7 formed therethrough at the backside thereof which is opposite to that surface of the molded body 6 at which a plurality of recesses are formed for mounting electric elements 8.
The above-described molded unit is produced as follows. First, a plurality of electrodes 1-5, which are electrically and mechanically disconnected from each other, are respectively or individually placed in a mold at predetermined locations therein and exactly positioned or supported in place by a plurality of support pins. Then, a molten resin is poured into the mold and cooled to provide a molded body 6 having the electrodes 1-5 embedded therein. After cooling of the molten resin, the support pins are removed from the molded body 6, forming a plurality of through-holes 7 at the backside thereof, as shown in FIGS. 5 and 6. In this state, it is undesirable for one side of the surfaces of the electrodes 1 through 5 to be exposed to the outside of the molded body 6 through the through-holes 7. Therefore, the through-holes 7 thus formed are then closed by filling therein a sealing material such as a silicone-based adhesive. Such a filling operation is troublesome, adding to the cost of manufacture. In addition, it is rather difficult, cumbersome and inefficient to exactly and individually position the mutually separated electrodes 1-5 at their respective predetermined locations inside the mold.
SUMMARY OF THE INVENTION
Accordingly, the present invention is intended to overcome the above-mentioned problems encountered with the known method for producing a molded unit with electrodes therein.
An object of the invention is provide a novel and improved method for producing a molded unit with a plurality of electrodes embedded therein which can prevent the embedded electrodes from being exposed to the outside of a molded body, and which is simple, efficient and has low manufacturing costs.
In order to achieve the above object, according to the invention, there is provided a method for producing a molded unit with a plurality of electrodes comprising the steps of:
pre-molding a plurality of electrodes supported by a support frame into an electrode assembly in which the electrodes are connected with each other through resin moldings;
cutting off the electrode assembly from the support frame to provide a primary product in which the electrodes are electrically disconnected from each other; and
molding the primary product into a molded unit having the electrodes embedded therein.
Preferably, the step of molding the primary product into a molded unit comprises:
placing the primary product in a mold at a predetermined location; and
pouring a molten resin into the mold to provide the molded unit.
Preferably, the primary product is supported in the mold at the predetermined location by a plurality of support pins which abut against the resin moldings. The support pins are removed from the molded unit after the molten resin poured into the mold is cooled.
The above and other objects, features and advantages of the present invention will become more readily apparent from the following detailed description of a preferred embodiment of the invention taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a bottom view of a molded unit with electrodes produced in accordance with the method of invention;
FIG. 2 is a plan view of a primary molded product to be incorporated in the molded unit of FIG. 1;
FIG. 3 is a plan view of the electrodes of FIG. 1, but showing their state before being formed into the primary molded product of FIG. 2;
FIG. 4 is a plan view of a molded unit with electrodes produced in accordance with a known method;
FIG. 5 is a bottom view of the molded unit of FIG. 4;
FIG. 6 is a cross section taken along line VI--VI in FIG. 5; and
FIG. 7 is a plan view of the electrodes to be embedded in the molded unit of FIG. 4.
DESCRIPTION OF THE PREFERRED EMBODIMENT
A preferred embodiment of the present invention will now be described in detail while referring to FIGS. 1 through 3 of the drawings.
FIG. 1 shows, in a bottom view, a molded unit with electrodes produced in accordance with the method of the invention. The molded unit of FIG. 1 is produced as follows. First, as shown in FIG. 3, a plurality of electrodes 101-104, which are supported by a support frame 110 of a metallic thin film through a plurality of support members 110a, are integrally pre-molded by an electrically insulating resin into an electrode assembly 111, in which the electrodes 101-104 are integrally and mechanically connected with each other through resin moldings 112. Then, the electrode assembly 111 thus formed is cut off from the support frame 110 at the support members 110a into a primary or intermediate molded product 113, as shown in FIG. 2. The primary molded product 113 thus formed is finally molded into a molded unit with the electrodes embedded therein, as shown in FIG. 1. Specifically, the primary molded product 113, which has the electrodes 101-104 mechanically connected with each other through the electrically insulating resin moldings 112, is placed into a mold at a predetermined location therein and supported by a plurality of support pins (not shown) at appropriate locations of the resin moldings 112. In this state, the support pins abut against the resin moldings 112 to support the primary molded product 113. A molten resin of an electrically insulating property is then poured into the mold and cooled to provide a molded body 106 of a generally cylindrical shape. After cooling of the resin, the support pins are removed from the molded body 106, leaving through-holes 114 at the backside of the cylindrical molded body 106. In this case, however, the support pins abut against the resin moldings 112 but not the electrodes 101-104 at all, so there is no possibility of the electrodes 101-104 being exposed to the outside of the molded body 106 via the through-holes 114. As a result, there is no need to take an additional measure such as closing the through-holes 114 with a sealing material as would by required with the aforementioned known method, thus resulting in a substantial improvement in productivity.
In addition, the primary molded product 113 comprising the electrode assembly 111, in which the electrodes 101-104 are mechanically and integrally connected with each other through the electrically insulating resin moldings 112, can be exactly positioned in the mold at a predetermined location with utmost ease. This serves to greatly simplify and facilitate the exact positioning of the electrodes in the mold as well as greatly increase the production efficiency. Thus, it becomes much easier to automate the entire process.

Claims (3)

What is claimed is:
1. A method of producing a molded unit with a plurality of electrodes, comprising the ordered steps of:
a) pre-molding a plurality of electrodes (101-104) laterally connected to a surrounding support frame (110) and electrically connected to each other by respective support members (110a) to form an electrode assembly (111) in which the electrodes are integrally and mechanically connected with each other through resin moldings (112);
b) cutting through the support members to electrically disconnect the electrodes from each other and to separate the electrode assembly from the support frame, to thus provide a first, intermediate molded unit (113);
c) placing the intermediate molded unit in a mold;
d) supporting the intermediate molded unit at a predetermined location with a plurality of support pins which exclusively abut against the resin moldings and do not contact the electrodes;
e) pouring a molten resin into the mold to produce a second, final molded unit having the electrodes embedded therein; and
f) removing the support pins from the final molded unit such that the electrodes are not exposed to the outside thereof through holes (114) left by the support pins.
2. A method according to claim 1, wherein the resin moldings mechanically connecting the electrodes with each other are formed of an electrically insulating resin.
3. A method according to claim 1, wherein the molten resin comprises an electrically insulating resin.
US08/205,821 1990-05-15 1994-03-02 Method for producing a molded unit with electrodes embedded therein Expired - Lifetime US6162381A (en)

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Application Number Priority Date Filing Date Title
US08/205,821 US6162381A (en) 1990-05-15 1994-03-02 Method for producing a molded unit with electrodes embedded therein

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2122996A JPH0419114A (en) 1990-05-15 1990-05-15 Manufacture of insert electrode molding
JP2-122996 1990-05-15
US69911091A 1991-05-13 1991-05-13
US08/205,821 US6162381A (en) 1990-05-15 1994-03-02 Method for producing a molded unit with electrodes embedded therein

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JP (1) JPH0419114A (en)
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US6506328B1 (en) * 1998-09-10 2003-01-14 Beru G Process for producing an electronic component
US20040232784A1 (en) * 2003-05-20 2004-11-25 Siemens Vdo Automotive Corporation EMI suppression in permanent magnet DC motors having PCB outside motor in connector and overmolded
US6841856B1 (en) * 1997-09-30 2005-01-11 Mitsubishi Denki Kabushiki Kaisha Insert conductor for use in a generator and having structure for preventing deformation
WO2009010743A1 (en) * 2007-07-18 2009-01-22 Deepstream Technologies Ltd Improvements in and relating to manufacture of electrical circuits for electrical components
US7712933B2 (en) 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
US7815339B2 (en) 2008-01-09 2010-10-19 Innotec Corporation Light module
US7909482B2 (en) 2006-08-21 2011-03-22 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
US8230575B2 (en) 2007-12-12 2012-07-31 Innotec Corporation Overmolded circuit board and method
CN101558285B (en) * 2006-10-04 2012-11-14 大陆汽车有限责任公司 Method for manufacturing a mounting element with an angle sensor
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
US9022631B2 (en) 2012-06-13 2015-05-05 Innotec Corp. Flexible light pipe

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DE19614879C1 (en) * 1996-04-16 1997-07-31 Preh Elektro Feinmechanik Solderless fixture method e.g. for mounting components on to circuit board conductor paths
DE19628379A1 (en) * 1996-07-13 1998-01-15 Pierburg Ag Plastic throttle body
FR3072322B1 (en) * 2017-10-13 2023-03-24 Psa Automobiles Sa PART IN COMPOSITE MATERIAL WITH METALLIC INSERT

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JPH0419114A (en) 1992-01-23
DE4115883C2 (en) 1995-01-19
KR910019746A (en) 1991-12-19
DE4115883A1 (en) 1991-11-21
KR940003172B1 (en) 1994-04-15

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